PACKAGE QUALIFICATION SUMMARY REPORT
Document Control #:
Purpose: To provide qualification summary
report for all packages
Device: Various
Mask Identification #: Various
Process Technology: Pure Matte Tin (Sn) Plating Process
(400 µin (10 µm) – 1000 µin (25
µm), Pre-Plated Leadframe (PPF),
or SnAgCu based solder bump
Product: Various devices plated with Matte Tin,
PPF, or with solder spheres
Updated: June 21, 2013
Package Qualification Summary Report
DOCUMENT CONTROL #
Microchip Technology Inc.
2
PACKAGE QUALIFICATION SUMMARY REPORT
CONTENTS
1) QUALIFICATION OVERVIEW
2) RELIABILITY TEST DESCRIPTIONS
3) QUALIFICATION RESULTS & RELEASE STATUS
4) CONCLUSION
RESULTS SUMMARY
The assembly using Matte Tin plating, PPF or solder spheres complies with the
reliability guidelines documented in the qualification plan.
Name Department/Function Date
Author S. Pokharel Quality Engineering June 21, 2013
Approved by A. Kumar Quality Engineering
Manager
June 21, 2013
Approved by A. Navarro FA & Reliability
Manager
June 21, 2013
Approved by G. Perzanowski Quality Director June 21, 2013
Approved by F. Chen Assembly Engineering
Manager
June 21, 2013
Approved by A. Abbott Product Environmental
Compliance Manager
June 21, 2013
Package Qualification Summary Report
DOCUMENT CONTROL #
Microchip Technology Inc.
3
1 QUALIFICATION OVERVIEW
The purpose of this report is to verify that the qualification testing was performed in accordance with the
documented qualification plan required by Microchip specification QCI-39000, “Worldwide Quality
Conformance Requirements”. The performance requirements was based on having passing moisture
sensitivity level, package reliability, JEDEC tin whiskers growth test results per JESD22A121 & JESD201A
requirements.
ASSEMBLY OR PLATING SITE DESIGNATION
APTOS TECHNOLOGY APTS
ADVANCED SEMICONDUCTOR
ENGINEERING GROUP, CHUNG LI
ASCL
ADVANCED SEMICONDUCTOR
ENGINEERING GROUP, TAIWAN
ASE
ADVANCED SEMICONDUCTOR
ENGINEERING GROUP, SHANGHAI
ASSH
AMKOR TECHNOLOGY CHINA
(aka ANAC)
ATC
AMKOR TECHNOLOGY KOREA
(aka ANAK)
ATK
AMKOR TECHNOLOGY
PHILIPPINES (aka ANAP)
ATP
CARSEM (M) SDN BHD CARM
CARSEM SEMICONDUCTOR SDN
BHD
CARS
CIRCUIT ELECTRONIC INDUSTRIES CEI
CIRTEK ELECTRONICS CORP. CRTK
GREATEK ELECTRONICS GTK
HANA MICROELECTRONIC HANA
KINGPAK TECHNOLOGY INC. KTI
LINGSEN PRECISION INDUSTRIES LPI
MILLENNIUM MICROTECH
SHANGHAI (aka ATES)
MMS
MILLENNIUM MICROTECH
THAILAND (aka ALPH)
MMT
MICROCHIP TECHNOLOGY
THAILAND
MTAI
POWERTECH TECHNOLOGY INC. PTI
SILICON PRECISION INDUSTRIES SPIL
UNISEM (M) BERHAD, MALAYSIA UNIB
UNISEM CHINA UNIC
UNISEM (M) SINGAPORE UNIS
UTAC HOLDINGS (aka ASAC) UTAC
UTAC THAI LIMITED (aka NSEB) UTL
VIGILANT TECHNOLOGY CO. LTD VGT
Package Qualification Summary Report
DOCUMENT CONTROL #
Microchip Technology Inc.
4
1.1 Qualification Plan
In keeping with guidelines established in QCI-39000 for new assembly packages or processes a minimum of
three assembly lots would be used for package qualification testing. Representative samples of each package
family and subcontractor were used to qualify the entire set of packages manufactured at each subcontractor.
Each package selected would be subjected to all tests. In addition, data was collected to verify the
solderability of the Matte tin lead finish in both the standard solder bath as well as a representative Pb-Free
solder (note 4). Tin whisker reliability testing was performed in compliance to JESD22A121 & JESD201A
requirements. A detailed qualification plan is listed below.
Preconditioning – Surface mount devices would be subjected to preconditioning stress before HAST,
Unbiased HAST (UHAST) , and Temperature Cycling.
HAST – Devices would be subjected to 96 hours of Highly Accelerated Stress Test (HAST).
Unbiased HAST ( UHAST ) – Devices would be subjected to 96 hours of Unbiased HAST testing.
or Autoclave (Pressure Cooker).
Temperature Cycling – Devices would be subjected to 500 temperature cycles.
Solderability – Devices would be subjected to 8 hours of steam aging and then tested for solderability
issues.
Whiskers Growth – Devices would be subjected to 1500 temperature cycles, 4000 hours ambient bake, and
4000 hours high temperature moisture bake.
1.2 Qualification Test Conditions
Tests are performed in accordance with QCI-39000, “Worldwide Quality Conformance Requirements”.
