2010 may fastech semicon marketing presentation

Building Assembly, Packaging and Test Solutions for our Global Partners

FASTECH SYNERGY LTDFASTECH SYNERGY LTD

Leading-edge Solutions for Niche CustomersLeading-edge Solutions for Niche CustomersLeading-edge Solutions for Niche CustomersLeading-edge Solutions for Niche Customers


26 years in Semiconductor Manufacturing business with 900+ employees

Established in 1983 as Circuit Packaging Inc. Renamed as Fastech in 1989.

Acquired Tag Semiconductor Philippine operations in 1993

IPO and listing in the Singapore Stock Exchange in 1999.

Consolidated factory operations from 3 to 1 location in 2001

Expanded RF Microwave operations in 2004

Certified to TS16949:2002 and ISO9001:2000 in 2006

Established Precision Machining for RF/Microwave customer in January 2007

Expanded capacity by 25% on 3 major package in 2007

Introduced 5 new packages on Power packages in 2007

MACOM/Tyco test transfer of all Mixer products at Fastech.

Microsemi Scottsdale line transfer of all CBU products

CASCO automotive sensor products, production orders from Volvo, Audi and BMW Europe.

2007 Sales US$ 14.2M / 2008 Sales US$11.6M / 2009 US$ 5M

Quick Facts about FASTECHQuick Facts about FASTECH……Quick Facts about FASTECHQuick Facts about FASTECH……


A recognized leader in outsource manufacturing & A recognized leader in outsource manufacturing & test for RF/Microwave components, systems and test for RF/Microwave components, systems and modules, and hybrid assembly products. modules, and hybrid assembly products.

Maintain a long-term relationship of trust and Maintain a long-term relationship of trust and confidence with our customer and supplier.confidence with our customer and supplier.

VisionVisionVisionVisionVisionVisionVisionVision

MissionMissionMissionMissionMissionMissionMissionMission

Achieve reasonable returns for our shareholders in Achieve reasonable returns for our shareholders in a a work environment where employees are work environment where employees are respected, respected, listened to, recognized, involved and listened to, recognized, involved and motivated. motivated.

Company IntroductionCompany IntroductionCompany IntroductionCompany Introduction


• Total Area (Building 1 & 2) Total Area (Building 1 & 2) : 145,300 square feet : 145,300 square feet• Addt'l. Available Area (Building 3)Addt'l. Available Area (Building 3) : 155,700 square feet : 155,700 square feet• Total Land AreaTotal Land Area : 300,000 square feet : 300,000 square feet

Bldg 3 - Corporate Office Bldg 2 – RF and Microwave Modules Division

Manufacturing ComplexManufacturing ComplexManufacturing ComplexManufacturing ComplexAmpere St. cor. West Road, Light Industry & Science Park I, Ampere St. cor. West Road, Light Industry & Science Park I,

Cabuyao, Laguna, Phils.Cabuyao, Laguna, Phils.Ampere St. cor. West Road, Light Industry & Science Park I, Ampere St. cor. West Road, Light Industry & Science Park I,

Cabuyao, Laguna, Phils.Cabuyao, Laguna, Phils.

Bldg 1 – Semiconductor Division

Building Assembly, Packaging and Test Solutions for our Global PartnersManagement Management

TeamTeamOFFICE OF THE CHIEF EXECUTIVE

SATURNINO G. BELEN JRCEO / PRESIDENT

BUSINESS UNIT BUSINESS SUPPORT

[ SALES & MARKETING & [ SALES & MARKETING & CUSTOMER SERVICE]CUSTOMER SERVICE]

[ SEMICONDUCTORS ][ SEMICONDUCTORS ] [RF & MICROWAVE ][RF & MICROWAVE ]

OFFICE OF THE PRESIDENTPRIMO MATEO

CFO - COO

BONG SADURAL Vice President

21 years

ERWIN O. MANIBOGExecutive Director

25 years

ARLENE S. SAUDIARLENE S. SAUDIVice- PresidentVice- President

15 years

[ HRMD ][ HRMD ]

