package qualification summary...

PACKAGE QUALIFICATION SUMMARY REPORT

Document Control #:

Purpose: To provide qualification summary

report for all packages

Device: Various

Mask Identification #: Various

Process Technology: Pure Matte Tin (Sn) Plating Process

(400 µin (10 µm) – 1000 µin (25

µm), Pre-Plated Leadframe (PPF),

or SnAgCu based solder bump

Product: Various devices plated with Matte Tin,

PPF, or with solder spheres

Updated: June 21, 2013

Package Qualification Summary Report

DOCUMENT CONTROL #

Microchip Technology Inc.

2

PACKAGE QUALIFICATION SUMMARY REPORT

CONTENTS

1) QUALIFICATION OVERVIEW

2) RELIABILITY TEST DESCRIPTIONS

3) QUALIFICATION RESULTS & RELEASE STATUS

4) CONCLUSION

RESULTS SUMMARY

The assembly using Matte Tin plating, PPF or solder spheres complies with the

reliability guidelines documented in the qualification plan.

Name Department/Function Date

Author S. Pokharel Quality Engineering June 21, 2013

Approved by A. Kumar Quality Engineering

Manager

June 21, 2013

Approved by A. Navarro FA & Reliability

Manager

June 21, 2013

Approved by G. Perzanowski Quality Director June 21, 2013

Approved by F. Chen Assembly Engineering

Manager

June 21, 2013

Approved by A. Abbott Product Environmental

Compliance Manager

June 21, 2013


DOCUMENT CONTROL #


3

1 QUALIFICATION OVERVIEW

The purpose of this report is to verify that the qualification testing was performed in accordance with the

documented qualification plan required by Microchip specification QCI-39000, “Worldwide Quality

Conformance Requirements”. The performance requirements was based on having passing moisture

sensitivity level, package reliability, JEDEC tin whiskers growth test results per JESD22A121 & JESD201A

requirements.

ASSEMBLY OR PLATING SITE DESIGNATION

APTOS TECHNOLOGY APTS

ADVANCED SEMICONDUCTOR

ENGINEERING GROUP, CHUNG LI

ASCL


ENGINEERING GROUP, TAIWAN

ASE


ENGINEERING GROUP, SHANGHAI

ASSH

AMKOR TECHNOLOGY CHINA

(aka ANAC)

ATC

AMKOR TECHNOLOGY KOREA

(aka ANAK)

ATK

AMKOR TECHNOLOGY

PHILIPPINES (aka ANAP)

ATP

CARSEM (M) SDN BHD CARM

CARSEM SEMICONDUCTOR SDN

BHD

CARS

CIRCUIT ELECTRONIC INDUSTRIES CEI

CIRTEK ELECTRONICS CORP. CRTK

GREATEK ELECTRONICS GTK

HANA MICROELECTRONIC HANA

KINGPAK TECHNOLOGY INC. KTI

LINGSEN PRECISION INDUSTRIES LPI

MILLENNIUM MICROTECH

SHANGHAI (aka ATES)

MMS

MILLENNIUM MICROTECH

THAILAND (aka ALPH)

MMT

MICROCHIP TECHNOLOGY

THAILAND

MTAI

POWERTECH TECHNOLOGY INC. PTI

SILICON PRECISION INDUSTRIES SPIL

UNISEM (M) BERHAD, MALAYSIA UNIB

UNISEM CHINA UNIC

UNISEM (M) SINGAPORE UNIS

UTAC HOLDINGS (aka ASAC) UTAC

UTAC THAI LIMITED (aka NSEB) UTL

VIGILANT TECHNOLOGY CO. LTD VGT


DOCUMENT CONTROL #


4

1.1 Qualification Plan

In keeping with guidelines established in QCI-39000 for new assembly packages or processes a minimum of

three assembly lots would be used for package qualification testing. Representative samples of each package

family and subcontractor were used to qualify the entire set of packages manufactured at each subcontractor.

Each package selected would be subjected to all tests. In addition, data was collected to verify the

solderability of the Matte tin lead finish in both the standard solder bath as well as a representative Pb-Free

solder (note 4). Tin whisker reliability testing was performed in compliance to JESD22A121 & JESD201A

requirements. A detailed qualification plan is listed below.

Preconditioning – Surface mount devices would be subjected to preconditioning stress before HAST,

Unbiased HAST (UHAST) , and Temperature Cycling.

HAST – Devices would be subjected to 96 hours of Highly Accelerated Stress Test (HAST).

Unbiased HAST ( UHAST ) – Devices would be subjected to 96 hours of Unbiased HAST testing.

or Autoclave (Pressure Cooker).

Temperature Cycling – Devices would be subjected to 500 temperature cycles.

Solderability – Devices would be subjected to 8 hours of steam aging and then tested for solderability

issues.

Whiskers Growth – Devices would be subjected to 1500 temperature cycles, 4000 hours ambient bake, and

4000 hours high temperature moisture bake.

1.2 Qualification Test Conditions

Tests are performed in accordance with QCI-39000, “Worldwide Quality Conformance Requirements”.

