president & ceo mentor, a siemens business · acceleration of semiconductor revenue growth ic...
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WALDEN
PRESIDENT & CEO
RHINES
MENTOR, A SIEMENS BUSINESS
Next Wave of Electronics-Driven Applications
Walden C. RhinesPresident & CEOMentor, a Siemens Business
July 2018
3
“Happy Days are Here Again!”
WCR, DARPA ERI July, 2018
Acceleration of Semiconductor Revenue Growth
IC growth of 22% after CAGR of 3%— 55% MOS memory, 8.4% non-memory— 2015 and 2016 growth was only 0.4%— Semiconductor industry R&D
grew 4% in 2017
22.2%
-5%
0%
5%
10%
15%
20%
25%
2011 2012 2013 2014 2015 2016 2017
Annu
al G
row
th (
Perc
ent)
IC Annual Growth
2.8 % 5yr CAGR
Source: VLSI Research, April 2018
WCR, DARPA ERI July, 20184
Accelerating R&D Investment
IC growth of 22% after CAGR of 3%
R&D Increase
$0
$20
$40
$60
$80
Sem
icon
duct
or R
&D
Spe
ndin
g ($
Billi
on)
Calendar Year
Semiconductor R&D Spending $ Billions
14.0% 1.7%
27.3%-1.5%
1.4%9.8%
Source: Semico Research, June 2018
WCR, DARPA ERI July, 20185
Concern about Semiconductor Industry Consolidation
“Within five years, half of all pure-play public semiconductor companies will be acquired
and the top three suppliers will likely see their market share double in the next dozen years
from around 30% share today.”Mark Edelstone
Managing Director Morgan Stanley’s Investment
Banking DivisionSilicon Valley
WCR, DARPA ERI July, 20186
All Others $21.3
All Others $19.1
Broadcom$36.9
Altera$18.2
Freescale$17.3
2010 2011 2012 2013 2014 2015 2016 2017
Actual Merger & Acquisition Activities
$10$23
$12$13 $23
Source: CapIQ and Mentor Graphics Analysis.
$94
$117Linear Tech
$14.8
ARM$31.5
NXP?$51.9
$29
AllOthers
$156
Toshiba?$17.9
$11
Qualcomm?$127.2
Tran
sact
ion
Valu
e ($
B)
WCR, DARPA ERI July, 20187
All Others $21.3
All Others $19.1
Broadcom$36.9
Altera$18.2
Freescale$17.3
2010 2011 2012 2013 2014 2015 2016 2017
Actual Merger & Acquisition Activities
$10$23
$12$13 $23
Source: CapIQ and Mentor Graphics Analysis.
$94
Linear Tech$14.8
ARM$31.5
$66.8
$29
AllOthers
$156
Toshiba?$17.9
$11
Qualcomm?$127.2
Tran
sact
ion
Valu
e ($
B)
WCR, DARPA ERI July, 20188
All Others $21.3
All Others $19.1
Broadcom$36.9
Altera$18.2
Freescale$17.3
2010 2011 2012 2013 2014 2015 2016 2017
Actual Merger & Acquisition Activities
$10$23
$12$13 $23
Source: CapIQ and Mentor Graphics Analysis.