WALTER AGCAMBERTVice President

22 years

CORPORATE QA/REL

RENE I. DELA CRUZExecutive Director

20 years

ODESSA T./ SALLY L./ RIZA R.QA Supervisors

[ SEMICON and RF MICROWAVE ][ SEMICON and RF MICROWAVE ]


Fastech Human ResourcesFastech Human Resources(Semiconductor / RF Microwave)(Semiconductor / RF Microwave)

As of June 2010As of June 2010

Fastech Human ResourcesFastech Human Resources(Semiconductor / RF Microwave)(Semiconductor / RF Microwave)

As of June 2010As of June 2010

561+ hi561+ highly-skilled and English-speaking employeesghly-skilled and English-speaking employees

88 Senior ManagementSenior Management

9 9 ManagersManagers

9 9 Technical Supervisors Technical Supervisors

31 31 EngineersEngineers

4444 Technicians Technicians

19 19 Administrative StaffAdministrative Staff

63 63 Non-Technical StaffNon-Technical Staff

378 378 Operators/ AssemblersOperators/ Assemblers


Human Resources FocusHuman Resources FocusHuman Resources FocusHuman Resources Focus

Engineering ScholarshipEngineering Scholarship

In-House Masters Program on Engineering courses In-House Masters Program on Engineering courses

Continuing Education ProgramContinuing Education Program

Advanced Technical TrainingAdvanced Technical Training

Team Building SeminarsTeam Building Seminars

Technical Ladder for Technicians and EngineersTechnical Ladder for Technicians and Engineers

Cadetship Engineers ProgramCadetship Engineers Program


Operating PillarsOperating PillarsOperating PillarsOperating Pillars

TQM – SEVEN ADVOCACY GROUPSTQM – SEVEN ADVOCACY GROUPS•Customer Focus

•TPM•ESD•IT

•Employee Empowerment•Environmental/Health/Safety

•5S

PRODUCTIVITYPRODUCTIVITY•Direct Labor & staff productivity thru IPR(DL800+; IDL150+)

•Integrated with Monthly Performance Appraisal(Individual/Team)•Results tied up to Incentive Programs

TECHNICAL COMPETENCY:TECHNICAL COMPETENCY:•Establish Technical position ladder•Technical Staff membership (10)

•Semi annual Key Technical Employee (KTE) summit/awards (40+papers)


Management Information SystemManagement Information System

• Integrated – Finance, Distribution and Manufacturing Systems

• 30+ segregated access terminals

Enterprise Resource Program (JD Edwards)Enterprise Resource Program (JD Edwards)

12 Support Information Systems in:12 Support Information Systems in:

• HRIS, Training, Quality, Maintenance and Test Engineering

System Infrastracture:System Infrastracture:

• Secured access by 300+ users in 250 terminals in the Factory

• T1 connection with back-up (Dial-up)

• Redundant Hardwire system on 15 servers


Management Information SystemManagement Information System


Quality MilestonesQuality MilestonesQuality MilestonesQuality Milestones

Major Customer CommendationsMajor Customer Commendations

Valpey Fisher CorporationValpey Fisher Corporation Best Supplier Best Supplier 20082008

Advanced Control ComponentsAdvanced Control Components Best SupplierBest Supplier 20082008

RFS/Alcatel RFS/Alcatel Best Supplier Best Supplier 20072007

Semtech Corporation Semtech Corporation Best QualityBest Quality 20082008

Macom/TycoMacom/Tyco Best SupplierBest Supplier 20072007

Maxim/Dallas (power modules)Maxim/Dallas (power modules) Best SupplierBest Supplier 20072007

Tyco / MACOM Best Supplier Award Tyco / MACOM Best Supplier Award MACOM Microwave GroupMACOM Microwave Group 2001/ 20032001/ 2003

Golden Shell Award Golden Shell Award Dept of Trade & Industry, Phils Dept of Trade & Industry, Phils 1995/ 20001995/ 2000


