rtn 950 idu hardware description-(v100r002c00_06)

8/11/2019 RTN 950 IDU Hardware Description-(V100R002C00_06)

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OptiX RTN 950 Radio Transmission System

V100R002C00

IDU Hardware Description

Issue 06

Date 2010-07-30

HUAWEI TECHNOLOGIES CO., LTD.


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Copyright Huawei Technologies Co., Ltd. 2010. All rights reserved.

No part of this document may be reproduced or transmitted in any form or by any means without prior writtenconsent of Huawei Technologies Co., Ltd. Trademarks and Permissions

and other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd. All other trademarks and trade names mentioned in this document are the property of their respective holders. Notice

The purchased products, services and features are stipulated by the contract made between Huawei and thecustomer. All or part of the products, services and features described in this document may not be within the

purchase scope or the usage scope. Unless otherwise specified in the contract, all statements, information,and recommendations in this document are provided "AS IS" without warranties, guarantees or representationsof any kind, either express or implied.

The information in this document is subject to change without notice. Every effort has been made in thepreparation of this document to ensure accuracy of the contents, but all statements, information, andrecommendations in this document do not constitute the warranty of any kind, express or implied.

Huawei Technologies Co., Ltd. Address: Huawei Industrial Base

Bantian, LonggangShenzhen 518129People's Republic of China

Website: http://www.huawei.com

Email: [email protected]

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About This Document

Related VersionsThe following table lists the product versions related to this document.

Product Name VersionOptiX RTN 950 V100R002C00

iManager U2000 V100R001C00

Intended AudienceThis document is intended for:

l Network planning engineer

l Hardware installation engineer

l Installation and commissioning engineer

l Field maintenance engineer

l Data configuration engineer

l System maintenance engineer

Before reading this document, you need to be familiar with the following:

l Basics of digital microwave communication

l Basics of the OptiX RTN 950

Symbol ConventionsThe symbols that may be found in this document are defined as follows.

Symbol Description

Indicates a hazard with a high level of risk,which if not avoided, will result in death or serious injury.

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Symbol Description

Indicates a hazard with a medium or low levelof risk, which if not avoided, could result inminor or moderate injury.

Indicates a potentially hazardous situation,which if not avoided, could result inequipment damage, data loss, performancedegradation, or unexpected results.

Indicates a tip that may help you solve a problem or save time.

Provides additional information to emphasizeor supplement important points of the maintext.

GUI ConventionsThe GUI conventions that may be found in this document are defined as follows.

Convention Description

Boldface Buttons, menus, parameters, tabs, window, and dialog titlesare in boldface . For example, click OK .

> Multi-level menus are in boldface and separated by the ">"signs. For example, choose File > Create > Folder .

Update HistoryUpdates between document issues are cumulative. Thus, the latest document issue contains all

updates made in previous issues.

Updates in Issue 06 (2010-07-30) Based on Product Version V100R002C00

This document is the sixth release of the V100R002C00 version.

The updated contents are as follows.

Section Description

- Fixes known bugs.

About This DocumentOptiX RTN 950


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This document is the fifth release of the V100R002C00 version.


Section Description

- Fixes known bugs.


This document is the fourth release of the V100R002C00 version.

The updated c ontents are as follows.

Section Description

3 Boards l Represents the section "Functions andFeatures" of each board by using tables.

l Provides description information and adiagram for the Tx interface and Rxinterface of the SFP optical module insection "Front Panel" of the EM6F board.

C Indicators of Boards Provides the weight of an empty chassis.

- Fixes known bugs.


This document is the third release of the V100R002C00 version.


Section Description

3.3.5 DIP Switches and CF Card Modifies the sequence of high-order bits andlower-order bits of DIP switches.

3.5.2 Functions and Features Deletes specifications for VC-4 loopbacks onthe IF1 board.

5.6.1 E1 Cable to the External Equipment Adds descriptions of requirements for thediameter of a 75-ohm E1 cable, types of coaxial connectors, and crimp pliers.

- Fixes known bugs.

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This document is the second release of the V100R002C00 version.


Section Description

- Adds certain terms.

- Adds certain abbreviations and acronyms.

Updates in Issue 01 (2009-06-30) Based on Product Version V100R002C00This document is the first release of the V100R002C00 version.

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Contents

About This Docum ent...................................................................................................................iii

1 Introduction.................................................................................................................................1-11.1 Network Application.......................................................................................................................................1-2

1.2 Components.....................................................................................................................................................1-31.3 Radio Link Forms............................................................................................................................................1-6

2 Chassis............ ..............................................................................................................................2-12.1 Chassis Struct ure.............................................................................................................................................2-2

2.2 Installation M ode.............................................................................................................................................2-2

2.3 IDU Labels.... ..................................................................................................................................................2-2

3 Boards.................. .........................................................................................................................3-13.1 Board Appear ance...........................................................................................................................................3-3

3.2 Board List..... ...................................................................................................................................................3-4

3.3 CST............... ...................................................................................................................................................3-6

3.3.1 Version Description................................................................................................................................3-7

3.3.2 Func tions and Features...........................................................................................................................3-7

3.3.3 Wor king Principle..................................................................................................................................3-8

3.3.4 Fron t Panel...........................................................................................................................................3-11

3.3 .5 DIP Switches and CF Card...................................................................................................................3-17

3.3.6 Vali d Slots............................................................................................................................................3-20

3.3.7 Boar d Parameter Settings.....................................................................................................................3-21

3.3.8 Tech nical Specifications......................................................................................................................3-21

3.4 CS H...............................................................................................................................................................3-223.4.1 Vers ion Description..............................................................................................................................3-23