$94
Linear Tech$14.8
ARM$31.5
$66.8
$29
AllOthers
Toshiba?$17.9
$11
Tran
sact
ion
Valu
e ($
B)
WCR, DARPA ERI July, 20189
$777
$984 $950 $970
$299
$511
$366 $354
$897
$-
$200
$400
$600
$800
$1,000
$1,200
2009 2010 2011 2012 2013 2014 2015 2016 2017
Fina
ncin
g Ra
ised
$M
VC Investment in Fabless Semiconductor Startups
IC growth of 22% after CAGR of 3%
R&D Increase
Increase in venture capital funding of fabless semiconductor companies
Average$920
Average$382
Source: Global Semiconductor Alliance (GSA) , IMF, VentureSource & Mentor Graphics Analysis
WCR, DARPA ERI July, 201810
Early Funding Greatly Increased in the Last 4 QuartersWorldwide Fabless Company Venture Capital Funding (1-3)
$142
$62 $61
$7$38
$0 $10 $18
$73 $72$40
$70 $55 $49$13
$39 $38 $20 $39 $45 $38 $40
$107
$298
$221
$566
$0
$200
$400
$600
Q11
2
Q21
2
Q31
2
Q41
2
Q11
3
Q21
3
Q31
3
Q41
3
Q11
4
Q21
4
Q31
4
Q41
4
Q11
5
Q21
5
Q31
5
Q41
5
Q11
6
Q21
6
Q31
6
Q41
6
Q11
7
Q21
7
Q31
7
Q41
7
Q11
8
Q21
8
Fina
ncin
g R
aise
d $M
Round 1Round 2Round 3
Source: Global Semiconductor Alliance (GSA) , VentureSource , PitchBook & Mentor Graphics Analysis
WCR, DARPA ERI July, 201811
$2$4$8$25$25$41$70
$113$201$204
$237$274
$415$543
$0 $100 $200 $300 $400 $500 $600
Hardware Security SoCImage Processor
Video CompressionFlexible Transistors-TFT
Waveguide OpticsLED
Silicon PhotonicsMPU & MCU
Comm. High Speed / 5GSensors & MEMSAnalog & Power
MemoryCrypto Currency
AI & Machine Learning
Market Segments Funded 2012 – 2018 YTD ($M)
13 Fabless AI Companies Received VC Funding 2018 YTDWorldwide Fabless Company Venture Capital Funding (Total Rounds)
$249
$354
$168$200
$71 $73$121
$34
$119$135$73
$184
$62$110 $94 $101
$64 $70
$154
$66$125$149$136
$487
$293
$1,051
$0
$200
$400
$600
$800
$1,000
$1,200
Q11
2
Q21
2
Q31
2
Q41
2
Q11
3
Q21
3
Q31
3
Q41
3
Q11
4
Q21
4
Q31
4
Q41
4
Q11
5
Q21
5
Q31
5
Q41
5
Q11
6
Q21
6
Q31
6
Q41
6
Q11
7
Q21
7
Q31
7
Q41
7
Q11
8
Q21
8
Fina
ncin
g R
aise
d $M
Round 1 Round 2 Round 3 Round 4 Round 5 Round 6 Round 7 Round 8 Round > 9
2018 YTD had 11 Rounds with undisclosed $’s
AI, Deep Learning Portion of Funding - 2018 YTDAIMotive Gmbh, $38M – ADAS Acceleration ChipBeijing Intengine Tech – $30M – AI chips for end-point devices in multiple industriesHailo Technologies – $12.5M – AI chips data center edge devicesKneron, $18M – AI Network Processor (NPU)Metawave, $10M – AI engine for autonomous driving radar chipMythic Inc, $40M – IPU for adding intelligence to any deviceNextVPU, $2M – computer vision chips for robotics, unmanned vehiclesSyntiant, $5.1M – Neural Decision Processors (NDP)-reducing data movementTenstorrent, $0.5M – Deep learning processorXanadu Quantum Tech, $9M – Quantum processor chip using Silicon PhotonicsHangzhou Fabu Technologies, $Undisclosed – AI adaptive chip architecture for ADASCambricon, $Undisclosed – Processor for AI, datacenterTachyum Inc, $Undisclosed – Processor for AI, data center and HPC platforms
Source: Global Semiconductor Alliance (GSA) , VentureSource , PitchBook & Mentor Graphics Analysis
WCR, DARPA ERI July, 201812
Chinese Government Incentives for Semiconductor Investment
$20 billion China Integrated Circuit
Investment Fund(Government Backed)
$97 billionin Private Equity,Local Governments,Regional Governments
Source: PWC 2014
First Fund - 2014 IC growth of 22% after CAGR of 3%
R&D Increase
Increase in venture capital funding of fabless semiconductor companies
China investments in semiconductor
WCR, DARPA ERI July, 201814