Quality MilestonesQuality MilestonesQuality MilestonesQuality Milestones

Certification/AwardCertification/Award Certifying Body Certifying BodyTS14969:2000TS14969:2000 TUV Nord TUV Nord 20072007

ISO 9001:2000ISO 9001:2000 TUV NORD TUV NORD 20072007

ISO/ TS16949 ISO/ TS16949 TUV NORD TUV NORD 2006 2006

RoHs CompliantRoHs Compliant 2005 2005

IPC-A-610 IPC-A-610 IPC / EPTAC IPC / EPTAC 2005 2005

IPC-J-STDIPC-J-STD IPC / EPTAC IPC / EPTAC 2005 2005

IBM Audit IBM Audit DALLAS/MAXIM DALLAS/MAXIM 2005 2005

Quality Systems ApprovalQuality Systems Approval HERLEY-CTI HERLEY-CTI 20062006

Quality Systems ApprovalQuality Systems Approval VALPEY FISHER VALPEY FISHER 20062006

Quality Systems ApprovalQuality Systems Approval ALCATEL FERROCOM ALCATEL FERROCOM 20062006

Quality Systems ApprovalQuality Systems Approval TEMEX FRANCE TEMEX FRANCE 20042004

Quality Systems ApprovalQuality Systems Approval CHELTON UK CHELTON UK 20042004

QS9000QS9000 TUV TUV 20032003

Quality System Review (Level 2)Quality System Review (Level 2) MACOM /Tyco MACOM /Tyco 20002000

IBM Audit IBM Audit (RF / Microwave)(RF / Microwave) modules modules 19991999

Quality System ApprovalQuality System Approval DALLAS/MAXIM DALLAS/MAXIM 19981998

Building Assembly, Packaging and Test Solutions for our Global PartnersQuality MilestonesQuality MilestonesQuality MilestonesQuality MilestonesCertification/ AwardCertification/ Award

20102010Fujitsu Quality Laboratory Ltd Audit Fujitsu Quality Laboratory Ltd Audit March 2010March 2010Broadband Amplifiers productsBroadband Amplifiers products

20092009Nokia Siemens Audit Nokia Siemens Audit (Broadband Wireless Group) (Broadband Wireless Group) February February 20092009Sony Japan (Power IC Group) Sony Japan (Power IC Group) March 2009March 2009NEC Audit (Microwave Group)NEC Audit (Microwave Group) June 2009June 2009Emerson Audit (Semicon/IC Group)Emerson Audit (Semicon/IC Group) October 2009October 2009

20082008Miyoshi Electric/ Sony Japan Quality Systems AuditMiyoshi Electric/ Sony Japan Quality Systems Audit December 2008December 2008Advanced Control Components - Quality Systems Approval Advanced Control Components - Quality Systems Approval October 2008 October 2008 Semtech/Huawei China Quality AuditSemtech/Huawei China Quality Audit August 2008August 2008Microsemi Quality Audit Microsemi Quality Audit July 2008July 2008Emerson Power/ Astec Quality Audit Emerson Power/ Astec Quality Audit July 2008July 2008Semtech / Canon Japan Quality AuditSemtech / Canon Japan Quality Audit May 2008May 2008

20072007RFS/ Alcatel Ferrocom / Motorola Quality Audit RFS/ Alcatel Ferrocom / Motorola Quality Audit November 2007November 2007M/A COM Tyco/ NTT Japan Quality Audit M/A COM Tyco/ NTT Japan Quality Audit October 2007October 2007Semtech / Sharp Japan Quality AuditSemtech / Sharp Japan Quality Audit October 2007October 2007Amplifier Solution Corp - Quality System Approval Amplifier Solution Corp - Quality System Approval April 2007April 2007

Building Assembly, Packaging and Test Solutions for our Global PartnersCustomer Milestones Customer Milestones Semiconductor GroupSemiconductor Group

