ISHIKAWA METAL Co.,Ltd

Technical data

EVASOL

Lead free cored solder

R23-C601-3for Al　

高作業性

低飛散

低温

SnAgBiIn

hygroscopic fluorineJIS-A

ＲＭＡ

for washing

R23-C601-3(2006.5)

ISHIKAWA METAL Co.,Ltd. 1

Special feature

・ This is resin flux cored lead free solder made by Sn and Cu, which can solder easily to Al wire coated by urethane or the other materials.

・ The flux consist of high moisture adsorption materials, so need to wash with water after soldering. Evaluation of special characteristic Ａ．Evaluation of special characteristic １．Electrolytic corrosion ２．Washability test of flux residue ２－１．Ionic residue ２－２．Corrosion ３．Solderability Ｂ．Basic characteristic １． Solder alloy １－１：Alloy composition １－２：melting point ２． Flux content ３． Halide content

4． Flux expansion 5． Insulation resistance

6． Voltage-applied moisture resistance (Migration test) Characteristics Table1. Characteristics of R23-C601-3

Test items Characteristic Test method Alloy composition Sn:Balance Cu:3.0 JIS Z 3910

Solidus temperature 227 Solder alloy Liquidus temperature 312

The type of flux Fluoride Flux Halide content 20% JIS Z 3197 8.1.4.2.1 Flux content 3.0% JIS Z 3197 8.1.2 Ionic residue 1.0µg NaCl /in2 JIS Z 3197 8.5.2

Corrosion No corrosion JIS Z 3197 8.4.1 Cu 77％ Expansion Al 75％ JIS Z 3197 8.3.1.1

Initial 4.7E+13 Ω After 168h 3.0E+8 Ω Insulation

resistance After 1008h 4.5E+8 Ω

JIS Z 3197 8.5.3 Condition : B (85, 85%RH)

Resin flux cored solder

Migration test No migration JIS Z 3197 8.5.4

R23-C601-3(2006.5)

ISHIKAWA METAL Co.,Ltd. 2

Ａ．Special characteristic 1．Electrolytic corrosion Outline

An electrolytic corrosion happens at the point of soldering because difference metals, base metal or alloy of solder contact. The electrolytic corrosion happens by the difference of metal’s electrode potential composed of metal alloy, the lower metal of electrode potential is dissolved as anode and metal alloy are peeled off. So “R23 (Sn-3.0Cu)”, metal components of “R23-C601-3”, shall be measured electrolytic corrosion characteristic and compared with “K4 (Sn-3.5Ag-0.2Ni)” of Pb free solder for Al and “18Sn-2.0Ag-Pb” that is Pb solder for Al.

Test method （Our company method）

2 Al plates (5mm×30mm) shall be soldered with flux for Al and 30g metal sample. The test specimen shall be soaked in 40 artificial sea water and kept in this state. Measuring time shall be taken to erode the point of soldering and separate each Al plate.

Test metal specimens are as follows, 【A】R23( Sn-3.0Cu)

【B】K4( Sn-3.5Ag-0.2Ni) 【C】18Sn-2.0Ag-Pb

→

enlarged

→

enlarged Initial crack

Test result Erosion characteristic of “R23”(Sn-3.0Cu) at the surface between Al and solder is not better than “K4” (Sn-3.5Ag-0.2Ni) and “18Sn-2.0Ag-Pb”.

Table2. Electrolytic corrosion

sample time R23 96h K4 3096h

18Sn-2.0Ag-Pb 504h

２．Washability of flux residue Outline

It is important to wash flux residue for prevention of corrosion and insulation reliability assurance for a long time. About “R23-C601-3”, the flux residue is hygroscopic property, so there is ionic material in the flux residue, it needs to wash. So we shall show the method of washing of “R23-C601-3” and the reliability after washing, and evaluate the ionic residue value and the corrosion after washing and no washing.

2-1 Ionic residue Test method （Our company method）

Test board, specified in JIS, shall be soldered by “ R23-C601-3” with soldering iron of 380 and washed by ion exchanged water, the specific resistance is more than 5000Ωm at 20, three times that is three, one and one with ultrasonic washer. The ion-exchanged water shall be changed and the board shall be rinsed every washing. After washing the board shall be dried in drying machine by blow adjusted 80 for 5 minutes.

