FEATURES AND BENEFITS

Molex adds Intel*-approved LGA 1155 socket assemblies to its extended series of high-performance Land Grid Array (LGA) CPU sockets

Known as Socket H2, the LGA 1155 CPU socket is used with Intel’s “2nd Generation Core* i7/i5/i3 series” of desktop microprocessors codenamed Sandy Bridge. This 1155-circuit socket is a replacement of its predecessor – the LGA 1156 Socket (or Socket H1) – which mates with the Nehalem processor. Sandy Bridge is a hallmark of Intel’s 32nm microarchitecture technology with highly acclaimed features of “breakthrough performance and capabilities”.

The LGA 1156 and LGA 1155 sockets have similar features such as the same pitch size of 0.9144mm (.036"); I/O, power and ground contacts for the proces-sors they mate to; and a grid array of 40 by 40 with 24 by 16 grid depopulation in the center of the array. Both sockets have contacts arranged in two opposing L-shaped patterns within the grid array for maintenance of electrical contact under processor-load conditions. These sockets use high strength copper alloy as base contact material to ensure reliable physical contact with their respective LGA land packages, and are designed to withstand typical reflow conditions. These LGA sockets have lead-free solder balls on the underside for surface mounting on the motherboard. An Independent Loading Mechanism (ILM) - usable with each of the two sockets and secured to the PCB by means of a base plate - provides the force needed to seat the processor onto the socket and distributes the resulting compressive load evenly through the socket solder joints.

Both LGA1155 and LGA1156-based processors are not compatible between sockets due to electrical, mechanical, and keying differences. Besides their different Alignment Post Void configurations, the distance from the center of the alignment post to the socket center has shifted from 9.0mm (.354") for Socket H1, to 11.5mm (.453") for Socket H2. Their similar 3- piece design (comprising socket, Integrated Loading Mechanism (ILM) and back plate), however, provides easy transfer of useful socket features and advantages from one generation of socket to the next. Molex’s newly released LGA 1155 socket assemblies (47596-0232 and 47596-0233) and new LGA 1156 product extensions (47596-0532 and 47596-0533), come in (respectively) 15 and 30 micron gold-plating contact versions. All these have a common alignment-key height of 2.10mm (.083") to accommodate an additional (and optional) ILM pick-and-place cover.

Other new socket components added to the series 47596 family are: LGA 1155 and LGA1156 Pan and Shoulder Screws for 1U Servers. These feature 5.60mm (.220") and 4.22mm (.166") Thread sizes respectively, and are both lead-free.

For additional information visit our website at: www.molex.com/link/lga1155and1156.html.

• Satisfies all requirements in Intel’s “Desktop Sandy Bridge

Processor and LGA1155 Socket, Thermal Mechanical Specifications and Design Guidelines” (Revision 1.5, October 2010). The LGA 1155 socket supports the Intel® Core™ i7/i5/i3 processors with thermal design power of 95W or less, including: Sandy Bridge Desktop processor with 4 cores and integrated

graphics; Sandy Bridge Desktop processor with 4 cores and no inte-

grated graphics, and Sandy Bridge Desktop processor with 2 cores and integrated graphics

LGA 1155/1156 Desktop PC CPU Sockets

47596 LGA 1155 / 1156 Desktop PC CPU Sockets

Series 47596 LGA 1155 / 1156 Processor Sockets with

Pick-and-Place Cap complete with Independent Loading Mechanism

(ILM) Assembly

• Similar 3-piece (socket, ILM and back plate) design as in LGA 1156 facilitates easy assembly of new processor to LGA 1155 socket with no re-learning processes needed

• Visible pin-1-identification triangle on housing corner ensures correct CPU loading with indication mark closest to socket pin marked “A1” (Refer Sales Drawing)

• Differentiated key-alignment posts on socket ensures mating

compatibility with correct CPU; prevents mis-mating with Intel’s 1156-pin Nehalem processor

• High-temperature thermoplastic housing with UL 94 V-0 flame rating withstands lead-free processing

temperatures typical with reflow profile

• Strong pick-and-place cover-to-socket retention helps prevent socket contacts from damage during board shipping and handling; and ensures sufficient support for socket weight during lifting, translation, and

placement on, or assembly of PCB

* Intel, Nehalem, Sandy Bridge, LGA 1155 (Socket H2), LGA 1156 (Socket H1), ILM, Core™ i-series (Core i3/i5/i7) and relevant names are either trademarks or registered trademarks of Intel Corporation

APPLICATIONS

SPECIFICATIONS

LGA 1155/1156 Desktop PC CPU Sockets

Reference Information

Packaging (Sockets): JEDEC Hard Tray (Screws): Bag

Mates With: Intel Nehalem Processor (LGA1156) Intel Sandy Bridge Processor (LGA 1155)

Designed In: mm

RoHS Compliant: Yes

Halogen Free: Refer to Ordering Information

Glow Wire Compliant: No

Electrical

Current (max.): 0.5A

Voltage (max): 5.0V

Contact Resistance: 19 milliohms max. socket average

Dielectric Withstanding Voltage: 360V (RMS)

Insulation Resistance: 800 Megaohms min.

