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Ph.D. Final Defense | Silicon, Germanium, and III-V-Based Tunneling Devices J.T. Smith
Research Portfolio Ali Razavieh
Postdoctoral Scholar Millennium Science Complex
Department of Electrical Engineering Penn State University
Tel: 765-729-8073E-Mail: [email protected]
Ph.D. Final Defense | Silicon, Germanium, and III-V-Based Tunneling Devices J.T. Smith
Table of Contents
A new Method to Achieve High Transconductance Linearity
through Electronic Transport Properties of Low-Dimensional
Nanowire MOSFETs
3Metal/Semiconductor Contacts in Schottky Barrier InAs Nanowire
Transistors
4
Low-Temperature Oxidation of Silicon Nanowires for Low-Leakage
Gate Dielectric Applications5
Circuit Design Experience6
III-V Quantum Well TransistorsIII-V Quantum-Well MOSFETs
Ferro Electric Capacitors on Silicon and InGaAs 1
2
Ph.D. Final Defense | Silicon, Germanium, and III-V-Based Tunneling Devices J.T. Smith
Ferroelectric Capacitors on III-V & Si
-2 -1 0 1 2-50
-25
0
25
50
Electric Field [MV/cm]
Po
lari
zatio
n [
C/c
m2]
III-V Substrate
-2 -1 0 1 2-60
-40
-20
0
20
40
60
Electric Field [MV/cm]
Po
lari
zatio
n [
C/c
m2]
Deposition Pressure = 6mtorrAnnealing Temperature = 620°CPad Area = 50x50 µm2
Deposition Pressure = 5mtorrAnnealing Temperature = 550°CPad Area = 45x45 µm2
Voltage 6V-20VStep: 2Vf = 100Hz
Voltage 6V-20VStep: 2Vf = 100Hz
20 nm n++ In0.53Ga0.47As
Ni
Au100nm PZT
10nm HfO2
Pt
Au
2nm InPSilicon Substrate
100nm PZT
10nm HfO2
Pt Contact
Au Contact
Ph.D. Final Defense | Silicon, Germanium, and III-V-Based Tunneling Devices J.T. Smith
III-V Quantum Well Substrates
-10 0 10 20 30 40 50
-0.1
0
0.1
0.2
0.3
0.4
0.5
Cross Section Height [nm]
Co
nd
uct
ion
Ba
nd
[e
V]
∆E1,2 = 98meV
∆E2,3 = 158meV
InP S. I.
Buffer ~ 400nm In0.52Al0.48As
14nm In0.7Ga0.3As Channel
2nm InP
20 nm n++ In0.53Ga0.47As Cap
1nm Doped In0.52Al0.48As
2 nm channel In0.52Al0.48As
2 nm channel In0.52Al0.48As
Band-Structure Simulation of the Quantum Well Substrates is done using nextnano Software
Ph.D. Final Defense | Silicon, Germanium, and III-V-Based Tunneling Devices J.T. Smith
III-V Quantum Well Device Structure
2nm channel In0.7Ga0.3As
15nm n++ In0.53Ga0.47As
30nm Ni 30nm Ni
Au 50nm Au 50nm
5nm channel InAs
2nm channel In0.7Ga0.3As
Buffer ~ 400nm In0.52Al0.48As
50nm InP S. I.