Test method （Based on JIS Z 3197 8.5.2）

18 pieces of test boards shall be prepared , the half , 9 boards shall be soldered and washed as above method, the other 9 boards not soldered as blank. Each 9 boards shall be measured the Ionic residue value by “Omega Meter”. As comparison, no washing test boards shall be done, too.

Standard Ionic residue value is less than 14µg NaCl/in2

Test result

Table3. Ionic residue value

Test results showed that the flux residue was able

to be washed by water with ultrasonic washer and in the case of no-washing, much ionic material remained.

Before washing After washing

sample washing Ionic residue value （µg NaCl/in2）

washing 1.0 R23-C601-3 no washing more than 50

R23-C601-3(2006.5)

ISHIKAWA METAL Co.,Ltd. 3

2-2 Corrosion Test method （Based on JIS Z 3197 8.4.1） The swirled sample “R23-C601-3” shall be melted at

the center of Cu plate been finished preparation for 5 seconds after it begins to melt. After that the test piece shall be got cold at room temperature, and washed and dried in the washing method shown in 2-1. It shall be put in thermoregulator adjusted 40±2,90～95% and kept in this state for 96 hours. 96 hours later corrosion shall be observed. As comparison, no washing and Al plate shall be done, too.

Test result

Washed Cu and Al plates were not found corrosion, but no washed plates were found corrosion at soldered portion and the base.

Initial 96 hours later

Fig. washing

96h later Point of corrosion

Note: ①solder ②Cu plate

Fig. no washing

３．Solderability Outline Al has more strong oxide film on the surface than Cu

or other base metals, so the solderability is not good. And in the case that Al is coated any organic substances, for example the heat resistance is high, even if it is thermoplasticity, it is difficult to solder with just heating. So some strong activator is needed to remove it. “R23-C601-3” is good at the solderability for Al and removing the organic substance, that is high heat resistance, coated Al. We shall show the solderability of “R23-C601-3” and

compare of general Pb free solder as follows.

Test method （Our company method） Copper plate covered with Al urethane wire shall be

soldered with “R23-C601-3”.Temperature of soldering iron is 380. And “J3-STE-3”, Pb –free solder contain fluorine in our company, shall be done, too.

Test result

R23-C601-3 J3-STE-3

R23-C601-3(2006.5)

ISHIKAWA METAL Co.,Ltd. 4

Ｂ．Basic characteristic １．Solder alloy １．１：Alloy composition

１．２：Melting point Table5. Melting point

Solidus temperature（） 227 Liquidus temperature（） 312

２．Flux content

Test method （Based on JIS Z 3197 8.1.2） 30±1g “Ｗ１”, the resin cored of solder shall be heated

by burner in crucible. After solder and flux shall be separated completely, the solder shall be solidified and cleaned, dried, and measured “W2”. The flux content shall be calculated by the following

formula.

Flux content(%) = (W1 -W2) × 100 / W1

Standard Flux content shall be 3.0±0.3 (%)

Test result Table6. Flux content

Flux content（％） 3.0

３．Halide content Test method （Based on JIS Z 3197 8.1.4.2.1）

5.0±0.1g flux shall be put into 300ml beaker and dissolved with ion exchanged water. The solution shall be titrated by silver nitrate standard solution with electric titration equipment.

Standard Halide content shall be 0%、

Fluorine content shall be 20±3% Test result Table7. Halide content

Halide content（％） 0 Fluorine content （％） 20

４．Expansion Test method （Based on JIS Z 3197 8.3.1.1）

The one side of Cu plate （30×30×0.3mm） shall be polished by abrasive paper (No.1000) in alcohol and cleaned with alcohol, and dried at room temperature. These plates shall be put into a dryer adjusted 150±3 for 1 hour to produce uniform oxidate on the plates.

Al plate （30×30×0.5mm） shall be not pretreated like copper plate.

