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Confidential Matsushita Electric Works, Ltd.
Proposal to Proposal to
Flexible PCB MaterialsFlexible PCB Materials
June, 2008June, 2008
Confidential Matsushita Electric Works, Ltd.
1. Core Technology and Capability 1. Core Technology and Capability
2. Total Solution for FPC & Rigid Flex2. Total Solution for FPC & Rigid Flex
3. Technology and Product Advantage 3. Technology and Product Advantage
4. Product Offering Availability4. Product Offering Availability
5. What5. What’’s New?s New?
ContentsContents
Confidential Matsushita Electric Works, Ltd.
1.Core Technology and Capability 1.Core Technology and Capability
Confidential Matsushita Electric Works, Ltd.
Halogen-free Resin Design Technology Core
Technology
ProductionProduction
EngineeringEngineering
Evaluation Evaluation
TechnologyTechnology
Extended
Lamination System(Roll type)
Batch Press System(Sheet type)
Quality Evaluation Technology(Ex.Connection with ACF)
Stress Analysis Simulation
Material Material
TechnologyTechnology
11--1.1. Core TechnologyCore Technology
Confidential Matsushita Electric Works, Ltd.JapanJapan Non JapanNon Japan
FPC UsersFPC Users
Rigid Flex UsersRigid Flex Users
90% share90% share
PWB customers
making Rigid Flex
Small LCD
Hinge
Overseas
PWB customers
making
Rigid Flex
•Total Solution(All HF Materials -Rigid & FCCL)
•Existing Sales Channel
•Focus Application
•Evaluation Technology(Ex; Bending test method
cooperative development with
customer and OEM)Small LCD
Hinge
11--2. FPC Material Marketing Strategy2. FPC Material Marketing Strategy
Multi Layer Multi Layer
Confidential Matsushita Electric Works, Ltd.
0000
20202020
40404040
60606060
80808080
100100100100
120120120120
140140140140
160160160160
180180180180
200200200200
2005 2006 2007 2008
(10K m2/Year)
*Source: Yano Economy Research Report with modification by MEW
11--3. 2Layer D/S FCCL Market 3. 2Layer D/S FCCL Market
No.No.112L D/S Laminator2L D/S Laminator
Production Volume by Supplier
in 2008
Confidential Matsushita Electric Works, Ltd.
11--4. Production Capacity4. Production Capacity
Yokkaichi
1.Roll Style
2.ELS
Koriyama
Yokkaichi
Koriyama
1.Sheet Style
2.BPS
(10K ㎡/year)
0
100
200
300
400
500
2007 2008 2009 2010
180180
240240
360360
120120
BPS
ELS
ELS(Newly Equiped)
Confidential Matsushita Electric Works, Ltd.
■■■■Environmental Friendly
All Halogen Free Type
■■■■ISO
【【【【Koriyama Factory】】】】 ISO9001
ISO14000
ISO14000
TS16949
【【【【Yokkaichi Factory】】】】 ISO9001
TS16949
April 2005
April 2005
May 2007
August 2006
February 2007
March 2007
11--5. ISO & Environmental Friendly5. ISO & Environmental Friendly
Confidential Matsushita Electric Works, Ltd.
2. Total Solution for FPC & Rigid Flex2. Total Solution for FPC & Rigid Flex
Confidential Matsushita Electric Works, Ltd.
22--1. Total Solution for FPC 1. Total Solution for FPC
Proposal for LCD Module with improved ACF connection
■■■■■■■■Test ConditionTest Condition
Supporting board
Test IC
FPC
Pull
Adhesive
ACF
1.Test IC and a FPC base material side
are pasted up by ACF
2.After humidity & thermal stress,
measure peel strength.
ACF Peel StrengthACF Peel Strength
N/mm
((((80808080℃℃℃℃95%95%95%95%))))
(Hours)(Hours)
0
0.2
0.4
0.6
0.8
1
1.2
0
100
200
300
400
500
600
700
800
900
1000
Company CPanasonic
Company D
R-F785 with Newly Developed Copper
Newly developedNewly developed Copper foil by collaboration with copper supplierCopper foil by collaboration with copper supplier
Confidential Matsushita Electric Works, Ltd.
