SEMI | MSIG ConnectsAn Overview of SEMI Standards Organization & Activities

Frank A. Shemansky, Jr., PhDCTO SEMI MEMS & Sensors

SEMI | MSIG Connects

970+ SEMI Standards5,000+ Standards Volunteers11 Annual Industry Expositions

For more than 40 years, SEMI has connected its members worldwide to achieve together what each cannot accomplish alone.

SEMI provides the platforms for the electronics manufacturing industry to connect, synchronize technology, discover new business opportunities, and change the world.

SEMI & MSIG integrated operations in January 2017 to leverage strengths & expand scope to growth areas

500,000+SEMI Member

Individuals

250,000+Global Attendees atSEMICON Shows

2,000+SEMI Member

Companies Worldwide

SEMI is the global not-for-profit association connecting and representing the worldwide electronics manufacturing supply chain.

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SEMI | MSIG Connects to Advance a Global Industry

MissionSEMI | MSIG provides industry stewardship and engages our members to advance the interests of the global electronics manufacturing supply chain.

VisionSEMI | MSIG promotes the development of the global electronics manufacturing supply chain and positively influences the growth and prosperity of its members. SEMI | MSIG advances the mutual business interests of its membership and promotes a free and open global marketplace.

SEMI | MSIG is the place to connect, collaborate, and solve problems in a pre-competitive forum. Platforms for regions and special interest groups are connected to global common interests.

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SEMI Strategic Association Partners

Flexible Hybrid Electronics

MEMS & Sensors

Semiconductor & MEMS Fabs

• MEMS & Sensors Industry Group (MSIG) represents the MEMS and sensors community

• Established in 2001 and integrated operations with SEMI in 2017 as a Strategic Association Partner

• Serves the global ecosystem & global markets

• Creates a neutral forum for discussion of industry challenges

• Champions MEMS and sensors technology & products

• Facilitates commercialization by helping to overcome technology and manufacturing hurdles

End Users/Integrators

Designers Device Producers

FoundriesMaterials & Equipment Suppliers

MEMS & Sensors Industry Group Connects the Community to Accelerate Technology Adoption

SEMI | MSIG Connects

SEMI | MSIG Connects for Member Growth and ProsperityCommunities Collaboration Collection Action

Standards Process, Device, SystemsMarket Intelligence Manufacturing data, forecasts, insight

Advocacy Issues, public policy, collective action

Communities Market segments, special interests

Programs Technology, business, issues

Expositions Business development, market access

In Union There Is Strength AESOP

SEMI | MSIG Standards Activities

Multiple Working Groups Currently Active• SEMI | MSIG Task Force WG• Core Standards WG

TopicTarget Area Stage Facilitating Organizations

Front End Back End Device Proposal Drafting Voting Complete NIST SEMI MIPI IEEE

MSIG Task ForceDeep Reactive Ion Etch (DRIE)

MEMS Substrate

Wafer Bonding Void Metrics Core Standards WG

Device Specifications (P2700)

Accelerometer Testing

I3C

SEMI | MSIG Annual Events

JANUARY 9-12, 2018 • LAS VEGAS, NV

MARCH 2017 • SHANGHAI CHINA

MAY 2017 • STANFORD UNIVERSITY

JUNE 26-29, 2017 • SAN JOSE, CA

NOVEMBER 1-2, 2017 • NAPA, CA

SEPT 13, 2017 • TAIPEI TAIWAN JULY 11-13, 2017 • SAN FRANCISCO, CA

SEPTEMBER 20-22, 2017 • GRENOBLE FRANCE 10-11 April | Tokyo

1 June | Seoul

And FlexTech Events

North America Chapter MEMS/NEMS Global Technical CommitteeMicro/Nano Electromechanical SystemsOverviewJune 2017James Amano, SEMI Standards

SEMI Standards Overview

• Established in 1973

• 970+ published Standards & Safety Guidelines

• 5,000+ volunteer experts

• 1,800+ companies

• 21 global technical committees

• Experts from the semiconductor, PV, LED, MEMS & Display industries

• International presence

– United States | Japan | Europe | Taiwan | Korea | China

Exchange ideas and develop globally-accepted technical Standards

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Critical Role of Standardization

Focus on critical performance variables

More resources for R&D

Faster deliveries

Productive spare parts inventoriesMultiple suppliers reduce costs

Multiple suppliers improve quality

Faster supplier response

Shorter time to market

Customer Supplier

SEMI Standards Reduce Manufacturing Complexity,Allowing Companies to Focus on Innovation