15nm n++ In0.53Ga0.47As
2nm InP
2nm In0.52Al0.48As
10nm HfO2
2e12/cm2 Si Delta Doping
100nm Ni
Ph.D. Final Defense | Silicon, Germanium, and III-V-Based Tunneling Devices J.T. Smith
0 0.5 1 1.50
5
10
15
Voltage [V]
Cu
rre
nt
[mA
]
VGS = 0.2V-1VStep: 0.2VT = 300K
III-V Quantum-Well Ring-FET
-2 -1 0 1
1e-4
1e-3
1e-2
1e-1
Voltage [V]
Cu
rre
nt
[A]
VDS = 0.2V-1VStep: 0.2VT = 300K
Drain
SourceGate Gate2µm
DrainSource
Ph.D. Final Defense | Silicon, Germanium, and III-V-Based Tunneling Devices J.T. Smith
Previous Works on Metal/InAs Nanowire Contacts Assume that Contacts are Ohmic Due to Fermi Level Pining in the Conduction
Band
Our Work Focuses on Schottky Barrier Heights
Previous Contact Studies
Temperature Annealing
Chemical Treatment
Formation of Metal/InAs Alloys
Removing the Native Oxides (InOx & AsOx)
A. Razavieh, P. Katal Mohseni, K. Jung, S. Mehrotra, S. Das, S. Suslov, X. Li, G. Klimeck, D. Janes, J. Appenzeller, “Effect of Diameter Variation on Electrical Characteristics of Schottky Barrier InAs Nanowire MOSFETs” ACS Nano, 8(6), pp 6281–6287, May 2014
Ph.D. Final Defense | Silicon, Germanium, and III-V-Based Tunneling Devices J.T. Smith
Extracted Schottky Barriers for InAs Nanowire Transistors (NWTs) are Independent of the Wire Diameter/Band-Gap
A. R
azavieh, P. K
atal Mohseni, K
. Jung, S. M
ehrotra, S. D
as, S. S
uslov, X.
Li, G
. Klim
eck, D. Janes, J. A
ppenzeller, “Effect of D
iameter V
ariation on E
lectrical Characteristics of S
chottky Barrier InA
s Nanow
ire MO
SF
ETs”
AC
S N
ano, 8(6), pp 6281–6287, M
ay 2014
Ph.D. Final Defense | Silicon, Germanium, and III-V-Based Tunneling Devices J.T. Smith
Electrical Characteristics of Different InAs NWTs Provides Solid Evidence to Back Up the Schottky Barrier Claims
A. R
azavieh, P. K
atal Mohseni, K
. Jung, S. M
ehrotra, S. D
as, S. S
uslov, X. L
i, G
. K
limeck,
D.
Janes, J. A
ppenzeller, “E
ffect of
Diam
eter V
ariation on
Electrical C
haracteristics of Schottky B
arrier InAs N
anowire M
OS
FE
Ts” AC
S
Nan
o, 8(6), pp 6281–6287, May 2014
Ph.D. Final Defense | Silicon, Germanium, and III-V-Based Tunneling Devices J.T. Smith
Achieving High Transconductance Linearity through Electronic Transport Properties of Low-Dimensional MOSFETs
Major Sources of Non-Linearityin Transistors
1. Transconductance2. Output Conductance
Traditional Methods to Improve Linearity
Provide High Linearity, but Trade-Off Linearity with Noise
or Supply Voltage
Proposed New MethodBias and Operation in 1-D, Ballistic Transport Regime in the Quantum
Capacitance Limit
Provides High Linearity and Requires Low Supply
Voltage
A. Razavieh, N. Singh, A. Paul, G. Klimeck, D. Janes, and Joerg Appenzeller, “A New Method to Achieve RF Linearity in SOI Nanowire MOSFETs,” IEEE RFIC Symposium, pp. 167-170. Baltimore, MD (June 2011)
Ph.D. Final Defense | Silicon, Germanium, and III-V-Based Tunneling Devices J.T. Smith
Small SwingLarge Swing
Comparison of Linear and Non-Linear FETs
2 31 2 3 3d m gs m gs m gsI g V g V g V )(
2 2
thgsd VVh
qI
Non-Linear TransistorConventional MOSFETs
Vgs -Vth
Linear Transistor1-D Ballistic MOSFETs in the Quantum Capacitance Limit
Ph.D. Final Defense | Silicon, Germanium, and III-V-Based Tunneling Devices J.T. Smith
What is the Best Choice of Device Structure to Achieve High Linearity Through this New Method?