Mechanical

Contact Insertion Force: Zero Insertion Force (ZIF)

Durability (min.): 20 cycles

Physical

ILM Lever, Frame and Base Plate: Stainless Steel

ILM Frame Insulator: Polypropylene Sheet

Pan and Shoulder Screws: Nickel-plated Low Carbon Steel

Housing and Cap: High Temperature Thermoplastic, Black

Contact: High Strength Copper Alloy

Flammability: UL-94V-0 Plating (Socket): Contact Area — 0.38 or 0.76μm (15 or 30μ") Gold (Au) Plating Solder Tail Area — Lead-free solder ball SnAg3.0Cu0.5

Contact and Paddle Area — 1.27μm (50μ") min. Nickel

Recommended PCB Thickness: 1.60mm (.062")

Operating Temperature: -25 to +100°C

• Desktop PCs

• Server and Workstations

Desktop PCs Servers and Workstations

PRODUCT FEATURES

SimilaritiesLGA 1155/1156 Desktop PC CPU SocketsTerminals in two L-shape regions of both the LGA 1156 / 1155 socket bases

in ‘opposing directions’ (indicated by yellow arrows) ensure electrical contact is maintained under processor-loaded conditions

(red arrows indicate loading direction)

LGA 1156 socket LGA 1155 socket

Differences

Diagrams of “Processor Package Land Coordinates” are courtesy of Intel Corporation

LGA 1156 socket has a 9.00mm (.354”) gap between the center of alignment post and the

socket center

LGA 1155 socket has a wider gap of 11.50mm (.453”) between the center of

alignment post and the socket center

Alignment Post

A1 Corner

9.00

mm

(.3

54")

A1 Corner

11.5

0mm

(.4

53")

LGA 1156 Processor Package Land Coordinatesshowing its unique

Alignment Post Void configuration

LGA 1155 Processor Package Land Coordinates showing its unique

Alignment Post Void configuration

PRODUCT INFORMATION

Order No. Component Contact Plating Circuits Comments47596-0132

LGA 1156 Socket with pick-and-place cover

0.38μm (15μ”) Gold (Au)1156

Alignment Key Height 0.75mm (.030")47596-0532 Alignment Key Height 2.10mm (.083")47596-0133

0.76μm (30μ”) Gold (Au)Alignment Key Height 0.75mm (.030")

47596-0533 Alignment Key Height 2.10mm (.083")47596-0232 LGA 1155 Socket with

pick-and-place cover0.38μm (15μ”) Gold (Au)

1155 Alignment Key Height 2.10mm (.083")47596-0233 0.76μm (30μ”) Gold (Au)47596-8811

ILM Assembly without pick-and-place cover

Stainless Steel with Nickel (ILM Frame)

N/A

Shepherd Hook, Halogen-free47596-9911 Shepherd Hook47596-8841 Straight Lever, Halogen-free47596-9941 Straight Lever

Order No. 987650-5651 Printed in USA/KC/2011.03 © 2011, Molex

LGA 1155/1156 Desktop PC CPU Sockets

For Shoulder screwFor Shoulder screwFor Pan screws

For Pan screws

Server base plate for LGA 1155 / 1156 Socket

Desktop base plate for LGA 1155 / 1156 Socket

Side view of Server (left picture) and Desktop (right picture) Base Plates and their different screw-thread thicknesses

LGA 1155 and LGA 1156 Shoulder Screw for 1U Server, 3.80mm (.150")

Thread Length, Lead-free(47597-6101)

LGA 1155 and LGA 1156 Shoulder Screw for Desktop

PC, 6.00mm (.236”)Thread Length, Lead-free

(47597-6001)

LGA 1155 and LGA 1156 Pan Screw for 1U Server,

5.17mm (.204”)Thread Length, Lead-free

(47597-6102)

LGA 1155 and LGA 1156 Pan Screw for Desktop PC,

6.35mm (.250”)Thread Length, Lead-free

(47597-6002)

ORDERING INFORMATION

Order No. Component Application Comments47596-8813

Back-plate Assembly without screws

Desktop PCHalogen-free

47596-9913 Non halogen-free47596-8823

1U ServerHalogen-free

47596-9923 Non halogen-free47596-8830 Back-plate Assembly with Shoulder screw and

2 Pan screws Desktop PC

Halogen-free47596-9930 Non halogen-free47596-8833 Back-plate Assembly with Shoulder Screw and

2 Pan Screws; 1.57mm (.062") PCB Thickness1U Server

Halogen-free47596-9933 Non halogen-free47596-8838 Back-plate Assembly with Shoulder Screw and

2 Pan Screws; 2.00mm (.079") PCB ThicknessHalogen-free

47596-9938 Non halogen-free47596-8814

ILM with Shepherd Hook Lever and Back-plate Assembly

Desktop PCHalogen-free

47596-9914 Non halogen-free47596-8834

1U ServerHalogen-free

47596-9934 Non halogen-free47597-6001 Shoulder Screw

Desktop PC6.00mm (.236") Thread

47597-6002 Pan Screw 6.35mm (.250") Thread47597-6101

Shoulder Screw1U Server

3.80mm (.150") Thread47597-6301 4.22mm (.166") Thread47597-6102

Pan Screw5.17mm (.204") Thread

47597-6202 5.60mm (.220") Thread

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