TEST METHOD CONDITION CRITERIA
Pre-Conditioning (SMD only) JESD22-A113E
1. Electrical Test @ 25°C
2. SAM exam
3. 150°C Bake for 24hrs
4. 85°C/85% R.H. for 168hrs or
30°C/60% R.H. for 192hrs
5. Reflow 3 cycles @ 260°C or 245°C
6. SAM exam
7. Electrical Test @ 25°C
0/all surface mount
devices
HAST JESD22-A110B 130°C/85%/96hrs 0/77
Unbiased HAST (UHAST) or
Unbiased Autoclave ( PCT )
JESD22-A118 130°C/85%/96hrs or
121°C/ 100%/96hrs
0/77
Temperature Cycling JESD22-A104C -65°C to +150°C/500 cycles
0/77
Solderability Test
Table 3.3
JESD22-B102E Solder temp. 245°C
SMD & Through hole
Rosin Flux
0/22
Package Qualification Summary Report
DOCUMENT CONTROL #
Microchip Technology Inc.
5
(Matte tin lead finish, SnAgCu
95.5/3.9/0.6 Solder)
Backward Compatibility
Solderability Test Table 3.1
JESD22-B102E Solder temp. 245°C Through hole
215°C SMD
Rosin Flux
(Matte tin lead finish, 60/40 SnPb Solder)
0/22
Forward Compatibility
Solderability Test Table 3.2
MIL-STD 883 Method 2003 Solder temp. 265°C ± 5°C
SMD & Through hole
(SnPb lead finish, Sn/Ag/Cu Solder)
0/22
Whiskers Growth All tin whisker reliability
testing was performed per the
requirements in JEDEC
specifications JESD22A121 &
JESD201A.
–55 (+0/-10) °C to +85 (+10/-0) °C or
-40 (+/-10)°C to +85 (+10/-0)°C
for 1500 cycles
30±2°C/60±2% RH 4000 hrs Bake
55±3°C /85±3% RH 4000 hrs Bake
Max whisker lengths:
45um for temp cycle
test and 40um for
ambient/high temp &
humidity tests.
2 RELIABILITY TEST DESCRIPTIONS
2.1 Preconditioning
This test consists of the following tests run in a consecutive order. The tests are electrical testing at 25°C,
C- SAM , Bake 150°C 24 hour , a moisture soak, 3X Reflow cycles, C-SAM and ending with electrical
testing at 25°C.
2.2 Highly Accelerated Stress Test (HAST) This test is similar to autoclave, but under more severe conditions. Device pins are connected in an
alternating bias of 5 volts (or the upper rated Vdd/Vcc level) and ground.
2.3 Unbiased HAST (UHAST)
The unbiased HAST is performed for the purpose of evaluating the reliability on non-hermetic packaged
solid-state devices in humid environments .It is a highly accelerated test with temperature and humidity that
are exposed to condition 130 oC , 85 % relative humidity for a period of 96 hours.
2.4 Temperature Cycle This stress test is used to determine if any structural defects are present in a packaging design. This test is
intended to reveal potential defects related to wire bonding, cracked die, substrate mounting and thermal
mismatch.
2.5 Solderability Test This test is to evaluate the solderability of terminations that are normally joined by a soldering operation.
The specimens subjected to this test are immersed in a flux and then dipped in a molten solder bath.
Package Qualification Summary Report
DOCUMENT CONTROL #
Microchip Technology Inc.
6
2.6 Autoclave (Pressure Cooker) The purpose of this test is to determine the resistance of the package to moisture under high temperature and
humidity conditions. This test may cause such potential failure mechanisms as metal corrosion or ionic
contamination. Unbiased devices are exposed to conditions of 121.5oC, at 15 PSI (one atmosphere), and
100% relative humidity for a period of 96 hours.
2.7 Whisker Growth
This test is to determine the susceptibility of the plated matte tin finish to form a dendrite type of growth
referred to as whiskers. One potential effect of excessive whisker growth includes electrical shorting
between two adjacent pins. Please note that the minimum matte tin thickness is 400 µin (10 µm) and that a
post plating bake or anneal process (150°C for 1 hr) is currently being utilized for all matte tin plated product
to mitigate the risk of tin whiskers. This anneal process is performed within 24 hours after the matte tin
deposit.
Package Qualification Summary Report
DOCUMENT CONTROL #0703461
Microchip Technology Inc.
7
3.0 QUALIFICATION RESULTS
3.1 Backward Solderability Compatibility Results (JESD22-B102E)
Plating Site Solder Paste Composition Flux Type Lead finish Solder Temp. Package Type Result
MTAI / MMT/UTL/ATP/
HANA/UNIS/CARM
Sn60Pb40A Rosin Flux 100% matte Sn 215°C SMD Passed
Sn60Pb40A Rosin Flux 100% matte Sn 245°C Through hole Passed
MMS/ATK/ATC/CARM Sn60Pb40A Rosin Flux 100% matte Sn 215°C SMD Passed
Sn60Pb40A Rosin Flux 100% matte Sn 245°C Through hole Passed
3.2 Forward Solderability Compatibility Results (MIL-STD 883 Method 2003)
Plating Site Solder Paste Composition Flux Type Lead finish Solder
Temperature
Package Type Result
MTAI / MMT Sn/Ag/Cu (96.5%/3.0%/0.5%) 100 R-type Sn/Pb 265°C SMD & Through hole Passed
UTL Sn/Ag/Cu (95.5%/4.0%/0.5%) 145 R-type Sn/Pb 265°C SMD Passed
ATP Sn/Ag/Cu (95.8%/3.5%/0.7%) Alpha 100 Sn/Pb 265°C SMD Passed
MMT Sn/Ag/Cu (96.5%/3.0%/0.5%) 100 R-type Sn/Pb 265°C SMD Passed
3.3 Pb-free Solderability Results (JESD22-B102E, Note 4)
Plating Site Solder Paste Composition Flux Type Lead finish Solder Temp. Package Type Result
MTAI /MMT/ MMS/UTL/ATP/
ATK/ATC/CARS/UNIS
SnAgCu (95.5/3.9/0.6) Rosin Flux 100% matte Sn 245°C SMD Passed
MTAI / MMT/ATP/ /UNIS
SnAgCu (95.5/3.9/0.6) Rosin Flux 100% matte Sn 245°C Through hole Passed
Note 4: Pb-free refers to non-SnPb based solder bath.