Customer Milestones Customer Milestones Semiconductor GroupSemiconductor Group

96 97 98 99 00 01 02 03 04 05 06 96 97 98 99 00 01 02 03 04 05 06 07 08 09 07 08 0996 97 98 99 00 01 02 03 04 05 06 96 97 98 99 00 01 02 03 04 05 06 07 08 09 07 08 09

MICROSEMI MICROSEMI

SEMTECH / FAGOR SEMTECH / FAGOR

SMARTEC/ VITESSE / TIMEX SMARTEC/ VITESSE / TIMEX

CATALYSTCATALYSTAME / HONEYWELLAME / HONEYWELL

ATMEL / API / EMMATMEL / API / EMM

Semiconductor ComponentsSemiconductor Components

TYCO ELECTRONICSTYCO ELECTRONICSRICHTEKRICHTEK

ST MICROELECTRONICS (ST MICROELECTRONICS (Grenoble)Grenoble)

MICROELECTRONICS (MICROELECTRONICS (Catania & Tours) Catania & Tours)

BOURNS U.K.BOURNS U.K.SEMELAB UK / CASCOSEMELAB UK / CASCOCENTRAL SEMI / SUPERTEXCENTRAL SEMI / SUPERTEX

CLARE / IXYSCLARE / IXYSLITTELFUSE/ TECCORLITTELFUSE/ TECCORAOS/ QSPEED / AMS AOS/ QSPEED / AMS FUJIMOTO INC / FUJI ELECTRIC INCFUJIMOTO INC / FUJI ELECTRIC INC

VISHAYVISHAYIES AUSTRALIAIES AUSTRALIAMICOSEMI – APTMICOSEMI – APTMICROSEMI – SCOTSDALEMICROSEMI – SCOTSDALESEMEFAB SCOTLANDSEMEFAB SCOTLANDE2VE2V

HENDONHENDONTRANSFORMTRANSFORM


Customer MilestonesCustomer MilestonesRF / Microwaves GroupRF / Microwaves Group

Customer MilestonesCustomer MilestonesRF / Microwaves GroupRF / Microwaves Group

96 97 98 99 00 01 02 03 04 05 06 07 08 0996 97 98 99 00 01 02 03 04 05 06 07 08 09 96 97 98 99 00 01 02 03 04 05 06 07 08 0996 97 98 99 00 01 02 03 04 05 06 07 08 09

RF / Microwave Components & Module AssemblyRF / Microwave Components & Module Assembly

MAXIM/ DALLASMAXIM/ DALLASM/A COM / TYCO (MA/ SJ)M/A COM / TYCO (MA/ SJ)

CHELTON U.K.CHELTON U.K.

TELEDYNE/ COUGARTELEDYNE/ COUGAR

HERLEY – CTIHERLEY – CTIRLC ELECTRONICS RLC ELECTRONICS MICRONETICS MICRONETICS ALCATEL FERROCOM/ LUCENT ALCATEL FERROCOM/ LUCENT VALPEY/ FISHERVALPEY/ FISHERADVANCED CONTROL COMPONENTSADVANCED CONTROL COMPONENTS