Chinese Government Incentives for Semiconductor Investment
IC growth of 22% after CAGR of 3%
R&D Increase
Increase in venture capital funding of fabless semiconductor companies
China investments in semiconductor
$47 billion China Integrated Circuit
Investment Fund(Government Backed)
Source: Wall Street Journal, May 2018
“Big Fund” - 2018
“China is Poised to announce a new fund of 300 Billion yaun ($47.4 Billion) to spur development of semiconductor industry…”
Wall Street Journal, May 2018
15 WCR, DARPA ERI July, 201815
Round 1, 2 and 3 Locations
$142
$62 $61
$7$38
$0 $10 $18
$73 $72$40
$70 $55 $49$13
$39 $38 $20$39 $45 $38 $40
$107
$298
$221
$566
0
100
200
300
400
500
600
700
Q112
Q212
Q312
Q412
Q113
Q213
Q313
Q413
Q114
Q214
Q314
Q414
Q115
Q215
Q315
Q415
Q116
Q216
Q316
Q416
Q117
Q217
Q317
Q417
Q118
Q218
Repo
rted
VC
Fund
ing
($M
illio
ns)
Others
China
Israel
Texas
Canada
Massachusetts
Europe
California
WCR, GSA June 4, 2018
Source: Global Semiconductor Alliance (GSA) , VentureSource , PitchBook & Mentor Graphics Analysis
China Pulls Away in Last Four QuartersWorldwide Fabless Company Venture Capital Rounds (1-3)
China 2.8X US in 2018 YTD FundingWorldwide Fabless Company Venture Capital Rounds 1-3
WCR, GSA June 4, 2018
Source: Global Semiconductor Alliance (GSA) , VentureSource , PitchBook & Mentor Graphics Analysis
0
100
200
300
400
500
600
China US Europe Other
Repo
rted
VC
Fund
ing
($M
illio
ns) 2012 2013 2014 2015 2016 2017 2018 YTD
2.8X
China Semiconductor Initiative Has Accelerated New Startup Formation
15 17 20 23 27 32 41 56 62 76 98
200
389463 471 479 488 491 483 472 485 495 518
583
681 715
1,3621,380
0
500
1,000
1,500IC Design Enterprises in China
Source: China’s Impact on the Semiconductor Industry, PWC and TrendForce,2017 Data Point is from EE Times Asia article dated November 28, 2017
WCR, DARPA ERI July, 201818
China chip segments
19 WCR, DARPA ERI July, 2018
> 500 0.4% 100-500,
9.8%
50-100, 22.1%
< 50, 67.7%
2006Employment
> 5006.1%
100-500, 43.3%
50-100, 33.2%
< 5017.4%
2015Employment
Total Enterprises = 479 Total Enterprises = 715
China’s Fabless Companies Have Become Much Larger
WCR, DARPA ERI July, 201820
Source: China’s Impact on the Semiconductor Industry: 2016 Update, PWC
“Artificial Intelligence Heavyweights”, July 1986A Technology that Arrived Before Its Time
WCR, DARPA ERI July, 201822
Lack of big data to analyze— No Internet or IoT to collect sizable data sets
Limited computing power— Limitation of traditional computer chip architectures
Need for more advanced algorithms
Lack of ‘killer’ applications to make money
Reasons for AI Adoption Delay in the 1980s
WCR, DARPA ERI July, 201823
Lack of big data to analyze— No Internet or IoT to collect sizable data sets
Limited computing power— Limitation of traditional computer chip architectures
Need for more advanced algorithms
Lack of ‘killer’ applications to make money
What’s Different Today?All these limitations are going away
WCR, DARPA ERI July, 201824
What’s Driving Semiconductor Design Starts & Innovation Today? And what new innovations will this momentum lead to in 2030?
WCR, DARPA ERI July, 201825
Artificial intelligence/machine learning
5G
IoT
Sensor fusion
Security
System emulation
Memory technology
Artificial intelligence/machine learning
5G
IoT
Sensor fusion
Security
System emulation
Memory technology
What’s Driving Semiconductor Design Starts & Innovation Today? And what new innovations will this momentum lead to in 2030?