Package Qualification Summary Report
DOCUMENT CONTROL #0703461
Microchip Technology Inc.
8
3.4 Package Reliability Test Results & Release Status By Pincount
Package Assembly
Site
Pre-
condition
MSL Results To
J-STD-020C
Profile
Solderability
Results To
JESD22-B102E
Lead
Finish
HAST UHAST
&
PCT
Temp.
Cycling
Package Release Status (Qualification Report Number)
3L DDPAK CARM Pass Pass MSL1/245C Pass Matte Sn Pass Pass Pass Released (Q08187), Qualified By Similarity To 5L DDPAK
3L SC70 UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04004,Q04059 for NCDA)
3L SC70 UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04143, Q07096)
3L SC70 CARM Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06256)
3L SOT23 MTAI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06008,Q06009,Q08080,Q08009,Q10083)
Qualified By Similarity To 5L SOT23
3L SOT23 MMS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q07104), Qualified By Similarity To 6L SOT23
3L SOT23 UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04149,Q07004)
3L SOT23 UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04140, Q04141), Qualified By Similarity To 6L
SOT23
3L SOT 23A LPI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q12062)
3L SOT23A HANA Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06236 ,Q12028 )
3L SOT89 CEI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05002,Q06255)
3L SOT89 HANA Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06244)
3L SOT89 LPI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q12061)
3L SOT223 HANA Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q07145, Q07169)
3L SOT223 UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q07170, Q08006, Q09078)
3L TO-220 CARM Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q08119), Qualified by similarity to 5L TO-220
3L TO-92 GTK Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q08166)
4L SOT143 UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q07173)
4L SOT143 MMS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q10100)
5L DDPAK CARM Pass Pass MSL1/245C Pass Matte Sn Pass Pass Pass Released (Q08187)
Package Qualification Summary Report
DOCUMENT CONTROL #0703461
Microchip Technology Inc.
9
Package Assembly
Site
Pre-
condition
MSL Results To
J-STD-020C
Profile
Solderability
Results To
JESD22-B102E
Lead
Finish
HAST UHAST
&
PCT
Temp.
Cycling
Package Release Status (Qualification Report Number)
5L SC70 UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04004, Q04059), Similarity To 3L SC70
5L SC70 UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04143)
5L SC70 HANA Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05070)
5L SC70 (COL) UTL Pass Pass MSL1/260C Pass NiPdAu
PPF Pass Pass Pass Released Q10066,Q11114,Q11122
5L SOT23 MTAI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06001,Q07021,Q08074,Q10083,Q08080)
5L SOT23 MMS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q07104), Qualified By Similarity To 6L SOT23
5L SOT23 UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04149,Q07098)
5L SOT23 UTL Pass Pass MSL1/260C Pass NiPdAu
PPF Pass Pass Pass Released (Q11027)
5L SOT23 UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04141 ), Qualified By Similarity To 6L SOT23
5L SOT23 HANA Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06150)
5L SOT23(COL) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08020)
5L SOT223 HANA Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q07080)
5L SOT223 LPI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q12005 )
5L SOT223 GTBF Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q11132 )
5L TO-220 CARM Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q08119)
5L TSOT UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06214, Q06261)
6L DFN (2x2x0.9) UTL Pass Pass MSL1/260C Pass NiPdAu
PPF Pass Pass Pass Released (Q10074)
6L SC70 (COL) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q09014)
6L SOT23 MTAI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06039, Q07021,Q08074,Q10083,Q10088)
6L SOT23 MMS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q07104)
6L SOT23 UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04149,Q05108)
Package Qualification Summary Report
DOCUMENT CONTROL #0703461
Microchip Technology Inc.
10
Package Assembly
Site
Pre-
condition
MSL Results To
J-STD-020C
Profile
Solderability
Results To
JESD22-B102E
Lead
Finish
HAST UHAST
&
PCT
Temp.