3.4.2 Func tions and Features.........................................................................................................................3-23

3.4.3 Working Principle................................................................................................................................3-25

3.4.4 Front Panel...........................................................................................................................................3-27

3.4.5 DIP Switches and CF Card...................................................................................................................3-34

3.4 .6 Valid Slots............................................................................................................................................3-36

3.4.7 Board Parameter Settings.....................................................................................................................3-37

3.4.8 Technical Specifications......................................................................................................................3-37

3.5 IF1.................................................................................................................................................................3-39

3.5.1 Version Description..............................................................................................................................3-39

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3.5.2 Functions and Features.........................................................................................................................3-39

3.5.3 Working Principle and Signal Flow.....................................................................................................3-41

3.5.4 Front Panel...........................................................................................................................................3-46

3.5.5 Valid Slots............................................................................................................................................3-48

3.5.6 Board Parameter Settings.....................................................................................................................3-49

3.5.7 Technic al Specifications......................................................................................................................3-49

3.6 IFU2........ ......................................................................................................................................................3-51

3.6.1 Version Description..............................................................................................................................3-52

3.6.2 Function s and Features.........................................................................................................................3-52


3.6.4 Front Pa nel...........................................................................................................................................3-59

3.6.5 Valid Sl ots............................................................................................................................................3-61

3.6.6 Paramet er Settings................................................................................................................................3-62

3.6.7 Technic al Specifications......................................................................................................................3-623.7 IFX2.............. ................................................................................................................................................3-65

3.7.1 Vers ion Description..............................................................................................................................3-65



3.7.4 Front Pa nel...........................................................................................................................................3-72

3.7.5 Valid Sl ot..............................................................................................................................................3-75

3.7.6 Paramet er Settings................................................................................................................................3-76


3.8 EM6T/EM6F. ................................................................................................................................................3-783.8.1 Version Description..............................................................................................................................3-79

3.8.2 Func tions and Features.........................................................................................................................3-79


3.8.4 Front Pa nel...........................................................................................................................................3-85

3.8.5 Valid Sl ots............................................................................................................................................3-89

3.8.6 Board F eature Code..............................................................................................................................3-90

3.8.7 Board P arameter Settings.....................................................................................................................3-90


3.9 SL1D............. ................................................................................................................................................3-92

3.9.1 Vers ion Description..............................................................................................................................3-93



3.9.4 Front Pa nel...........................................................................................................................................3-97

3.9.5 Valid Sl ots............................................................................................................................................3-99

3.9.6 Board F eature Code............................................................................................................................3-100

3.9.7 Paramet er Settings..............................................................................................................................3-100

3.9.8 Technic al Specifications....................................................................................................................3-100

3.10 SP3S/SP 3D................................................................................................................................................3-101

3.10.1 Versio n Description..........................................................................................................................3-102

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3.10.2 Functions and Features.....................................................................................................................3-102

3.10.3 Working Principle and Signal Flow.................................................................................................3-103

3.10.4 Front Panel.......................................................................................................................................3-105

3.10.5 Valid Slots........................................................................................................................................3-109

3.10.6 Board Feature Code..........................................................................................................................3-110

3.10.7 Bo ard Parameter Settings.................................................................................................................3-110

3.10.8 Tec hnical Specifications..................................................................................................................3-110

3.11 AUX...... ....................................................................................................................................................3-111


3.11.2 Functio ns and Features.....................................................................................................................3-111

3.11.3 Wo rking Principle............................................................................................................................3-112

3.11.4 Fro nt Panel.......................................................................................................................................3-113

3.1 1.5 Valid Slots........................................................................................................................................3-116

3.11.6 Technical Specifications..................................................................................................................3-1173.12 PIU............................................................................................................................................................3-118

3.12.1 Version Description..........................................................................................................................3-118

3.12.2 Functions and Features.....................................................................................................................3-119

3.12.3 Working Principle............................................................................................................................3-119

3.12.4 Front Panel.......................................................................................................................................3-120

3.1 2.5 Valid Slots........................................................................................................................................3-121

3.12.6 Techni cal Specifications..................................................................................................................3-122

3.13 FAN............ ...............................................................................................................................................3-122


3.13.2 Functio ns and Features.....................................................................................................................3-123

3.13.3 Workin g Principle............................................................................................................................3-123

3.13.4 Front P anel.......................................................................................................................................3-125

3.13.5 Val id Slots........................................................................................................................................3-126

3.13.6 Techni cal Specifications..................................................................................................................3-127

4 Accessories...................................................................................................................................4-14.1 E1 Panel...........................................................................................................................................................4-2

4.2 PDU.................................................................................................................................................................4-4

4.2.1 Front Panel............................................................................................................................................. 4-4

4.2.2 Functions and Working Principle...........................................................................................................4-5

4.2.3 Power Distribution Mode.......................................................................................................................4-6

5 Cables.................. .........................................................................................................................5-15.1 Power Cable.. .................................................................................................................................................. 5-3

5.2 PGND Cable. ...................................................................................................................................................5-3

5.2.1 IDU PG ND Cable...................................................................................................................................5-4

5.2.2 E1 Pane l PGND Cable........................................................................................................................... 5-4

5.3 IF Jumper .........................................................................................................................................................5-5

5.4 XPIC Cable... .................................................................................................................................................. 5-6

5.5 Fiber Jumper. ...................................................................................................................................................5-7



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5.6 E1 Cables.........................................................................................................................................................5-9

5.6.1 E1 Cable to the External Equipment ...................................................................................................5-10

5.6.2 E1 Cable to the E1 Panel......................................................................................................................5-13