WCR, DARPA ERI July, 201826
The Gompertz Curve
Benjamin Gompertz, 1825 Mathematical model for time series
— Growth percent is fastest at the start and slowest at the end
Example— Growth of tumors— Population growth— Mobile phone uptake— Market impact in finance
y = a e
be-ct
time
y
WCR, DARPA ERI July, 201827
0.0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
Global Subscribers Forecast
Total Cell Phone SubscribersGompertz Forecast 2016
Cellu
lar
Subs
crib
ers
(Bill
ions
)
Source: International Telecommunications Union
Source: The Guardian
WCR, DARPA ERI July, 201828
0.0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
Global Subscribers Forecast 1997
Total Cell Phone SubscribersGompertz Forecast 1997
Cellu
lar
Subs
crib
ers
(Bill
ions
)
Source: International Telecommunications Union
Source: The Guardian
WCR, DARPA ERI July, 201829
0.0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
Global Subscribers Forecast 2016 Forecast 1997
Total Cell Phone SubscribersGompertz Forecast 1997 vs. 2016
Cellu
lar
Subs
crib
ers
(Bill
ions
)
Source: International Telecommunications Union
Source: The Guardian
WCR, DARPA ERI July, 201830
0
50
100
150
200
250
300
350
400
Server Unit Shipments Forecast
Data Center Processing Demands Have Grown for Decades Servers S-Curve
Server Semiconductor Consumption as a Percentage of Total Semiconductor Revenue 2015 … 4.2%
Cum
ulat
ive
Uni
t Vol
ume
(Mill
ions
)
Sources: Gartner Group, IC Insights & Mentor Graphics analysis
WCR, DARPA ERI July, 201831
+30% Commercial Server Growth after 4 Years of 2% CAGR(Recent 4 Quarters/Prior 4 Quarters)
$11.8$12.6$12.6
$14.9
$11.1$12.3$12.1
$14.3
$11.0$12.7$12.8
$14.5$12.8$13.5$13.4
$15.3
$12.4
$14.8$14.2$14.6
$11.8
$15.7$17.0
$20.7
$18.8
Rev
enue
$B
illio
ns
Commercial Server Revenue ($ Billions)
WCR, DARPA ERI July, 201832
New Breed of Applications Creating Demand for Innovative New Custom Architectures
Artificial intelligence/machine learning— Pattern recognition
– Intelligent image processing– Audio, other senses
Block chain processing— Bitcoin mining— Provenance/Supply Chain
Management— Identity Authentication
WCR, DARPA ERI July, 201833
AI/ML Requires Moving to the Next Level of Abstraction and Power Analysis
Market Drivers for High-Level Synthesis
Reduced Time To Market with good QofR
Late Changing Specifications
Reduce Verification and Debug Cost/Time
Require FPGA Prototype and SoC/ASIC
High Bandwidth and Cellular
Comm
Image Processing,
Video & Compression
Computer Vision and
Neural Computing
WCR, DARPA ERI July, 201834
Artificial intelligence/machine learning
5G
IoT
Sensor fusion
Security
System emulation
Memory technology
WCR, DARPA ERI July, 201835
What’s Driving Semiconductor Design Starts & Innovation Today? And what new innovations will this momentum lead to in 2030?
Major Applications for 5G Video/entertainment delivery
— Next generation video and TV— Video to mobile— Video to broadband
Smart city systems Smart home/Building Augmented & virtual reality Mobile connectivity IoT and Industrial IoT Cloud computing/big data analytics Automotive telematics and autonomous drive (constrained)
Source: IMT-2020https://www.rfpage.com/applications-5g-technology/
WCR, DARPA ERI July, 201836
Latency specifications of 1 msec
Peak throughput 10Gbit/s
Ultra low power
Enablement of new cloud-based apps— Such as factory gateways
5G system simulation
WCR, DARPA ERI July, 201837
5G Is Stimulating a Plethora of Chip DesignsBut has challenging design problems
Artificial intelligence/machine learning
5G
IoT
Sensor fusion
Security
System emulation
Memory technology
WCR, DARPA ERI July, 201838
What’s Driving Semiconductor Design Starts & Innovation Today? And what new innovations will this momentum lead to in 2030?