Swirled 0.30±0.03g resin flux cored of solder shall be placed at the center of Cu (Al) plate. It shall be melted on a solder bath adjusted 270 for 30 seconds after starting to melt, and lifted from the bath and cooled at room temperature. Flux residue shall be removed. The height of the spread solder shall be measured by a micrometer and calculated by the following method.

Ｓ：Spreading ratio(%) H：height of the spread solder (mm) D：diameter of the solder, when it is

assumed to be a sphere (mm) Ｄ： = 1.24V1/3

Ｖ：density of solder

Standard Cu ：75% min. ,Al ：70％ min.

Test result Table8. Spreading ratio

Spreading ratio （％） Cu 77.4 Al 75.3

note：diameter of solder is φ0.8

Table4. Alloy composition Sn Pb Cu Bi Sb

Barance less than 0.05 3.0±0.3 0.10

max 0.10 max

Zn Fe Al As Cd

0.001 max

0.02 max

0.001 max

0.03 max

less than 0.002

R23-C601-3(2006.5)

ISHIKAWA METAL Co.,Ltd. 5

５．Insulation resistance Test method （Based on JIS Z 3197 8.5.3）

The test board specified JIS shall be soldered with a soldering iron (380) and cleaned by ion exchanged water. It shall be dried in a drying machine adjusted 80 for 5 minutes. It shall be put into a thermoregulator adjusted 85 85%, and initial, 24, 96, 168, 408, 648, 840, 1008 hours later, the insulation resistance shall be measured at DC100V.

Test result Test results are showed as follows.

Table9. Insulation resistance (Ω)

６．Voltage-applied moisture resistance （Migration test）

Test method （Based on JIS Z 3197 8.5.4） The test board specified JIS is soldered with a

soldering iron (380) and cleaned by ion exchanged water. It shall be dried in a drying machine adjusted ８０ for 5 minutes. It shall be put into a thermo-regulator adjusted 85 85%, DC45 to 50V shall be applied between the electrodes, and initial, 24, 96, 168, 408, 648, 840, 1008 hours later, the insulation resistance shall be measured at DC100V. 1008h later the test boards shall be taken out and confirmed that if there shall be any migration. Test result Any migration were not found.

Table10. Voltage-applied resistance (Ω)

Fig. Voltage-applied resistance test

1.0E+07

1.0E+08

1.0E+09

1.0E+10

1.0E+11

1.0E+12

1.0E+13

1.0E+14

0 500 1000Time (h)

Insu

lation r

esi

stan

ce （

Ω）

Initial 24hr 96hr 168hr

No.１ 2.3E+13 1.1E+8 1.5E+8 1.8E+8

No.２ 6.5E+13 2.6E+8 3.3E+8 3.5E+8

No.３ 7.0E+13 3.0E+8 4.1E+8 4.5E+8

Average 4.7E+13 2.0E+8 2.8E+8 3.0E+8

408hr 648hr 840hr 1008hr

No.１ 2.0E+8 2.1E+8 2.3E+8 2.4E+8

No.２ 4.0E+8 4.6E+8 5.1E+8 5.6E+8

No.３ 5.3E+8 5.7E+8 6.2E+8 6.6E+8

Average 3.5E+8 3.8E+8 4.2E+8 4.5E+8

Initial 24hr 96hr 168hr

No.１ 5.0E+12 1.0E+8 1.1E+8 2.1E+8

No.２ 3.5E+13 4.4E+8 5.0E+8 6.9E+8

No.３ 2.6E+13 3.1E+8 3.8E+8 5.0E+8

Average 1.7E+13 2.6E+8 2.8E+8 4.2E+8

408hr 648hr 840hr 1008hr

No.１ 5.3E+8 6.8E+8 7.5E+8 8.1E+8

No.２ 9.5E+8 9.6E+8 1.2E+9 1.2E+9

No.３ 7.9E+8 9.6E+8 1.1E+9 1.0E+9

Average 7.4E+8 8.6E+8 9.8E+8 9.8E+8

Fig.　Insulation resistance test

1.0E+07

1.0E+08

1.0E+09

1.0E+10

1.0E+11

1.0E+12

1.0E+13

1.0E+14

0 500 1000Time(h)

insu

lation r

esi

stan

ce（Ω

）