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The top documents tagged [oxide bonding]
Ronald Lipton Hiroshima 2006 3D Sensors - Vertical Integration of Detectors and Electronics Contents: Introduction to three dimensional integration of
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Metal Catalyst Particles Smaller than 8 nm Have Properties That Depend Strongly on Size Charles T. Campbell, D. E. Starr, J. T. Ranney, J. Larsen, S. C
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Track Trigger Meeting 3/ 23/10
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V. Re 3D integration and microelectronics in “AIDA-2” for H2020 AIDA H2020 open meeting, February 17, 2014 Valerio Re INFN Sezione di Pavia Università
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The Monolithic 3D-IC
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Lessons and Future for 3D Circuit Design With focus on Chartered/Tezzaron Activities
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