status of the advanced packaging industry 2021
TRANSCRIPT
© 2021
From Technologies to MarketsFrom Technologies to Markets
Status of the Advanced
Packaging Industry 2021
Market and Technology
Report 2021
Sample
2Status of the Advanced Packaging Industry 2021 | Sample | www.yole.fr | ©2021
• Introduction 3
o Methodology
o Report synergies
o Objectives, scope, glossary
o What we get right & what we get wrong ?
o Advanced packaging platforms
• Noteworthy news on advanced packaging 16
• Three-Page summary 18
• Executive summary 22
• Semiconductor business trends & outlook 78
o Semiconductor industry trends and market drivers
o Effect of US-China trade dispute on semiconductor business & supply chain
o Chip shortage issue
• Substrate shortage analysis 100
• Advanced packaging - technology trend 109
o What is driving AP business ?
o Impact of FEOL on packaging
o Packaging & technology roadmaps
o Focus on TSMC, Intel & Samsung Electronics AP
• Advanced packaging - market trend 148
o Forecasts per adv. packaging platforms
o Unit count
o Wafer count
o Revenue
o Forecast of adv. packaging platforms by applications
TABLE OF CONTENTS
• Different advanced packaging platforms – summary 168
o Analysis per platform and future development : flip-chip, fan-out, fan-in, 3d-stacking,
embedded-die & advanced substrates
• Players and supply chain 184
o Player landscape and positioning
o Business model shifts
o Overview of production per manufacturer
o Advanced packaging wafer breakdown by manufacturers by different technology: flip-chip,
fan-out, fan-in, 3D/2.5D IC
o Advanced packaging wafer breakdown by business model: OSATs, IDMs & Foundries
• Player financials 208
o Top 25 OSATs financial analysis
o Rankings by different parameters: revenues, gross profit, net-income, R&D etc.
o Recent development of key OSATs
• Mergers/Acquisitions and recent developments 248
o List of M&As in semiconductor since 2013
o Analysis of M&As trend in OSATs sector and various scenarios for 2019-2024
o M&As scenarios for OSATs
• Conclusions 263
• Appendix 266
• Yole Développement presentation 274
3Status of the Advanced Packaging Industry 2021 | Sample | www.yole.fr | ©2021
METHODOLOGIES & DEFINITIONS
Market
Volume (in Munits)
ASP (in $)
Revenue (in $M)
Yole’s market forecast model is based on the matching of several sources:
Information
Aggregation
Preexisting
information
4
ABOUT THE AUTHORS
Biographies & contacts
Santosh KUMAR
Santosh Kumar Santosh Kumar is currently working as Principal Analyst and Director Packaging, Assembly & Substrates for Yole Développement's
activities in Korea. Based in Seoul, Santosh is strongly involved in the market, technology and strategic analysis of the microelectronic assembly &
packaging technologies and present his vision of the industry in numerous conferences as well as through papers and patents publication.
Santosh Kumar received the bachelor and master degree in engineering from the Indian Institute of Technology (IIT), Roorkee and University of Seoul
respectively.
Stefan CHITORAGA
Favier Shoo is a Team Lead Analyst in the Packaging team within the Semiconductor, Memory and Computing Division at Yole Développement. Based in
Singapore, Favier manages an international team and develops the team’s technical and market expertise. In Addition, Favier generates technology &
market reports, provides strategic consulting, and performs custom studies. He is regularly engaged in conferences, presentations, keynotes, and panel
sessions and has developed a deep understanding of the supply chain and core business values.
Favier holds a bachelor’s in Materials Engineering (Hons) and a Minor in Entrepreneurship from Nanyang Technological University (NTU) Singapore.
Email: [email protected]
Favier SHOO
Status of the Advanced Packaging Industry 2021 | Sample | www.yole.fr | ©2021
Stefan Chitoraga is a Technology and Market Analyst specializing in Packaging and Assembly at Yole Développement (Yole). As part of the
Semiconductor, Memory & Computing division at Yole, Stefan is focused on advanced packaging platforms and processes, substrates, and PCBs. He is
involved daily in the production of technology & market reports and custom consulting projects.
