standard operating procedure - silanex.com · standard operating procedure thermally conductive...

Simplicity is an expectation

© 2015 Silanex Technology Pty Ltd All right reserved

Silanex Technology is a member of Thermex Group SILANEX is registered trademark of the Silanex Technology

1/9

Standard Operating Procedure

Thermally Conductive Adhesive：Product Name

ST0903 / S100：Product Model

Silanex Technology Pty Ltd：Manufacturer

23rd Mar 2015：Date

Please contact us if any question on this SOP

Kaman Fan：Contact

+61 2 8872 5561：Phone

[email protected]：Email

Remarks: This document covers operating procedure to apply the adhesive Silanex glue on the back side of a LED module.

This may not be the sole operating procedure. Please also read the Technical Specifications and Safety Instructions before using the adhesive glue.

Please always refer to the latest released document. Silanex Technology Pty Ltd All rights reserved

V1.1

50323

mailto:[email protected]




2/9

Index

Notes

1.1 Product Features··················································································································3

1.2 Important Reminders···········································································································3

1.2.1 Operating temperature ················································································································3

1.2.2 External factors························································································································· 4 1.2.3 Surface contaminations ················································································································4

Operating Methods

2.1 Stencil Printing Operation···································································································5

2.1.1 Stencil printer···························································································································5 2.1.2 Glue gun assembly······················································································································5

2.1.3 Stencil printing···························································································································6 2.1.4 Stencil cleaning··························································································································7

2.2 Automatic Dispenser and Chip Mounter Operations·························································7

2.3 Manual and Samples Operations························································································· 8

Disassembly

3.1 Notes on Disassembly ·······································································································9

3.2 Disassembly Steps··············································································································9




3/9

1 Notes 1.1 Product Features

Thermally conductive adhesives ST0903 and S100 are epoxy glue which realizes adhesion by the chemical reaction between epoxide resin and the firming agent.

Significant amount of metal is mixed with the resin to achieve high heat-conducting property and low heat capacity.

Main features: High heat-conducting property and low heat capacity.

An adhesive material with ultra-high bonding strength; It is perfect to achieve adhesion between different material without applying any mechanical part.

ST0903 and S100 polymerized at room temperature or below. This low-temperature curing characteristic prevents

heat sensitive components from thermal damage during assembly process. Cured ST0903 and S100 are electrically insulated which improves the safety class of the products.

ST0903 and S100 are in paste and suitable for automatic dispenser, manual operation and stencil printing.

1.2 Important Reminders 1.2.1 Operating temperature

Thermally conductive adhesives are very susceptible to heat. It is important to follow below storage and operation guideline.

Storage temperature (in unopened original packaging):

Storage temperature Storage life

25℃ avoid light 1 month

-2℃ avoid light 12 months

Visual check

Detection of deteriorated product.

1) Color of glue is not consistent. 2) Bubbles are observed when the glue is squeezed out from the mixing tube.

3) Bubbles are observed inside the hardened glue or the glue has poor adhesion.

Transportation temperature (in unopened original packaging):

Transportation temperature Storage life

50℃ avoid light 14 days

25℃ avoid light 30 days

Please keep open packaging adhesive away from light and heat.

Operating temperature:

Operate the adhesive glue at room temperature (25℃). It could be difficult to squeeze out the adhesive if temperature is too low.

1) Viscosity of the adhesive increases if the room temperature is too high. It is recommended to put the squeezed adhesive aside for 30 minutes before using.

2) Viscosity of the adhesive decreases if the room temperature is too low. It is recommended to slightly heat up the adhesive to reduce the viscosity before using.

Oxidative deterioration Deterioration caused by

storage temperature Qualified Product




4/9

Curing temperature Longer curing time is needed if too much adhesive glue is applied. Following data is just for reference:

Curing temperature Surface drying time Curing time

25℃ 3-5 hours 36 hours

40℃ 1-3 hours 24 hours

60℃ 30 min 4 hours

80℃ 15 min 1 hour

100℃ 10 min 45 min

1) Never apply the adhesive twice. Aging test must be run after the adhesive glue is completely hardened to avoid the LED from peeling-off due to thermal stress.

2) It is suggested to apply the adhesive glue by stencil printing or automation process at production to maintain consistent adhesive glue amount and thickness.

3) It is strongly recommended to apply heat for sample test curing at the first time to ensure a completely hardened adhesive glue.

Warning: Poor bonding and LED peeling-off will occur if the curing temperature or curing time is not sufficient.

1.2.2 External factors

Wires / Optics

Solutions:

Change the production processes to firstly attach LED on the heat sink with adhesive glue. Do not connect any wire and ensure no mechanical force is applied to the LED before the adhesive glue is hardened (surface drying).