5.6.3 E1 Transit Cable...................................................................................................................................5-15

5.7 Orderwire Cable............................................................................................................................................5-17

5.8 Network Cabl e...............................................................................................................................................5-18

A Parameters Desc ription...........................................................................................................A-1A.1 Parameters fo r NE Management....................................................................................................................A-2

A.1.1 Para meter Description: NE Searching..................................................................................................A-2

A.1.2 Parame ter Description: NE Creation....................................................................................................A-6

A.1.3 Parame ter Description: Attribute_Changing NE IDs...........................................................................A-9

A.1.4 Parame ter Description: NE Time Synchronization............................................................................A-10

A.1.5 Parame ter Description: Localization Management of the NE Time..................................................A-12

A.1.6 Parame ter Description: Standard NTP Key Management..................................................................A-13

A.1.7 Parame ter Description: License Management....................................................................................A-15

A.1.8 Parame ter Description: Automatic Disabling of the Functions of NEs..............................................A-16

A.2 Parameters fo r Cable Management..............................................................................................................A-16

A.2.1 Parame ter Description: Fiber Search..................................................................................................A-17

A.2.2 Parame ter Description: Fiber Creation...............................................................................................A-18

A.2.3 Parame ter Description: Radio Link Creation.....................................................................................A-20

A.3 Parameters fo r Communications Management............................................................................................A-21

A.3.1 Parame ter Description: NE Communication Parameter Setting.........................................................A-22

A.3.2 Parame ter Description: DCC Management_DCC Rate Configuration..............................................A-23A.3.3 Parame ter Description: DCC Management_DCC Transparent Transmission Management.............A-25

A.3.4 Parame ter Description: ECC Management_Ethernet Port Extended ECC........................................A-27

A.3.5 Parame ter Description: NE ECC Link Management..........................................................................A-28

A.3.6 Para meter Description: IP Protocol Stack Management_IP Route Management..............................A-30

A.3.7 Parame ter Description: IP Protocol Stack Management_IP Route Management Creation................A-31

A.3.8 Parame ter Description: IP Protocol Stack Management_OSPF Parameter Settings..........................A-32

A.3.9 Parame ter Description: IP Protocol Stack_Proxy ARP......................................................................A-34

A.3.10 Pa rameter Description: OSI Management_Network Layer Parameter............................................A-35

A.3.11 Param eter Description: OSI Management_Routing Table...............................................................A-36A.3.12 Param eter Description: OSI Management_OSI Tunnel...................................................................A-37

A.3.13 Param eter Description: DCN Management_Bandwidth Management............................................A-41

A.3.14 Param eter Description: DCN Management_Port Setting.................................................................A-42

A.3.15 Param eter Description: DCN Management_Protocol Setting..........................................................A-43

A.3.16 Param eter Description: Access Control............................................................................................A-44

A.3.17 Param eter Description: LCT Access Control...................................................................................A-45

A.4 Radio Link P arameters................................................................................................................................A-46

A.4.1 Para meter Description: Link Configuration_XPIC Workgroup_Creation.........................................A-47

A.4.2 Parameter Description: Link Configuration_XPIC............................................................................A-51

A.4.3 Para meter Description: N+1 Protection_Create.................................................................................A-59



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A.4.4 Parameter Description: N+1 Protection..............................................................................................A-60

A.4.5 Parameter: IF 1+1 Protection_Create.................................................................................................A-61

A.4.6 Parameter Description: IF 1+1 Protection..........................................................................................A-63

A.4.7 Parameter: Link Configuration_IF/ODU Configuration....................................................................A-66

A.5 Multiplex Section Protection Parameters....................................................................................................A-77

A.5.1 Para meter Description: Linear MSP_Creation...................................................................................A-77

A.5.2 Parame ter Description: Linear MSP...................................................................................................A-80

A.6 SDH/PDH Se rvice Parameters....................................................................................................................A-83

A.6.1 Parame ter Description: SDH Service Configuration_Creation..........................................................A-84

A.6.2 Parame ter Description: SDH Service Configuration_SNCP Service Creation..................................A-86

A.6.3 Parame ter Description: SDH Service Configuration_Converting Normal Services Into SNCP Services................ ......................................................................................................................................................A-89

A.6.4 Parame ter Description: SDH Service Configuration..........................................................................A-92

A.6.5 Parameter Description: SNCP Service Control..................................................................................A-94A.7 Clock Parameters.........................................................................................................................................A-97

A.7.1 Parameter Description: Clock Source Priority Table.........................................................................A-98

A.7.2 Parame ter Description: Clock Subnet Setting_Clock Subnet..........................................................A-100

A.7.3 Para meter Description: Clock Subnet Setting_Clock Quality..........................................................A-103

A.7.4 Parameter Description: Clock Subset Setting_SSM Output Control...............................................A-106

A.7.5 Parameter Description: Clock Subset Setting_Clock ID Enabling Status........................................A-107

A.7.6 Parameter Description: Clock Source Switching_Clock Source Restoration Parameters...............A-108

A.7.7 Parame ter Description: Clock Source Switching_Clock Source Switching....................................A-110

A.7.8 Para meter Description: Clock Source Switching_Clock Source Switching Conditions..................A-111

A.7.9 Parameter Description: Output Phase-Locked Source of the External Clock Source......................A-113

A.7.10 Parameter Description: Clock Synchronization Status...................................................................A-115

A.8 RMON Parameters....................................................................................................................................A-116

A.8.1 Parame ter Description: RMON Performance_Statistics Group.......................................................A-117

A.8.2 Parame ter Description: RMON Performance_History Group..........................................................A-118

