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QUALITY CONTROL PROCEDURE
Procedure No. EG-QC-PR-01
Revision No. 01
Page No: 2 of 15
Revision History
Rev.No Date of
Revision
Details of
Changes Reason for Change
Rev.No
From To
00 20-04-2017 Initial release Upgraded to ISO
9001:2015 -- 00
01 19-08-2019
Flow chart,
Sampling plan
modified and
Reference for
Formats, Work
Instructions
Modified to meet the
process requirements 00 01
Distribution List This Documented Information will be uploaded in QMS application for reference.
QUALITY CONTROL PROCEDURE
Procedure No. EG-QC-PR-01
Revision No. 01
Page No: 3 of 15
List of Abbreviations
S.No. Abbreviation Expansion
1. AQL Acceptable Quality Level
2. AVL Approved Vendor List
3. BOM Bill Of Materials
4. CAR Corrective Action Report
5. DGM Deputy General Manager
6. EG Electronics Group
7. FCBC Float Cum Boost Charger
8. GRN Goods Receipt Note
9. I/C In - Charge
10. IQC Inward Quality Control
11. NCR Non conformance Report
12. PCB Printed Circuit Board
13. PCBA Printed Circuit Board Assembly
14. PMM Permanent Magnet Machines
15. PO Purchase Order
16. PR Procedure
17. QC Quality Control
18. SCAR Supplier Corrective Action Report
19. SPI Solar Pump Inverter
QUALITY CONTROL PROCEDURE
Procedure No. EG-QC-PR-01
Revision No. 01
Page No: 4 of 15
Table of Contents 1 Purpose ........................................................................................................................................... 5
2 Scope .............................................................................................................................................. 5
3 Organization chart ......................................................................................................................... 5
4 Roles, Responsibilities and Authorities ...................................................................................... 6
5 Process Flow Chart ....................................................................................................................... 7
6 Procedure ..................................................................................................................................... 10
6.1 Inward Material Inspection ...................................................................................................... 10
6.2 PCB Assembly: ........................................................................................................................ 12
6.3 Modules Assembly: ................................................................................................................ 13
6.4 Rack Level (Final QC) : ............................................................................................. 13
7.0 Documented Information ............................................................................................................. 14
List of Tables
Table 1: Roles, Responsibilities and Authorities .............................................................................. 6
List of Figures
Figure 1: Organization Chart ............................................................................................................... 5
Figure 2: Process Flow Chart .............................................................................................................. 9
QUALITY CONTROL PROCEDURE
Procedure No. EG-QC-PR-01
Revision No. 01
Page No: 5 of 15
1 Purpose
This Procedure shall ensure that the Inward materials inspection, in-process inspection, Final
inspection of all products being manufactured shall be done as per the controlled BOM / AVL /
Drawing requirements.
2 Scope
This procedure shall cover all Quality Control activities from component level to finished product
and packing.
3 Organization chart
Figure 1: Organization Chart
I/C RACK LEVEL
FINAL QC
I/C PCB
ASSEMBLY
INSPECTION
I/C INWARD
MATERIAL
INSPECTION
I/C MODULE
ASSEMBLY
INSPECTION
All Projects
All Projects
Technicians
Technicians
Technicians
Technicians
DGM-QUALITY
All Projects
All Projects
QUALITY CONTROL PROCEDURE
Procedure No. EG-QC-PR-01
Revision No. 01
Page No: 6 of 15
4 Roles, Responsibilities and Authorities
DGM-Quality
Responsibilities: Overall responsibility of the Quality for
Electronics Group.
Authorities: Recruit, Train and deploy the Manpower in the
Quality Dept. Approval of department QUALITY Procedures.
In-charge Inward Material
Inspection
Responsibilities: Responsible for inward material inspection.
Authorities: Inspection and clearance of inward material for
manufacturing.
In-charge PCB Assembly
Inspection
Responsibilities: Responsible for In-Process inspection of
PCB Assemblies.
Authorities: Inspection and clearance of PCB Assemblies to
next stage for further process.
In-charge Module Assembly Inspection
Responsibilities: Responsible for monitoring and controlling of quality activities of in-process inspection and functional testing of of SPI, Looms and Calibration.
Authorities: Authorized to raise and closure of NCR and
to give Finished Goods dispatch clearance.