Stefan holds a Bachelor’s in Electronics and Computer Science for Industry Applications from the Polytech Grenoble (France).
Email: [email protected]
5Status of the Advanced Packaging Industry 2021 | Sample | www.yole.fr | ©2021
Altera, Amkor, Analog Devices, Ardentec, Atmel, AOI Electronics, Apple, ARM, ASE, Avago, Bitmain, Broadcom,BroadPak Carsem, China WLCSP, Chipbond, ChipMOS, Cisco, Cypress Semiconductor, Deca
Technologies, Greatek, IC Interconnect, Fairchild, Facebook, Flip Chip International, Formosa, Freescale, Fujitsu, GlobalFoundries, Google, Hana Micron, Huawei, Inari Berhad, Intel, Intersil, J-Devices, JCET, King Yuan, Linear
Technology, LB Semicon, Lingsen Precision, Maxim, MaxLinear, MediaTek, Microchip, Microsemi, Movidius, Nantong-Fujitsu, Nanium, Nepes, Nvidia, NXP, onsemi, OptoPAC, Orient Semiconductor, Powertech Technology, Renesas, Qualcomm, Rohm, Samsung, SilTech, Sigurd, SK Hynix, Softbank, SPIL, ST Microelectronics, STATS ChipPAC, STS
Semiconductor, Teraprobe, Texas Instruments, Tianshui Huatian, Tong Hsing, Toshiba, TSMC, Unisem, UTAC, Walton Advanced Engineering, and many more…
COMPANIES CITED IN THIS REPORT
> 100 companies cited in the report
6Status of the Advanced Packaging Industry 2021 | Sample | www.yole.fr | ©2021
o Updated forecast of the semiconductor market including memory & non-memory components
o Includes key system-level demand forecast: mobile & consumer, automotive, telecom & infrastructure
o Updated Advanced Packaging market data (2019-2026):
o By revenue, wafer, and unit forecasts
o By Advanced Packaging platform: flip-chip, fan-out, fan-in, 3D stacked, embedded die
o Analysis of US-China effect on semiconductor business & supply chain
o Updated 2019 - 2025 revenue, wafer, and unit forecasts, by various application segments: consumer &mobile, automotive & transportation, telecom & infrastructure, medical, industrial, defense & aerospace
o Updated supply chain analysis with focus on impact of foundry entry into Advanced Packaging business
o Wafer starts share by manufacturers from different business models (IDM, OSAT, foundry) by differentAdvanced Packaging platform and its evolution
o Updated financial analysis of the top 25 OSATs (2013-2020) by various parameters: Revenue, YoYgrowth, R&D, CapEx, Gross profit, Gross Margin, Net Income etc.
o Updated M&A data, and provides different scenarios for OSATs for 2019-2026
WHAT’S NEW IN THE STATUS OF ADVANCED PACKAGING 2020?
7Status of the Advanced Packaging Industry 2021 | Sample | www.yole.fr | ©2021
In 2019, the Advanced Packaging team from the Semiconductor, Memory and Computing
Division at Yole Développement started the “Advanced Packaging Monitor”, providing
quarterly updates and deeper focus on these segments
The main objectives of this monitor are the following:
o Near-term market dynamics on quarterly basis
o Long-term market dynamics for 2019-2025
o CapEx & capacity by major players
o Market share of major OSATs/foundries
o Package ASP per given market/platform
o Device/application adoption for Advanced Packaging technologies
WHAT’S NEW FROM THE ADVANCED PACKAGING TEAM?
Advanced Packaging monitor
Start of Advanced Packaging Monitors with quarterly update.