Proposal 3
Flexible PCB partFlexible PCB part
Low Flow Prepreg
R-1551L
Proposal 1Proposal 1
2Layer FCCL 2Layer FCCL
R-F775
R-F785
R-F705
22--2. Total Solution for Rigid2. Total Solution for Rigid--FlexFlex
Rigid PCB partRigid PCB part
RigidRigid
Flexible
Rigid-Flex Board
Halogen-free FR-4 CCL
R-1566
Proposal 5
Materials for Build-Up
ARCC R-0582
Proposal 4NewNew
Proposal 2Proposal 2
CC--F170,F175F170,F175
CC-- F176,F156,F166F176,F156,F166NewNew
NewNew
FCCL based FCCL based MasslamMasslam
Confidential Matsushita Electric Works, Ltd.
3.Technology and Product Advantage3.Technology and Product Advantage
Confidential Matsushita Electric Works, Ltd.
RR--F775,770F775,770:: Polyimide (Polyimide (UpilexUpilex))
RR--F785,780F785,780:: Polyimide (Polyimide (PixeoPixeo))
RR--F705,700F705,700:: LCP (LCP (VecstorVecstor))
33--11--1. 2Layer FCCL 1. 2Layer FCCL (Face Lamination System)(Face Lamination System)
ELS(Extended Lamination System)
ELSELS(Extended Lamination System)
BPS(Batch Press System)
BPSBPS(Batch Press System)
NewNew
NewNew
Confidential Matsushita Electric Works, Ltd.
Feature of Panasonic ELS
- Stable Quality- Uniform lamination by pressing with large area
- <Class100 clean environment in ELS processing
- ELS with various kinds of Films and Copper foils
33--11--2. Panasonic ELS 2. Panasonic ELS (Extended Lamination System)
•Upilex
•Pixeo
•Vecstor, etc
ELS ELS Typical Roll
Lamination SystemFilmFilm
Copper foilCopper foil
•RA type (General, Special)
•ED type (General, Special)
Very Thin (9μm, 12μm)
Confidential Matsushita Electric Works, Ltd.
1414μμμμμμμμm PI based FCCL (Rm PI based FCCL (R--F785F) F785F) ・Copper=Special RA 18 μm ・Test method :IPC‐TM‐650
0.2
0
0.2
0.2
0
0.2
0.2
0
0.20.2
0
①
②
③ ④ ⑤
⑥
⑦⑧0.2
0
0
0
0-0.2
MD
After 150After 150℃℃℃℃℃℃℃℃ 30min30minAfter EtchingAfter Etching
0.2
0
0.2
0.2
0
0.2
0.2
0
0.20.2
0
①
②
③ ④ ⑤
⑥
⑦⑧0.2
0
0
0
0-0.2
MD
0.2
0
0.2
0.2
0
0.2
0.2
0
0.20.2
0
①
②
③ ④⑤
⑥
⑦⑧0.2
0
0
0
0-0.2
MD
0.2
0
0.2
0.2
0
0.2
0.2
0
0.20.2
0
①
②
③ ④⑤
⑥
⑦⑧0.2
0
0
0
0-0.2
MD
Company A Company A R-F785F(ELS)
R-F785F(ELS)
33--22--1. Excellent Dimensional Stability 1. Excellent Dimensional Stability
Confidential Matsushita Electric Works, Ltd.
After EtchingAfter Etching After 150After 150℃℃℃℃℃℃℃℃ 30min30min
R-F785F Company A R-F785F Company A
0.050
0.000
0.100
0.150
0.200
-0.050
-0.100
-0.150
-0.200
0.050
0.000
0.100
0.150
0.200
-0.050
-0.100
-0.150
-0.200
MD TD MD TD MD TDMD TD
% %
33--22--2. Excellent Dimensional Stability 2. Excellent Dimensional Stability
1414μμμμμμμμm PI based FCCL (Rm PI based FCCL (R--F785F) F785F)
(ELS) (ELS)
・Copper=Special RA 18 μm ・Test method :IPC‐TM‐650
Confidential Matsushita Electric Works, Ltd.
33--22--3. Excellent Dimensional Stability 3. Excellent Dimensional Stability
2525μμμμμμμμm PI based FCCL (Rm PI based FCCL (R--F775) F775)
After 150After 150℃℃℃℃℃℃℃℃ 30min30minAfter EtchingAfter Etching
Company B Company B R-F775(ELS)
R-F775(ELS)
0.1
0
0.1
0.1
0
0.1
0.1
0
0.10.1
0
①
②
③ ④ ⑤
⑥
⑦⑧0.1
0
0
0
0 -0.1
MD
0.1
0
0.1
0.1
0
0.1
0.1
0
0.10.1
0
①
②
③ ④ ⑤
⑥
⑦⑧0.1
0
0
0
0 -0.1
MD
0.1
0
0.1
0.1
0
0.1
0.1
0
0.10.1
0
①
②
③ ④ ⑤
⑥
⑦⑧0.1
0
0
0
0 -0.1
MD
0.1
0
0.1
0.1
0
0.1
0.1
0
0.10.1
0
①
②
③ ④ ⑤
⑥
⑦⑧0.1
0
0
0
0 -0.1
MD
・Copper=RA 18 μm ・Test method :Panasonic method
Confidential Matsushita Electric Works, Ltd.
