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Page 1: Semicon eu 2010
Page 2: Semicon eu 2010

Global and European Market and

SEMICON Europa 2010 Webinar

Our program will begin momentarily…

Page 3: Semicon eu 2010

SEMICON Europa 2010 Webinar

Beat Mueller

Director, Members Relations

Page 4: Semicon eu 2010

Agenda

1. Welcome and Introduction

– Beat Mueller / Director Member Relations, SEMI Europe

2. Global/European Market Update

– Dan Tracy / Sr. Director, SEMI HQ

3. SEMICON Europa Update

– Heinz Kundert / President, SEMI Europe

4. SEMICON Europa Program Update

– Carlos Lee, Sr. Manager, SEMI Europe

5. Q&A

Page 5: Semicon eu 2010

Semiconductor Industry Update

Dan Tracy

Senior Director, Industry Research and Statistics, SEMI

Page 6: Semicon eu 2010

Record IC Unit Shipments

Source: WSTS/SIA

Chip demand drives material consumption and capital investment

IC Unit (3-month average)

and ASP Trends

0.0

2.0

4.0

6.0

8.0

10.0

12.0

14.0

16.0

Jan-03

Mar-03

May-03

Jul-03

Sep-03

Nov-03

Jan-04

Mar-04

May-04

Jul-04

Sep-04

Nov-04

Jan-05

Mar-05

May-05

Jul-05

Sep-05

Nov-05

Jan-06

Mar-06

May-06

Jul-06

Sep-06

Nov-06

Jan-07

Mar-07

May-07

Jul-07

Sep-07

Nov-07

Jan-08

Mar-08

May-08

Jul-08

Sep-08

Nov-08

Jan-09

Mar-09

May-09

Jul-09

Sep-09

Nov-09

Jan-10

Mar-10

Billions of Units

$0.00

$0.50

$1.00

$1.50

$2.00

$2.50

US$

IC Units

IC ASP

Page 7: Semicon eu 2010

Market Drivers

• On-going recovery in economy, though concerns remain (debt, unemployment, economic growth in 2H 2010?, etc.)

• Electronics market growth (Gartner)

– PC unit production to grow 22% in 2010

– Cell phone unit production to grow 14%

• Improving fab utilization

– 93% in 1Q per SICAS

• Firm average selling prices overall

– Rising ASP for DRAM

Page 8: Semicon eu 2010

2010 Semiconductor Revenue Forecasts-Outlook at the New Year

Source: SEMI

10.4%

12.2%

13.0%

14.0%

15.0%

22.0%

22.4%

10.2%

0% 5% 10% 15% 20% 25% 30% 35%

SIA (Nov 09)

Henderson Ventures (Jan 10)

WSTS (Nov 09)

Gartner (Nov 09)

VLSI Research (Dec 09)

IC Insights (Jan 10)

Semico Research (Jan 10)

Future Horizons (Dec 09)

Page 9: Semicon eu 2010

2010 Semiconductor Revenue Forecasts-Updated Outlook

Source: SEMI

32.7%

28.6%

27.1%

25.0%

27.0%

29.8%

31.0%

28.4%

0% 5% 10% 15% 20% 25% 30% 35%

SIA (Jun 10)

Henderson Ventures (Jun 10)

WSTS (Jun 10)

Gartner (Jun 10)

VLSI Research (May 10)

IC Insights (May 10)

Semico Research (May 10)

Future Horizons (May 10)

Page 10: Semicon eu 2010

Semiconductor Cycles-2010 will be a record year

3345 49 51

55 6077

102

144132137126

150

204

139141

166

228

256249

318

226

309291

248

213

$0

$50

$100

$150

$200

$250

$300

$3501987

1988

1989

1990

1991

1992

1993

1994

1995

1996

1997

1998

1999

2000

2001

2002

2003

2004

2005

2006

2007

2008

2009

2010F

2011F

2012F

-50%

-25%

0%

25%

50%

75%

100%

Semiconductor Revenue Annual Growth

Source: SIA/WSTS historical year end reports, SIA June 2010 Forecast

Global Semiconductor Revenue US $B

(bar graph)

Annual Growth % (line graph)

