slhc sensor r&d
DESCRIPTION
sLHC sensor R&D. Module Plans (Nobu) Manufacturing plans, including financing (Nobu) Sensor Specs (Nobu). Masks are done Fabrication is on-going p-FZ(100) p-MCZ(100) 3 wafers each Delivery April Irradiation End April 70 (or 80) MeV p. ATLAS06J fabrication. 150mm wafer p-FZ(100) - PowerPoint PPT PresentationTRANSCRIPT
Y. Unno, 2007/2/26
sLHC sensor R&D• Module Plans (Nobu)• Manufacturing plans, including financing (Nobu)• Sensor Specs (Nobu)
Y. Unno, 2007/2/26
ATLAS06J fabrication• Masks are done• Fabrication is on-g
oing– p-FZ(100)
– p-MCZ(100)
– 3 wafers each
• Delivery– April
• Irradiation– End April
– 70 (or 80) MeV p
Y. Unno, 2007/2/26
ATLAS07
• 150mm wafer– p-FZ(100)
• n-strip isolation– Individual p-stop
• 4 segments– SS: as is– LS: wire-bond segments
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Stereo?
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Edge stereo connection
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ATLAS07 specification
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ATLAS07• Design
– 2 months+?– by May?
• Fabrication– a few months– depends on quantity
• Financing– Mask cost to be shared– No. wafers=Cost share– Invoices
• Japan: KEK
• Outside Japan: CERN TID
• My big question mark– Readout ASIC?
• Irradiation campaign– CYRIC (70-80 MeV p)
• (April), Aug, Nov,Mar
– PSI (pions)– Neutrons
• Dummy ATLAS07– Al metal only– Who are interested?– How many?– Financing with same mod
el
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ATLASxx plan• 2007 3-5 Design of pre-prototype (Barrels)• 2007 6-9 Fabrication of pre-prototype• 2007 9- Irradiation, Module fabrication a
nd evaluation• 2008 3-6 Design of prototype (Barrels, En
dcaps)• 2008 6-10 Fabrication of prototypes• 2008 10- Irradiation, Module fabrication a
nd evaluation, beamtests• 2010 2 TDR
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Sensor parameters for ASIC
• 1-MeV neq /cm2 • Fluence by particles
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Sensor parameters for ASIC• Constraint from HV
cable rating– 500 V– (1 kV tested)
• Sensor operation– <500 V
• Parameters for ASIC– at 500 V– Preliminary
Y. Unno, 2007/2/26
Sensor parameters for ASIC
• Preliminary!!!
pFZ initial pFZ 5x1014 pFZ 9x1013 pMCZ Initial pMCZ 5x1014 pMCZ 9x1014
Coupling type to amplifier AC <- <- AC <- <-
Coupling capacitance to amp Total for 2.4, 4.8, 9.6 cm strips
20 pF/cm 48, 96, 192 pF
<- <- 20 pF/cm 48, 96, 192 pF
<- <-
Capacitance of strip to all neighbour strips 1.03 pF/cm <- <- 1.03 pF/cm <- <-
Capacitance of strip to backplane 0.30 pF/cm 0.42 pF/cm 0.48 pF/cm 0.4 pF/cm 030 pF/cm 0.33 pF/cm
Metal strip resistance 15 /cm <- <- 15 /cm <- <-
Bias Resistor 1.5 M <- <- 1.5 M <- <-
Max leakage current per strip for shot noise
2.4, 4.8, 9.6 cm strips
0.5, 1, 2 nA 0.3, 0.6, 1.2 µA 0.5, 1, 2 A 0.5, 1, 2 nA 0.3, 0.6, 1.2 µA 0.5, 1, 2 A
Charge collection efficiency (at 500 V) 1 0.6 0.45 0.6 0.85 0.6
Charge collection time < 10 ns <- <- < 10 ns <- <-
Y. Unno, 2007/2/26
Module plan• Modules
– have to have– ABCN
• when?
– hybrids• develop along with A
BCN
– fabrication of modules
• time scale uncertain
• Staves– ?