After EtchingAfter Etching After 150After 150℃℃℃℃℃℃℃℃ 30min30min
0.050
0.000
0.100
0.150
0.200
-0.050
-0.100
-0.150
0.050
0.000
0.100
0.150
0.200
-0.050
-0.100
-0.150
-0.200 -0.200
% %
MD TD MD TD
R-F775 Company B
MD TD MD TD
R-F775 Company B
(ELS) (ELS)
2525μμμμμμμμm PI based FCCL (Rm PI based FCCL (R--F775) F775) ・Copper=RA 18 μm ・Test method :Panasonic method
33--22--4. Excellent Dimensional Stability 4. Excellent Dimensional Stability
Confidential Matsushita Electric Works, Ltd.
Open Closed
Crank Bending
Open Closed
ααααBending
Open Closed
Slide Bending
FPC FormFPC Form FPC Form
33--33--1. Bending Flexibility 1. Bending Flexibility
Confidential Matsushita Electric Works, Ltd.
Coverlay
(PI12.5,Ad25)
Plan view
Double sided
FCCL R-F775
L/S=100/100um
Side view
0
50000
100000
150000
200000
250000
Number of times (time)
R-F775
18-20-18
(General RA)
R-F775F
18-20-18
(Special RA)
R-F775
18-25-18
(General RA)
■■■■ Test result
33--33--2. Enhanced Flexibility 2. Enhanced Flexibility ((ααBendingBending))
OPEN CLOSE
170170170170°°°°
・・・・Angle:::: 0 ⇔⇔⇔⇔ 170 °°°°
・・・・Frequency:::: 60rpm
・・・・αααα-bending diameter ::::8ΦΦΦΦ
Test machine
■■■■ Test condition
Note) CoverNote) Cover--lay (PI12.5,Ad25lay (PI12.5,Ad25μμm) was used for the testing.m) was used for the testing.
Confidential Matsushita Electric Works, Ltd.
Analysis ①①①① Thin copper ((((18μμμμm ⇒⇒⇒⇒ 12μμμμm))))
Analysis ②②②② Thin Film ((((25μμμμm ⇒⇒⇒⇒ 20μμμμm))))
18181818----25252525----18181818 12121212----25252525----12121212Cu----Film-Cu-Cu-Cu-Cu (μμμμm)
18181818----25252525----18181818 18181818----20202020----18181818Cu----Film-Cu-Cu-Cu-Cu (μμμμm)
50.45 MPa57.52 MPastress
51.95 MPa57.52 MPastress
33--33--3. Finite Element Method (3. Finite Element Method (ααBendingBending))
Confidential Matsushita Electric Works, Ltd.
33--33--4. Enhanced Flexibility 4. Enhanced Flexibility (Slide Bending)(Slide Bending)
PatternPatternPatternPattern
■■■■Test Method
A circuit is
an outside
-Stroke :50mmmmmmmm-Speed :60rrrrpm-Temperature :room temp
-Radius of curvature :1.0mm
-Life judging :20%UP
0
100000
200000
300000
400000
R-F785F
18-14-18
(Special RA)
Number of times (time)
R-F785
18-14-18
(General RA)
R-F775
18-20-18
(General RA)
R-F775
18-25-18
(General RA)
■■■■ Test result
Note) CoverNote) Cover--lay (PI12.5,Ad15lay (PI12.5,Ad15μμm) was used for the testing.m) was used for the testing.
■■■■Test Sample
0.1mm 0.1mm
TDTD
Confidential Matsushita Electric Works, Ltd.4μm 4μm
Special RA Special RA General RAGeneral RA
Crack formation along
grain boundary
33--33--5. Special RA copper pressed by ELS5. Special RA copper pressed by ELS
Special RA, pressed by ELS, is reSpecial RA, pressed by ELS, is re--crystallized,crystallized,
and features superior performance for slide hinge.and features superior performance for slide hinge.
Confidential Matsushita Electric Works, Ltd.