In-charge Rack Level Final QC
Responsibilities: Responsible for monitoring and controlling of quality activities of in-process inspection and functional testing of all projects related to HBL Rail and other projects called as FCBC and PMM,
Authorities: Authorized to raise and closure of NCR and to
give Finished Goods dispatch clearance
Technicians
Responsibilities:
Inspection of inward materials as per the BOM / AVL / Drawing. Inspection of in-process assemblies as per the BOM / AVL / Drawing / controlled procedures.
Authorities:
Authorized to give clearance of items from one stage to
another stage of concerned product.
Table 1: Roles, Responsibilities and Authorities
QUALITY CONTROL PROCEDURE
Procedure No. EG-QC-PR-01
Revision No. 01
Page No: 7 of 15
5 Process Flow Chart
Electronics / Electrical / Mechanical Items /
Consumables / Packing Materials / Job work
materials
Inward Materials
Inspect as per BOM/AVL/GRN/
DWG/Specifications
Material
Accept Reject
Indicate Status on Material & GRN through
SAP.
Indicate Status on Material & GRN through
SAP.
GRN Return to Stores Handover NCR with
GRN to Stores & NCR to
Purchase
QUALITY CONTROL PROCEDURE
Procedure No. EG-QC-PR-01
Revision No. 01
Page No: 8 of 15
PCB Assembly Modules / Sub-systems / Cabinets / Racks
manufacturing
PCBA
Inspection
In-process
Inspection
System Integration / Rack Assembly
A
Rework Rework
Production Work Order
Accept Accept
Reject Reject
QUALITY CONTROL PROCEDURE
Procedure No. EG-QC-PR-01
Revision No. 01
Page No: 9 of 15
Figure 2: Process Flow Chart
A
Inspection
Functional
Testing
Packing
Inspection
Rework
Rework
Rework
DISPATCH THROUGH COMMERCIAL / STORES
END
Reject
Reject
Accept
Accept
Accept
Reject
QUALITY CONTROL PROCEDURE
Procedure No. EG-QC-PR-01
Revision No. 01
Page No: 10 of 15
6 Procedure
6.1 Inward Material Inspection
1. Inward Quality Control (IQC) receives material from Stores along with GRN.
2. Inspection of received materials shall be carried out as per sampling plan (Reference Standard:
IS 2500,Part-1,Single sampling Plan for Normal Inspection, Special inspection level –II). Refer
ANNEXURE-I.
3. Inward Inspection shall be done as per GRN Description, and controlled AVL / BOM /
Specifications, Drawing, given by Engineering.
4. Check and ensure that the received Materials Description, Part Number mentioned in the GRN
should match with the received materials.
5. GRN for Materials which are used for Project / Maintenance, R&D, Stationary etc., are passed
by IQC on the basis of Visual quality / user‟s approval.
6. If BOM / AVL is not available, then inspect the components as per the GRN Description.
7. Accepted materials shall be labeled with ACCEPTED label and hand over to stores along with
the GRN duly filled and signed by QC Inspector and approved by HEAD-QUALITY.
8. Accepted materials shall be stored at allocated location at holding materials store.
9. Non-conformance materials may be accepted on DEVIATION if the deviations are minor
and deviations approved by Head – QUALITY, Head - Production, Head - Engg, Head -
Purchase. If required, take the deviation from the internal user.
10. All the inspected parameters shall be recorded in the inspection format.
11. Rejected material shall be sent to stores duly identified by a rejected tag, if specifications are
not meeting with PO/AVL/BOM/ Specifications, Drawing, given by Engineering department.
Raise the NCR which shall be signed by HEAD's of Quality, Production, Engineering, Purchase
and send it to purchase.
12. Rejected materials shall be stored at a 'separate location' allocated by the Stores.
13. Upon receipt of NCR, Purchase Department shall prepare and send the SCAR duly filled to the
supplier and shall get the filled SCAR from the supplier.
