perfect pcb warp compensation solution must-check...
TRANSCRIPT
SPC Pro
● Minimization of False Call : Koh Young’s W arp Compensation provides a revolutionary solution to PCB warpage
Warp problems of big-sized PCB and FPCB after reflowseriously affect production quality.
Perfect PCB Warp Compensation Solution
W arp Compensation Before W arp Compensation After
K SMART L ink
● Process control data, provided by Koh Young’s full 3D SPI and AOI are stored and shared in DB real time● Software tool that monitors and analyzes defects and root cause of defects v
● SPC Pro provides various process analysis tools such as yield rate, NG analysis, PPM analysis, Gage R& R, Offset analysis, and more● Able to set by order according to user’s wish through Scenario
Scenario Setting W indow Offset Analysis
Gage R& R Analysis Defect Frequency and Type Analysis
RequirementsShadow Problem Solution
Specular Problem Solution
Shadowed Area between Tall Components
Small ( 01 005 inch) Component Insepction
W ide Measurement Range + Accuracy ( Measurement Range Problem)
Real Time PCB W arp Compensation
Dark Component & W hite Body Component Location
Component Body, Lead Coplanarity Inspection
Solder Joint Profile Inspection
3D Polarity Inspection
Component Crack Inspection
Solutions
● W arp Compensation ( Pad Referencing + Multi-Frequency Moiré Technology)
● 3D Shadow Free Moiré Technology & 8 W ay Projection
● Full 3D Measurement
● Multi-Frequency Moiré Technology
Inspection Task● Missing, Offset, Rotation, 3D Polarity, Upside down, OCV/OCR, Coplanarity, Solder fillet, Lifted lead, Billboarding, tombstone, Bridging, Dimension
InspectionItems
Conveyor W idth Adjustment
Conveyor Fix Type
● Automatic● Front / Rear Fix ed ( factory setting)
PCBH andling
● 1 D & 2D Handy Barcode Reader● 1 D & 2D Inline Barcode Reader● Offline Programming Station● Offline SPC Pro Station● Standard Calibration Target
● KSMART Remote Monitoring System● W arp Compensation● Foreign Material Inspection● Review Station
Add-onSolutions
Softw are
Supported Input Format
Operating System
Operator User-friendliness
Statistical Process Control Tool
Programming S/WOperating System
● KSMART Library Manager 2.0● KYCal: Auto Camera Calibration, Auto Illumination Calibration, Auto Height Calibration● Intel i7 -39 7 0X ( 6 Core) , 32GB, W indows 7 Ultimate 6 4 bit
● GE RBE R Data ( 27 4 X , 27 4 D) , ODB+ + , Placement file, Mounter JOB file, Allegro, Zuken, Mentor ( optional)● ePM-AOI, AOI GUI 2.3.6● AOI GUI 2.3.6● Renewal AOI SPC● Review Station● KSMART Remote Monitoring System
Camera ResolutionFOV SizeFull 3D Inspection SpeedHeight Accuracy ( on KY Calibration Target)CameraIlluminationMax . Measurement Height
● ± 3%● 4 M Pix el High Speed Camera● IR-RGB LE D Dome Styled Illumination● 5 mm
30× 30mm ( 1 .1 8 × 1 .1 8 inch)20
4 0× 4 0mm ( 1 .5 7 × 1 .5 7 inch)
InspectionPerfor-mance
Max . PCB Size 330X 330mm( 1 3X 1 3 inch)
5 0X 5 0mm( 1 .9 7 X 1 .9 7 inch)
5 0mm( 1 .9 7 inch)200~ 24 0VAC, 5 0/6 0Hz Single Phase, 5 Kgf/cm2
0.4 ~ 5 mm( 0.01 5 ~ 0.20 inch)
Ring Belt : 2kg ( 4 .4 lbs) , Timing Belt : 5 kg ( 1 1 lbs)8 5 0kg ( 1 8 7 4 lbs)
8 20mm( 32.2 inch)
1 6 27 mm( 6 4 inch)9 8 5 mm( 38 .7 inch) 1 1 6 5 mm( 4 5 .8 inch)
1 35 0mm( 5 3.1 inch)1 26 5 mm( 4 9 .8 inch) 1 26 5 mm( 4 9 .8 inch) 1 4 4 5 mm( 5 6 .9 inch) 1 4 4 5 mm( 5 6 .9 inch)
1 0kg ( 22 lbs)
0.5 ~ 8 mm( 0.02~ 0.31 inch)
7 0X 7 0mm( 2.7 X 2.7 inch)
5 1 0X 5 1 0mm( 20X 20 inch)
Dual: 5 1 0X 320mm( 20X 1 2.6 inch)
Single: 5 1 0X 5 8 0mm( 20X 22.8 inch)
8 5 0X 6 9 0mm( 33.4 X 27 .1 inch)
Min. PCB Size