Nanowire Transistors
Excellent Scaling Potential
Body Thickness Channel Length
1-D Transport
Oxide Thickness
Quantum Capacitance Limit (QCL)
Ballistic Transport
22( )d gs th
qI V V
h
2277.46m
qg S
h
constEDOSEvEM
dEffEMETh
qI
D
DSd
1
1
~
Ideal Linearity Provides Constant Transconductance which is Independent of the Choice of Channel Material.
Ph.D. Final Defense | Silicon, Germanium, and III-V-Based Tunneling Devices J.T. Smith
Ultra-Thin Gate-All-Around Silicon Nanowire Transistors are Examined for Linearity Evolution Through Our Proposed Method
a
6nm
cGate
DrainSource
b
250nm
A. Razavieh, S. Mehrotra, N. Singh, G. Klimeck, D. Janes, and J. Appenzeller, “Utilizing the Unique Properties of Nanowire MOSFETs for RF Applications,” Nano Letters, 13(4), pp. 1549–1554, April 2013
Channel Length : 200nm-400nmBody Thickness : 6nmOxide Thickness : 4nm
m*= 0.19m0
Device is biased to Operate in 1-D Transport Regime.
Gate Voltage is Replaced by Channel Potential to Simulate the Operation in QCL.
Ph.D. Final Defense | Silicon, Germanium, and III-V-Based Tunneling Devices J.T. Smith
Effect of Channel Length on Linearity for Devices Which are Biased to operate in 1-D transport Regime in the QCL is Studied
The linearity trend for devices operating in 1-D ballistic transport regime in the QCL is shown for a wide range of channel lengths (circles and solid line). The dashed line shows the effect of increasing the mean-free-path for the same channel material.
Conclusion:
1- Absolute Linearity (Infinite IIP3) Requires ideal Ballistic Transport2- Larger λ Improves Linearity3- Rate of Change of λ with Energy (Scattering Mechanism) Effects Linearity More than the Length of λ
Ballistic Transport: Mean-Free-path (λ) > Channel Length (Lch)
GAA Si NWTs : λ = 8nm Quasi- Ballitic Transport Lch = 200nm-400nm T = 77K
A. Razavieh, S. Mehrotra, N. Singh, G. Klimeck, D. Janes, and J. Appenzeller, “Utilizing the Unique Properties of Nanowire MOSFETs for RF Applications,” Nano Letters, 13(4), pp. 1549–1554, April 2013
Ph.D. Final Defense | Silicon, Germanium, and III-V-Based Tunneling Devices J.T. Smith
Effect of Rate of Change of λ on Transconductance Linearity is Examined for 1-D Devices which Operate in the QCL
IIP3 values for 1-D devices in the QCL considering different scattering mechanisms (left plot). IIP3 plot for an ideal ballistic channel is shown for comparison.
A. Razavieh, D. Janes, and J. Appenzeller, “Transconductance Linearity Analysis of 1-D, Quasi-Ballistic Nanowire FETs in the Quantum Capacitance Limit,” IEEE Transactions on Electron Devices, vol.60, no.6, pp.2071,2076, June 2013
Ph.D. Final Defense | Silicon, Germanium, and III-V-Based Tunneling Devices J.T. Smith
Some Materials Such as Graphene are Inherently Linear
Drain
SourceGraphene Ribbon
2µm
L = 7µmW = 1µm
44
220 )()( diracgsdiracgsd VVaVVaaI
Current Equation in Graphene is almost an even function around the Dirac Point which suppresses the odd-order harmonics and intermodulation products.
Ph.D. Final Defense | Silicon, Germanium, and III-V-Based Tunneling Devices J.T. Smith
600°C Wet Oxidation of Silicon Nanowires for Low-Leakage Gate Dielectric Applications (Not Published)
5nm-6nm of thin oxide is grown and used for low-leakage gate dielectric.
Furnace is divided to different temperature zones somehow that pyrogenic reaction between H2 and O2 happens at the 750°C zone but the sample oxidation happens at the 600°C zone.