QUALITY CONTROL PROCEDURE
Procedure No. EG-QC-PR-01
Revision No. 01
Page No: 11 of 15
14. Classification of Materials and Inspection Levels / Quantum of Inspection:
Sl.No Component Visual Inspection Functional Testing 1 TRANSFORMERS** AQL 2.5% AQL 0.65%
2 CHOKES / Inductors** AQL 2.5% AQL 0.65%
3 POPULATED PCB's AQL 2.5% 100%
4 IC‟s (DIP)+ IC's(all SMD packages)* TRANSISTORS* TRANSISTORS*(all SMD packages)
AQL 2.5% AQL 2.5% AQL 2.5% AQL 2.5%
AQL 0.65% for DIP IC's ---------------- AQL 0.65%% ----------------
5 SWITCHES AQL 2.5% AQL 0.65%(Continuity test)
6 D-Type Connector (With cables) AQL 2.5% ---------
7 CONTACTORS AQL 2.5% ---------
8 SHUNTS AQL 2.5% AQL 0.65%
9 BLANK PCB** AQL 2.5% ---------
10 LED's AQL 2.5% AQL 0.65%
11 MOSFET's MOSFET(SMD)
AQL 2.5% AQL 2.5%
AQL 0.65% --------
12 POTENTIOMETERS AQL 2.5% AQL 0.65%
13 REISITORS /SMD Resistors AQL 2.5% AQL 0.65%
14 CAPACITORS / SMD capacitors AQL 2.5% AQL 0.65%
15 DIODES DIODES(SMD packages)
AQL 2.5% AQL 2.5%
AQL 0.65% -----------
16 RELAYS** AQL 2.5% AQL 0.65%
17 ZENER DIODES ZENER DIODES(SMD packages)
AQL 2.5% AQL 2.5%
AQL 0.65% ---------
18 HRC FUSE BASE * Fuses
AQL 2.5% AQL 2.5%
-------- AQL 0.65%(Continuity test)
19 RACK & MODULE * AQL 2.5% --------
20 CABLES, WIRES** AQL 2.5% --------
21 PULSE TRANSFORMERS** AQL 2.5% --------
22 Adhesives 1No per Lot Visual / as per label & coc
23 Plastics and Rubber Parts, Gaskets
AQL 2.5% as per COC
24 Solder Bars/Paste/Wire AQL 2.5% as per COC
25 Chemicals, Flux 1No / batch Visual / as per coc & label
26 Metal Parts, Hardware Items,Tubes AQL 2.5% AQL 0.65%(Dimensional inspection)
27 Adapters AQL 2.5% AQL 0.65%(Dimensional inspection)
28 Connectors AQL 2.5% AQL 0.65%(Dimensional inspection)
29 LCD** AQL 2.5% As per COC/Test Reports
30 Packing Boxes / Materials AQL 2.5% --------------
31 Name Plates/Stickers/Labels AQL 2.5% --------------
32 Valves AQL 2.5% --------------
33 Antennas** AQL 2.5% -------------
34 SENSORS/ RF ID SENSORS** AQL 2.5% ------------
35 Regulators AQL 2.5% AQL 0.65%
36 Controllers AQL 2.5% ----------------
37 Crystals / MOV's/Varistors/ Thermistors/SPD
AQL 2.5% ------------
QUALITY CONTROL PROCEDURE
Procedure No. EG-QC-PR-01
Revision No. 01
Page No: 12 of 15
NOTE:
1. COC, Test reports are required for all Projects need based.
2. Materials not listed in the above table, shall be inspected and accepted as per the
COC/Test reports/ or IQC inspection reports.
3. *Catalog items/Bought out items, Standard items shall be inspected and accepted as
per the catalog/data sheet specifications and COC/Test reports.
4. * * Materials shall be accepted based on the functional parameters of the Supplier test
reports.
5. „+ shall be tested as per available IC test programs. If program is not available, only
Visual Inspection, verification of Part Number, Date of Manufacture/Packing shall be
done and accepted.
6. The AQL may be revised depending upon the Materials Rejection data.
6.2 PCB Assembly:
1. Controlled copies of BOM / AVL / Drawings / Schematics / Test Procedures / Work
Instructions shall be taken from share point or from Engineering Dept.
2. Product work flow inspection shall be controlled by “ROUTE CARD”.
3. Feeder Verification and set up approval shall be done at Pick & place machine for SMD
Components.
4. In Process Inspection shall be carried out as given below:
a. Through hole components assembled on the PCBs are visually inspected (100%).
b. SMD Components are inspected with AOI machine / visually (100%).
5. Functional Testing of PCB‟s shall be done 100% by the ICT / Test Jigs (if supplied by
the customer) by the production.
6. QC shall test 5% samples. If all samples are passed, then LOT shall be accepted. if one
sample is failed, then LOT shall be rejected and returned back to Production for rework /
retesting. After completion of rework / retesting, QC shall test 5% samples and accept
the LOT if all samples Passed. Reject the Lot if one sample is failed. Corrective Action
shall be taken for any repeated failures.