Cycling
Package Release Status (Qualification Report Number)
6L SOT23 UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04141)
6L SOT23 (COL) MTAI Pass Pass MSL1/260C Pass NiPdAu
PPF Pass Pass Pass Released (Q12004,Q12008)
6L SOT23 (COL) UTL Pass Pass MSL1/260C Pass NiPdAu
PPF Pass Pass Pass Released (Q09004)
6L TDFN (2x2x0.8) UNIS Pass Pass MSL1/260C Pass NiPdAu
PPF Pass Pass Pass Released (Q10036)
6L TSOT UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08147)
6L UQFN (3x1.6x0.55) LPI Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-LPI-QU6E)
6L XSON (1.5x1.5x0.45) LPI Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-LPI-QX6E
8L DFN (2x3x0.9) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05125,Q08162,Q09098,Q10078,Q11022)
8L DFN (2x3x0.9) CARS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04106)
8L DFN (2x3x0.9) UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q09018)
8L DFN (3x3x0.9) ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04105,Q05047)
8L DFN (3x3x0.9) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05125)
8L DFN (4x4x0.9) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05130,Q09057,Q10070)
8L DFN (4x4x0.9) UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06185,Q08002)
Qualified by similarity 44L QFN(8x8) at UNIS per CCB#796
8L DFN (5x6x0.9) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05125,Q07174,Q09094)
8L DFN (5x6x0.9) ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04101,Q05003)
8L MSOP MTAI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06007,Q06229,Q07067,Q10090)
8L MSOP MMS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q10037)
8L MSOP ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08065,Q09087)
Qualified By Similarity To 10L MSOP
8L MSOP UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q09121)
Qualified By Similarity To 10L MSOP
8L PDIP ATP Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q09086), Qualified By Similarity To 14L PDIP
8L PDIP CEI Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q02111)
8L PDIP MTAI Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q09048)
8L PDIP GTK Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (PQF-GEI-PAE)
Package Qualification Summary Report
DOCUMENT CONTROL #0703461
Microchip Technology Inc.
11
Package Assembly
Site
Pre-
condition
MSL Results To
J-STD-020C
Profile
Solderability
Results To
JESD22-B102E
Lead
Finish
HAST UHAST
&
PCT
Temp.
Cycling
Package Release Status (Qualification Report Number)
8L PDIP MMT Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q08081)
8L PDIP MMS Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q09108)
8L PDIP UTL Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q07166)
8L PDIP UNIS Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q04034)
8L PDIP VGT Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q09049)
8L SOIC MTAI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q10089, Q09054,Q08191,Q09002,R04140),
8L SOIC ASCL Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-ASECL-SAE)
8L SOIC ASSH Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-ASESH-SAE)
8L SOIC GTK Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q12042)
8L SOIC GTK Pass Pass MSL3/260C Pass NiPdAu
PPF Pass Pass Pass Released (PQF-GEI-SAF)
8L SOIC MMS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q09068)
8L SOIC ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q09085, Q04097), Qualified By Similarity To 16L
SOIC
8L SOIC UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04053)
8L SOIC MMT Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04122,Q08016,Q10108)
8L SOIC ATC Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04103,Q05233)
8L SOIC UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04100,Q09036,Q09122)
8L SOIC VGT Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05153,Q08079,Q10107,Q09045)
8L SOIC LPI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q12037)
8L SOIC LPI Pass Pass MSL3/260C Pass NiPdAu
PPF Pass Pass Pass Released (PQF-LPI-SAF)
8L SOIC (COL) MTAI Pass Pass MSL1/260C Pass NiPdAu
PPF Pass Pass Pass Released (Q10116)
8L SOIC (EIAJ) MTAI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released
(Q04084,R04125,Q06029,Q10082,Q10057,Q09023,Q10094)
8L SOIC (EIAJ) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04009,Q07167,Q08085,Q09067)
8L SOIC (EIAJ) HANA Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04089)
8L SOIC (EIAJ) LPI Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-LPI-S2AE)
Package Qualification Summary Report
DOCUMENT CONTROL #0703461
Microchip Technology Inc.
12
Package Assembly
Site
Pre-
condition
MSL Results To
J-STD-020C
Profile
Solderability
Results To
JESD22-B102E
Lead
Finish
HAST UHAST
&
PCT
Temp.
Cycling
Package Release Status (Qualification Report Number)
8L SOIC (EIAJ) GTK Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-GEI-S2AE)
8L SOIJ-S LPI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (CCB1064, REL-100204)
8L TDFN (2x3x0.8) UNIS Pass Pass MSL1/260C Pass NiPdAu
PPF Pass Pass Pass Released (Q09012)
8L TDFN (2x3x0.8) UTL Pass Pass MSL1/260C Pass NiPdAu
PPF Pass Pass Pass Released (Q07171,Q08169,Q09038,Q10059
8L USON (2x3x0.6, COL) LPI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (R12023)
8L TDFN (5x6x0.8) LPI Pass Pass MSL3/260C Pass NiPdAu
PPF Pass Pass Pass Released (PQF-LPI-QAF)
8L TDFN (5x6x0.8) GTK Pass Pass MSL3/260C Pass NiPdAu
PPF Pass Pass Pass Released (PQF-GEI-QAF)
8L TDFN (5x6x0.8) LPI Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-LPI-QAE)
8L TDFN (5x6x0.8) GTK Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-GEI-QAE)
8L TDFN (5x6x0.8) ASCL Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-ASECL-QAE)
8L TSSOP UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q03024,Q07046,Q08093)
8L TSSOP UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06020,Q06237)
8L TSSOP ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q07101)
8L TSSOP VGT Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08090,Q09046)
8L TSSOP MMT Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q12031)
8L UDFN (2x3x0.5) UTL Pass Pass MSL1/260C Pass NiPdAu
PPF Pass Pass Pass Released (Q08068,Q09104)
8L WSON (5x6x0.8) LPI Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-LPI-QAE)
8L WSON (5x6x0.8) GTK Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-GEI-QAE)
8L WSON (5x6x0.8) ASCL Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-ASECL-QAE)
8L XSON (2x2x0.45) ASCL Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-ASECL-QX8E)
8L XSON (2x2x0.45) LPI Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-LPI-QX8E)
8L X2SON (2x2x0.40) LPI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (CCB1109.02)
10L DFN (3x3x0.9) CARS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04155)
10L DFN (3x3x0.9) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05125,Q09016,Q11021,Q11082)
Package Qualification Summary Report
DOCUMENT CONTROL #0703461
Microchip Technology Inc.