8©2018 | www.yole.fr | Status of the Advanced Packaging Industry 2018Status of the Advanced Packaging Industry 2021 | Sample | www.yole.fr | ©2021
SYSTEM INTEGRATION LEVELS
iPhone 6
LEVEL 3:
end
device/equipment
LEVEL 2:
device/equipment
board
iPhone 6 PCB
Qorvo RF SiP
in the iPhone 6s Plus
LEVEL 1:
semiconductor
packaging
LEVEL 0:
semiconductor
die/wafer
Power amplifier in
Qorvo RF SiPSemiconductor
wafer
LEVEL 1+2:
semiconductor package + board
Semiconductor
package
Board (PCB)
Si dies
Package substrate
9©2018 | www.yole.fr | Status of the Advanced Packaging Industry 2018Status of the Advanced Packaging Industry 2021 | Sample | www.yole.fr | ©2021
PACKAGING FAMILY PLATFORMS
No substrate
Fan-Out WLCSP
Organic substrates
Wire-Bond
BGA CSP
COB
BOC
WB CSP
LGA
Flip-Chip
BGA
FC BGA
FO on Substrate
2.5D
2.1D
CSP LGA
Leadframe substrates
Wire-Bond
QFN/QFP
SOIC
TSOP
LCC
DIP
Flip-Chip
FC QFN (MIS)
Ceramic substrates
Wire-Bond
Hi Rel
Flip-Chip
HTCC
LTCC
Embedded Die
10©2018 | www.yole.fr | Status of the Advanced Packaging Industry 2018Status of the Advanced Packaging Industry 2021 | Sample | www.yole.fr | ©2021
ADVANCED PACKAGING PLATFORMS
No substrate
Fan-Out WLCSP
Organic substrates
Wire-bond
BGA CSP
COB
BOC
WB CSP
LGA
Flip-Chip
BGA
FC BGA
FO on Substrate
2.5/2.1D
3D
CSP LGA
Leadframe substrates
Wire Bond
QFN/QFP
SOIC
TSOP
LCC
DIP
Flip-Chip
FC QFN (MIS)
Ceramic substrates
Wire-bond
Hi Rel
Flip-Chip
HTCC
LTCC
Embedded Die
11Status of the Advanced Packaging Industry 2021 | Sample | www.yole.fr | ©2021
ADVANCED PACKAGING PLATFORMS –Classification at System Integration Level
Wafer level Substrate/Strip level (Panel based) Panel level
Level 1 - Die
Interconnection
Substrate/
leadframe
Level 2 -
Packaging
Module
Level 3 -
No SMT needed
SiP/PoP, etc.
ED in PCB/Flex
ED in
laminate
Organic/
glass
substrate
etc.
Standard organic substrate
Flip-chip Wire-bond RDL
FIWLP FOWLP 3DFOPLP
Silicon/
glass
bridge
Bump/
pillar
TSV/
TGV
Ceramic/
leadframe
and others
Advanced
organic
substrate
Mold
embeddingOrganic interposer
FC
WB
CSP
BGA Standard
BGA Advanced
LGA
BGA
LGA
CSP
*Lv=level
Organic substrate Ceramic/
leadframe
and others
FC WB
Conventional wire-bond based SiP
is not covered in this report
12Status of the Advanced Packaging Industry 2021 | Sample | www.yole.fr | ©2021
GLOBAL ECONOMIC OUTLOOK
According to World Bank, the global economy is set to expand
5.6 percent in 2021 (its strongest post-recession pace in 80
years) and 4.3% in 2022. This recovery is uneven and largely
reflects sharp rebounds in some major economies.
China economy is expected to grow at impressive 8.5% in
2021, while USA economy will grow at 6.8%
In many emerging market and developing economies
(EMDEs), obstacles to vaccination continue to weigh on
activity.
As the global economy rebounds from COVID-19 induced
global recession, the accompanying strength in global trade
offers an opportunity to jump-start the recovery in EMDEs
The global outlook remains subject to significant downside
risks, including the possibility of additional COVID-19 waves
and financial stress amid high EMDE debt levels.