Intelligence Flows Downhill Over Time
1960s 1980s 2000s
Dumb Terminals
Mini Computers Mini Computers
Personal Computers
Dumb Peripherals
2020s
Cloud
Gateways (Fog)
Edge Nodes (Mist)
Dumb Terminals
WCR, DARPA ERI July, 201839
Complex but extremely cost-sensitive design, ultra low power and ultra high volume— Sensor with MEMS— N-Zero power— A/D converter— Analog signal processing
IoT Intelligent Edge Device
— Digital interface— Radio (RF communication)— Microcontroller
Accelerometer
MicrocontrollerST Microelectronics / STM32L151C6ARM Cortex-M3 processor
Battery Charger ICTexas Instruments / BQ24040
Bluetooth ICNordic Semiconductor / nRF8001
Source: ifixit.com
WCR, DARPA ERI July, 201840
WCR, DARPA ERI July, 201841
What’s Driving Semiconductor Design Starts & Innovation Today? And what new innovations will this momentum lead to in 2030?
Artificial intelligence/machine learning
5G
IoT
Sensor fusion
Security
System emulation
Memory technology
Source: Mentor Analysis
59 120
1142
119
346 Companies Developing Electric Cars and Light Trucks144 Companies Announced Autonomous Drive Programs
Automotive Disruption on the Horizon?
WCR, DARPA ERI July, 201842
Autonomous Drive Stimulating Design ActivityVehicle Architecture Levels 1 to 5
Centralized raw data fusion
WCR, DARPA ERI July, 201843
HIGH SPEED SENSOR LINK CONTROL AND COMMUNICATIONS LINK CONTROL AND COMMUNICATIONS LINK
WCR, DARPA ERI July, 201844
What’s Driving Semiconductor Design Starts & Innovation Today? And what new innovations will this momentum lead to in 2030?
Artificial intelligence/machine learning
5G
IoT
Sensor fusion
Security
System emulation
Memory technology
Counterfeiting
Safety
Fraud
Government policy
Likely Stimuli for New ApplicationsCounterfeit Known Good Part
WCR, DARPA ERI July, 201845
WCR, DARPA ERI July, 201846
What’s Driving Semiconductor Design Starts & Innovation Today? And what new innovations will this momentum lead to in 2030?
Artificial intelligence/machine learning
5G
IoT
Sensor fusion
Security
System emulation
Memory technology
Sense
SensorsTraffic Data
SystemAlgorithms
Ad-hoc TLM, D
PI Interfaces FMU MODELS
FMI
FMI
Mechanical and dynamic simulation
5000+ ModelsCustom Models
AMESimCompute: Veloce Strato
Image Processing
Powertrain Controller
Sensor Fusion
Safety & Security
Controller
Actuate
Transmission
Engine
Braking
Steering
Co-development of AUTOSAR software and ECU hardware together with mechanical system actuators, sensors, and traffic scenarios
Automotive EmulationIntegrated System of Systems Framework to Simulate and Verify Multiple ECUs
WCR, DARPA ERI July, 201847
Both Electrical and Mechanical Must Be Verified Virtually
Perspective Update
Scenario
Auto Dynamic State
Actuator ControlSensor Signals
D&V PlatformVeloceHYCON
CALYPTOFor CNNs
Simcenter Prescan
Simcenter Amesim
Sensor Fusion
Accident Database
Powertrain Model Chassis Model
WCR, DARPA ERI July, 201848
Artificial intelligence/machine learning
5G
IoT
Sensor fusion
Security
System emulation
Memory technology
WCR, DARPA ERI July, 201849
What’s Driving Semiconductor Design Starts & Innovation Today? And what new innovations will this momentum lead to in 2030?