■■■■ Test condition ■■■■ Test result
33--33--6. Enhanced 6. Enhanced Flexibility Flexibility (Crank Bending)(Crank Bending)
Test machine
Plan view
Double sidde
FCCL R-F775
L/S=100/100um
Side view
170170170170°°°°・・・・Angle :0 <=> 170°°°°
・・・・Frequency : 60rpm
・・・・Circuit :Both side ・・・・Judgment Resistance 10%UP
0
50000
100000
150000
Number of times (time)
R-F775
18-25-18
R-F775F
18-25-18
R-F775
12-25-12
R-F775
12-20-12
R-F785
12-14-12
(General RA) (Special ED)
Coverlay
(PI12.5,Ad25)
Note) CoverNote) Cover--lay (PI12.5,Ad25lay (PI12.5,Ad25μμm) was used for the testing.m) was used for the testing.
(Special RA)
R-F775
18-25-18
Confidential Matsushita Electric Works, Ltd.
General EDGeneral ED Special ED Special ED
MD MD
TD TD
Special ED, pressed by ELS(<300Special ED, pressed by ELS(<300℃℃)), is re, is re--crystallized, crystallized,
and has the almost same crystal structure as General RAand has the almost same crystal structure as General RA’’s.s.
General RA General RA
33--33--7. Special ED copper pressed by ELS7. Special ED copper pressed by ELS
Confidential Matsushita Electric Works, Ltd.
ELSELS
(R-F775/R-F785)
CastingTypical
Roll
Lamination
1.0
1.7
1.0 0.9
(N/mm)• Test Method: IPC-TM-650
1.7N/mm (ELS) vs 0.9-1.0N/mm (Other system)
33--44--1. Excellent Peel Strength 1. Excellent Peel Strength
Confidential Matsushita Electric Works, Ltd.
33--5. Spring Back Performance 5. Spring Back Performance
CCLCCLCCLCCL
■■■■■■■■Loop TestLoop Test
1gf
Loop Dia at no pressure
F785, F780F785, F780 F775, F770F775, F770
0000
20202020
40404040
60606060
80808080
14μμμμm
18μμμμm
20μμμμm
25μμμμm
Stiffness (( ((%
)) ))
F785, F780F785, F780 F775, F770F775, F770
0000
20202020
40404040
60606060
80808080
14μμμμm
18μμμμm
20μμμμm
25μμμμm
Stiffness (( ((mg)) ))
■■■■■■■■Gurley TestGurley Test
Confidential Matsushita Electric Works, Ltd.
4.Product Offering Availability 4.Product Offering Availability
Confidential Matsushita Electric Works, Ltd.
RR--F775 RF775 R--F770F770
RR--F785 RF785 R--F780F780
44--1. Product Offering Availability 1. Product Offering Availability
Max 510㎜㎜㎜㎜
250㎜㎜㎜㎜500㎜㎜㎜㎜, , 510㎜㎜㎜㎜
Roll
Sheet
○○○○
-
○○○○
-○○○○
1414μμμμμμμμ 2020μμμμμμμμ 2525μμμμμμμμ
-
○○○○
5050μμμμμμμμ
Polyimide Thickness
NewNew
1818μμμμμμμμ
○○○○
--
○○○○○○○○ -
○○○○
Copper foil
○○○○
○○○○
○○○○○○○○
99μμμμμμμμmm
(1/4oz)(1/4oz)
1212μμμμμμμμmm
(1/3oz)(1/3oz)
1818μμμμμμμμmm
(1/2oz)(1/2oz)
3535μμμμμμμμmm
(1oz)(1oz)
EDED
RARA
Product Size
Type TD (width)
Double Sided Single Sided
■■■■ Part Number
Confidential Matsushita Electric Works, Ltd.
-Dissipation Factor (Df)
-Dielectric Constant (Dk)
JIS C6471
IPA 23℃ for 5 min
NaOH 2mol/l 23℃ for 5 min No abnormalityNo abnormality-
HCl 2mol/l 23℃ for 5min
Chemical Resistance
IPC-TM-6501.70.8N/m
m
APeel Strength
260℃ Solder for 5 sec
-94V-094VTM-0-A and E-168/70Frame Resistant (UL)
JIS C6471
No abnormalityNo abnormality-260℃ solder float for 1 minSolder Heat Resistance
Internal Method
No abnormalityNo abnormality-288℃ solder float for 1 min
No abormalityNo abnormality-C-96/40/90
260℃ solder float for 1 min
Water Absorption
Solder Heat Resistance
-1.00.04%25℃/50h dippingMoisture Absorption
0.000
-0.023
0.016
0.0027
3.2
4.0E+13
-0.007
0.0015
3.2
R-F775
PI25μμμμm, Cu18μμμμ
IPC-TM650
Method2.5.5.5
IPC-TM650
Method2.5.5.5
0.0016A 10GHz
3.0A 10GHz
0.0008A 2GHz
3.0A 2GHz
0.014E-0.5/150 (MD direction)
-0.005After etching (TD direction)IPC-TM650
0.001
%
After etching (MD direction)
Dimensional Stability
0.019E-0.5/150 (TD direction)
4.9E+14ΩASurface Resistivity
Test MethodR-F705
LCP50μμμμm, Cu18μμμμUnitTest ConditionProperty
55--1. LCP based FCCL 1. LCP based FCCL ((LLiquid iquid CCrystal rystal PPolymerolymer))
RR--F705 F705 ■■■■■■■■General PropertiesGeneral Properties
Note) The above data are our actual values and not assured values.