TEST METHOD CONDITION CRITERIA

Pre-Conditioning (SMD only) JESD22-A113E

1. Electrical Test @ 25°C

2. SAM exam

3. 150°C Bake for 24hrs

4. 85°C/85% R.H. for 168hrs or

30°C/60% R.H. for 192hrs

5. Reflow 3 cycles @ 260°C or 245°C

6. SAM exam

7. Electrical Test @ 25°C

0/all surface mount

devices

HAST JESD22-A110B 130°C/85%/96hrs 0/77

Unbiased HAST (UHAST) or

Unbiased Autoclave ( PCT )

JESD22-A118 130°C/85%/96hrs or

121°C/ 100%/96hrs

0/77

Temperature Cycling JESD22-A104C -65°C to +150°C/500 cycles

0/77

Solderability Test

Table 3.3

JESD22-B102E Solder temp. 245°C

SMD & Through hole

Rosin Flux

0/22


DOCUMENT CONTROL #


5

(Matte tin lead finish, SnAgCu

95.5/3.9/0.6 Solder)

Backward Compatibility

Solderability Test Table 3.1

JESD22-B102E Solder temp. 245°C Through hole

215°C SMD

Rosin Flux

(Matte tin lead finish, 60/40 SnPb Solder)

0/22

Forward Compatibility

Solderability Test Table 3.2

MIL-STD 883 Method 2003 Solder temp. 265°C ± 5°C

SMD & Through hole

(SnPb lead finish, Sn/Ag/Cu Solder)

0/22

Whiskers Growth All tin whisker reliability

testing was performed per the

requirements in JEDEC

specifications JESD22A121 &

JESD201A.

–55 (+0/-10) °C to +85 (+10/-0) °C or

-40 (+/-10)°C to +85 (+10/-0)°C

for 1500 cycles

30±2°C/60±2% RH 4000 hrs Bake

55±3°C /85±3% RH 4000 hrs Bake

Max whisker lengths:

45um for temp cycle

test and 40um for

ambient/high temp &

humidity tests.

2 RELIABILITY TEST DESCRIPTIONS

2.1 Preconditioning

This test consists of the following tests run in a consecutive order. The tests are electrical testing at 25°C,

C- SAM , Bake 150°C 24 hour , a moisture soak, 3X Reflow cycles, C-SAM and ending with electrical

testing at 25°C.

2.2 Highly Accelerated Stress Test (HAST) This test is similar to autoclave, but under more severe conditions. Device pins are connected in an

alternating bias of 5 volts (or the upper rated Vdd/Vcc level) and ground.

2.3 Unbiased HAST (UHAST)

The unbiased HAST is performed for the purpose of evaluating the reliability on non-hermetic packaged

solid-state devices in humid environments .It is a highly accelerated test with temperature and humidity that

are exposed to condition 130 oC , 85 % relative humidity for a period of 96 hours.

2.4 Temperature Cycle This stress test is used to determine if any structural defects are present in a packaging design. This test is

intended to reveal potential defects related to wire bonding, cracked die, substrate mounting and thermal

mismatch.

2.5 Solderability Test This test is to evaluate the solderability of terminations that are normally joined by a soldering operation.

The specimens subjected to this test are immersed in a flux and then dipped in a molten solder bath.


DOCUMENT CONTROL #


6

2.6 Autoclave (Pressure Cooker) The purpose of this test is to determine the resistance of the package to moisture under high temperature and

humidity conditions. This test may cause such potential failure mechanisms as metal corrosion or ionic

contamination. Unbiased devices are exposed to conditions of 121.5oC, at 15 PSI (one atmosphere), and

100% relative humidity for a period of 96 hours.

2.7 Whisker Growth

This test is to determine the susceptibility of the plated matte tin finish to form a dendrite type of growth

referred to as whiskers. One potential effect of excessive whisker growth includes electrical shorting

between two adjacent pins. Please note that the minimum matte tin thickness is 400 µin (10 µm) and that a

post plating bake or anneal process (150°C for 1 hr) is currently being utilized for all matte tin plated product

to mitigate the risk of tin whiskers. This anneal process is performed within 24 hours after the matte tin

deposit.


DOCUMENT CONTROL #0703461


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3.0 QUALIFICATION RESULTS

3.1 Backward Solderability Compatibility Results (JESD22-B102E)

Plating Site Solder Paste Composition Flux Type Lead finish Solder Temp. Package Type Result

MTAI / MMT/UTL/ATP/

HANA/UNIS/CARM

Sn60Pb40A Rosin Flux 100% matte Sn 215°C SMD Passed

Sn60Pb40A Rosin Flux 100% matte Sn 245°C Through hole Passed

MMS/ATK/ATC/CARM Sn60Pb40A Rosin Flux 100% matte Sn 215°C SMD Passed

Sn60Pb40A Rosin Flux 100% matte Sn 245°C Through hole Passed

3.2 Forward Solderability Compatibility Results (MIL-STD 883 Method 2003)

Plating Site Solder Paste Composition Flux Type Lead finish Solder

Temperature

Package Type Result

MTAI / MMT Sn/Ag/Cu (96.5%/3.0%/0.5%) 100 R-type Sn/Pb 265°C SMD & Through hole Passed

UTL Sn/Ag/Cu (95.5%/4.0%/0.5%) 145 R-type Sn/Pb 265°C SMD Passed

ATP Sn/Ag/Cu (95.8%/3.5%/0.7%) Alpha 100 Sn/Pb 265°C SMD Passed

MMT Sn/Ag/Cu (96.5%/3.0%/0.5%) 100 R-type Sn/Pb 265°C SMD Passed

3.3 Pb-free Solderability Results (JESD22-B102E, Note 4)

Plating Site Solder Paste Composition Flux Type Lead finish Solder Temp. Package Type Result

MTAI /MMT/ MMS/UTL/ATP/

ATK/ATC/CARS/UNIS

SnAgCu (95.5/3.9/0.6) Rosin Flux 100% matte Sn 245°C SMD Passed

MTAI / MMT/ATP/ /UNIS

SnAgCu (95.5/3.9/0.6) Rosin Flux 100% matte Sn 245°C Through hole Passed

Note 4: Pb-free refers to non-SnPb based solder bath.




