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ASMD0805 Series Surface Mount PTC Devices PRODUCT DATASHEET Surface Mount PTC Devices

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Page 1: PRODUCT DATASHEET · Environmental Specifications Page 2/7 I hold = Hold Current. Maximum current device will not trip in 25°C still air. I trip = Trip Current. Minimum current at

ASMD0805 Series Surface Mount PTC Devices

PRODUCT DATASHEETSurface Mount PTC Devices

Page 2: PRODUCT DATASHEET · Environmental Specifications Page 2/7 I hold = Hold Current. Maximum current device will not trip in 25°C still air. I trip = Trip Current. Minimum current at

Page 1/7

ASMD0805 Series Surface Mount PTC Devices

Description

The ASMD0805 series provides miniature surface mount resettable overcurrent protection with holding current from 50mA to 1.5A. This series is suitable for ultra portable applications where space is at a premium and the device current is low.

Features

● ● ●●●●

RoHS compliant and lead-freeLow profileHalogen-freeFast response to fault currentCompact design saves board spaceCompatible with high temperature solders

Mobile phones and PDAsIC VCC protectionPortable MP3 and media playerSet-top-box and HDMIMobile Internet Device (MID)Game console port protectionUSB peripherals

Applications

● ● ● ● ● ●●

Agency Approvals

Agency File Number

E472196

Regulation Standard

2002/95/EC

EN14582

Revised:14/06/18JDT Fuse Industrial Co., Ltd

www.jdtfuse.com

Page 3: PRODUCT DATASHEET · Environmental Specifications Page 2/7 I hold = Hold Current. Maximum current device will not trip in 25°C still air. I trip = Trip Current. Minimum current at

Environmental Specifications

Page 2/7

I hold = Hold Current. Maximum current device will not trip in 25°C still air.I trip = Trip Current. Minimum current at which the device will always trip in 25°C still air.V max = Maximum operating voltage device can withstand without damage at rated current (Imax).I max = Maximum fault current device can withstand without damage at rated voltage (V max).Pd = Power dissipation when device is in the tripped state in 25°C still air environment at rated voltage.Ri min/max = Minimum/Maximum device resistance prior to tripping at 25°C.R1max = Maximum device resistance is measured one hour post reflow.CAUTION : Operation beyond the specified ratings may result in damage and possible arcing and flame.

Test Conditions Resistance change

ASMD0805 Series Surface Mount PTC Devices

Passive agingHumidity agingThermal shockResistance to solvent Vibration  Ambient operating conditions : - 40 °C to +85 °CMaximum surface temperature of the device in the tripped state is 125 °C

+85°C, 1000 hrs.+85°C, 85% R.H. , 168 hours+85°C to -40°C, 20 timesMIL-STD-202,Method 215MIL-STD-202,Method 201

±5% typical±5% typical±33% typicalNo changeNo change

Performance Specification

Model V max(V dc)

I max(A)

I hold@25°C

(A)

I trip@25°C

(A)

P dTyp.(W)

MaximumTime To Trip Resistance

Current(A)

Time(Sec)

R i min(Ω)

R1max(Ω)

ASMD0805-005ASMD0805-010ASMD0805-010-30VASMD0805-020ASMD0805-035ASMD0805-035-12VASMD0805-050ASMD0805-050-12VASMD0805-050-16VASMD0805-050-24VASMD0805-075ASMD0805-075-12VASMD0805-100ASMD0805-100-12VASMD0805-110ASMD0805-110-12VASMD0805-125ASMD0805-150

15.015.030.09.006.0012.06.0012.016.024.06.0012.06.0012.06.0012.06.006.00

10010010010010010010010010010040.040.0100100100100100100

0.050.100.100.200.350.350.500.500.500.500.750.751.001.001.101.101.251.50

0.150.300.300.500.750.751.001.001.001.001.501.501.951.952.202.202.503.00

0.50.50.50.50.50.50.50.50.50.50.60.60.60.60.60.61.51.0

0.50.50.58.08.08.08.08.08.08.08.08.08.08.08.08.08.08.0

1.501.501.500.020.100.100.100.100.100.100.200.200.300.300.300.300.600.50

1.5000.7500.7500.5000.2000.2000.1000.1000.1000.1000.0700.0700.0400.0400.0350.0350.0250.015