13
Package Assembly
Site
Pre-
condition
MSL Results To
J-STD-020C
Profile
Solderability
Results To
JESD22-B102E
Lead
Finish
HAST UHAST
&
PCT
Temp.
Cycling
Package Release Status (Qualification Report Number)
10L MSOP ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08065,Q09087)
10L MSOP UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08173,Q09121,Q11078)
10L UDFN(3.3x3.3x0.5) NSEB Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q11099 )
12L XQFN (2x2x0.45) LPI Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-LPI-QXBE)
12L X2QFN (2x2x0.40) LPI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (CCB1109.03, REL-100469)
14L PDIP MMT Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q08046)
14L PDIP ATP Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q09086)
14L PDIP HANA Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q05234), Qualified By Similarity To 16L PDIP
14L PDIP UNIS Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q06080)
14L PDIP VGT Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q09095)
14L SOIC MTAI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04165,Q06082,Q08189)
14L SOIC MMT Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q03175,Q08038)
14L SOIC UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04074)
14L SOIC HANA Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04060, Q04061)
14L SOIC ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q03129,Q04071),
Qualified by Similarity To 28L SOIC
14L SOIC GTK Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q10076)
14L TSSOP UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q07006)
14L TSSOP ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q09083,Q07090,Q11072)
14L TSSOP UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05030,Q09109,Q11104,Q11124)
14L TSSOP VGT Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08070,Q09097)
14L TSSOP MMT Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q12091,Q12093)
16L PDIP HANA Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q05234)
16L PDIP MMT Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q08076)
16L PDIP GTK Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q10086)
16L PDIP ATP Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q09084)
16L PDIP UNIS Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q06092)
16L QFN (3x3x0.9) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08154)
16L QFN (4x4x0.9) CARS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05001)
16L QFN (4x4x0.9) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05129,Q07024,Q08171,Q11024)
Package Qualification Summary Report
DOCUMENT CONTROL #0703461
Microchip Technology Inc.
14
Package Assembly
Site
Pre-
condition
MSL Results To
J-STD-020C
Profile
Solderability
Results To
JESD22-B102E
Lead
Finish
HAST UHAST
&
PCT
Temp.
Cycling
Package Release Status (Qualification Report Number)
16L QSOP UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06174)
16L QSOP HANA Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05076)
16L QSOP MMS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q07078)
16L SOIC (150) ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q09085)
16L SOIC (150) MMT Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08072,Q10103,Q12013,Q12014)
16L SOIC (150) GTK Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q10076)
16L SOIC (150) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08064) Similarity To 20L SOIC(150)
16L SOIC (300) ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q09080)
16L SOIC (300) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08064)
Qualified By Similarity To 20L SOIC(300)
16L SOIC (300) GTK Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q10065),
Qualified by Similarity To 20L SOIC
16L SOIC (300) ASCL Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-ASECL-SCE)
16L TSSOP UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q10001,Q12052 )
16L TSSOP ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q09034)
16L VQFN (3x3x0.9) LPI Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-LPI-QVCE)
16L WQFN (3x3x0.75) LPI Pass Pass MSL3/260C Pass NiPdAu
PPF Pass Pass Pass Released (PQF-LPI-QCF)
18L PDIP ATP Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q08155)
18L PDIP UTL Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q07159)
18L PDIP MTAI Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q09055)
18L PDIP MMT Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q07125)
18L PDIP MMS Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q04029), Qualified By Similarity To 28L PDIP
18L SOIC UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04100)
18L SOIC MTAI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04169,Q07102,Q08081,Q08087,Q10004,R04124)
18L SOIC MMS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04092Q10120),
Qualified By Similarity To 28L SOIC
18L SOIC ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04071),Qualified By Similarity To 28L SOIC
20L PDIP ATP Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q08112)
20L PDIP MMT Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q08089)
Package Qualification Summary Report
DOCUMENT CONTROL #0703461
Microchip Technology Inc.
15
Package Assembly
Site
Pre-
condition
MSL Results To
J-STD-020C
Profile
Solderability
Results To
JESD22-B102E
Lead
Finish
HAST UHAST
&
PCT
Temp.
Cycling
Package Release Status (Qualification Report Number)
20L UQFN 3x3x0.55) LPI Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (CCB1109.01)
20L QFN (4x4x0.9) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05127,Q09058)
20L QFN (4x4x0.9) UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06040,Q08002,)
Qualified by Similarity To 44L QFN 8x8
20L QFN (5x5x0.9) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08160,Q09011)
20L SSOP MTAI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05025,Q06246,Q08083,Q10136)
20L SSOP ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04158), Qualified By Similarity To 28L SSOP
20L SSOP UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05209)
20L TSSOP ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04102,Q07119)
20L TSSOP UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08124)
20L SOIC UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08064,Q09102)
20L SOIC UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q07037)
20L SOIC GTK Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q10065)
20L SOIC ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q07103)
20L SOIC MMT Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06055,Q08026,Q09101)
24L PDIP ATP Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q08123)
24L PDIP MMT Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q02110), Qualified By Similarity To 40L PDIP
24L QFN (4x4x0.9) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08091)
24L SOIC ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04071), Qualified By Similarity To 28L SOIC
24L SOIC MMT Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06050)
24L SSOP ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04158), Qualified By Similarity To 28L SSOP
24L SSOP GTK Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q10072)
24L SSOP UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q09031)
24L WQFN (4x4x0.75) LPI Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-LPI-QDE)
24L TFBGA (6x8x1.2) LPI Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (CCB1157)
28L PDIP UTL Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q07158)
28L PDIP MTAI Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q07164)
28L PLCC ATP Pass Pass MSL1/245C Pass Matte Sn Pass Pass Pass Released (Q08078)
28L PLCC MMT Pass Pass MSL3/245C Pass Matte Sn Pass Pass Pass Released (Q06053)
Package Qualification Summary Report
DOCUMENT CONTROL #0703461
Microchip Technology Inc.