8

3.4 Package Reliability Test Results & Release Status By Pincount

Package Assembly

Site

Pre-

condition

MSL Results To

J-STD-020C

Profile

Solderability

Results To

JESD22-B102E

Lead

Finish

HAST UHAST

&

PCT

Temp.

Cycling

Package Release Status (Qualification Report Number)

3L DDPAK CARM Pass Pass MSL1/245C Pass Matte Sn Pass Pass Pass Released (Q08187), Qualified By Similarity To 5L DDPAK

3L SC70 UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04004,Q04059 for NCDA)

3L SC70 UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04143, Q07096)

3L SC70 CARM Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06256)

3L SOT23 MTAI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06008,Q06009,Q08080,Q08009,Q10083)

Qualified By Similarity To 5L SOT23

3L SOT23 MMS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q07104), Qualified By Similarity To 6L SOT23

3L SOT23 UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04149,Q07004)

3L SOT23 UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04140, Q04141), Qualified By Similarity To 6L

SOT23

3L SOT 23A LPI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q12062)

3L SOT23A HANA Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06236 ,Q12028 )

3L SOT89 CEI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05002,Q06255)

3L SOT89 HANA Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06244)

3L SOT89 LPI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q12061)

3L SOT223 HANA Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q07145, Q07169)

3L SOT223 UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q07170, Q08006, Q09078)

3L TO-220 CARM Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q08119), Qualified by similarity to 5L TO-220

3L TO-92 GTK Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q08166)

4L SOT143 UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q07173)

4L SOT143 MMS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q10100)

5L DDPAK CARM Pass Pass MSL1/245C Pass Matte Sn Pass Pass Pass Released (Q08187)




9

Package Assembly

Site

Pre-

condition

MSL Results To

J-STD-020C

Profile

Solderability

Results To

JESD22-B102E

Lead

Finish

HAST UHAST

&

PCT

Temp.

Cycling


5L SC70 UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04004, Q04059), Similarity To 3L SC70

5L SC70 UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04143)

5L SC70 HANA Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05070)

5L SC70 (COL) UTL Pass Pass MSL1/260C Pass NiPdAu

PPF Pass Pass Pass Released Q10066,Q11114,Q11122

5L SOT23 MTAI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06001,Q07021,Q08074,Q10083,Q08080)

5L SOT23 MMS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q07104), Qualified By Similarity To 6L SOT23


5L SOT23 UTL Pass Pass MSL1/260C Pass NiPdAu

PPF Pass Pass Pass Released (Q11027)

5L SOT23 UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04141 ), Qualified By Similarity To 6L SOT23


5L SOT23(COL) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08020)


5L SOT223 LPI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q12005 )

5L SOT223 GTBF Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q11132 )

5L TO-220 CARM Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q08119)

5L TSOT UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06214, Q06261)

6L DFN (2x2x0.9) UTL Pass Pass MSL1/260C Pass NiPdAu


6L SC70 (COL) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q09014)

6L SOT23 MTAI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06039, Q07021,Q08074,Q10083,Q10088)

6L SOT23 MMS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q07104)





10

Package Assembly

Site

Pre-

condition

MSL Results To

J-STD-020C

Profile

Solderability

Results To

JESD22-B102E

Lead

Finish

HAST UHAST

&

PCT

Temp.

Cycling


6L SOT23 UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04141)

6L SOT23 (COL) MTAI Pass Pass MSL1/260C Pass NiPdAu

PPF Pass Pass Pass Released (Q12004,Q12008)

6L SOT23 (COL) UTL Pass Pass MSL1/260C Pass NiPdAu


6L TDFN (2x2x0.8) UNIS Pass Pass MSL1/260C Pass NiPdAu


6L TSOT UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08147)

6L UQFN (3x1.6x0.55) LPI Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-LPI-QU6E)

6L XSON (1.5x1.5x0.45) LPI Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-LPI-QX6E

8L DFN (2x3x0.9) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05125,Q08162,Q09098,Q10078,Q11022)

8L DFN (2x3x0.9) CARS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04106)

8L DFN (2x3x0.9) UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q09018)

8L DFN (3x3x0.9) ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04105,Q05047)

8L DFN (3x3x0.9) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05125)

8L DFN (4x4x0.9) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05130,Q09057,Q10070)

8L DFN (4x4x0.9) UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06185,Q08002)

Qualified by similarity 44L QFN(8x8) at UNIS per CCB#796

8L DFN (5x6x0.9) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05125,Q07174,Q09094)

8L DFN (5x6x0.9) ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04101,Q05003)

8L MSOP MTAI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06007,Q06229,Q07067,Q10090)

8L MSOP MMS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q10037)

8L MSOP ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08065,Q09087)

Qualified By Similarity To 10L MSOP

8L MSOP UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q09121)

Qualified By Similarity To 10L MSOP

8L PDIP ATP Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q09086), Qualified By Similarity To 14L PDIP

8L PDIP CEI Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q02111)

8L PDIP MTAI Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q09048)

8L PDIP GTK Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (PQF-GEI-PAE)




11

Package Assembly

Site

Pre-

condition

MSL Results To

J-STD-020C

Profile

Solderability

Results To

JESD22-B102E

Lead

Finish

HAST UHAST

&

PCT

Temp.