Policy makers will need to balance the need to support the
recovery while safeguarding price stability and fiscal
sustainability and to continue efforts toward promoting
growth-enhancing reforms.Data source: https://www.worldbank.org/en/publication/global-economic-prospects
-6,0%
-4,0%
-2,0%
0,0%
2,0%
4,0%
6,0%
8,0%
2018 2019 2020e 2021f 2022f 2023f
Real GDP at market prices
(in %)
World Advanced economies EMDE LIC
13Status of the Advanced Packaging Industry 2021 | Sample | www.yole.fr | ©2021
SEMICONDUCTOR INDUSTRY OUTLOOK
Despite COVID-19, semiconductor market grew by 6.8% in 2020 to reach ~ $440B in 2020. Going forward, the market will grow by whooping 25% to reach $551B by 2021.
• Despite COVID-19, semiconductor market grew by 6.8% in 2020 to reach ~ $440B in 2020. Going forward, the market will grow by whooping 25% to
reach $551B by 2022.
• On a regional basis, sales into the Americas market stood out, increasing annually by 19.8% in 2020. China remained the largest individual market for
semiconductors, with sales there totaling $151.7 billion in 2020, an increase of 5.0%. Annual sales also increased in 2020 in Asia Pacific/All Other (5.3%)
and Japan (1.0%), but decreased in Europe (-6.0%)
• Logic ($117.5 billion in 2020 sales) and memory ($117.3 billion) were the largest semiconductor categories by sales. Annual sales of logic products
increased by 10.3% compared to 2019, while sales of memory products were up 10.2%. Within the memory category, annual sales of NAND flash
products stood out, increasing 23.1% to $49.5 billion in 2020. Sales of micro-ICs — a category that includes microprocessors — increased 4.8% to
$69.6 billion in 2020. Sales of all non-memory products combined increased by 5.2% in 2020 and that category reached an all-time high in total sales.
3%
-3%
-9%
32%
1%
-3%
5%
10%
0%1%
22%
14%
-12%
7%
25%
-15%
-10%
-5%
0%
5%
10%
15%
20%
25%
30%
35%
0
100
200
300
400
500
600
2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 2020 2021
Global Semiconductor Market (in $Bn)
Market size ($Bn) YoY Growth rate (%) Data source: WSTS
14©2018 | www.yole.fr | Status of the Advanced Packaging Industry 2018Status of the Advanced Packaging Industry 2021 | Sample | www.yole.fr | ©2021
SEMICONDUCTOR M&A
Driven by the mega acquisitions deal, 2020 wasthe record year for semiconductor M&Aagreements. Compared with 2019, the M&Asvalue increased by 272% in 2020 to reach~$118B. Majority of the deals happened in latterhalf of the year.
Semiconductor acquisitions in 2020 were drivenby large IC companies looking to sharpen theirpositions in emerging and high-growth marketopportunities, such as embedded machine-learning and AI capabilities, self-driving cars, all-electric vehicles, expansion of data centers forcloud-computing services and proliferation of thesensors and systems connected to IoT.
Key consolidation drivers include desire tosupplement organic growth, revenue & costsynergies to drive growth, importance of scalegiven cutting edge R&D costs, desire to addcomplementary and market exposure and fear ofmissing out.
Out of total semiconductor M&A, SemiconductorPackaging M&A was only ~ $4B in all 5 past yearscombined.
Semiconductor industry saw record M&A agreements in 2020.