45.0%
78.0%
92.0%97.0% 99.2% 99.7%
1990 1995 2000 2005 2010 2015
Memory as a Percentage of All Transistors
Source: VLSI Research, 2016
Memory Now Dominates Transistors Manufactured
WCR, DARPA ERI July, 201850
1.0E-10
1.0E-09
1.0E-08
1.0E-07
1.0E-06
1.0E-05
1.0E-04
1.00E+15 1.00E+16 1.00E+17 1.00E+18 1.00E+19 1.00E+20 1.00E+21 1.00E+22
Reve
nue/
Bit (
$Nan
o)
Cumulative Transistors Shipped
Learning Curve CAGR 1995-2015DRAM & FLASH ……... -39%Remaining SEMI …..… -21%
Semiconductor (excluding DRAM & FLASH)
DRAM &FLASH
Without Memory, the Semiconductor Industry is Not Continuing on the Long Term Learning Curve
Source: VLSI Research 2016, Federal Reserve Note: Revenue adjusted for Inflation… 1954-2015
WCR, DARPA ERI July, 201851
1.0E-10
1.0E-07
1.0E-04
1.0E-01
1.0E+02
1.0E+05 1.0E+07 1.0E+09 1.0E+11 1.0E+13 1.0E+15 1.0E+17 1.0E+19 1.0E+21
Reve
nue/
Bit
Cumulative Transistors Shipped
Learning Curve CAGR 1995-2015DRAM & FLASH ……... -39%Total Semiconductor…..… -37%
Semiconductor
DRAM &FLASH
Source: VLSI Research 2016, Federal Reserve Note: Revenue adjusted for Inflation… 1954-2015
Memory, Instead of Logic, Transistors Keep Semiconductors on the Long Term Learning Curve
WCR, DARPA ERI July, 201852
3D NAND Allows Memory to Scale Faster than Logic or SoC’s
Source: IC Insights, McClean Report, 2016
WCR, DARPA ERI July, 201853
0.E+00
5.E+21
1.E+22
2.E+22
2.E+22
3.E+22
3.E+22
4.E+22
4.E+22
5.E+22
5.E+22
Total Transistors Forecast
0.E+00
2.E+20
4.E+20
6.E+20
8.E+20
1.E+21
1.E+21
1.E+21
2005 2010 2015
Cum
ulat
ive
Tran
sist
or U
nit V
olum
e
Source: VLSI Research, 2016
y = a ebe
-ctTotal Transistors Gompertz Curve
WCR, DARPA ERI July, 201854
0.E+00
5.E+21
1.E+22
2.E+22
2.E+22
3.E+22
3.E+22
4.E+22
4.E+22
5.E+22
5.E+22
Total Transistors Forecast
Cum
ulat
ive
Tran
sist
or U
nit V
olum
e
Today
Silicon Transistor Growth Stalls
Need an Alternative to the Silicon Transistor ‘Switch’ Before 2030
Source: VLSI Research, 2016
WCR, DARPA ERI July, 201855
Non-von Neumann Computer Architectures Will Improve Processing Speed, Reduce
Power and Integrate More Memory
Source: ISSCC 2014 Trends - 61st ISSCC 2014, February 2014
Memory improvements— Increased capacity— Hierarchical memory— Memory cell connectivity— Invariant memory
Processor architecture improvements— Parallelism— Error tolerance— Continuous feedback— Integration with memory
Requirements for Brain-Like Pattern Recognition
WCR, DARPA ERI July, 201857
Who Will Create the Designs and Develop the Technology?
0
200
400
600
800
1,000
1,200
1,400
1,600
2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014
Thou
sand
s of
ann
ual g
radu
ates
First University Degrees in Natural Sciences and Engineering
China United States EU-Top 8 Japan Taiwan
Source: National Science Foundation 2018 Science and Engineering Indicators
WCR, DARPA ERI July, 201859
Who Will Create the Designs and Develop the Technology?
0
2,000
4,000
6,000
8,000
10,000
12,000
14,000
16,000
18,000
20,000 Earned Doctoral Degrees2014 or Most Recent Year
Source: National Science Foundation 2018 Science and Engineering Indicators
WCR, DARPA ERI July, 201860
Source: OECD Science, Technology and Industry Scoreboard 2017
WCR, DARPA ERI July, 201861
Global Share of Top Cited Scientific Publications 2016As a percentage of world’s top 10% most cited publications
0
5
10
15
20
25
30
35
EU28 USA CHN GBR DEU ITA FRA JPN CAN AUS IND ESP KOR NLD CHE
Current acceleration in design starts and startups will generate semiconductor momentum for the next decade
New apps at the leading edge of technology— Pattern recognition – AI/ML/automotive— 5G enabled capabilities— IoT and IIoT — Sensor fusion— Security— System emulation
Memory technology as a key driver for brain-like architectures— Will need a new memory cell around 2025 — Learning curve continues
Growing and training the developers of semiconductor technology/design for new applications
WCR, DARPA ERI July, 201862
What’s Driving Semiconductor Design Starts & Innovation Today? And what new innovations will this momentum lead to in 2030?