Cycling


8L PDIP MMT Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q08081)

8L PDIP MMS Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q09108)

8L PDIP UTL Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q07166)

8L PDIP UNIS Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q04034)

8L PDIP VGT Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q09049)

8L SOIC MTAI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q10089, Q09054,Q08191,Q09002,R04140),

8L SOIC ASCL Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-ASECL-SAE)

8L SOIC ASSH Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-ASESH-SAE)

8L SOIC GTK Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q12042)

8L SOIC GTK Pass Pass MSL3/260C Pass NiPdAu

PPF Pass Pass Pass Released (PQF-GEI-SAF)

8L SOIC MMS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q09068)

8L SOIC ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q09085, Q04097), Qualified By Similarity To 16L

SOIC

8L SOIC UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04053)

8L SOIC MMT Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04122,Q08016,Q10108)

8L SOIC ATC Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04103,Q05233)

8L SOIC UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04100,Q09036,Q09122)

8L SOIC VGT Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05153,Q08079,Q10107,Q09045)

8L SOIC LPI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q12037)

8L SOIC LPI Pass Pass MSL3/260C Pass NiPdAu

PPF Pass Pass Pass Released (PQF-LPI-SAF)

8L SOIC (COL) MTAI Pass Pass MSL1/260C Pass NiPdAu


8L SOIC (EIAJ) MTAI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released

(Q04084,R04125,Q06029,Q10082,Q10057,Q09023,Q10094)

8L SOIC (EIAJ) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04009,Q07167,Q08085,Q09067)

8L SOIC (EIAJ) HANA Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04089)

8L SOIC (EIAJ) LPI Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-LPI-S2AE)




12

Package Assembly

Site

Pre-

condition

MSL Results To

J-STD-020C

Profile

Solderability

Results To

JESD22-B102E

Lead

Finish

HAST UHAST

&

PCT

Temp.

Cycling


8L SOIC (EIAJ) GTK Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-GEI-S2AE)

8L SOIJ-S LPI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (CCB1064, REL-100204)

8L TDFN (2x3x0.8) UNIS Pass Pass MSL1/260C Pass NiPdAu


8L TDFN (2x3x0.8) UTL Pass Pass MSL1/260C Pass NiPdAu

PPF Pass Pass Pass Released (Q07171,Q08169,Q09038,Q10059

8L USON (2x3x0.6, COL) LPI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (R12023)

8L TDFN (5x6x0.8) LPI Pass Pass MSL3/260C Pass NiPdAu

PPF Pass Pass Pass Released (PQF-LPI-QAF)

8L TDFN (5x6x0.8) GTK Pass Pass MSL3/260C Pass NiPdAu

PPF Pass Pass Pass Released (PQF-GEI-QAF)

8L TDFN (5x6x0.8) LPI Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-LPI-QAE)

8L TDFN (5x6x0.8) GTK Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-GEI-QAE)

8L TDFN (5x6x0.8) ASCL Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-ASECL-QAE)

8L TSSOP UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q03024,Q07046,Q08093)

8L TSSOP UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06020,Q06237)

8L TSSOP ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q07101)

8L TSSOP VGT Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08090,Q09046)

8L TSSOP MMT Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q12031)

8L UDFN (2x3x0.5) UTL Pass Pass MSL1/260C Pass NiPdAu

PPF Pass Pass Pass Released (Q08068,Q09104)

8L WSON (5x6x0.8) LPI Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-LPI-QAE)

8L WSON (5x6x0.8) GTK Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-GEI-QAE)

8L WSON (5x6x0.8) ASCL Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-ASECL-QAE)

8L XSON (2x2x0.45) ASCL Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-ASECL-QX8E)

8L XSON (2x2x0.45) LPI Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-LPI-QX8E)

8L X2SON (2x2x0.40) LPI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (CCB1109.02)

10L DFN (3x3x0.9) CARS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04155)

10L DFN (3x3x0.9) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05125,Q09016,Q11021,Q11082)




13

Package Assembly

Site

Pre-

condition

MSL Results To

J-STD-020C

Profile

Solderability

Results To

JESD22-B102E

Lead

Finish

HAST UHAST

&

PCT

Temp.