A.8.3 Parameter Description: RMON Performance_History Control Group............................................A-119

A.8.4 Parameter Description: RMON Performance_RMON Setting........................................................A-120

A.9 Parameters for Ethernet Services and Ethernet Features...........................................................................A-122

A.9.1 Parame ters for Ethernet Services......................................................................................................A-122

A.9.2 Parame ters for Ethernet Protocols....................................................................................................A-151A.9.3 Parameters for the Ethernet OAM....................................................................................................A-194

A.9.4 QoS Parameters................................................................................................................................A-206

A.9.5 Parameters for the Ports on Ethernet Boards....................................................................................A-238

A.10 Parameters f or the Orderwire and Auxiliary Interfaces...........................................................................A-248

A.10.1 Param eter Description: Orderwire_General...................................................................................A-248

A.10.2 Param eter Description: Orderwire_Advanced................................................................................A-250

A.10.3 Param eter Description: Orderwire_F1 Data Port...........................................................................A-251

A.10.4 Pa rameter Description: Orderwire_Broadcast Data Port................................................................A-251

A.10.5 Param eter Description: Environment Monitoring Interface...........................................................A-252

A.11 Parameters f or Board Interfaces..............................................................................................................A-255



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A.11.1 Parameter Description: IF Interface_IF Attribute..........................................................................A-256

A.11.2 Parameter Description: IF Interface_ATPC Attribute....................................................................A-258

A.11.3 Parameter Description: Hybrid/AM Configuration........................................................................A-260

A.11.4 Parameter Description: ATPC Adjustment Records......................................................................A-262

A.11.5 Parameter Description: PRBS Test................................................................................................A-263

A.11.6 Parameter Description: ODU Interface_Radio Frequency Attribute.............................................A-264

A.11.7 Parameter Description: ODU Interface_Power Attributes.............................................................A-265

A.11.8 Parameter Description: ODU Interface_Equipment Information...................................................A-269

A.11.9 Parameter Description: ODU Interface_Advanced Attributes.......................................................A-270

A.11.10 Parameter Description: SDH Interfaces.......................................................................................A-271

A.11.11 Parameter Description: Automatic Laser Shutdown....................................................................A-273

A.11.12 Parameter Description: PDH Interfaces.......................................................................................A-274

A.11.13 Parameter Description: Microwave Interface_Basic Attributes...................................................A-276

A.11.14 Parameter Description: Microwave Interface_Layer 2 Attributes...............................................A-277A.11.15 Parameter Description: Microwave Interface_Advanced Attributes............................................A-279

A.12 Parameters for Overhead.........................................................................................................................A-281

A.12.1 Parameter Description: Regenerator Section Overhead.................................................................A-282

A.12.2 Pa rameter Description: VC-4 POHs...............................................................................................A-283

A.12.3 Pa rameter Description: VC-12 POHs.............................................................................................A-284

B Board Loopba ck Types............................................................................................................B-1

C Indicators of Boards.................................................................................................................C-1

D Weight and P ower Consumption of Boards.......................................................................D-1E Glossary.......................................................................................................................................E-1

E.1 0- 9...................................................................................................................................................................E-2

E.2 A- E.................................................................................................................................................................E-2

E.3 F- J...................................................................................................................................................................E-7

E.4 K-O...............................................................................................................................................................E-10

E.5 P-T................ ................................................................................................................................................E-12

E.6 U-Z............... ................................................................................................................................................E-16



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Figures

Figure 1-1 TDM microwave transmission solution provided by the OptiX RTN 950........................................1-2

Figure 1-2 Hybrid microwave transmission solution provided by the OptiX RTN 950......................................1-3

Figure 1-3 ID U 950..............................................................................................................................................1-4

Figure 1-4 Di rect mounting..................................................................................................................................1-6

Figure 1-5 Se parate mounting..............................................................................................................................1-6

Figure 2-1 Ch assis structure of the IDU 950........................................................................................................2-2

Figure 2-2 Po sitions of the IDU 950 labels..........................................................................................................2-4

Figure 3-1 Bo ard appearance (IFU2)...................................................................................................................3-3

Figure 3-2 Ba r code..............................................................................................................................................3-3

Figure 3-3 ID U slot layout...................................................................................................................................3-4

Figure 3-4 Fu nctional block diagram of the CST.................................................................................................3-9

Figure 3-5 Fu nctional block diagram of the cross-connect unit.........................................................................3-10

Figure 3-6 Fr ont panel of the CST.....................................................................................................................3-11

Figure 3-7 Fr ont view of the RJ-45 connector...................................................................................................3-13Figure 3-8 Incorrect connections between the NMS/COM port and the NE port..............................................3-14

Figure 3-9 Po sitions of the DIP switches and CF card ......................................................................................3-18

Figure 3-10 Slot for the CST in the IDU chassis...............................................................................................3-20

Figure 3-11 Logical slot for the logical board of the CST.................................................................................3-20

Figure 3-12 Functional block diagram of the CSH............................................................................................3-25

Figure 3-13 Functional block diagram of the cross-connect unit.......................................................................3-27

Figure 3-14 Front panel of the CSH...................................................................................................................3-28

Figure 3-15 Front view of the RJ-45 connector.................................................................................................3-30

Figure 3-16 Incorrect connections between the NMS/COM port and the NE port............................................3-31

Figure 3-17 Positions of the DIP switches and CF card ....................................................................................3-34

Figure 3-18 Slot for the CSH in the IDU chassis...............................................................................................3-36

Figure 3-19 Logical slot for the logical board of the CSH.................................................................................3-37