PCB Thickness
Max . PCB W eightMachine W eight
Bottom Side ClearanceSupplies
WDHF
M L DL X L
6 00kg ( 1 322 lbs) 7 00kg ( 1 5 4 3 lbs)5 5 0kg ( 1 21 2 lbs)
1 000mm( 39 .3 inch)1 000mm( 39 .3 inch)
H F( Front-Fix )
(PC
B H
eigh
t 950
mm
)
PC
B T
rans
fer H
eigh
t
PC
B H
eigh
t 950
mm
870~
950m
m
1182
mm
167m
m47
5mm
(PC
B H
eigh
t 950
mm
Fro
m B
otto
m C
lear
ance
)
Must-check Requirements of 3D AOI System
1 8 .3 ~ 30.4 cm2 /sec ( Inspection speed varies by PCB, and inspection condition.)
W D4 1 8 mm
※ Above specifications are subject to change without notice.
Zenith brings a revolution to SMT process
control, based on the world’s best full 3D
measurement & inspection by visualizing,
identifying and eliminating root cause of defects.
Perfect Full 3D
Inspection Performance
Fast and Intuitive
Programming
3D Data basedSMT Process ControlSystem
Koh Young Technology Inc. All rights reserved.
08 5 8 8
+82-2-6343-6000 +82-2-6343-6001
Measurement based Inspection
The AOI system measures the
true profilometric shape of components,
solder joints, patterns and even foreign materials on assembled PCBs,
overcoming the shortcomings and vulnerabilities of 2D AOI.
Dimension Rotation Bridging Lead Coplanarity Missing
Solder Fillet Billboarding Upside down OCV/OCR Offset
Quantified inspection condition setting based on 3D measurement dataRemoval of uncertainties of production control by inspection resultquantification Easy inspection condition setting and modification based on quantifiedinspection result Inspection condition recommendation by componentEasy component addition/deletion/copy/location modification usingJOB manager
Specular Reflection Tall Obstacles Problem Measurement RangeProblem
Shadow Problem
conventionalinspectionproblems
Quantified inspection conditionbased on measurement data
Inspection conditionrecommendation by component
Component conditionrecommendation
Com
pone
ntC
rack
Insp
ectio
n3D
Pol
arity
Insp
ectio
n
2D vs 3D
Solder Joint 3D Measurement
KSMART Library Manager 2.0
Using Koh Young’s patented Multi-Frequency heightmeasurement technology, heights of various componentscan be accurately measured
Multi-Frequency Moiré TechnologyPatented
Zenith 3D based inspection technology provides solutionsfor conventional inspection problems
8 Way Projection Technology
Fast and Intuitive ProgrammingㆍInspection Condition Setting
JOB files containing quantified inspection conditions, OCV/OCR images andnonstandard components are shared with all installed KY AOI systems by KSMARTLibrary Manager 2.0.
Quick and Easy Data Sharing
Performance of Zenith UHS is not interrupted by line and machine differences, andPCB environment such as color and material. The Inspection program shared by KSMARTLibrary Manager 2.0 does not need additional fine tuning and can be applied directly.
Maximization of Data Utilization
Inspection Program Management Automation
Perfect Full 3D Inspection Performance
● Good/NG Decision making based on height and volume measurement data● Perfect detection of 3D coplanarity without additional option items such as a side camera● True process optimization by process feedback based on a reliable inspection result● 3D measurement data from 3D SPI, Pre-Reflow 3D AOI, Post-Reflow 3D AOI enables quantified Good/NG judgments, which are used for process optimization
Measurement and Inspection of All kinds of Defects● Detecting all kinds of defects including Missing, Offset, Rotation, Polarity, Upside down, OCV/OCR, Solder filet, Billboarding, Lifted Lead, Lifted Body, Tombstone, Bridging and more.