Cycling


10L MSOP ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08065,Q09087)

10L MSOP UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08173,Q09121,Q11078)

10L UDFN(3.3x3.3x0.5) NSEB Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q11099 )

12L XQFN (2x2x0.45) LPI Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-LPI-QXBE)

12L X2QFN (2x2x0.40) LPI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (CCB1109.03, REL-100469)


14L PDIP ATP Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q09086)

14L PDIP HANA Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q05234), Qualified By Similarity To 16L PDIP


14L PDIP VGT Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q09095)

14L SOIC MTAI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04165,Q06082,Q08189)

14L SOIC MMT Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q03175,Q08038)


14L SOIC HANA Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04060, Q04061)

14L SOIC ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q03129,Q04071),

Qualified by Similarity To 28L SOIC


14L TSSOP UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q07006)

14L TSSOP ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q09083,Q07090,Q11072)

14L TSSOP UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05030,Q09109,Q11104,Q11124)

14L TSSOP VGT Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08070,Q09097)

14L TSSOP MMT Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q12091,Q12093)

16L PDIP HANA Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q05234)


16L PDIP GTK Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q10086)



16L QFN (3x3x0.9) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08154)

16L QFN (4x4x0.9) CARS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05001)

16L QFN (4x4x0.9) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05129,Q07024,Q08171,Q11024)




14

Package Assembly

Site

Pre-

condition

MSL Results To

J-STD-020C

Profile

Solderability

Results To

JESD22-B102E

Lead

Finish

HAST UHAST

&

PCT

Temp.

Cycling


16L QSOP UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06174)

16L QSOP HANA Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05076)

16L QSOP MMS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q07078)

16L SOIC (150) ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q09085)

16L SOIC (150) MMT Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08072,Q10103,Q12013,Q12014)

16L SOIC (150) GTK Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q10076)

16L SOIC (150) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08064) Similarity To 20L SOIC(150)

16L SOIC (300) ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q09080)

16L SOIC (300) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08064)

Qualified By Similarity To 20L SOIC(300)

16L SOIC (300) GTK Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q10065),

Qualified by Similarity To 20L SOIC

16L SOIC (300) ASCL Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-ASECL-SCE)

16L TSSOP UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q10001,Q12052 )

16L TSSOP ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q09034)

16L VQFN (3x3x0.9) LPI Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-LPI-QVCE)

16L WQFN (3x3x0.75) LPI Pass Pass MSL3/260C Pass NiPdAu

PPF Pass Pass Pass Released (PQF-LPI-QCF)





18L PDIP MMS Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q04029), Qualified By Similarity To 28L PDIP

18L SOIC UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04100)

18L SOIC MTAI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04169,Q07102,Q08081,Q08087,Q10004,R04124)

18L SOIC MMS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04092Q10120),

Qualified By Similarity To 28L SOIC

18L SOIC ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04071),Qualified By Similarity To 28L SOIC






15

Package Assembly

Site

Pre-

condition

MSL Results To

J-STD-020C

Profile

Solderability

Results To

JESD22-B102E

Lead

Finish

HAST UHAST

&

PCT

Temp.

Cycling


20L UQFN 3x3x0.55) LPI Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (CCB1109.01)

20L QFN (4x4x0.9) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05127,Q09058)

20L QFN (4x4x0.9) UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06040,Q08002,)

Qualified by Similarity To 44L QFN 8x8


20L SSOP MTAI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05025,Q06246,Q08083,Q10136)

20L SSOP ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04158), Qualified By Similarity To 28L SSOP

20L SSOP UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05209)

20L TSSOP ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04102,Q07119)

20L TSSOP UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08124)

20L SOIC UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08064,Q09102)



20L SOIC ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q07103)

20L SOIC MMT Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06055,Q08026,Q09101)


24L PDIP MMT Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q02110), Qualified By Similarity To 40L PDIP


24L SOIC ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04071), Qualified By Similarity To 28L SOIC

24L SOIC MMT Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06050)

24L SSOP ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04158), Qualified By Similarity To 28L SSOP

24L SSOP GTK Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q10072)

24L SSOP UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q09031)

24L WQFN (4x4x0.75) LPI Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-LPI-QDE)

24L TFBGA (6x8x1.2) LPI Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (CCB1157)



28L PLCC ATP Pass Pass MSL1/245C Pass Matte Sn Pass Pass Pass Released (Q08078)

28L PLCC MMT Pass Pass MSL3/245C Pass Matte Sn Pass Pass Pass Released (Q06053)




16

Package Assembly

Site

Pre-

condition

MSL Results To

J-STD-020C

Profile

Solderability

Results To

JESD22-B102E

Lead

Finish

HAST UHAST

&

PCT

Temp.

Cycling


28L QFN(5x5x0.9) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q12002,Q11107)

28L QFN (6x6x0.9) UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08002,Q09072),

Qualified By Similarity To 44L QFN ( 8x8) CCB#893


28L QFN (6x6x0.9) ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q10121)

28L QFN (6x6x0.9) ASAC Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q10115)

28L QFN-S (6x6x0.9) UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08002,Q09072),

Qualified By Similarity To 44L QFN 8x8

28L QFN-S (6x6x0.9) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q09060,Q09125)

28L SPDIP MMT Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q07124)

28L SPDIP GTK Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q10098)

28L SPDIP MTAI Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q08130)

28L SPDIP UNIS Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q04037)

28L SOIC MMS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q004092,Q10049)

28L SOIC MMT Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04091)

28L SOIC ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04071)

28L SOIC MTAI Pass Pass MSL1 or 3/260C

Note 3

Pass Matte Sn Pass Pass Pass Released (Q04169,Q06083,Q09111)

28L SSOP MTAI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q07007,Q09008,Q10092,Q11066)

28L SSOP ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04158,Q08135)

28L UQFN (4x4x0.5) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q09041)

32L PDIP GTK Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (PQF-GEI-PHE)

32L PDIP LPI Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (PQF-LPI-PHE)

32L PLCC GTK Pass Pass MSL3/245C Pass Matte Sn Pass Pass Pass Released (PQF-GEI-NHE)

32L PLCC LPI Pass Pass MSL3/245C Pass Matte Sn Pass Pass Pass Released (PQF-LPI-NHE)

32L TQFP (7x7x1) ATP Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q05106)

32L TSOP (8x14) LPI Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-LPI-WHE)

32L TSOP (8x14) SPIL Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-SPIL-WHE)

34L WFBGA (4x6x0.8) LPI Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (CCB1061.01)




17

Package Assembly

Site

Pre-

condition

MSL Results To

J-STD-020C

Profile

Solderability

Results To

JESD22-B102E

Lead

Finish

HAST UHAST

&

PCT

Temp.