5nm-6nm of Amorphous SiO2
5nm-6nm of Amorphous SiO2
Crystalline Silicon
Nanowire
Oxidation Time: 5 Hours
Ph.D. Final Defense | Silicon, Germanium, and III-V-Based Tunneling Devices J.T. Smith
Nickel Silicide
Source/Drain Nickel Contact 100nm
Source
DrainGateGate
2μm Silicon Nanowire
Fabricated devices show very low-leakage current levels through the top-gate .
Ph.D. Final Defense | Silicon, Germanium, and III-V-Based Tunneling Devices J.T. Smith
Circuit Design Experience
Analog Circuits
Design and Implementation of a Low-Noise Amplifier, an Active MOS Multiplication-Based Mixer and a Voltage-Controlled Oscillator Using Cadence.
Design and Implementation of a Folded Cascode Op-Amp with Switch Capacitor Filter Using Cadence.
Digital Circuits
Design, Implementation and Layout of an 8-bit Wallace Tree Multiplier with CRitical Path ISolation for Timing Addaptiveness (CRISTA) Using Cadence and Hspice.
Design and Implementation of an 6-T SRAM Cell for Maximum Read Stability with Static Noise Margin (SNM) Analysis Using Cadence and Hspice.
Ph.D. Final Defense | Silicon, Germanium, and III-V-Based Tunneling Devices J.T. Smith
List of Publications and Patents
Publications:
1. A. Razavieh, Xu. Li, P. Katal Mohseni, K. Jung, S. Mehrotra, S. Datta, V. Narayanan, Xi. Li, G. Klimeck, D. Janes, and J. Appenzeller, “Low-Dimensional Nanowire Dynamic Random-Access-Memory Cell” Nano Letters, In Preparation
2. S. DasGupta, A. Rajashekhar, A. Razavieh, N. Agrawal, K. Majumdar, S. Trolier-McKinstry, and S. Datta, “Sub-kT/q Switching in Strong Inversion of Ferroelectric Gated Negative Capacitance FETs” Submitted to Symposia on VLSI and Circuits VLSI, 2015
3. A. Razavieh, P. Katal Mohseni, K. Jung, S. Mehrotra, S. Das, S. Suslov, X. Li, G. Klimeck, D. Janes, J. Appenzeller, “Effect of Diameter Variation on Electrical Characteristics of Schottky Barrier InAs Nanowire MOSFETs” ACS Nano, 8(6), pp 6281–6287, May 2014
4. A. Razavieh, D. Janes, and J. Appenzeller, “Transconductance Linearity Analysis of 1-D, Quasi-Ballistic Nanowire FETs in the Quantum Capacitance Limit,” IEEE Transactions on Electron Devices, vol.60, no.6, pp.2071-2076, June 2013
5. A. Razavieh, S. Mehrotra, N. Singh, G. Klimeck, D. Janes, and J. Appenzeller, “Utilizing the Unique Properties of Nanowire MOSFETs for RF Applications,” Nano Letters, 13(4), pp. 1549–1554, April 2013
6. A. Razavieh, N. Singh, A. Paul, G. Klimeck, D. Janes, and Joerg Appenzeller, “A New Method to Achieve RF Linearity in SOI Nanowire MOSFETs,” IEEE RFIC Symposium, pp. 167-170. Baltimore, MD (June 2011)
7. J. Smith, Y. Zhao, A. Razavieh, C. Yang, J. Appenzeller, “Ge/Si Core/Shell Nanowire Structures for Tunneling Devices,” 218th ECS Transactions, 33(6), pp. 707-714. Las Vegas, NV (2010).
Ph.D. Final Defense | Silicon, Germanium, and III-V-Based Tunneling Devices J.T. Smith
List of Publications and Patents
Patents:
A. Razavieh, X. Li, J. Appenzeller, V. Varnarayan, S. Datta, “Multi-Level One-Dimensional Nanowire Memory”, U.S. Patent, Filing in Progress