121%
-44%
24%43%
537%
-44% -53%
-8%22%
272%
-100%
0%
100%
200%
300%
400%
500%
600%
0
20
40
60
80
100
120
140
2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 2020
Semiconductor M&As value ($B)
M&A value YoY (%)
1515Status of the Advanced Packaging Industry 2021 | Sample | www.yole.fr | ©2021
DIGITAL SOCIETY: NEW TRENDS & MARKET DRIVERS
RobotSmart AugmentationPC Mobile
ImagingCamera
Smart speaker
Smart camera
Wearables
Companion robotOlfactometry
Smelling
Motion sensing
Holographic interaction
Augmented human
Robot home
PC
Audio
Mobile
Speaker
Smart hearables
Smart assistantSmartwatch
Smart TV
Smartwatch
SMARTPHONE
+ Accelerator + NeuromorphicApplication processorStandalone CPU, GPU, memory and connectivity
SMARTPHONE
SMARTPHONE
>20302000 2010 2020
16Status of the Advanced Packaging Industry 2021 | Sample | www.yole.fr | ©2021
SEMICONDUCTOR INDUSTRY
Chronological order of Players pursuing Moore’s Law
Moore’s law has guided the global semiconductor industry for past decades (since 1965), improving both performance and cost through node scaling.
After 2002 (130nm), the industry has been consolidating extensively. Limitations in scaling have disrupted companies competing in this business.
Presently, it is an oligopoly market, with a handful of key players remaining.
26
18
14 14
10
76
3 32
0
5
10
15
20
25
130nm 90nm 65nm 45nm/40nm 32nm/28nm 22nm/20nm 16nm/14nm 10nm 7nm 5nm/3nm
2002-2003 2004-2006 2006-2008 2008-2012 2010-2012 2012-2014 2014-2016 2017-2019 2020-2022 2023-2025
Nu
mb
er
of
Pla
yers
Technology Node [Moore’s Law*]Year
ADI
AMD
Atmel
Cypress
Freescale
Fujitsu
Hitachi
HLMC
IBM
Infineon
Intel
Mitsubishi
ON
Panasonic
Renesas
Rohm
Samsung
Sanyo
Sharp
SMIC
Sony
STM
TI
Toshiba
TSMC
UMC
AMD
Cypress
Freescale
Fujitsu
IBM
Infineon
Intel
Panasonic
Renesas
Samsung
Sharp
SMIC
Sony
STM
TI
Toshiba
TSMC
UMC
Fujitsu
GF
HLMC
IBM
Intel
Panasonic
Renesas
Samsung
SMIC
STM
TI
Toshiba
TSMC
UMC
Fujitsu
GF
HLMC
IBM
Intel
Panasonic
Renesas
Samsung
SMIC
STM
TI
Toshiba
TSMC
UMC
GF
HLMC
IBM
Intel
Panasonic
Samsung
SMIC
STM
TSMC
UMC
Intel
Samsung
TSMC
GF
Intel
Samsung
SMIC
TSMC
UMC
Intel
Samsung
TSMC
?
?
GF
HLMC
IBM
Intel
Samsung
SMIC
TSMC
* Moore’s law states that the number of transistors in an integrated circuit chip doubles every 2 years
Data referenced from Intel and WikiChip
Number of Players with leading-edge manufacturing capabilities
Only 3 players left
[2020]
1717Status of the Advanced Packaging Industry 2021 | Sample | www.yole.fr | ©2021
TECHNOLOGY ROADMAP: FROM NANO-SCALE TO MICRO-SCALE..