Cycling


34L WFBGA (4x6x0.8) PTI Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (CCB1088)

36L VTLA (5x5x0.9) ASAC Pass Pass MSL1/260C Pass NiPdAu


40L PDIP CEI Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q08195)


40L PDIP LPI Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (PQF-LPI-PIE)

40L PDIP GTK Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (PQF-GEI-PIE)



40L QFN (5x5x0.9) UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q09072), Qualified by similarity to 44L QFN 8x8

40L QFN (5x5x0.9) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08159), Qualified by similarity to 44L QFN 8x8


40L TSOP (10x20) LPI Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-LPI-EIE)

40L UQFN (5x5x0.5) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q10050)

40L WQFN (6x6x0.8) LPI Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-LPI-QIF)

44L MQFP (10x10x2) ATP Pass Pass MSL 3/260C Pass Matte Sn Pass Pass Pass Released (Q08045) Note 2

44L MQFP (10x10x2) MMT Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q08023,Q11060) Note 2


44L PLCC MMT Pass Pass MSL1/245C Pass Matte Sn Pass Pass Pass Released (Q09099,Q08027,Q11093,Q11094)

44L PLCC MMS Pass Pass MSL1/245C Pass Matte Sn Pass Pass Pass Released (Q05205,Q06240)

44L PLCC GTK Pass Pass MSL3/245C Pass Matte Sn Pass Pass Pass Released (PQF-GEI-NJE)

44L QFN (8x8x0.9) UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08002,Q09072)


44L TQFP

(10x10x1)

MTAI Pass Pass MSL1 /260C Pass Matte Sn Pass Pass Pass Released

(Q04057,Q09029,Q10003,Q06058,Q06251,Q08174)

44L TQFP

(10x10x1)

ASAC Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q06045,Q09120,Q09133) Note 2

44L TQFP

(10x10x1)

ATP Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q04087), Qualified By Similarity To 64L TQFP

(10X10) Note 2




18

Package Assembly

Site

Pre-

condition

MSL Results To

J-STD-020C

Profile

Solderability

Results To

JESD22-B102E

Lead

Finish

HAST UHAST

&

PCT

Temp.

Cycling


44L TQFP

(10x10x1) ATK Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q04137-02), Qualified By Similarity To 80L TQFP

(12X12) Note 2

44L TQFP

(10x10x1)

LPI Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-LPI-TQJE)

44L VLAP (6x6x0.9) ASAC Pass Pass MSL3/260C Pass NiPdAu

PPF Pass Pass Pass Released (Q10045,Q10046,Q11084)

48L TQFP (7x7x1mm) ATK Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q12036)

48L TFBGA (6x8x1.2) PTI Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (PQF-PTI-B3KE)

48L TFBGA (6x8x1.2) LPI Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (CCB1055, REL-100257)

48L TQFP (7x7x1mm) ATK Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q12036)

48L TFBGA (6x8x1.2) APTS Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (PQF-APTS-B3KE)

48L TFBGA (6x8x1.2) ASSH Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (PQF-ASESH-B3KE)

48L TFBGA (6x8x1.2) KTI Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (PQF-KTI-B3KE)

48L TFBGA (6x8x1.2) PTI Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (PQF-PTI-B3KE)

48L TFBGA (6x8x1.2) SPIL Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (PQF-SPIL-B3KE)

48L TSOP (12x20) LPI Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-LPI-EKE)

48L TSOP (12x20) SPIL Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-SPIL-EKE)

48L UQFN (6x6x0.5) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q09064,Q11004)

48L WFBGA (4x6x0.8) ATK Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (PQF-ATK-MAQE)

48L WFBGA (4x6x0.8) SPIL Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (PQF-SPIL-MAQE)

48L WFBGA (4x6x0.8) ASCL Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (PQF-ASECL-MAQE)

48L WFBGA (5x6x0.8) ATK Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (PQF-ATK-MBQE)

48L WFBGA (5x6x0.8) SPIL Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (PQF-SPIL-MBQE)

48L XFLGA (4x6x0.6) ATK Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (PQF-ATK-C1QE)

48L XFLGA (5x6x0.6) ATK Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (PQF-ATK-C2QE)

48L WFBGA (4x6x0.8) LPI Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (CCB1061.01)

48L WFBGA (5x6x0.8) LPI Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (CCB1061.01, REL-100376)

48L WFBGA (4x6x0.8) PTI Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (CCB1088)

48L WFBGA (5x6x0.8) PTI Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (CCB1088, Rel report #1111160 )





19

Package Assembly

Site

Pre-

condition

MSL Results To

J-STD-020C

Profile

Solderability

Results To

JESD22-B102E

Lead

Finish

HAST UHAST

&

PCT

Temp.