Measurement based Inspection
The AOI system measures the
true profilometric shape of components,
solder joints, patterns and even foreign materials on assembled PCBs,
overcoming the shortcomings and vulnerabilities of 2D AOI.
Dimension Rotation Bridging Lead Coplanarity Missing
Solder Fillet Billboarding Upside down OCV/OCR Offset
Quantified inspection condition setting based on 3D measurement dataRemoval of uncertainties of production control by inspection resultquantification Easy inspection condition setting and modification based on quantifiedinspection result Inspection condition recommendation by componentEasy component addition/deletion/copy/location modification usingJOB manager
Specular Reflection Tall Obstacles Problem Measurement RangeProblem
Shadow Problem
conventionalinspectionproblems
Quantified inspection conditionbased on measurement data
Inspection conditionrecommendation by component
Component conditionrecommendation
Com
pone
ntC
rack
Insp
ectio
n3D
Pol
arity
Insp
ectio
n
2D vs 3D
Solder Joint 3D Measurement
KSMART Library Manager 2.0
Using Koh Young’s patented Multi-Frequency heightmeasurement technology, heights of various componentscan be accurately measured
Multi-Frequency Moiré TechnologyPatented
Zenith 3D based inspection technology provides solutionsfor conventional inspection problems
8 Way Projection Technology
Fast and Intuitive ProgrammingㆍInspection Condition Setting
JOB files containing quantified inspection conditions, OCV/OCR images andnonstandard components are shared with all installed KY AOI systems by KSMARTLibrary Manager 2.0.
Quick and Easy Data Sharing
Performance of Zenith UHS is not interrupted by line and machine differences, andPCB environment such as color and material. The Inspection program shared by KSMARTLibrary Manager 2.0 does not need additional fine tuning and can be applied directly.
Maximization of Data Utilization
Inspection Program Management Automation
Perfect Full 3D Inspection Performance
● Good/NG Decision making based on height and volume measurement data● Perfect detection of 3D coplanarity without additional option items such as a side camera● True process optimization by process feedback based on a reliable inspection result● 3D measurement data from 3D SPI, Pre-Reflow 3D AOI, Post-Reflow 3D AOI enables quantified Good/NG judgments, which are used for process optimization
Measurement and Inspection of All kinds of Defects● Detecting all kinds of defects including Missing, Offset, Rotation, Polarity, Upside down, OCV/OCR, Solder filet, Billboarding, Lifted Lead, Lifted Body, Tombstone, Bridging and more.
Measurement based Inspection
The AOI system measures the
true profilometric shape of components,
solder joints, patterns and even foreign materials on assembled PCBs,
overcoming the shortcomings and vulnerabilities of 2D AOI.
Dimension Rotation Bridging Lead Coplanarity Missing
Solder Fillet Billboarding Upside down OCV/OCR Offset
Quantified inspection condition setting based on 3D measurement dataRemoval of uncertainties of production control by inspection resultquantification Easy inspection condition setting and modification based on quantifiedinspection result Inspection condition recommendation by componentEasy component addition/deletion/copy/location modification usingJOB manager
Specular Reflection Tall Obstacles Problem Measurement RangeProblem
Shadow Problem
conventionalinspectionproblems
Quantified inspection conditionbased on measurement data
Inspection conditionrecommendation by component
Component conditionrecommendation
Com
pone
ntC
rack
Insp
ectio
n3D
Pol
arity
Insp
ectio
n
2D vs 3D
Solder Joint 3D Measurement
KSMART Library Manager 2.0
Using Koh Young’s patented Multi-Frequency heightmeasurement technology, heights of various componentscan be accurately measured
Multi-Frequency Moiré TechnologyPatented
Zenith 3D based inspection technology provides solutionsfor conventional inspection problems
8 Way Projection Technology
Fast and Intuitive ProgrammingㆍInspection Condition Setting
JOB files containing quantified inspection conditions, OCV/OCR images andnonstandard components are shared with all installed KY AOI systems by KSMARTLibrary Manager 2.0.
Quick and Easy Data Sharing
Performance of Zenith UHS is not interrupted by line and machine differences, andPCB environment such as color and material. The Inspection program shared by KSMARTLibrary Manager 2.0 does not need additional fine tuning and can be applied directly.