TEMEX CERAMICSTEMEX CERAMICS

TEMEX MICROSONICSTEMEX MICROSONICS

HETRONIC MALTAHETRONIC MALTAFIRST SUMIDEN CIRCUITS FIRST SUMIDEN CIRCUITS RALTON ELECTRONICSRALTON ELECTRONICS

CENTELLAXCENTELLAXAMPLIFIER SOLUTIONSAMPLIFIER SOLUTIONSTRAK MICORWAVETRAK MICORWAVE

TRIQUINT/ WJTRIQUINT/ WJRFS / ALCATELRFS / ALCATEL

SILICON CRYSTALSILICON CRYSTAL


Power DiscretesPower

Discretes

SOT Micro Packages SOT

Micro Packages Copper Strap

PackagesCopper Strap

Packages

Metal Can OPTOELECTRONICS /

POWER

Metal Can OPTOELECTRONICS /

POWER

Hybrid Power Packages

Hybrid Power Packages

Opto Sensor Clear Packages

Opto Sensor Clear Packages

Semicondutor

CORE COMPETENCE

Semicondutor

CORE COMPETENCE

Core Competence Core Competence Core Competence Core Competence

SemiconductorSemiconductor


RF Isolators / Circulators

RF Isolators / Circulators

RF FiltersRF Filters

RF VCO/ OCXO/ Oscillators

RF VCO/ OCXO/ Oscillators

RF/ Microwave CORE

COMPETENCE

RF/ Microwave CORE

COMPETENCE

RF Mixers / Dividers

RF Mixers / Dividers

VTDRO/PDROVSSVTDRO/

PDROVSS

LNA AmplifiersLNA AmplifiersAttenuatorsAttenuators

Power LimitersPower Limiters

LNA AmplifiersLNA AmplifiersAttenuatorsAttenuators

Power LimitersPower Limiters

Core CompetenceCore Competence

RF/ MicrowaveRF/ Microwave


SEMICON MANUFACTURING EXPERTISESEMICON MANUFACTURING EXPERTISE

I.I. Power DiscretePower Discrete1. TO-220 3L/5L Au/Al2. TO-263 3L/5L Au/Al3. TO-252 3L/5L Au/Al4. TO-251 3L/5L Au/Al5. TO-247 3L Al6. TO-264 coming 2011 Al

7. TO-268 coming 2011 Al8. TO-3P coming 2012 Al9. SOT-223 Au

10. SOT-89 Au11. SOT-23 3/5/6L Au12. SO-813. SO-14/1614. SMA/ SMB/ SMC15. Axial

II.II. Opto Sensors/ITSOpto Sensors/ITS1. SO-8 Clear Package2. SO-16 Black Transmissive3. Custom Automotive Package4. Metal Cans TO-18/TO-72/TO-39

III.III. Thermally Enhanced PackageThermally Enhanced Package1. TO-220 Dual Die w/ DBC2. TO-247 Dual Die w/ DBC3. SO-8 EHS Clip coming 20114. DPAK Clip coming 2011


POWER POWER PackagesPackages

TO92 2L/3L3L TO252 (DPAK)

5L TO252(DPAK)

3L TO252(IPAK)

3L TO263(DDPAK)

5L TO263(DDPAK)

3L TO220Standard

5L TO220Standard

3L TO220 B/CNIA/ISOATO202 V1 TO202 V3

TO3

MICRO MICRO PackagesPackages

SOT23 3L SOT23 5L SOT89 SOT223

Annual Capacity of 600 Million units

TSOT25 5L SOT23 6L


NEW PACKAGE NEW PACKAGE CAPABILITIESCAPABILITIES

TO-247 Standard / Max PLAD (Plastic Large Area Device)

AXIAL

SMB SMC


Integrated Circuits &Integrated Circuits &

OptoelectronicsOptoelectronics

5L SIP

8L SIP 8L SOIC

16L SOIC

CUSTOM CLEAR & DIP PACKAGES


Wafer Wafer Plus Plus

ServicesServices

WAFER PLATEWAFER PLATE

WAFER SORTWAFER SORT

WAFER SAWWAFER SAW

WAFER PROBEWAFER PROBE

WAFER BACKGRINDWAFER BACKGRIND


Handler and ProberHandler and ProberHandler and ProberHandler and Prober

Package Model Configuration / Capability PACKAGINGDPAK MCT3608 Ambient or Dual – Temp; Single site Bulk, tubeIPAK MCT3608 Ambient or Dual -Temp; Single site Bulk, tubeT0263 3Ld/5Ld MCT3608 Ambient ; Single site Bulk, tubeT0220 Tesec 8512PH Ambient ; 4 test site Bulk, tube

Tesec 8307MK Ambient ; Dual function (Test/Mark) Bulk, tubeT0202 Tesec 8017PH Ambient ; Single test Bulk, tube

• Gravity:

Package Model Configuration / Capability PACKAGING T092 TSM THD111 Ambient ; Single test Bulk Tesec 906 Ambient ; Single test Bulk Tesec 786 Ambient ; Single test BulkSOT89 Shinja JT100 Ambient ; Single test BulkSOT23 3Ld Tesec 9718HT Ambient ; In-line (Test/Mark/Reel) Bulk, TNR Ismeca NT216 Ambient ; In-line (Test/Mark/Reel) Bulk, TNRSOT23 5Ld/6Ld Tesec 9718HT Ambient ; In-line (Test/Mark/Reel) Bulk, TNR Ismeca NT216 Ambient ; In-line (Test/Mark/Reel) Bulk, TNRSOT223 Tesec 9718HT Ambient ; In-line (Test/Mark/Reel) Bulk, tube, TNR

• Bowl Feed:


Wafer ProbingWafer ProbingAssembly / PackagingAssembly / PackagingCustom Package DevelopmentCustom Package DevelopmentFinal TestFinal TestProduct EngineeringProduct EngineeringNew Product DevelopmentNew Product DevelopmentFailure AnalysisFailure AnalysisProduct ReliabilityProduct ReliabilityComponent/ Logistics OutsourcingComponent/ Logistics OutsourcingDrop Shipment/ WarehousingDrop Shipment/ Warehousing

Packaging & Test Turnkey ServicesPackaging & Test Turnkey Services

Packaging & Test Turnkey ServicesPackaging & Test Turnkey Services


TEST/ADDED VALUE SERVICESTEST/ADDED VALUE SERVICES

Test Program Generation and Hardware Development

Test Program Debugging and Optimization

Test Program Platform Conversion

New Device Correlation and Qualification

In depth Product Engineering

24-Hour Failure Analysis

Test Yield Improvements

FT Data Logs and Statistical Analysis

Correlation to Wafer Probe and Fab Yields

Primary Test Platforms TMT, LTX and TESEC

Delta Vf, UIL/UIS and Trr tests for MOSFET devices


Test EquipmentTest EquipmentTest EquipmentTest Equipment

Tester / Mdl Mode Type CapabilityTMT ASL 1000 Serial

(Single head)Mixed Signals 100A, 45V (std)

or ±850V maxLTX TS88 Serial

(Four heads)Mixed Signals 10A, 60V max

Tesec 941TT 4 - Serial 2 - Systems

Discrete 50A, 1KV max

Tesec 941TT w/ Vreg

4 - Serial 2 - Systems


Tesec 881TT Serial (Five heads)


Lorlin Double Impact

Serial Discrete 60A, 2KV max


Package Model Configuration / Capability PACKAGING T0202 Tesec 9512PH Ambient ; In-line (Test/Mark/Test) Bulk, tubeTO220 Tesec 9512PH Ambient ; In-line (Test/Mark/Test) Bulk, tube

Three Test siteTO247 Tesec 9512PH Ambient ; In line (Test/Mark/Test) Bulk, tube

• Pick & Place:

Package Model Configuration / Capability4-6 inch EG2001X Ambient ; Single test

• Prober:

Package Model Configuration / Capability PACKAGINGDPAK STI TRI8AS3 Mark & lead vision inspection, taping TNRSOT89 Shinja ST400 Taping TNRTO263 3Ld/5Ld STI TRI8AS3 Mark & Lead vision inspection, taping TNR

Shinja ST300 Mark & Lead vision inspection, taping TNRTO92 Sillner Taping Ammopack (Reverse/standard) TNR

• Tape & Reel:


PACKAGE RELIABILIY CAPABILITYPACKAGE RELIABILIY CAPABILITYPACKAGE RELIABILIY CAPABILITYPACKAGE RELIABILIY CAPABILITY

Test Integrity for Die and Wire BondTest Integrity for Die and Wire Bond Intermittent Operating Life (IOL)Intermittent Operating Life (IOL) Solder Heat Test (Die Crack Test)Solder Heat Test (Die Crack Test) High Temp. Storage Life (HTSL)High Temp. Storage Life (HTSL) Resistance to Soldering Heat (RSH)Resistance to Soldering Heat (RSH)

Temp. Cycle Test (TCT)Temp. Cycle Test (TCT) IR ReflowIR Reflow Pressure Cooker Test (PCT)Pressure Cooker Test (PCT) Pre conditioningPre conditioning

Humidity Chamber (Q2 2004 Avail.)Humidity Chamber (Q2 2004 Avail.)