Figure 3-20 Functional block diagram of the IF1..............................................................................................3-41

Figure 3-21 Front panel of the IF1.....................................................................................................................3-46

Figure 3-22 Slots for the IF1 in the IDU chassis................................................................................................3-48

Figure 3-23 Logical slots for the logical boards of the IF1................................................................................3-49

Figure 3-24 Functional block diagram of the IFU2...........................................................................................3-56

Figure 3-25 Front panel of the IFU2..................................................................................................................3-59

Figure 3-26 Slots for the IFU2 in the IDU chassis.............................................................................................3-61

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Figure 3-27 Logical slots for the logical boards of the IFU2.............................................................................3-62

Figure 3-28 Functional block diagram of the IFX2........................................................................................... 3-69

Figure 3-29 Front panel of the IFX2..................................................................................................................3-72

Figure 3-30 Slots for the IFX2 in the IDU chassis.............................................................................................3-75

Figure 3-31 Logical slots for the logical boards of the IFX2.............................................................................3-75

Figure 3-32 Functional block diagram...............................................................................................................3-83

Figure 3-33 Front panel of the EM6T................................................................................................................3-85

Figure 3-34 Front panel of the EM6F................................................................................................................ 3-85

Figure 3-35 Ports of the SFP optical module.....................................................................................................3-87

Figure 3-36 Front view of the RJ-45 connector.................................................................................................3-87

Figure 3-37 Slots for the EM6T/EM6F in the IDU chassis............................................................................... 3-89

Figure 3-38 Logical slots for the logical boards of the EM6T/EM6F................................................................3-89

Figure 3-39 Functional block diagram of the SL1D.......................................................................................... 3-95

Figure 3-40 Front panel of the SL1D.................................................................................................................3-97Figure 3-41 Slots for the SL1D in the IDU chassis............................................................................................3-99

Figure 3-42 Logical slots for the logical boards of the SL1D............................................................................3-99

Figure 3-43 Functional block diagram of the SP3S/SP3D...............................................................................3-103

Figure 3-44 Front panel of the SP3S................................................................................................................3-105

Figure 3-45 Front panel of the SP3D...............................................................................................................3-106

Figure 3-46 Pin assignment of the Anea 96 connector.....................................................................................3-107

Figure 3-47 Slots for the SP3S/SP3D in the IDU 950 chassis.........................................................................3-109

Figure 3-48 Logical slots for the logical boards of the SP3S/SP3D................................................................3-109

Figure 3-49 Functional block diagram of the AUX.........................................................................................3-112Figure 3-50 Front panel of the AUX................................................................................................................3-113

Figure 3-51 Front view of the RJ-45 connector...............................................................................................3-114

Figure 3-52 Slots for the AUX in the IDU chassis...........................................................................................3-116

Figure 3-53 Logical slots for the logical boards of the AUX...........................................................................3-116

Figure 3-54 Functional block diagram of the PIU...........................................................................................3-119

Figure 3-55 Front panel of the PIU..................................................................................................................3-120

Figure 3-56 Slots for the PIU in the IDU chassis.............................................................................................3-121

Figure 3-57 Logical slots for the logical boards of the PIU.............................................................................3-122

Figure 3-58 Functional block diagram of the FAN..........................................................................................3-124

Figure 3-59 Front Panel Diagram.....................................................................................................................3-125

Figure 3-60 Slot for the FAN in the IDU chassis.............................................................................................3-126

Figure 3-61 Logical slot for the logical board of the FAN...............................................................................3-126

Figure 4-1 Fr ont panel of an E1 panel..................................................................................................................4-2

Figure 4-2 Pin assignments of an E1 port (E1 panel)...........................................................................................4-3

Figure 4-3 Fr ont panel of the PDU.......................................................................................................................4-4

Figure 4-4 Fu nctional block diagram of the PDU................................................................................................4-6

Figure 4-5 In ternal structure of the PDU in DC-C mode ....................................................................................4-7

Figure 4-6 In ternal structure of the PDU in DC-I mode .....................................................................................4-7

Figure 5-1 Po wer cable.........................................................................................................................................5-3

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Figure 5-2 IDU PGND cable................................................................................................................................5-4

Figure 5-3 E1 panel PGND cable.........................................................................................................................5-5

Figure 5-4 IF jumper............................................................................................................................................5-6

Figure 5-5 View of the XPIC cable......................................................................................................................5-7

Figure 5-6 LC/PC connector................................................................................................................................5-8

Figure 5-7 SC/PC connector.................................................................................................................................5-9

Figure 5-8 FC/PC connector.................................................................................................................................5-9

Figure 5-9 E1 cable............................................................................................................................................5-10

Figure 5-10 E1 cable that connects the IDU to an E1 panel..............................................................................5-14

Figure 5-11 E1 transit cable terminated with the Anea 96 and DB44 connectors.............................................5-15

Figure 5-12 Orderwire cable..............................................................................................................................5-17

Figure 5-13 Network cable........................................................................................................ .........................5-19

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Tables

Table 1-1 Intr oduction of the IDU 950.................................................................................................................1-3

Table 1-2 RT N 600 ODUs supported by the OptiX RTN 950.............................................................................1-4

Table 1-3 RT N XMC ODUs supported by the OptiX RTN 950..........................................................................1-5

Table 1-4 Ra dio link forms of the OptiX RTN 950.............................................................................................1-7

Table 2-1 De scription of the IDU labels..............................................................................................................2-3

Table 3-1 Lis t of IDUs..........................................................................................................................................3-4

Table 3-2 Fun ctions and features of the CST.......................................................................................................3-7