Page 11: Semicon eu 2010

Fab Spending-More than doubling from 2009

Source: SEMI World Fab Forecast, May 2010

Equipment Spending on Front End Facilities

$-

$5

$10

$15

$20

$25

$30

$35

$40

$45

2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010

US $ Billion

-60.0%

-40.0%

-20.0%

0.0%

20.0%

40.0%

60.0%

80.0%

100.0%

120.0%

140.0%

Change (YoY) Taiwan

SE Asia

S. Korea

Japan

Europe &Mideast

China

Americas

Change %

• Top spenders: Samsung, GLOBALFOUNDRIES, Intel, TSMC, Hynix, and Toshiba • 45/40 capacity ramp on-going; investments in 32 nm and below• Capacity to increase 8% in 2010 and 7% in 2011• US$1.3 billion in spending for LED fabs

Page 12: Semicon eu 2010

Fab Equipment Spending in Europe

$-

$500

$1,000

$1,500

$2,000

$2,500

$3,000

2007 2008 2009 2010 2011

US$ Millions

Source: SEMI World Fab Forecast May 2010

• ~170% increase in 2010

• GLOBALFOUNDRIES:• 45/40 nm ramp• preparing for 28 nm• new plans for Dresden expansion

• ST Micro:• Crolles2, 32 nm prototype

• Bosch:• 200 mm fab

• IMEC: • Extension of 300 mm

Page 13: Semicon eu 2010

Packaging and Test Equipment Spending in Europe

$0.0

$100.0

$200.0

$300.0

$400.0

$500.0

$600.0

Europe 545 421 188 260 300

2007 2008 2009 2010F 2011F

US$ Millions

Source: SEMI

Page 14: Semicon eu 2010

Semiconductor Materials Market in Europe

$0.0

$0.5

$1.0

$1.5

$2.0

$2.5

$3.0

$3.5

$4.0

Europe 3.68 3.32 2.52 2.89 3.09

2007 2008 2009 2010F 2011F

US$ Billions

Source: SEMI Materials Market Data Subscription May 2010

Page 15: Semicon eu 2010

Summary

• Record year for semiconductor sales and unit shipments, continuing growth in 2011

• Strong capital/equipment spending plans

– Ramping advanced technologies

– Capacity expansion

• European market

– Investing in advanced technologies

– $5 billion per year to be spent on semiconductor equipment and materials in both 2010 and 2011

Page 16: Semicon eu 2010

SEMICON Europa 2010 Update

Heinz Kundert

President, SEMI Europe

Page 17: Semicon eu 2010

SEMICON Europa 2010 Overview

• Date: October 19-21, 2010

• Location: Messe Dresden, Germany

– GLOBALFOUNDRIES and Infineon fabs and 240 related semiconductor companies nearby

• Exhibition and related conference

• New for 2010: Co-located with Plastic Electronics Conference

Page 18: Semicon eu 2010

Investment in Europe

• Big investment in Europe – spending over US$2.8 billion expected this year*

– GLOBALFOUNDRIES (Dresden)—$1.35B

• Recently announced a new 300 mm fab plan to increase capacity to 80,000 wpm

– Intel $740M (includes Israel)

– ST ~$200M

– IMEC ~$150M

– Bosch ~$80M

• SEMICON Europa continues to be the most important semiconductor industry event in Europe *Source: World Fab Forecast, SEMI

Page 19: Semicon eu 2010

Attendee Profile

• SEMICON Europa is an international and pan-European event

– 6000+ professional attendees

– 50+ countries represented

– Buying teams and engineers from all major European Fabs

– 50% represent Management Level

– 65% are involved in Product Selection and Purchasing Decisions

Page 20: Semicon eu 2010

SEMICON Europa 2010:Focused on hot topics and critical industry issues

• MEMS/MST Applications

• Advanced Packaging

• Test

• Solid State Lighting

• Foundries Manufacturing Challenges

• Fab Enhancement and Improvement

• Research and Development

Page 21: Semicon eu 2010

SEMICON Europa 2010:Special Interest Pavilions

• Science Park / European Research and Development Centers

• MEMS Pavilion

• Packaging and Test Pavilion

• Secondary Equipment Pavilion

• French Pavilion

• Silicon Saxony Pavilion

• Scottish Pavilion

• New York Loves Nanotech Pavilion

• SEMI Pavilion

Page 22: Semicon eu 2010

New for 2010:Plastic Electronics Conference

• The co-location with the Plastic Electronics Conference makes use of many synergies the two events are offering

• Learn more about tomorrow's technology and applications

• Connect with 500+ conference attendees from this emerging industry

Page 23: Semicon eu 2010

Semiconductors matter in Europe

• SEMICON Europa is the ideal forum for the industry to meet and to collaborate on common interests and issues including:

– European competitiveness

– Collective identity

– European Commission initiatives (e.g. Key Enabling Technologies)