Wire BondWire Bond

Die BondDie Bond

Lead Integrity TestLead Integrity Test Lead Fatigue TestLead Fatigue Test


Package Analysis CapabilityPackage Analysis CapabilityPackage Analysis CapabilityPackage Analysis Capability


VCXO, Clock

New New ProductsProducts

VCXO

Low Noise Amplifier

Radio Remote Control

Transmitter for Overhead Crane

Tunnel Module Detector

SP3T RF Switch

SP2T RF Switch


ON-GOING QUALSON-GOING QUALS

Circulator - 6GHz

Broadband Amplifier Module

Broadband

Digital Synthesizer

Down Converter

Jitter Attenuator

Crystal Oscillator


To enable our customers/strategic partners to achieve a sustainable advantage in terms of:

Quality

Cost of Ownership

Delivery (time to market/time to volume)

Process technology/engineering

Assurance of supply (capacity planning)

Environmental Compliance

Security

Commitment to CustomersCommitment to Customers Commitment to CustomersCommitment to Customers


Line Transfer Success Line Transfer Success StoryStory

1. 1. 20082008 CENTELLAX INCCENTELLAX INC- Broadband Amplifier- Broadband Amplifier

2.2. 20082008 TRIQUINT / WJ TRIQUINT / WJ - High Linear Amplifier- High Linear Amplifier

3.3. 20082008 RFS / ALCATEL RFS / ALCATEL - Isolators- Isolators

4. 4. 20072007 MICROSEMI CORPORATIONMICROSEMI CORPORATION- Plad / SMB/SMC / Axial / Dicing - Plad / SMB/SMC / Axial / Dicing

5. 5. 20072007 AMPLIFIER SOLUTION CORPORATIONAMPLIFIER SOLUTION CORPORATION- LNA Amplifiers - LNA Amplifiers

6.6. 20062006 HERLEY CTIHERLEY CTI- VSS Oscillator Modules, VTDRO- VSS Oscillator Modules, VTDRO

7.7. 20062006 ADVANCED CONTROL COMPONENTSADVANCED CONTROL COMPONENTS- Down Converter, RF Driver Amplifier- Down Converter, RF Driver Amplifier


8.8. 20052005 CASCO / ITALYCASCO / ITALY- Optoelectronics / Sun sensors- Optoelectronics / Sun sensors

9.9. 20052005 VALPEY FISHERVALPEY FISHER- RF Oscillator Modules- RF Oscillator Modules

10.10. 20052005 ALCATEL / LUCENT FERROCOMALCATEL / LUCENT FERROCOM- Isolators / Circulators- Isolators / Circulators

11.11. 20042004 TEMEX / CHELTONTEMEX / CHELTON- VCO-Oscillators / Isolators / Circulators- VCO-Oscillators / Isolators / Circulators

12.12. 19991999 DALLAS / MAXIM (second source 2007)DALLAS / MAXIM (second source 2007)- PCB Modules- PCB Modules

13.13. 19971997 ST MICOELECTRONICSST MICOELECTRONICS- TO-220 B/C / TO220 Al / TO202 / - TO-220 B/C / TO220 Al / TO202 / TOP3P (ended 2005)TOP3P (ended 2005)

14.14. 19951995 MACOM / TYCOMACOM / TYCO- RF Components- RF Components

Building Assembly, Packaging and Test Solutions for our Global Partners Thank you & MabuhayThank you & Mabuhay

Thank you & MabuhayThank you & Mabuhay

“ If we don’t have it, let’s talk. ““ If we don’t have it, let’s talk. “

Contact: Rene I. Dela Cruz

Business Development

[email protected]

Contact: Rene I. Dela Cruz

Business Development

[email protected]

2010 may fastech semicon marketing presentation

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