Table 3-3 De scription of the indicators on the CST...........................................................................................3-11

Table 3-4 De scription of the clock port and auxiliary management ports.........................................................3-12

Table 3-5 Pin assignment of the NMS/COM port..............................................................................................3-13

Table 3-6 Pin assignment of the EXT port.........................................................................................................3-13

Table 3-7 De scription of the two indicators of the RJ-45 connector..................................................................3-14

Table 3-8 Pin assignment of the CLK/TOD1 port.............................................................................................3-15

Table 3-9 Pin assignment of the TOD2 port.......................................................................................................3-16Table 3-10 Buttons.............................................................................................................................................3-17

Table 3-11 Se tting the DIP switches..................................................................................................................3-18

Table 3-12 Slot allocation ..................................................................................................................................3-20

Table 3-13 Clock timing and synchronization performance..............................................................................3-21

Table 3-14 W ayside service interface performance...........................................................................................3-22

Table 3-15 Mechanical behavior........................................................................................................................3-22

Table 3-16 Fu nctions and features of the CSH...................................................................................................3-23

Table 3-17 Description of the indicators on the CSH........................................................................................3-28

Table 3-18 Description of the clock port and auxiliary management ports.......................................................3-29

Table 3-19 Pin assignment of the NMS/COM port............................................................................................3-30

Table 3-20 Pin assignment of the EXT port.......................................................................................................3-30

Table 3-21 Description of the two indicators of the RJ-45 connector................................................................3-31

Table 3-22 Pin assignment of the CLK/TOD1 port...........................................................................................3-32

Table 3-23 Pin assignment of the TOD2 port.....................................................................................................3-33

Table 3-24 Buttons.............................................................................................................................................3-33

Table 3-25 Setting the DIP switches..................................................................................................................3-35


Table 3-27 Clock timing and synchronization performance..............................................................................3-38

Table 3-28 Wayside service interface performance...........................................................................................3-38

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Table 3-30 Functions and features of the IF1.....................................................................................................3-40

Table 3-31 Signal processing flow in the receive direction of the IF1...............................................................3-42

Table 3-32 Signal processing flow in the transmit direction of the IF1.............................................................3-45

Table 3-33 Description of the indicators on the IF1...........................................................................................3-46

Table 3-34 Description of the Ports ...................................................................................................................3-47


Table 3-36 SDH/PDH microwave work modes (IF1 board)..............................................................................3-50

Table 3-37 IF performance.................................................................................................................................3-50

Table 3-38 Baseband signal processing performance of the modem.................................................................3-51


Table 3-40 Fu nctions and features of the IFU2..................................................................................................3-52

Table 3-41 Signal processing flow in the receive direction of the IFU2............................................................3-56

Table 3-42 Signal processing flow in the transmit direction of the IFU2..........................................................3-58Table 3-43 Description of the indicators on the IFU2........................................................................................3-59

Table 3-44 Description of the Ports ...................................................................................................................3-60


Table 3-46 Hybrid microwave work modes (IFU2 board).................................................................................3-63




Table 3-50 Fu nctions and features of the IFX2..................................................................................................3-66

Table 3-51 Signal processing flow in the receive direction of the IFX2............................................................3-69Table 3-52 Signal processing flow in the transmit direction of the IFX2..........................................................3-71

Table 3-53 Description of the indicators on the IFX2........................................................................................3-73

Table 3-54 Description of the ports....................................................................................................................3-74


Table 3-56 Hybrid microwave work modes (IFX2 board).................................................................................3-76




Table 3-60 Fu nctions and features of the EM6T/EM6F.....................................................................................3-79

Table 3-61 Signal processing flow in the receive direction...............................................................................3-83

Table 3-62 Signal processing flow in the transmit direction..............................................................................3-84

Table 3-63 Description of the indicators on the EM6T/EM6F..........................................................................3-85

Table 3-64 Description of the ports on the EM6T/EM6F..................................................................................3-87

Table 3-65 Pin assignment of the RJ-45 port in MDI mode..............................................................................3-88

Table 3-66 Pin assignment of the RJ-45 port in MDI-X mode..........................................................................3-88

Table 3-67 Description of the two indicators of the RJ-45 connector................................................................3-89

Table 3-68 Slot configuration for the EM6T/EM6F..........................................................................................3-90

Table 3-69 Board feature code of the EM6F......................................................................................................3-90

Table 3-70 Pe rformance of the GE optical port .................................................................................................3-91

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Table 3-71 GE electric interface performance....................................................................................................3-91

Table 3-72 FE electric interface performance....................................................................................................3-92

Table 3-73 Mechanical behavior .......................................................................................................................3-92

Table 3-74 Functions and features of the SL1D.................................................................................................3-93

Table 3-75 Signal processing flow in the receive direction of the SL1D...........................................................3-95

Table 3-76 Signal processing flow in the transmit direction of the SL1D.........................................................3-96

Table 3-77 Description of the indicators on the SL1D.......................................................................................3-97

Table 3-78 Description of the ports ...................................................................................................................3-98

Table 3-79 Slot allocation for the SL1D............................................................................................................ 3-99

Table 3-80 Board feature code of the SL1D.....................................................................................................3-100

Table 3-81 STM-1 optical interface performance............................................................................................3-100

Table 3-82 Mechanical behavior......................................................................................................................3-101

Table 3-83 Fu nctions and features of the SP3S/SP3D.....................................................................................3-102

Table 3-84 Signal processing flow in the receive direction of the SP3S/SP3D...............................................3-104Table 3-85 Signal processing flow in the transmit direction of the SP3S/SP3D.............................................3-104