Cycling


64L TQFP

(10x10x1)

CARS Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q02005)

64L TQFP

(10x10x1)

ASAC (UDG) Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q09118,Q09135,Q06060,Q11092)

64L TQFP

(10x10x1)

ATK Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q08044)

64L TQFP

(10x10x1)

ATP Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q04087)

Note 2

64L TQFP

(10x10x1)

MTAI Pass Pass MSL1/260 Pass Matte Sn Pass Pass Pass Released

(Q04065,Q07101,Q08176,Q09075,Q10005,Q11028)

64L TQFP

(14x14x1)

ATP Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q04159-04), Qualified

By Similarity To 80L TQFP (14X14) Note 2

64L TQFP

(14x14x1)

UTAC Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q06065), Note 2


Note 2

68L PLCC MMT Pass Pass MSL3/245C Pass Matte Sn Pass Pass Pass Released (Q08021)

Note 2

80L TQFP

(12x12x1)

ATK Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q06096,Q10047)

Note 2

80L TQFP

(12x12x1)

ASAC Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q06217,Q08175,Q10038,Q11049,Q11067)

80L TQFP

(12x12x1)

CARS Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q04112-02)

80L TQFP

(12x12x1)

MTAI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released

(Q06063,Q07083,Q08073,Q09079,Q11052,Q12009)

80L TQFP

(14x14x1)


80L TQFP

(14x14x1)

ASAC Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q06066,Q06067)

Note 2

84L PLCC ATP Pass Pass MSL3/245C Pass Matte Sn Pass Pass Pass Released (Q08050), Note 2

84L PLCC MMT Pass Pass MSL3/245C Pass Matte Sn Pass Pass Pass Released (Q08029), Note 2




20

Package Assembly

Site

Pre-

condition

MSL Results To

J-STD-020C

Profile

Solderability

Results To

JESD22-B102E

Lead

Finish

HAST UHAST

&

PCT

Temp.

Cycling


100L TQFP

(12x12x1)

MTAI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06224,Q08161,Q26225,Q09079,Q11029)

Note3

100L TQFP

(12x12x1)

ASE Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q06074)

100L TQFP

(14x14x1)

ATP Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q05141,QQ06043,Q11033)

Note 2

100L TQFP

(14x14x1)

ASAC Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q06207,Q08177,Q11089,Q11090)

121L TFBGA

(10x10x1.1)

ATP Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (Q09003,Q09103,Q11038)

124L VTLA

(9x9x0.9)

ASAC Pass Pass MSL1/260C Pass NiPdAu

PPF

Pass Pass Pass Released ( Q11083)

144L TQFP

(16x16x1mm)


144L TQFP

(20x20x1.4mm)


Note 1: Not required for through hole packages.

Note 2: Although the package qualification passed MSL1/260°C conditions, MCHP is offering the package as MSL3/260°C due to concerns with normal variability in

BOM and manufacturing affecting MSL performance. This is to inform customers that the MSL level stated in the individual package qualification reports is

different than the one being reported in table 3.4 of this Package Qualification Summary Report.

Note 3: Dependent on the package bill of materials, i.e. leadframe paddle size, mold compound, etc. As part of Microchip’s continuous improvement efforts, the MSL

classification may improve to the desired MSL1 classification. MSL1 units are shipped in low-temp trays therefore these trays should not be used for baking

parts.




21

3.5 Please see the attached document for Microchip’s tin whisker reliability test status.

Tin Whisker

Test Package

Plating Site Tin Whisker Test

Lead Frame Type

Package Qualified

By Tin Whisker Test

Lead Frame Type

Precondition

Pre inspection Tin Whisker Measurement Result

Temperature Cycling (cycles)