Confidential Matsushita Electric Works, Ltd.
55--2. Dimensional Stability 2. Dimensional Stability ((LCP based FCCL)LCP based FCCL)
0.1
-0.1
0.1 -0.10
0.1
-0.1
0.1-0.10
0.1
-0.1
0.1 -0.10
0.1-0.1
0.1
-0.1
0
①
②
③ ④⑤
⑥
⑦⑧0.1
-0.1
0.1 -0.10
0.1
-0.1
0.1-0.10
0.1
-0.1
0.1 -0.10
0.1-0.1
0.1
-0.1
0
①
②
③ ④⑤
⑥
⑦⑧ ⑧0.1
-0.1
0.1 -0.10
0.1
-0.1
0.1-0.10
0.1
-0.1
0.1 -0.10
0.1-0.1
0.1
-0.1
0
①
②
③ ④⑤
⑥
⑦0.1
-0.1
0.1 -0.10
0.1
-0.1
0.1-0.10
0.1
-0.1
0.1 -0.10
0.1-0.1
0.1
-0.1
0
①
②
③ ④⑤
⑥
⑦⑧
After 150After 150℃℃℃℃℃℃℃℃ 30min30minAfter EtchingAfter Etching
ELSELS vsvs Typical Roll LaminationTypical Roll Lamination
R-F705 Company D
(ELS)
R-F705 Company D
(ELS)
・LCP=50μm、Copper=ED 18 μm ・Test method :Panasonic method
Confidential Matsushita Electric Works, Ltd.
0
0.2
0.4
0.6
0.8
1
ELSELS vsvs Typical Roll LaminationTypical Roll Lamination・LCP=50μm、Copper=ED 18 μm ・Test method :IPC-TM-650
55--3. Peel Strength 3. Peel Strength ((LCP based FCCL)LCP based FCCL)
ELSELS
(R-F705)
Typical
Roll
Lamination
(N/mm)
Confidential Matsushita Electric Works, Ltd.
2.80
2.85
2.90
2.95
3.00
3.05
3.10
3.15
3.20
3.25
3.30
2GHz 4GHz 6GHz 8GHz 10GHz
0.0000
0.0005
0.0010
0.0015
0.0020
0.0025
0.0030
0.0035
0.0040
2GHz 4GHz 6GHz 8GHz 10GHz
Dk (εεεεr) Df (tanδδδδ)
55--4. 4. Dk/DfDk/Df ((LCP based FCCL)LCP based FCCL)
R-F705 (as it is )
R-F705 (C-96/40/90)
R-F705 (as it is )
R-F705 (C-96/40/90)
R-F775 (as it is )
R-F775 (C-96/40/90)
R-F775 (as it is )
R-F775 (C-96/40/90)
Dk/DfDk/Df is very stable against the moisture uptake. is very stable against the moisture uptake.
Confidential Matsushita Electric Works, Ltd.
18μμμμm
50μμμμm
•LCP film: 50μm
•Copper foil: 18μm
•Characteristic Impedance: 50Ω•Preconditioning: C-96/40/90
after moisture uptake
55--5. Transmission Loss 5. Transmission Loss ((LCP based FCCL)LCP based FCCL)
■■■■Test Sample■■■■Transmission Loss
(dB/cm)
-0.35-0.35-0.35-0.35
-0.3-0.3-0.3-0.3
-0.25-0.25-0.25-0.25
-0.2-0.2-0.2-0.2
-0.15-0.15-0.15-0.15
-0.1-0.1-0.1-0.1
-0.05-0.05-0.05-0.05
0000
1GHz1GHz1GHz1GHz 2GHz2GHz2GHz2GHz 3GHz3GHz3GHz3GHz 4GHz4GHz4GHz4GHz 5GHz5GHz5GHz5GHz
R-F775
R-F705
R-F705w/Special Copper