16
Package Assembly
Site
Pre-
condition
MSL Results To
J-STD-020C
Profile
Solderability
Results To
JESD22-B102E
Lead
Finish
HAST UHAST
&
PCT
Temp.
Cycling
Package Release Status (Qualification Report Number)
28L QFN(5x5x0.9) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q12002,Q11107)
28L QFN (6x6x0.9) UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08002,Q09072),
Qualified By Similarity To 44L QFN ( 8x8) CCB#893
28L QFN (6x6x0.9) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q05129,Q08122)
28L QFN (6x6x0.9) ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q10121)
28L QFN (6x6x0.9) ASAC Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q10115)
28L QFN-S (6x6x0.9) UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08002,Q09072),
Qualified By Similarity To 44L QFN 8x8
28L QFN-S (6x6x0.9) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q09060,Q09125)
28L SPDIP MMT Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q07124)
28L SPDIP GTK Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q10098)
28L SPDIP MTAI Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q08130)
28L SPDIP UNIS Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q04037)
28L SOIC MMS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q004092,Q10049)
28L SOIC MMT Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04091)
28L SOIC ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04071)
28L SOIC MTAI Pass Pass MSL1 or 3/260C
Note 3
Pass Matte Sn Pass Pass Pass Released (Q04169,Q06083,Q09111)
28L SSOP MTAI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q07007,Q09008,Q10092,Q11066)
28L SSOP ATP Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q04158,Q08135)
28L UQFN (4x4x0.5) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q09041)
32L PDIP GTK Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (PQF-GEI-PHE)
32L PDIP LPI Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (PQF-LPI-PHE)
32L PLCC GTK Pass Pass MSL3/245C Pass Matte Sn Pass Pass Pass Released (PQF-GEI-NHE)
32L PLCC LPI Pass Pass MSL3/245C Pass Matte Sn Pass Pass Pass Released (PQF-LPI-NHE)
32L TQFP (7x7x1) ATP Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q05106)
32L TSOP (8x14) LPI Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-LPI-WHE)
32L TSOP (8x14) SPIL Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-SPIL-WHE)
34L WFBGA (4x6x0.8) LPI Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (CCB1061.01)
Package Qualification Summary Report
DOCUMENT CONTROL #0703461
Microchip Technology Inc.
17
Package Assembly
Site
Pre-
condition
MSL Results To
J-STD-020C
Profile
Solderability
Results To
JESD22-B102E
Lead
Finish
HAST UHAST
&
PCT
Temp.
Cycling
Package Release Status (Qualification Report Number)
34L WFBGA (4x6x0.8) PTI Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (CCB1088)
36L VTLA (5x5x0.9) ASAC Pass Pass MSL1/260C Pass NiPdAu
PPF Pass Pass Pass Released (Q11131)
40L PDIP CEI Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q08195)
40L PDIP UTL Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q08185)
40L PDIP LPI Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (PQF-LPI-PIE)
40L PDIP GTK Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (PQF-GEI-PIE)
40L PDIP MTAI Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q08149)
40L PDIP MMT Note 1 Note 1 Pass Matte Sn Pass Pass Pass Released (Q02110)
40L QFN (5x5x0.9) UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q09072), Qualified by similarity to 44L QFN 8x8
40L QFN (5x5x0.9) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08159), Qualified by similarity to 44L QFN 8x8
40L QFN (6x6x0.9) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08004)
40L TSOP (10x20) LPI Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-LPI-EIE)
40L UQFN (5x5x0.5) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q10050)
40L WQFN (6x6x0.8) LPI Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-LPI-QIF)
44L MQFP (10x10x2) ATP Pass Pass MSL 3/260C Pass Matte Sn Pass Pass Pass Released (Q08045) Note 2
44L MQFP (10x10x2) MMT Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q08023,Q11060) Note 2
44L PLCC ATP Pass Pass MSL1/245C Pass Matte Sn Pass Pass Pass Released (Q08051)
44L PLCC MMT Pass Pass MSL1/245C Pass Matte Sn Pass Pass Pass Released (Q09099,Q08027,Q11093,Q11094)
44L PLCC MMS Pass Pass MSL1/245C Pass Matte Sn Pass Pass Pass Released (Q05205,Q06240)
44L PLCC GTK Pass Pass MSL3/245C Pass Matte Sn Pass Pass Pass Released (PQF-GEI-NJE)
44L QFN (8x8x0.9) UNIS Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08002,Q09072)
44L QFN (8x8x0.9) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06108,Q08159,Q09033,Q11004)
44L TQFP
(10x10x1)
MTAI Pass Pass MSL1 /260C Pass Matte Sn Pass Pass Pass Released
(Q04057,Q09029,Q10003,Q06058,Q06251,Q08174)
44L TQFP
(10x10x1)
ASAC Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q06045,Q09120,Q09133) Note 2
44L TQFP
(10x10x1)
ATP Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q04087), Qualified By Similarity To 64L TQFP
(10X10) Note 2
Package Qualification Summary Report
DOCUMENT CONTROL #0703461
Microchip Technology Inc.