High

Temperature & Humidity

Ambient


500 1,000 1,500 1,000 2,000 3,000 4,000 1,000 2,000 3,000 4,000

3L SOT -89 CEI Cu 8/24/40L PDIP

No Pass Pass Pass Pass Pass Pass Pass - Pass Pass Pass Pass

Sn-Pb Reflow Pass Pass Pass Pass Pass Pass Pass - Pass Pass Pass Pass

Pb-Free Reflow Pass Pass Pass Pass Pass Pass Pass - Pass Pass Pass Pass

3L TO-92 GTK C194

8/16/24L SOIC,

24L SSOP,

8/16/32/40L PDIP,

8L SOIJ, 28L SPDIP

No Pass Pass Pass Pass Pass Pass - - Pass Pass Pass Pass

Sn-Pb Reflow Pass Pass Pass Pass Pass Pass - - Pass Pass Pass Pass

Pb-Free Reflow Pass Pass Pass Pass Pass Pass - - Pass Pass Pass Pass

5L DDPAK CARM HCL-12S

3L DDPAK

3/5L TO – 220

No Pass Pass Pass - Pass Pass Pass - Pass Pass Pass Pass

Sn-Pb Reflow Pass Pass Pass - Pass Pass Pass - Pass Pass Pass Pass

Pb-Free Reflow Pass Pass Pass - Pass Pass Pass - Pass Pass Pass Pass

5L SOT 223 HANA C194

3L SOT 223,

3/5L SOT-23, 3LSOT-89

8/14/16/18L PDIP,

14L SOIC, 8L SOIJ,

16L QSOP

No Pass - - - - - - - Pass Pass Pass Pass

Sn-Pb Reflow Pass Pass Pass Pass Pass Pass Pass Pass - - - -

Pb-Free Reflow Pass Pass Pass Pass Pass Pass Pass Pass - - - -

8L EIAJ UTL C194

3/5/6 SOT23

3/5/6 L SC70

8/18/28/40L PDIP ,

28LSPDIP,

8/16/18/20L SOIC ,

8L MSOP, 20L SSOP

No Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass

Sn-Pb Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass

Pb-Free Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass




22

Tin Whisker

Test Package


Lead Frame Type

Package Qualified

By Tin Whisker Test

Lead Frame Type

Precondition



High


Ambient


500 1,000 1,500 1,000 2,000 3,000 4,000 1,000 2,000 3,000 4,000

8L SOIC ANAC C194




8L SOIC MMS C194

3/5/6L SOT-23,

4L SOT-143,

8L MSOP, 44L PLCC,

8/18 PDIP

16L QSOP

18/28L SOIC




8L SOIC VGT C194 8/14L PDIP




8L TSSOP UTL C7025 8/10L MSOP

14/16/20L TSSOP




14L TSSOP ANAP C7025 8/16/20L TSSOP

44L MQFP




14L TSSOP UNIS C7025 8L TSSOP, 24L SSOP




14L TSSOP VGT C7025 8L TSSOP, 8L SOIC






23

Tin Whisker

Test Package


Lead Frame Type

Package Qualified

By Tin Whisker Test

Lead Frame Type

Precondition



High


Ambient


500 1,000 1,500 1,000 2,000 3,000 4,000 1,000 2,000 3,000 4,000


16L QSOP UNIS C194

3/5/6L SOT 23

5L TSOT ,5L SC70

14L PDIP, 20L SOIC

28L SPDIP, 3L SOT 223

No Pass Pass Pass Pass Pass Pass Pass Pass(S) Pass Pass Pass Pass



28L SOIC MTAI C194

8L MSOP, 28L SPIDP,

8/18/28/40L PDIP

8/14/18L SOIC

8L EIAJ,3/5/6 LSOT23

20/28L SSOP

No Pass Pass Pass Pass - - - - Pass Pass Pass Pass



28L SOIC MMT C194

8/14/16/20 L SOIC

8/14/16/18/20/24/40L

PDIP

28L SPDIP, 44L TQFP




28L SSOP ANAP C194

8/14/16/18/20/24L PDIP

8/10L MSOP,

8/14/16/18/20/24/28L

SOIC ,20/24/L SSOP

80L LQFP, 80L TQFP,

16L QSOP, 5/6L TSOT




44L TQFP ANAP EFTEC64T 32/64/80/100/144L TQFP ,

128/144L LQFP




64L TQFP ASAC EFTEC64T

44/80/100L TQFP







24

Tin Whisker

Test Package


Lead Frame Type

Package Qualified

By Tin Whisker Test

Lead Frame Type

Precondition



High


Ambient


500 1,000 1,500 1,000 2,000 3,000 4,000 1,000 2,000 3,000 4,000

64L TQFP MMT C7025

44L TQFP,

44L MQFP,

8/14L TSSOP




64L TQFP MTAI C7025 44/80/100L TQFP




80L TQFP ANAK EFTEC64T 44/64L TQFP




100L TQFP

ASAC

EFTEC64T

44/64/80L TQFP

No Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S)

Sn-Pb Reflow Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S)

Pb-Free Reflow Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S)

8L SOP

LPI

C194

32/40L PDIP, 8/16L SOIC,

8L SOIJ, 8L SOIJ-S,

5L SOT0223




5L SOT- 89 LPI KFCAG 3L SOT 89




48L TSOP

LPI

C7025

44L TQFP,

32/40L TSOP







25

Tin Whisker

Test Package


Lead Frame Type

Package Qualified

By Tin Whisker Test

Lead Frame Type

Precondition



High


Ambient


500 1,000 1,500 1,000 2,000 3,000 4,000 1,000 2,000 3,000 4,000

3L SOT-23

LPI

EFTEC64T




NOTE: All tin whisker reliability testing was performed per the requirements in JEDEC specifications JESD22A121 & JESD201A. The tin whisker acceptance criteria

was based on the class 2 requirements in JESD201A, which is 45 um for the temperature cycling test and 40 um for the ambient/high temperature & humidity tests. Pass

(S) is tin whisker reliability test data from Microchip's assembly subcontractor (whisker testing was performed using a different package type). Sn-Pb and Pb-free

reflows have a peak reflow temperature of 215°C and 245°C respectively and both reflow profiles comply to J-STD-020.




26

4.0 CONCLUSION

The assembly using Matte Tin plating, PPF or solder spheres complies with the reliability

guidelines documented in the qualification plan. Compliance was based on passing moisture

sensitivity level (JEDEC J-STD-020 compliance for SMD), package reliability, solderability

(JESD22-B102E compliance for SMD and through hole packages), and JEDEC whiskers growth

test results per the JESD22A121 & JESD201A requirements. Therefore, the assembly using

Matte Tin plating or PPF for these packages is released for production using die from all of

Microchip’s process technologies and product fabricated at silicon foundries for the packages and

assembly sites outlined in table 3.4.

package qualification summary...

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