Maximization of Data Utilization
Inspection Program Management Automation
Perfect Full 3D Inspection Performance
● Good/NG Decision making based on height and volume measurement data● Perfect detection of 3D coplanarity without additional option items such as a side camera● True process optimization by process feedback based on a reliable inspection result● 3D measurement data from 3D SPI, Pre-Reflow 3D AOI, Post-Reflow 3D AOI enables quantified Good/NG judgments, which are used for process optimization
Measurement and Inspection of All kinds of Defects● Detecting all kinds of defects including Missing, Offset, Rotation, Polarity, Upside down, OCV/OCR, Solder filet, Billboarding, Lifted Lead, Lifted Body, Tombstone, Bridging and more.
SPC Pro
● Minimization of False Call : Koh Young’s W arp Compensation provides a revolutionary solution to PCB warpage
Warp problems of big-sized PCB and FPCB after reflowseriously affect production quality.
Perfect PCB Warp Compensation Solution
W arp Compensation Before W arp Compensation After
K SMART L ink
● Process control data, provided by Koh Young’s full 3D SPI and AOI are stored and shared in DB real time● Software tool that monitors and analyzes defects and root cause of defects v
● SPC Pro provides various process analysis tools such as yield rate, NG analysis, PPM analysis, Gage R& R, Offset analysis, and more● Able to set by order according to user’s wish through Scenario
Scenario Setting W indow Offset Analysis
Gage R& R Analysis Defect Frequency and Type Analysis
RequirementsShadow Problem Solution
Specular Problem Solution
Shadowed Area between Tall Components
Small ( 01 005 inch) Component Insepction
W ide Measurement Range + Accuracy ( Measurement Range Problem)
Real Time PCB W arp Compensation
Dark Component & W hite Body Component Location
Component Body, Lead Coplanarity Inspection
Solder Joint Profile Inspection
3D Polarity Inspection
Component Crack Inspection
Solutions
● W arp Compensation ( Pad Referencing + Multi-Frequency Moiré Technology)
● 3D Shadow Free Moiré Technology & 8 W ay Projection
● Full 3D Measurement
● Multi-Frequency Moiré Technology
Inspection Task● Missing, Offset, Rotation, 3D Polarity, Upside down, OCV/OCR, Coplanarity, Solder fillet, Lifted lead, Billboarding, tombstone, Bridging, Dimension
InspectionItems
Conveyor W idth Adjustment
Conveyor Fix Type
● Automatic● Front / Rear Fix ed ( factory setting)
PCBH andling
● 1 D & 2D Handy Barcode Reader● 1 D & 2D Inline Barcode Reader● Offline Programming Station● Offline SPC Pro Station● Standard Calibration Target
● KSMART Remote Monitoring System● W arp Compensation● Foreign Material Inspection● Review Station
Add-onSolutions
Softw are
Supported Input Format
Operating System
Operator User-friendliness
Statistical Process Control Tool
Programming S/WOperating System
● KSMART Library Manager 2.0● KYCal: Auto Camera Calibration, Auto Illumination Calibration, Auto Height Calibration● Intel i7 -39 7 0X ( 6 Core) , 32GB, W indows 7 Ultimate 6 4 bit
● GE RBE R Data ( 27 4 X , 27 4 D) , ODB+ + , Placement file, Mounter JOB file, Allegro, Zuken, Mentor ( optional)● ePM-AOI, AOI GUI 2.3.6● AOI GUI 2.3.6● Renewal AOI SPC● Review Station● KSMART Remote Monitoring System