2014 2016 2018 2020 2022 2024 2026
Assumed
Moore’s law
Stacked die
µBump pitch (μm)
Die to substrate
FC Bump pitch (μm)
Substrate to board
BGA Ball pitch (μm)
22nm 14nm 10nm 7nm
28nm 14nm 10nm 7nm 5nm 3nm
20nm 16nm 10nm 7nm 5nm 3nm
20nm 14nm (licensed) Stopped
Adva
nce
d n
odes
Adva
nce
d p
ackag
ing*
16/14nm 10nm 7nm 5nm 3nm
200 to 150 μm 80 to 40 μm 60 to 30 μm 50 to 30 μm
400/350 μm 300 μm
Advanced packaging is essential to bridge the scale-gap between die and PCBIndustry is looking into the growing importance of functional roadmap
Average trends based on technology and industry expectation
*Minimum dimension
2nm
95 to 48 μm 44 to 20 μm 20 to 10 μm
2nm
1.5nm
2nm
18©2018 | www.yole.fr | Status of the Advanced Packaging Industry 2018Status of the Advanced Packaging Industry 2021 | Sample | www.yole.fr | ©2021
SEMICONDUCTOR PACKAGING OPPORTUNITY
Driven by demands of semiconductor hardware created by mega trends
CPU
/GPUAPU MCUs ASICs FPGAs Memory
Sensors/
Actuators/CIS
Analog /
Discretes
Opto-
electronics
AI/ML
FC, 2.5D/3D,
FO, SiP
FC, FO,ED
FC, FOFC, 2.5D/3D,
FO
FC, 3D,
WB,QFN,
WLCSP, SiP
Smart automotive
/Electrification/ ADAS
FC, WB,QFN,
WLCSP FC,FO,WB, QFN,
WLCSP, SiP
FC,WB,FO,QF
N, ED, SiP
AR/VR
HPCFC, 2.5D/3D,
FO
SiP, 2.5D/3D,
FC, WB
IoTFC, WB,QFN,
WLCSP
FC,FO,WB, QFN,
WLCSP, SiP
FC,WB,FO,QF
N, ED, SiP5G
FC, 2.5D/3D,
FO, SiP FC, FO,ED SiP, 2.5D/3D,
FC, WBMobile
FC,FO,WB, QFN,
WLCSP, SiP
Blockchain /
Cryptocurrency
FC, 2.5D/3D,
FO
FC, 2.5D/3D,
FO
FC,WB,FO,QF
N, ED, SiP
1919Status of the Advanced Packaging Industry 2021 | Sample | www.yole.fr | ©2021
2020Status of the Advanced Packaging Industry 2021 | Sample | www.yole.fr | ©2021
VOLUME PRODUCTION ROADMAP FOR…
21©2018 | www.yole.fr | Status of the Advanced Packaging Industry 2018Status of the Advanced Packaging Industry 2021 | Sample | www.yole.fr | ©2021
ADVANCED PACKAGING OVERVIEW 2014 to 2026
Revenue Split ($B)
AP; 20,2;
38%
Others;
33,0; 62%
2014
( $53.2B)
• Advanced Packaging revenue is swiftly catching up to the traditional packaging market.
• In 2014, Advanced Packaging accounted for 38% of total packaging market. However, its market share will increase to
~50% in 2026 to reach ~$45.9B.
• In an 11-year period, Advanced Packaging revenue almost caught up with that of traditional packaging.
AP; 30,4;
45%
Others;
37,3; 55%
2020( $67.7B)
AP; 45,9;
50%
Others;
46,2; 50%
2026( $92.1B)
22©2018 | www.yole.fr | Status of the Advanced Packaging Industry 2018Status of the Advanced Packaging Industry 2021 | Sample | www.yole.fr | ©2021
ADVANCED PACKAGING REVENUE FORECAST 2019-2026
• The Advanced Packaging market was
worth ~$30.4B in 2020 It is
expected to grow at ~ 8%
CAGR2020-2026 to reach ~$47.5B in
2026.
• COVID-19 has no adverse impact,
on the AP market. The market
increased by 4% in 2020 and is
expected to grow strongly (16%) to
reach $35B in 2021.
• Highest revenue CAGR expected
from 3D stacking, fan-out and ED (in
laminate substrate), 22%, 15% and
25%, respectively, as high-volume
products further penetrate the
market -
• FO in mobile, networking,
automotive;
• 3D stacking in AI/ML, HPC,
datacenters, CIS, 3D NAND;
• ED in automotive and mobile.