18
Package Assembly
Site
Pre-
condition
MSL Results To
J-STD-020C
Profile
Solderability
Results To
JESD22-B102E
Lead
Finish
HAST UHAST
&
PCT
Temp.
Cycling
Package Release Status (Qualification Report Number)
44L TQFP
(10x10x1) ATK Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q04137-02), Qualified By Similarity To 80L TQFP
(12X12) Note 2
44L TQFP
(10x10x1)
LPI Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-LPI-TQJE)
44L VLAP (6x6x0.9) ASAC Pass Pass MSL3/260C Pass NiPdAu
PPF Pass Pass Pass Released (Q10045,Q10046,Q11084)
48L TQFP (7x7x1mm) ATK Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q12036)
48L TFBGA (6x8x1.2) PTI Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (PQF-PTI-B3KE)
48L TFBGA (6x8x1.2) LPI Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (CCB1055, REL-100257)
48L TQFP (7x7x1mm) ATK Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q12036)
48L TFBGA (6x8x1.2) APTS Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (PQF-APTS-B3KE)
48L TFBGA (6x8x1.2) ASSH Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (PQF-ASESH-B3KE)
48L TFBGA (6x8x1.2) KTI Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (PQF-KTI-B3KE)
48L TFBGA (6x8x1.2) PTI Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (PQF-PTI-B3KE)
48L TFBGA (6x8x1.2) SPIL Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (PQF-SPIL-B3KE)
48L TSOP (12x20) LPI Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-LPI-EKE)
48L TSOP (12x20) SPIL Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (PQF-SPIL-EKE)
48L UQFN (6x6x0.5) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q09064,Q11004)
48L WFBGA (4x6x0.8) ATK Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (PQF-ATK-MAQE)
48L WFBGA (4x6x0.8) SPIL Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (PQF-SPIL-MAQE)
48L WFBGA (4x6x0.8) ASCL Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (PQF-ASECL-MAQE)
48L WFBGA (5x6x0.8) ATK Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (PQF-ATK-MBQE)
48L WFBGA (5x6x0.8) SPIL Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (PQF-SPIL-MBQE)
48L XFLGA (4x6x0.6) ATK Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (PQF-ATK-C1QE)
48L XFLGA (5x6x0.6) ATK Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (PQF-ATK-C2QE)
48L WFBGA (4x6x0.8) LPI Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (CCB1061.01)
48L WFBGA (5x6x0.8) LPI Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (CCB1061.01, REL-100376)
48L WFBGA (4x6x0.8) PTI Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (CCB1088)
48L WFBGA (5x6x0.8) PTI Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (CCB1088, Rel report #1111160 )
64L QFN (9x9x0.9) UTL Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q08145,Q09106,Q10138,Q11026)
Package Qualification Summary Report
DOCUMENT CONTROL #0703461
Microchip Technology Inc.
19
Package Assembly
Site
Pre-
condition
MSL Results To
J-STD-020C
Profile
Solderability
Results To
JESD22-B102E
Lead
Finish
HAST UHAST
&
PCT
Temp.
Cycling
Package Release Status (Qualification Report Number)
64L TQFP
(10x10x1)
CARS Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q02005)
64L TQFP
(10x10x1)
ASAC (UDG) Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q09118,Q09135,Q06060,Q11092)
64L TQFP
(10x10x1)
ATK Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q08044)
64L TQFP
(10x10x1)
ATP Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q04087)
Note 2
64L TQFP
(10x10x1)
MTAI Pass Pass MSL1/260 Pass Matte Sn Pass Pass Pass Released
(Q04065,Q07101,Q08176,Q09075,Q10005,Q11028)
64L TQFP
(14x14x1)
ATP Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q04159-04), Qualified
By Similarity To 80L TQFP (14X14) Note 2
64L TQFP
(14x14x1)
UTAC Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q06065), Note 2
68L PLCC ATP Pass Pass MSL3/245C Pass Matte Sn Pass Pass Pass Released (Q08049)
Note 2
68L PLCC MMT Pass Pass MSL3/245C Pass Matte Sn Pass Pass Pass Released (Q08021)
Note 2
80L TQFP
(12x12x1)
ATK Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q06096,Q10047)
Note 2
80L TQFP
(12x12x1)
ASAC Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q06217,Q08175,Q10038,Q11049,Q11067)
80L TQFP
(12x12x1)
CARS Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q04112-02)
80L TQFP
(12x12x1)
MTAI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released
(Q06063,Q07083,Q08073,Q09079,Q11052,Q12009)
80L TQFP
(14x14x1)
ATP Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q07099)
80L TQFP
(14x14x1)
ASAC Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q06066,Q06067)
Note 2
84L PLCC ATP Pass Pass MSL3/245C Pass Matte Sn Pass Pass Pass Released (Q08050), Note 2
84L PLCC MMT Pass Pass MSL3/245C Pass Matte Sn Pass Pass Pass Released (Q08029), Note 2
Package Qualification Summary Report
DOCUMENT CONTROL #0703461
Microchip Technology Inc.
20
Package Assembly
Site
Pre-
condition
MSL Results To
J-STD-020C
Profile
Solderability
Results To
JESD22-B102E
Lead
Finish
HAST UHAST
&
PCT
Temp.