Camera ResolutionFOV SizeFull 3D Inspection SpeedHeight Accuracy ( on KY Calibration Target)CameraIlluminationMax . Measurement Height
● ± 3%● 4 M Pix el High Speed Camera● IR-RGB LE D Dome Styled Illumination● 5 mm
30× 30mm ( 1 .1 8 × 1 .1 8 inch)20
4 0× 4 0mm ( 1 .5 7 × 1 .5 7 inch)
InspectionPerfor-mance
Max . PCB Size 330X 330mm( 1 3X 1 3 inch)
5 0X 5 0mm( 1 .9 7 X 1 .9 7 inch)
5 0mm( 1 .9 7 inch)200~ 24 0VAC, 5 0/6 0Hz Single Phase, 5 Kgf/cm2
0.4 ~ 5 mm( 0.01 5 ~ 0.20 inch)
Ring Belt : 2kg ( 4 .4 lbs) , Timing Belt : 5 kg ( 1 1 lbs)8 5 0kg ( 1 8 7 4 lbs)
8 20mm( 32.2 inch)
1 6 27 mm( 6 4 inch)9 8 5 mm( 38 .7 inch) 1 1 6 5 mm( 4 5 .8 inch)
1 35 0mm( 5 3.1 inch)1 26 5 mm( 4 9 .8 inch) 1 26 5 mm( 4 9 .8 inch) 1 4 4 5 mm( 5 6 .9 inch) 1 4 4 5 mm( 5 6 .9 inch)
1 0kg ( 22 lbs)
0.5 ~ 8 mm( 0.02~ 0.31 inch)
7 0X 7 0mm( 2.7 X 2.7 inch)
5 1 0X 5 1 0mm( 20X 20 inch)
Dual: 5 1 0X 320mm( 20X 1 2.6 inch)
Single: 5 1 0X 5 8 0mm( 20X 22.8 inch)
8 5 0X 6 9 0mm( 33.4 X 27 .1 inch)
Min. PCB Size
PCB Thickness
Max . PCB W eightMachine W eight
Bottom Side ClearanceSupplies
WDHF
M L DL X L
6 00kg ( 1 322 lbs) 7 00kg ( 1 5 4 3 lbs)5 5 0kg ( 1 21 2 lbs)
1 000mm( 39 .3 inch)1 000mm( 39 .3 inch)
H F( Front-Fix )
(PC
B H
eigh
t 950
mm
)
PC
B T
rans
fer H
eigh
t
PC
B H
eigh
t 950
mm
870~
950m
m
1182
mm
167m
m47
5mm
(PC
B H
eigh
t 950
mm
Fro
m B
otto
m C
lear
ance
)
Must-check Requirements of 3D AOI System
1 8 .3 ~ 30.4 cm2 /sec ( Inspection speed varies by PCB, and inspection condition.)
W D4 1 8 mm
※ Above specifications are subject to change without notice.
Zenith brings a revolution to SMT process
control, based on the world’s best full 3D
measurement & inspection by visualizing,
identifying and eliminating root cause of defects.
Perfect Full 3D
Inspection Performance
Fast and Intuitive
Programming
3D Data basedSMT Process ControlSystem
Koh Young Technology Inc. All rights reserved.
08 5 8 8
+82-2-6343-6000 +82-2-6343-6001
SPC Pro
● Minimization of False Call : Koh Young’s W arp Compensation provides a revolutionary solution to PCB warpage
Warp problems of big-sized PCB and FPCB after reflowseriously affect production quality.
Perfect PCB Warp Compensation Solution
W arp Compensation Before W arp Compensation After
K SMART L ink
● Process control data, provided by Koh Young’s full 3D SPI and AOI are stored and shared in DB real time● Software tool that monitors and analyzes defects and root cause of defects v
● SPC Pro provides various process analysis tools such as yield rate, NG analysis, PPM analysis, Gage R& R, Offset analysis, and more● Able to set by order according to user’s wish through Scenario
Scenario Setting W indow Offset Analysis
Gage R& R Analysis Defect Frequency and Type Analysis
RequirementsShadow Problem Solution
Specular Problem Solution
Shadowed Area between Tall Components
Small ( 01 005 inch) Component Insepction
W ide Measurement Range + Accuracy ( Measurement Range Problem)
Real Time PCB W arp Compensation
Dark Component & W hite Body Component Location
Component Body, Lead Coplanarity Inspection
Solder Joint Profile Inspection
3D Polarity Inspection
Component Crack Inspection
Solutions