SEMI®International

Standards

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High-Profile SEMI Standards

• Wafer Dimensions (M1)• Factory efficiency/equipment reliability (E10, E79)• Equipment Interface

– SEMI Equipment Communication Standards (SECS) / Generic Equipment Model (GEM / GEM300)– Hardware/Automated Material Handling Systems (300 mm, 450 mm)

• Environmental, Health and Safety– Safety for Semiconductor (S2), Ergonomic (S8), Energy conservation (S23)

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High Profile SEMI Standards

• Wafer Dimensions, Materials

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High Profile SEMI Standards

• Factory Automation– Equipment Interface Software (SECS/GEM/EDA)– Efficiency, equipment reliability, and availability

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High Profile SEMI Standards

• Factory Automation– Hardware, AMHS (300 mm, 450 mm)

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High Profile SEMI Standards

• Environmental, Health and Safety (EHS)

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SEMI Standards Program

• SEMI Standards are created through developing consensus in the industry

• Worldwide distribution of document drafts and ballots ensures global consensus

• SEMI Standards activities are open to all interested parties, including users, suppliers, trade organizations, and government agencies

Consensus-based Standards Development

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SEMI Standards Technical Committees

Assembly & PackagingAutomated Test EquipmentAutomation TechnologyCompound Semiconductor MaterialsEnvironmental Health & SafetyFacilitiesFPD Materials & ComponentsFPD MetrologyGasesHigh-Brightness LEDInformation & Control

Liquid ChemicalsMEMS / NEMSMetricsMicropatterningPhotovoltaicPhotovoltaic MaterialsPhysical Interfaces & CarriersSilicon WaferTraceability3DS-IC

Join SEMI Standardswww.semi.org/en/standardsmembership

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SEMI Standards Document Development Process

Technology TrendsSuppliers

UsersOther Stakeholders

AuthorizeActivity

DocumentDevelopment

Idea toCommittee

BallotVoting /Tallying

Publishing

BallotAdjudication

Procedural Review

BallotSubmission

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North America Chapter MEMS/NEMS Global Technical CommitteeMicro/Nano Electromechanical Systems

Activities & OverviewApril 2017

MEMS/NEMSCurrent Committee Structure

North America MEMS / NEMS

Technical Committee Chapter

MEMS Packaging TF(Inactive)

MEMS Wafer Bond TF(Inactive)

MEMS Microfluidics TF

MEMS International Terminology TF

(Inactive)

MEMS Material Characterization TF

MEMS Reliability TF(Inactive)

MEMS Substrate TF

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Current Activities

• Draft Doc. 5267, New Standard: Specification for Microfluidic Port and Pitch Dimensions

– Currently available for voting

Interleaved Port Array with X Pitch = 4.00 mm and Y Pitch = 4.00 mm

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Current Activities

• SNARF Doc. 6007, New Standard: Specification for a Test Pattern for Deep Reactive Ion Etching (DRIE) Process Characterization

– Draft Doc work in-progress with SEMI | MSIG Task Force– To participate in this activity, contact Rich Allen/NIST (richard.allen@nist.gov)

• SNARF Doc. 6018, New Standard: Specification for Silicon Substrates used in fabrication of MEMS Devices

– Draft Doc work in-progress, initial proposal from SEMI | MSIG Task Force– To participate in this activity, contact Rich Allen/NIST (richard.allen@nist.gov) and Chris

Moore/Frontier Semiconductor (chrisjlmoore@frontiersemi.com)

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Current Activities

• Draft Doc. 5822A, New Standard: Specification for Reference Material for Bonded Wafer Stack Void Metrology

– Currently available for voting

Layout of the Artificial Voids of Different Sizes and Densities in a Die-Sized Array

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MEMS Standards Developed

• MS1 – Guide to Specifying Wafer-Wafer Bonding Alignment Targets• MS2 – Test Method for Step-Height Measurements of Thin Films• MS3 – Terminology for MEMS Technology• MS4 – Test Method for Young's Modulus Measurements of Thin, Reflecting Films Based on

the Frequency of Beams in Resonance• MS5 – Test Method for Wafer Bond Strength Measurements Using Micro-Chevron Test

Structures• MS6 – Guide for Design and Materials for Interfacing Microfluidic Systems• MS7 – Specification for Microfluidic Interfaces to Electronic Device Packages• MS8 – Guide to Evaluating Hermeticity of MEMS Packages• MS9 – Specification for High Density Permanent Connections Between Microfluidic Devices• MS10 – Test Method to Measure Fluid Permeation Through MEMS Packaging Materials

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SEMI MS1Guide to Specifying Wafer-Wafer Bonding Alignment Targets

• This Guide provides a framework for specifying the dimensions, location, quantity and characteristics of alignment targets that are placed on each wafer of a pair of wafers. Such targets are used to align two patterned wafers prior to an operation that bonds them together.