Table 3-86 Description of the indicators on the SP3S/SP3D...........................................................................3-106

Table 3-87 Description of the port on the SP3S...............................................................................................3-106

Table 3-88 Description of the ports on the SP3D.............................................................................................3-107

Table 3-89 Pin assignment of the Anea 96 connector......................................................................................3-107

Table 3-90 Slot configuration for the SP3S/SP3D...........................................................................................3-110

Table 3-91 Board feature code of the SP3S/SP3D...........................................................................................3-110

Table 3-92 E1 interface performance...............................................................................................................3-110

Table 3-93 Mechanical behavior .....................................................................................................................3-111Table 3-94 Fu nctions and features of the AUX................................................................................................3-112

Table 3-95 Description of the indicators on the AUX......................................................................................3-114

Table 3-96 Description of the auxiliary ports and management ports..............................................................3-114

Table 3-97 Pin assignment of the F1/S1 port...................................................................................................3-115

Table 3-98 Pin assignment of the ALMI port...................................................................................................3-115

Table 3-99 Pin assignment of the ALMO port.................................................................................................3-115

Table 3-100 Slot configuration for the AUX....................................................................................................3-116

Table 3-101 Orderwire interface performance.................................................................................................3-117

Table 3-102 Synchronous data interface performance.....................................................................................3-117

Table 3-103 Asynchronous data interface performance...................................................................................3-117

Table 3-104 Mechanical behavior ...................................................................................................................3-118

Table 3-105 Functions and features of the PIU................................................................................................3-119

Table 3-106 Description of the power status indicators ..................................................................................3-121

Table 3-107 Description of the ports on the PIU..............................................................................................3-121

Table 3-108 Technical specifications...............................................................................................................3-122

Table 3-109 Functions and features of the FAN..............................................................................................3-123

Table 3-110 Adjustment of the fan rotating speed...........................................................................................3-124

Table 3-111 Description of the fan status indicators........................................................................................3-126

Table 3-112 Technical specifications for the FAN...........................................................................................3-127

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Table 4-1 Port description of an E1 panel............................................................................................................4-2

Table 4-2 Pin assignments of an E1 port (E1 panel)............................................................................................4-3

Table 4-3 Ports on the PDU..................................................................................................................................4-5

Table 5-1 Specifications of the power cable.........................................................................................................5-3

Table 5-2 Types of fiber jumpers.........................................................................................................................5-7

Table 5-3 Pin assignment of the 75-ohm E1 cable.............................................................................................5-11

Table 5-4 Pin assignment of the 120-ohm E1 cable...........................................................................................5-12

Table 5-5 Connection table of the E1 cable that connects a PO1/PH1 board to an E1 panel............................5-14

Table 5-6 Connection table of the E1 transit cable terminated with the Anea 96 and DB44 connectors..........5-16

Table 5-7 Pin assignment of the orderwire cable...............................................................................................5-17

Table 5-8 Pin assignment of the MDI port.........................................................................................................5-18

Table 5-9 Pin assignment of the MDI-X port.....................................................................................................5-18

Table 5-10 Pin assignment of the straight through cable...................................................................................5-20

Table 5-11 Pin assignment of the crossover cable.............................................................................................5-20Table A-1 Methods used by Ethernet interfaces to process data frames.........................................................A-245

Table A-2 Data frame processing....................................................................................................................A-278

Table B-1 Loopback types supported by different service interface boards........................................................B-1

Table C-1 Description of the indicators on the CST...........................................................................................C-1

Table C-2 De scription of the indicators on the CSH...........................................................................................C-2

Table C-3 De scription of the indicators on the IF1.............................................................................................C-3

Table C-4 De scription of the indicators on the IFU2..........................................................................................C-5

Table C-5 De scription of the indicators on the IFX2..........................................................................................C-6

Table C-6 De scription of the indicators on the EM6T/EM6F.............................................................................C-7Table C-7 De scription of the indicators on the SL1D.........................................................................................C-8

Table C-8 De scription of the indicators on the SP3S/SP3D................................................................................C-9

Table C-9 De scription of the indicators on the AUX........................................................................................C-10

Table C-10 Description of the power status indicators ....................................................................................C-10

Table C-11 Description of the fan status indicators..........................................................................................C-10

Table D-1 W eight and power consumption of boards.........................................................................................D-1

TablesOptiX RTN 950


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1 IntroductionAbout This Chapter

The OptiX RTN 950 is one of the series products of the OptiX RTN 900 radio transmissionsystem.

1.1 Network ApplicationThe OptiX RTN 900 is a new generation split microwave transmission system developed byHuawei. It can provide a seamless microwave transmission solution for a mobile communicationnetwork or pr ivate network.

1.2 Compone ntsThe OptiX RTN 950 adopts a split structure. The system consists of the IDU 950 and the ODU.An ODU is c onnected to an IDU through an IF cable.

1.3 Radio Lin k FormsThe OptiX RTN 950 provides the radio links of different forms by flexibly configuring differentIF boards and ODUs to meet the requirements of different microwave application scenarios.

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1.1 Network ApplicationThe OptiX RTN 900 is a new generation split microwave transmission system developed byHuawei. It can provide a seamless microwave transmission solution for a mobile communicationnetwork or private network.

The OptiX RTN 900 products are available in two types: OptiX RTN 910 and OptiX RTN 950.The users can choose an appropriate type based on the actual requirements.l The IDU of the OptiX RTN 910 is 1U high and supports one or two IF boards.

l The IDU of the OptiX RTN 950 is 2U high and supports one to six IF boards.

NOTE

The OptiX RTN 910 and OptiX RTN 950 support the same IF boards and service interface boards.