● W arp Compensation ( Pad Referencing + Multi-Frequency Moiré Technology)
● 3D Shadow Free Moiré Technology & 8 W ay Projection
● Full 3D Measurement
● Multi-Frequency Moiré Technology
Inspection Task● Missing, Offset, Rotation, 3D Polarity, Upside down, OCV/OCR, Coplanarity, Solder fillet, Lifted lead, Billboarding, tombstone, Bridging, Dimension
InspectionItems
Conveyor W idth Adjustment
Conveyor Fix Type
● Automatic● Front / Rear Fix ed ( factory setting)
PCBH andling
● 1 D & 2D Handy Barcode Reader● 1 D & 2D Inline Barcode Reader● Offline Programming Station● Offline SPC Pro Station● Standard Calibration Target
● KSMART Remote Monitoring System● W arp Compensation● Foreign Material Inspection● Review Station
Add-onSolutions
Softw are
Supported Input Format
Operating System
Operator User-friendliness
Statistical Process Control Tool
Programming S/WOperating System
● KSMART Library Manager 2.0● KYCal: Auto Camera Calibration, Auto Illumination Calibration, Auto Height Calibration● Intel i7 -39 7 0X ( 6 Core) , 32GB, W indows 7 Ultimate 6 4 bit
● GE RBE R Data ( 27 4 X , 27 4 D) , ODB+ + , Placement file, Mounter JOB file, Allegro, Zuken, Mentor ( optional)● ePM-AOI, AOI GUI 2.3.6● AOI GUI 2.3.6● Renewal AOI SPC● Review Station● KSMART Remote Monitoring System
Camera ResolutionFOV SizeFull 3D Inspection SpeedHeight Accuracy ( on KY Calibration Target)CameraIlluminationMax . Measurement Height
● ± 3%● 4 M Pix el High Speed Camera● IR-RGB LE D Dome Styled Illumination● 5 mm
30× 30mm ( 1 .1 8 × 1 .1 8 inch)20
4 0× 4 0mm ( 1 .5 7 × 1 .5 7 inch)
InspectionPerfor-mance
Max . PCB Size 330X 330mm( 1 3X 1 3 inch)
5 0X 5 0mm( 1 .9 7 X 1 .9 7 inch)
5 0mm( 1 .9 7 inch)200~ 24 0VAC, 5 0/6 0Hz Single Phase, 5 Kgf/cm2
0.4 ~ 5 mm( 0.01 5 ~ 0.20 inch)
Ring Belt : 2kg ( 4 .4 lbs) , Timing Belt : 5 kg ( 1 1 lbs)8 5 0kg ( 1 8 7 4 lbs)
8 20mm( 32.2 inch)
1 6 27 mm( 6 4 inch)9 8 5 mm( 38 .7 inch) 1 1 6 5 mm( 4 5 .8 inch)
1 35 0mm( 5 3.1 inch)1 26 5 mm( 4 9 .8 inch) 1 26 5 mm( 4 9 .8 inch) 1 4 4 5 mm( 5 6 .9 inch) 1 4 4 5 mm( 5 6 .9 inch)
1 0kg ( 22 lbs)
0.5 ~ 8 mm( 0.02~ 0.31 inch)
7 0X 7 0mm( 2.7 X 2.7 inch)
5 1 0X 5 1 0mm( 20X 20 inch)
Dual: 5 1 0X 320mm( 20X 1 2.6 inch)
Single: 5 1 0X 5 8 0mm( 20X 22.8 inch)
8 5 0X 6 9 0mm( 33.4 X 27 .1 inch)
Min. PCB Size
PCB Thickness
Max . PCB W eightMachine W eight
Bottom Side ClearanceSupplies
WDHF
M L DL X L
6 00kg ( 1 322 lbs) 7 00kg ( 1 5 4 3 lbs)5 5 0kg ( 1 21 2 lbs)
1 000mm( 39 .3 inch)1 000mm( 39 .3 inch)
H F( Front-Fix )
(PC
B H
eigh
t 950
mm
)
PC
B T
rans
fer H
eigh
t
PC
B H
eigh
t 950
mm
870~
950m
m
1182
mm
167m
m47
5mm
(PC
B H
eigh
t 950
mm
Fro
m B
otto
m C
lear
ance
)
Must-check Requirements of 3D AOI System
1 8 .3 ~ 30.4 cm2 /sec ( Inspection speed varies by PCB, and inspection condition.)
W D4 1 8 mm
※ Above specifications are subject to change without notice.
Zenith brings a revolution to SMT process
control, based on the world’s best full 3D
measurement & inspection by visualizing,
identifying and eliminating root cause of defects.
Perfect Full 3D
Inspection Performance
Fast and Intuitive
Programming
3D Data basedSMT Process ControlSystem
Koh Young Technology Inc. All rights reserved.
08 5 8 8
+82-2-6343-6000 +82-2-6343-6001