– Maintaining powerful ecosystems

– Collaboration of Clusters

– European R&D projects

– Individual initiatives

Page 24: Semicon eu 2010

SEMICON Europa:Your Platform for Success

• No other event in Europe offers you the same great opportunitiesat one time under one roof:

– Meet with new and existing customers

– Meet with your OEM partners

– Showcase your products and brand

– Network among industry peers

– Demonstrate and learn about new technologies

– Learn about industry trends

– Maintain and enlarge your network

Page 25: Semicon eu 2010

SEMICON Europa 2010

Programs Update

Carlos Lee

Senior Manager, SEMI Europe

Page 26: Semicon eu 2010

SEMICON Europa 2010:Programs

• 41 programs and events scheduled

– 12 Technology conferences

– 13 Free technology and standardization sessions

– 4 Executive and networking events

– 12 Courses

• Key Segments at SEMICON Europa

– Semiconductor front-end and back-end

– MEMS Micro-Electro-Mechanical Systems

– Plastic Electronics

Page 27: Semicon eu 2010

Leading companies presenting at SEMICON Europa 2010

• Altis

• Bosch

• CSR (Cambridge Silicon Radio)

• GLOBALFOUNDRIES

• Intel

• Lfoundry

• Nanium

• Numonyx

• Osram

• Texas Instruments

• X-Fab

• Analog Devices

• Colibrys

• Freescale

• Infineon

• IBM

• Micron

• Nokia

• NXP

• STMicroelectronics

• Thales

Companies that have confirmed their participation in conferencesand programs at SEMICON Europa 2010 include:

Page 28: Semicon eu 2010
Page 29: Semicon eu 2010
Page 30: Semicon eu 2010

Segments/Hot Topics• Semiconductor

– Front-End/Wafer Processing

• New Materials• Automation and Process Control • Metrology• Lithography• Refurbished Equipment• 450mm

– Back-End/Test, Assembly & Packaging

• Integrated analog/mixed signal test; improvements in test operations; docking and mounting

• Packaging technologies for system integration; embedded wafer level packaging; alternative device packaging

• MEMS

– MEMS applications; manufacturing strategies and challenges; MEMS process technologies

• Plastic Electronics

Sponsors

www.semiconeuropa.org/ProgramsandEvents

Page 31: Semicon eu 2010

Technical Conference Keynotes

• "Trends for Automotive Micromechanical Sensors" – Bosch

• "Monolithic to Multi Chip: Smart Partitioning" – Analog Devices

• "III-V and III-V on Si for Future Nanoelectronics" – Intel

• "Systems Design Drives Package Design, Drives Silicon Design" – CSR

• "Revolution and Evolution of Consumer MEMS Applications" –Bosch Sensortec

• "High Brightness Phosphor Converted White LEDs" – OsramOpto Semiconductors

• "RF and Optoelectronic System Applications of Compound Semiconductors" – Thales

• "Substitute Materials for High-Lead Solders" – Robert Bosch GmbH

Page 32: Semicon eu 2010

TechARENA

• Free technical sessions and exhibitor presentations

– New Materials

– Automation and Process Control

– Metrology

– Lithography

– Secondary equipment, services, and technology

– Exhibitor presentations

• Exhibitor presentation topics: Materials, automation and process control, MEMS, materials, test, packaging, lithography, refurbished equipment

Sponsors

Page 33: Semicon eu 2010

Exhibitor Opportunities:Get engaged, get connected

• TechARENA exhibitor presentation opportunities– MEMS

– Test

– Packaging

– R&D

– Metrology

– Materials

– Process control/Automation

– Lithography

– Refurbished/secondary equipment

• Standards meetings– Compound Materials

– Silicon Wafer

– Gases and Liquid Chemicals

– Equipment Automation

– Environmental, Health, and Safety

SEMICON Europa is your

platform for exchanging

information and driving

technology advancements

forward

Page 34: Semicon eu 2010

Summary Programs Update

• 41 Programs and Events

• Key segments

– Semiconductor front-end and back-end

– MEMS Micro-Electro-Mechanical Systems

– Plastic Electronics

• All major European fabs present

www.semiconeuropa.org/ProgramsandEvents

Page 35: Semicon eu 2010

Plan now to exhibit!

• Contact us:

– Exhibition and Sponsorship ContactsBeat Mueller [email protected] Raithel [email protected]

– Programs and Standards ContactCarlos Lee [email protected]

www.semiconeuropa.org