The OptiX RTN 950 provides several types of service interfaces and facilitates installation andflexible configuration. It can provide a solution that is integrated with the TDM microwave,Hybrid microwave, and Packet microwave based on the network requirements. It supports thesmooth upgrade from the TDM microwave to the Hybrid microwave, and from the Hybridmicrowave to the Packet microwave. The solution can evolve based on the service changes thatoccur due to radio mobile network evolution. Thus, this solution can meet the transmissionrequirements of not only 2G and 3G networks, but also future LTE and 4G networks.

Figure 1-1 and Figure 1-2 show the TDM microwave transmission solution and the Hybridmicrowave transmission solution respectively that are provided by the OptiX RTN 950 for themobile communication network.

Figure 1-1 TDM microwave transmission solution provided by the OptiX RTN 950

OptiX RTN 950 BTS BSC

E1

E1

E1

STM-1/E1 E1Regional BackhaulNetwork

E1 E1

E1

E1

E1E1

1 IntroductionOptiX RTN 950


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Figure 1-2 Hybrid microwave transmission solution provided by the OptiX RTN 950

Regional BackhaulNetwork

OptiX RTN 950 BTSNodeB BSCRNC

FE

E1

FE

E1

E1

E1

FE

FE/GE

STM-1/E1

GE

E1

E1

STM-1/E1

FE

NOTE

l In the solutions, the local backhaul network is optional. The OptiX RTN 950 can be connected to the RNC

or the BSC directly.

1.2 ComponentsThe OptiX RTN 950 adopts a split structure. The system consists of the IDU 950 and the ODU.An ODU is connected to an IDU through an IF cable.

IDU 950

The IDU 950 is the indoor unit of an OptiX RTN 950 system. It accesses services, performsmultiplexing/demultiplexing and IF processing of the services, and provides system control andcommunication function.

Table 1-1 lists the basic features of the IDU 950.

Table 1-1 Introduction of the IDU 950

Item Performance

Chassis height 2U

Pluggable Supported

Number of microwavedirections

1-6



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Item Performance

RF configuration mode 1+0 non-protection configuration

N+0 non-protection configuration (N 5)

1+1 protection configuration N+1 protection configuration (N 4)

XPIC configuration

Figure 1-3 IDU 950

ODU

The ODU is the outdoor unit of the OptiX RTN 900. It performs frequency conversion andamplification of signals.

The OptiX RTN 900 series products can uses the RTN 600 ODU and RTN XMC ODU, covering6 GHz to 38 GHz entire frequency band.

NOTE

Unlike the other frequency bands that use 14 MHz, 28 MHz, or 56 MHz channel spacing, the 18 GHzfrequency band uses 13.75 MHz, 27.5 MHz, or 55 MHz channel spacing correspondingly.

Table 1-2 RTN 600 ODUs supported by the OptiX RTN 950

Item Description

Standard PowerODU

High Power ODU Low Capacity forPDH ODU

ODU type SP, SPA HP LP




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Item Description

Standard PowerODU

High Power ODU Low Capacity forPDH ODU

Frequency band 7/8/11/13/15/18/23/26/38 GHz (SPODU)

6/7/8/11/13/15/18/23 GHz (SPA ODU)

7/8/10/10.5/11/13/15/18/23/26/28/32/38GHz

7/8/11/13/15/18/23GHz

Microwavemodulation mode

QPSK/16QAM/32QAM/64QAM/128QAM/256QAM(SP)

QPSK/16QAM/

32QAM/64QAM/128QAM (SPA)

QPSK/16QAM/32QAM/64QAM/128QAM/256QAM

QPSK/16QAM

Channel spacing 3.5/7/14/28 MHz 7/14/28/56 MHz 3.5/7/14/28 MHz

Table 1-3 RTN XMC ODUs supported by the OptiX RTN 950

Item Description

High Power ODU Low Capacity for PDHODU

ODU type XMC-2 XMC-1

Frequency band 7/8/13/15/18/23 GHz 7/8/13/15/18/23 GHz

Microwave modulationmode

QPSK/16QAM/32QAM/64QAM/128QAM/256QAM

QPSK/16QAM

Channel spacing 7/14/28/56 MHz 3.5/7/14/28 MHz

The OptiX RTN 950 provides an entire frequency band antenna solution, and supports the single- polarized antenna and dual-polarized antenna with a diameter of 0.3 m to 3.7 m and thecorresponding feeder system.

There are two methods of mounting the ODU and the antenna: direct mounting and separatemounting.

l The direct mounting method is normally adopted when a small-diameter and single- polarized antenna is used. In this situation, if one ODU is configured for one antenna, theODU is directly mounted at the back of the antenna. If two ODUs are configured for oneantenna, an RF signal combiner/splitter (hereinafter referred to as a hybrid coupler) must

be mounted to connect the ODUs to the antenna. Figure 1-4 shows the direct mountingmethod.



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Figure 1-4 Direct mounting

l The separate mounting method is adopted when a double-polarized antenna or big-diameter and single-polarized antenna is used. Figure 1-5 shows the separate method. In thissituation, a hybrid coupler can be mounted. That is, two ODUs share one feed boom.

Figure 1-5 Separate mounting

1.3 Radio Link FormsThe OptiX RTN 950 provides the radio links of different forms by flexibly configuring differentIF boards and ODUs to meet the requirements of different microwave application scenarios.




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Table 1-4 Radio link forms of the OptiX RTN 950

Radio Link Form Type of theControl,Switching, andTiming Board

rtn 950 idu hardware description-(v100r002c00_06)

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