20.006.0006.0003.5001.2001.2000.8500.8500.8500.8500.3850.3850.2300.2300.2100.2100.1400.130

Revised:14/06/18JDT Fuse Industrial Co., Ltd

www.jdtfuse.com

Page 4: PRODUCT DATASHEET · Environmental Specifications Page 2/7 I hold = Hold Current. Maximum current device will not trip in 25°C still air. I trip = Trip Current. Minimum current at

Thermal Derating Curve

Page 3/7

ASMD0805 Series Surface Mount PTC Devices

Average Time-Current Curve

Derating Curves for ASMD0805 Series

Temperature (°C )

Perc

enta

ge o

f Der

ated

Cur

rent

0

50

100

150

200

-40 -20 0 20 40 60 80

Thermal Derading Chart

Model- 40°C - 20°C 0°C 25°C 40°C 50°C

Maximum ambient operating temperature (Tmao) vs. hold current (Ihold)

60°C 70°C 85°C

0.0700.140.280.470.681.001.351.451.651.98

ASMD0805-005ASMD0805-010ASMD0805-020ASMD0805-035ASMD0805-050ASMD0805-075ASMD0805-100ASMD0805-110ASMD0805-125ASMD0805-150

0.0600.120.250.440.620.901.251.351.531.84

0.0550.110.230.390.550.791.151.201.361.63

0.0500.100.200.350.500.751.001.101.251.50

0.0400.080.170.300.400.630.820.921.051.26

0.0250.050.100.200.290.410.550.650.740.88

0.0350.070.140.270.370.570.740.840.951.14

0.0300.060.120.240.330.530.650.750.851.02

0.0150.030.070.140.230.340.420.520.590.71

Revised:14/06/18JDT Fuse Industrial Co., Ltd

www.jdtfuse.com

Page 5: PRODUCT DATASHEET · Environmental Specifications Page 2/7 I hold = Hold Current. Maximum current device will not trip in 25°C still air. I trip = Trip Current. Minimum current at

Soldering Parameters

Page 4/7

ASMD0805 Series Surface Mount PTC Devices

t L 60~150 s

tsPreheat 60~180 s

t 25°C to peak

Time

TL 217

TP 260

25

TP 20~40 S

Ramp-up Critical Zone TL to TP

Ramp-down

Tsmax

Tsmin

150

200

Tem

pera

ture

(°C

)

Profile Feature Pb-Free Assembly

Average Ramp-Up Rate(Ts max to T p)Preheat -Temperature Min(Ts min) -Temperature Max(Ts max) -Time(Ts min to Ts max)Time maintained above: -Temperature(TL) -Time(tL)Peak Temperature(Tp)Ramp-Down RateTime 25℃ to Peak TemperatureStorage Condition

3℃/second mac.

150℃200℃60~180 seconds

217℃60~150 seconds260℃6℃/second max.8 minutes max0℃~35℃,≤70%RH

Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-freeRecommended maximum paste thickness is 0.25mmDevices can be cleaned using standard industry methods and solvents.Note 1:All temperature refer to topside of the package, measured on the package body surface.Note 2: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.

Revised:14/06/18JDT Fuse Industrial Co., Ltd

www.jdtfuse.com

Page 6: PRODUCT DATASHEET · Environmental Specifications Page 2/7 I hold = Hold Current. Maximum current device will not trip in 25°C still air. I trip = Trip Current. Minimum current at

Page 5/7

ASMD0805 Series Surface Mount PTC Devices

Physical Dimensions(mm.)

Termination Pad CharacteristicsTerminal pad materials:Tin-plated Nickel-CopperTerminal pad solder ability:Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3

ModelMin. Max. Min. Max. Min.

A B C D E

Max. Min. Min.