7. All accepted PCB Assemblies are identified with accepted sticker and shall be cleared for
dispatch with Dispatch Instructions signed by authorized Quality persons
QUALITY CONTROL PROCEDURE
Procedure No. EG-QC-PR-01
Revision No. 01
Page No: 13 of 15
8. All Final Inspection reports / Route cards shall be maintained as hard copies or soft
copies with respective Project Quality In-charges for traceability
6.3 Modules Assembly:
1. Sub Systems / Modules shall be tested as per test procedure by testing team of
production. QC team shall monitor the testing activities. In case of any problems during
testing, QC team shall report to Production team for further action. This shall be done
through NCR/mails.
2. Visual inspection of Product / Modules Assembly, etc. shall be carried out on 100%.
3. QC Shall do 5% sample testing of Modules/console wiring as per the respective
Drawing/BOM.
4. During the Inspection, if any process / product non-conformity found, shall be sent back
to previous process stage for re-work with “REWORK” tag. QC inspector shall re-inspect
the same after rework and ensure the compliance of product specifications.
5. NCR shall be raised for any non-conforming product/process and give it to the
Production. Production shall find the root cause and take corrective action and close the
NCR and move to the next process.
6.4 Rack Level (Final QC) :
1. After receipt of accepted Modules and Racks from In-process inspection, system / final
product shall be integrated.
2. Functional testing shall be carried out on integrated system / final product.
3. In order to comply with customer requirements, QC shall use Internal Test Report and
shall do 5% sample testing. If all samples are passed, then LOT shall be accepted. If
one sample is failed, then LOT shall be rejected and returned back to Production for
rework / retesting. After completion of rework / retesting, QC shall test 5% samples and
accept the LOT, if all samples Passed. Reject the LOT if one sample is failed. Corrective
Action shall be taken for any repeated failures.
4. During functional testing, if product requirements / process requirements are not met
and reported as MAJOR non conformity which is non-repairable, then that particular
sub- module / module / Rack shall be rejected with “REJECTED” tag.
QUALITY CONTROL PROCEDURE
Procedure No. EG-QC-PR-01
Revision No. 01
Page No: 14 of 15
5. All accepted products are identified with Customer Holograms or Customer Stamps or
Accepted sticker whichever is applicable and shall be cleared for dispatch with Dispatch
Instructions signed by authorized Quality persons.
6. All Inspection Certificates, I-Notes, Internal Test Reports, Acceptance Test Reports,
Final Inspection reports, Dispatch Memos whichever is applicable shall be maintained as
Hard Copies or scanned soft copies with respective Project Quality In-charges and shall
be maintained in share point for traceability.
7. Refer QUALITY MANUAL (EG-MR-AN-07) for Inspection formats, Test formats, Work
Instructions.
7.0 Documented Information
Refer QUALITY MANUAL (EG-MR-AN-07) for Inspection formats, Test formats, Work Instructions.
S.
No.
Documented Information
(Records) Retention Time
Person
Responsible Storage location
1
Inspection Reports
(IQC, Rail Electronics, SPI,
PMM)
3-years Project In-charge Thumkunta /
Shameerpet
2 Inspection Reports (DCH) 10-years from the
close of Contract Project In-charge Thumkunta
QUALITY CONTROL PROCEDURE
Procedure No. EG-QC-PR-01
Revision No. 01
Page No: 15 of 15
ANNEXURE-I
SAMPLING PLAN (Reference Standard: IS-2500 ; Part-I)
S.N
o
Lo
t s
ize
Sa
mp
le s
ize
Single Sampling Plan for Normal Inspection
Visual Inspection AQL Functional inspection AQL
2.50% 0.65%
Ac <= Re >= Ac <= Re >=
1 2 to 8 2 0 1 0 1
2 9 to 15 2 0 1 0 1
3 16 to 25 2 0 1 0 1
4 26 to 50 3 0 1 0 1
5 51 to 90 3 0 1 0 1
6 91 to 150 3 0 1 0 1
7 151 to 280 5 0 1 0 1
8 281 to 500 5 0 1 0 1
9 501 to 1200 5 0 1 0 1
10 1201 to 3200 8 1 2 1 2
11 3201 to 10000 8 1 2 1 2
12 10001 to 35000 8 1 2 1 2
13 35001 to 150000 13 1 2 1 2
14 150001 to 500000 13 1 2 1 2
15 500001 over 13 1 2 1 2