23©2018 | www.yole.fr | Status of the Advanced Packaging Industry 2018Status of the Advanced Packaging Industry 2021 | Sample | www.yole.fr | ©2021
ADVANCED PACKAGING FORECAST 2019-2026
24©2018 | www.yole.fr | Status of the Advanced Packaging Industry 2018Status of the Advanced Packaging Industry 2021 | Sample | www.yole.fr | ©2021
ADVANCED PACKAGING 2020 WAFER SPLIT BY MANUFACTURER
TEN players, which includes 2 IDMs (Intel, Samsung), a foundry (TSMC), the top 5 global OSATs (ASE, SPIL, Amkor, PTI, JCET) together with Nepes and Chipbond, process approximately 75% of Advanced Packaging wafers.
2020
32.2 M
300 mm eq.
25©2018 | www.yole.fr | Status of the Advanced Packaging Industry 2018Status of the Advanced Packaging Industry 2021 | Sample | www.yole.fr | ©2021
9 415
5 051
4 054
2 712
1 649
1 284
1 031
819
793
702
680
527
523
493
442
423
407
394
362
346
344
319
316
247
212
194
ASE (rev w/SPIL & w/o USI)
Amkor
JCET Group
Powertech Technology
Tongfu Microelectronics
Tianshui Huatian Microelectronics
King Yuan Electronics
ChipMOS Technologies
Chipbond Technology
UTAC
Hana Micron (Rev w/o Hana…
SFA semicon
Greatek Elec
Orient Semiconductor Electronics
Sigurd Microelectronics
Carsem
LB Semicon Inc
AOI Electronics
Tong Hsing
Formosa Advanced Technologies
Ardentec
Unisem Berhad
Nepes Corporation
Inari Amertron Berhad
Walton Advanced Engineering
Lingsen Precision Industries
TOP 26 OSAT ranking by 2020 revenue [M$]
FINANCIAL OVERVIEW FOR TOP 26 OSATS
Revenue in 2020
Top OSATs with heavy
investments were creating a
disparity with the rest of the
pack.
Top 8 OSATs include 3
manufacturer HQ-ed in China, 4
manufacturer HQ-ed in Taiwan
and 1 manufacturer HQ-ed in
US.
UTAC lost its 8th position from
last year. ChipMOS Technologies
has the 8th spot now.
Companies in the tail are at a higher
risk if there is no differentiated
technology or IP for merger and
acquisition as an exit strategy.
Large OSATs were separated from the rest.
Top 8 OSATs continued with heavy investment in CapEx and R&D.
**Note: SPIL included in ASE figures from 2019 onwards
Players not within the Top 8 rankings need to catch up.
Otherwise, they risk being acquired or incurring losses in business.
TSMC ranks between 3rd & 4th
Companies in the tail are at a
higher risk if there is no
differentiated technology or IP
for merger and acquisition as an
exit strategy.
**Note: SPIL included in ASE figures from 2019 onwards
26©2018 | www.yole.fr | Status of the Advanced Packaging Industry 2018Status of the Advanced Packaging Industry 2021 | Sample | www.yole.fr | ©2021
Japan
394
1%
Singapore
702
2%
Malaysia
989
3%
Korea
1 929
6%
US
5 051
15%
China
6 987
21%
Taiwan
17 687
52%
2020 REVENUE DISTRIBUTION BY OSAT HQ
2020 REVENUE DISTRIBUTION BY TOP 26 OSATS
Based on company HQ location (Top 26 OSATs)
Out of Top 25 OSATs, Taiwan-based OSATs contributed more than half of the revenue in 2020 followed by China. US came third, and Korean OSATs were higher than Malaysian.
2020
$33.74B
27
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Fan-Out WLP and PLP Applications and Technologies 2021
Advanced Packaging Quarterly Market Monitor
System-in-Package Technology and Market Trends 2021
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YOLE GROUP OF COMPANIES RELATED REPORTS
Yole Développement
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Sales Team
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Advanced System-in-Package Technology in Apple’s AirPods
Pro
HiSilicon Hi1382 Coherent Processor with ASE’s FOCoS
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YOLE GROUP OF COMPANIES RELATED REPORTS
System Plus Consulting
29
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