Utilize a fixture to hold the LED position if necessary. Use soft wires.

Do not apply screws on the LED (especially before the adhesive is hardened) Use recommended stencil design to ensure right adhesive glue is applied.

Speed up curing by heat.

1.2.3 Surface contaminations

Solutions: Check the contact surfaces of both the LED and the heat sink to ensure no oily substances and/or solder flux is left on

the surface. Do not apply adhesive on any oily surface. Clean the surface with alcohol if oily contamination is found.

Apply the adhesive glue on gloss surfaces only. Polish the rugged area if it is found on the heat sink surface.

Do not apply adhesive glue on an heat sink with rugged surface and dust.

Oily substances could seriously impact on the curing of the adhesive glue and result in system failure.

Wires and optics may easily lift the LED from heat sink if the assembling is done before

the adhesive glue is hardened. This may cause LED overheating and system failure.




5/9

2 Operation Methods 2.1 Stencil Printing Operation 2.1.1 Stencil printer

2.1.2 Glue Gun Assembly

LED mounting tray

Scraper

Remarks: We provide stencil design service to fit for any LED and application requirements

Match the handspike of glue gun with the bayonet Hold the lockset and insert the handspike

Insert the glue into the glue gun

Ready to use

Remarks: Glue tube and mix tube (only one mix tube for each adhesive)

The mixing tube can be reused twice if it is not blocked by cured adhesive

1 2

3 4




6/9

2.1.3 Stencil Printing

Fix the mounting tray with the stencil printing fixture Put LED into the mounting tray

Close the stencil fixture firmly

Apply the adhesives glue onto the platform by glue gun

Remarks: Press the trigger at a constant rate for stable and

well-mixed adhesive output

Use the scraper to scrap adhesive at 45 degree angle

Remarks: Only scrap the LED one time.

It is suggested to wear gloves and keep oily substances away from the whole process

Ensure the adhesive glue are well applied on all LED by visual check, then open the stencil fixture

Attach heat sink with the LED inside the mounting tray

Press the heat sink softly

Lift the heat sink

1 2

3 4

5 6

7 8

9 10




7/9

2.1.4 Stencil Cleaning

To clean the cured adhesive glue, please drop acetone onto the hardened adhesive glue and apply for 5 minutes.

Then clean the stencil with microfiber cloth which contains acetone.

How to deal with surplus adhesive 1) Rub the stencil with microfiber cloth which contains alcohol or toluene until it is clean.

2) A mixing tube can be reused twice if it is not blocked by hardened adhesive. 3) A used mixing tube can be frozen immediately after use.

Do not reuse the mixing tube more than one time.

2.2 Automatic Dispenser and Chip Mounter Operations

Silanex’s adhesive glues are suitable for automatic assembly production operations. The setup normally includes an automatic dispenser and chip mounter.

Please contact us for further discussion if it is required.

Step 2

Real Product Finish

After cleaning Before cleaning

Please clean the stencil with microfiber cloth which contains alcohol or acetone after use.

11 12

Top view Side view




8/9

2.3 Manual and Samples Operations

Warning: Please ensure that oily substances and dust do not exist on the heat sink surface.

It is highly recommended to ware gloves all the time.

Sample package (Net 20-30g) A=14g B=7g

Mix component A with component B at A:B=2:1 ratio.

Carefully apply the LED onto the heat sink and press it softly.

Finish

Apply the glue onto the back side of the LED Mix it up and down until no white color could be seen

1 2

3 4

5 6

Mix repeatedly to ensure uniformity




9/9

3 Disassembly 3.1 Notes on Disassembly

3.1.1 The adhesive glue printing area should be 2mm smaller on each side of the LED substrate to allow easy disassembly.

3.1.2 Keep the whole disassembly away from any flame.

3.2 Disassembly Steps

Bake the heat sink for 5-10 minutes at 100℃

After

Remove the heat sink from the oven and carefully remove the LED

with a flat-bladed screwdriver

Put the heat sink on a workbench and apply appropriate amount of acetone around the LED substrate and heat

sink surface.

Before

1 2

3 4

Remarks:

If adhesive had overflowed, firstly apply appropriate amount of acetone around the edge of LED substrate and apply for 5-10 minutes, then remove the overflowed adhesive before step 1

If the LED is still not removable, once again apply the acetone and further remove the overflowed adhesive Clean the heat sink surface thoroughly before re-attach LED onto the heat sink according to 2.1.3

standard operating procedure - silanex.com · standard operating procedure thermally conductive...

Documents