Packaging Quantity and Marking

Part Number Quantity

ASMD0805-005.010.020.035.050.ASMD0805-075.100.110.125.ASMD0805-150Tape & reel packaging per EIA481-1

5,000 pcs/reel4,000 pcs/reel3,500 pcs/reel

1.5±0.1

1.2±0.1

1.0±0.11.0±0.1

ASMD0805-005ASMD0805-010

ASMD0805-010-30VASMD0805-020ASMD0805-035

ASMD0805-035-12VASMD0805-050

ASMD0805-050-12VASMD0805-050-16VASMD0805-050-24V

ASMD0805-075ASMD0805-075-12V

ASMD0805-100ASMD0805-100-12V

ASMD0805-110ASMD0805-110-12V

ASMD0805-125ASMD0805-150

2.002.002.002.002.002.002.002.002.002.002.002.002.002.002.002.002.002.00

2.202.202.202.202.202.202.202.202.202.202.202.202.202.202.202.202.202.20

1.201.201.201.201.201.201.201.201.201.201.201.201.201.201.201.201.201.20

1.501.501.501.501.501.501.501.501.501.501.501.501.501.501.501.501.501.50

0.200.200.200.200.200.200.200.200.200.200.200.200.200.200.200.200.200.20

0.400.400.400.350.350.350.350.350.500.500.500.500.700.700.700.701.001.00

0.900.900.900.800.800.800.800.801.101.101.001.001.201.201.201.201.501.50

0.100.100.100.100.100.100.100.100.100.100.100.100.100.100.100.100.100.10

Revised:14/06/18JDT Fuse Industrial Co., Ltd

www.jdtfuse.com

Page 7: PRODUCT DATASHEET · Environmental Specifications Page 2/7 I hold = Hold Current. Maximum current device will not trip in 25°C still air. I trip = Trip Current. Minimum current at

Page 6/7

ASMD0805 Series Surface Mount PTC Devices

Governing Specifications EIA 481-1

WP0P1P2A0B0B1max.D0FE1E2min.TT1max.K0Leader min.Trailer min.Reel DimensionsA max.N min.W1W2

8.0 ± 0.34.0 ± 0.104.0 ± 0.102.0 ± 0.051.45 ± 0.102.30 ± 0.104.351.55 + 0.1, -03.5 ± 0.051.75 ± 0.106.250.250.10.74 ± 0.1390160 

178609.0 ± 0.512.0 ± 0.05

Tape And Reel Specifications (mm)

Storage And Handling ● Storage conditions:40°C max, 70% R.H.● Devices may not meet specified performance if storage conditions are exceeded.Technology Corp.

D2

K0 B0A0

T

F

W

E1

P2D0P0

P1

W4

W2

W3

W1

F

H1

W

CD

H

Revised:14/06/18JDT Fuse Industrial Co., Ltd

www.jdtfuse.com

Page 8: PRODUCT DATASHEET · Environmental Specifications Page 2/7 I hold = Hold Current. Maximum current device will not trip in 25°C still air. I trip = Trip Current. Minimum current at

Page 7/7

ASMD0805 Series Surface Mount PTC Devices

Special Voltage Rating(Optional)

Holding Current Rating

Device Dimensions: Length/width(Unit:1/100 inch) Size 2012 mm / 0805 inch

Surface Mount Device

Part Number System

Cross Reference

ASMD 0805 -

“PolySwitch” is a registered trademark of Tyco Electronics.“POLY-FUSE” is a registered trademark of Littelfuse,Inc.“EVERFUSE” is a registered trademark of Polytronics Technology Corp.

ModelTyco / PolySwitch® Littelfuse / POLY-FUSE® Polytronics / EVERFUSE®

Cross Reference

ASMD0805-010ASMD0805-020ASMD0805-035ASMD0805-050ASMD0805-075ASMD0805-100

ASMD0805-100-12ASMD0805-110ASMD0805-125

--

picoSMDC035F------

0805L0100805L0200805L0350805L0500805L0750805L100

0805L100/120805L110

-

SMD0805P010TFSMD0805P020TFSMD0805P035TFSMD0805P050TFSMD0805P075TFSMD0805P100TF

SMD0805P100TF/12 SMD0805P110TF

-

-

Revised:14/06/18JDT Fuse Industrial Co., Ltd

www.jdtfuse.com