Published Standards [1/10]

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SEMI MS2Test Method for Step Height Measurements of Thin Films

• This Test Method enables the determination of step height measurements of thin films. Step height measurements can be used to determine thin film thickness values. Thickness measurements are an aid in the design and fabrication of MEMS devices and can be used to obtain thin film material parameters, such as Young’s modulus.

Published Standards [2/10]

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Published Standards [3/10]

SEMI MS3Terminology for MEMS Technology

To promote common understanding and clear communication among suppliers, customers, and others in the field, these terms should be defined.

This Terminology document covers definitions of terms used in MEMS technology, especially in those areas of greatest interest to the SEMI community.

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SEMI MS4Test Method for Young's Modulus Measurements of Thin, Reflecting Films Based on the Frequency of Beams in Resonance

• This Test Method covers a procedure for measuring Young’s modulus in thin films. • It applies only to films, such as found in MEMS materials that can be imaged using a noncontact optical vibrometer, stroboscopic interferometer or comparable instrument that is capable of obtaining the resonance frequency of a beam oscillating out-of-plane.

Published Standards [4/10]

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SEMI MS5Test Method for Wafer Bond Strength Measurements Using Micro-Chevron Test Structures

• This Test Method allows determination of the bond-interface strength, using micro-chevron test structures, of bonded wafer materials.

• The bond-interface strength is expressed in units of energy per unit area and is technically the critical wafer bond toughness.

Published Standards [5/10]

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SEMI MS6Guide for Design and Materials for Interfacing Microfluidic Systems

• This Document provides guidelines for general fluidic interface design and materials selection that can reduce redundant engineering effort and lead to improved design, manufacturability, and operation.

Published Standards [6/10]

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SEMI MS7Specification for Microfluidic Interfaces to Electronic Device Packages

• This Document defines an industry-standard for fluidic interfaces with electronic devices. • The specification describes the connection attributes and specifies the interface dimensions required to design and build devices and systems that are compliant with this standard. • The goal is to enable devices from different vendors to interconnect via an open architecture.

Published Standards [7/10]

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Published Standards [8/10]

SEMI MS8Guide to Evaluating Hermeticity of MEMS Packages

This Document is intended to provide an overview of hermetic packaging with emphasis on the evaluation of hermeticity of the smaller internal volumes typical of MEMS.

Hermeticity is critical to MEMS device functionality. In other cases, hermeticity is primarily important to reliability of MEMS devices, similarly to integrated circuits.

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Published Standards [9/10]

SEMI MS9Specification for High Density Permanent Connections Between Microfluidic DevicesThis Standard provides specification for interconnection dimensions and performance requirements for permanent microfluidic interfaces. It also provides guidance for interface design. This will help to enable low cost and high volume manufacturing of products having high density permanent interfaces between plastic tube adapters, plastic microfluidic cartridges, and electrofluidic devices.

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SEMI MS10Test Method to Measure Fluid Permeation Through MEMS Packaging Materials

• This Standard is directed towards defining a common method of measurement of permeation through technical films that are used in sealing hermetic MEMS packages.

• Areas to be addressed include materials and equipment for producing and evaluating hermetic seals; methods for detection and measurement of leakage; and considerations and recommendations on the evaluation of hermeticity.

Published Standards [10/10]

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Upcoming MEMS / NEMS Meetings

In conjunction with SEMICON West, the North America Standards meetings will be held July 10-13, 2017.

MEMS/NEMS Committee and Task ForceTentative Schedule:Thursday, July 13• 13:00-13:30 Microfluidics (TF)• 13:30-15:30 Joint MSIG, MEMS Substrate and Material Characterization (TF)• 15:30-17:30 MEMS / NEMS (C)

For more information and to register for SEMICON West meetings: https://www.xpressreg.net/register/semi0717/start.asp?sc=STAN2017

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Thank you!

For more information regarding MEMS/NEMS North America activities, please contact:

Laura Nguyenlnguyen@semi.org

For more information regarding SEMI | MSIGPlease contact:Andy Knopes

aknopes@semi.org

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Q & A• Please type your questions into the Q&A box on the GoToWebinar Control Panel• Any question not addressed will be responded to directly

Thank you for attending!

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