Cycling
Package Release Status (Qualification Report Number)
100L TQFP
(12x12x1)
MTAI Pass Pass MSL1/260C Pass Matte Sn Pass Pass Pass Released (Q06224,Q08161,Q26225,Q09079,Q11029)
Note3
100L TQFP
(12x12x1)
ASE Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q06074)
100L TQFP
(14x14x1)
ATP Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q05141,QQ06043,Q11033)
Note 2
100L TQFP
(14x14x1)
ASAC Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q06207,Q08177,Q11089,Q11090)
121L TFBGA
(10x10x1.1)
ATP Pass Pass MSL3/260C NA SnAgCu Pass Pass Pass Released (Q09003,Q09103,Q11038)
124L VTLA
(9x9x0.9)
ASAC Pass Pass MSL1/260C Pass NiPdAu
PPF
Pass Pass Pass Released ( Q11083)
144L TQFP
(16x16x1mm)
ATP Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q11073)
144L TQFP
(20x20x1.4mm)
ATP Pass Pass MSL3/260C Pass Matte Sn Pass Pass Pass Released (Q11079)
Note 1: Not required for through hole packages.
Note 2: Although the package qualification passed MSL1/260°C conditions, MCHP is offering the package as MSL3/260°C due to concerns with normal variability in
BOM and manufacturing affecting MSL performance. This is to inform customers that the MSL level stated in the individual package qualification reports is
different than the one being reported in table 3.4 of this Package Qualification Summary Report.
Note 3: Dependent on the package bill of materials, i.e. leadframe paddle size, mold compound, etc. As part of Microchip’s continuous improvement efforts, the MSL
classification may improve to the desired MSL1 classification. MSL1 units are shipped in low-temp trays therefore these trays should not be used for baking
parts.
Package Qualification Summary Report
DOCUMENT CONTROL #0703461
Microchip Technology Inc.
21
3.5 Please see the attached document for Microchip’s tin whisker reliability test status.
Tin Whisker
Test Package
Plating Site Tin Whisker Test
Lead Frame Type
Package Qualified
By Tin Whisker Test
Lead Frame Type
Precondition
Pre inspection Tin Whisker Measurement Result
Temperature Cycling (cycles)
High
Temperature & Humidity
Ambient
Temperature & Humidity
500 1,000 1,500 1,000 2,000 3,000 4,000 1,000 2,000 3,000 4,000
3L SOT -89 CEI Cu 8/24/40L PDIP
No Pass Pass Pass Pass Pass Pass Pass - Pass Pass Pass Pass
Sn-Pb Reflow Pass Pass Pass Pass Pass Pass Pass - Pass Pass Pass Pass
Pb-Free Reflow Pass Pass Pass Pass Pass Pass Pass - Pass Pass Pass Pass
3L TO-92 GTK C194
8/16/24L SOIC,
24L SSOP,
8/16/32/40L PDIP,
8L SOIJ, 28L SPDIP
No Pass Pass Pass Pass Pass Pass - - Pass Pass Pass Pass
Sn-Pb Reflow Pass Pass Pass Pass Pass Pass - - Pass Pass Pass Pass
Pb-Free Reflow Pass Pass Pass Pass Pass Pass - - Pass Pass Pass Pass
5L DDPAK CARM HCL-12S
3L DDPAK
3/5L TO – 220
No Pass Pass Pass - Pass Pass Pass - Pass Pass Pass Pass
Sn-Pb Reflow Pass Pass Pass - Pass Pass Pass - Pass Pass Pass Pass
Pb-Free Reflow Pass Pass Pass - Pass Pass Pass - Pass Pass Pass Pass
5L SOT 223 HANA C194
3L SOT 223,
3/5L SOT-23, 3LSOT-89
8/14/16/18L PDIP,
14L SOIC, 8L SOIJ,
16L QSOP
No Pass - - - - - - - Pass Pass Pass Pass
Sn-Pb Reflow Pass Pass Pass Pass Pass Pass Pass Pass - - - -
Pb-Free Reflow Pass Pass Pass Pass Pass Pass Pass Pass - - - -
8L EIAJ UTL C194
3/5/6 SOT23
3/5/6 L SC70
8/18/28/40L PDIP ,
28LSPDIP,
8/16/18/20L SOIC ,
8L MSOP, 20L SSOP
No Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass
Sn-Pb Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass
Pb-Free Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass
Package Qualification Summary Report
DOCUMENT CONTROL #0703461
Microchip Technology Inc.
22
Tin Whisker
Test Package
Plating Site Tin Whisker Test
Lead Frame Type
Package Qualified
By Tin Whisker Test
Lead Frame Type
Precondition
Pre inspection Tin Whisker Measurement Result
Temperature Cycling (cycles)
High
Temperature & Humidity
Ambient
Temperature & Humidity
500 1,000 1,500 1,000 2,000 3,000 4,000 1,000 2,000 3,000 4,000
8L SOIC ANAC C194
No Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass
Sn-Pb Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass
Pb-Free Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass
8L SOIC MMS C194
3/5/6L SOT-23,
4L SOT-143,
8L MSOP, 44L PLCC,
8/18 PDIP
16L QSOP
18/28L SOIC
No Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass
Sn-Pb Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass
Pb-Free Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass
8L SOIC VGT C194 8/14L PDIP
No Pass - - - - - - - Pass Pass Pass Pass
Sn-Pb Reflow Pass Pass Pass Pass Pass Pass Pass Pass - - - -
Pb-Free Reflow Pass Pass Pass Pass Pass Pass Pass Pass - - - -
8L TSSOP UTL C7025 8/10L MSOP
14/16/20L TSSOP
No Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass
Sn-Pb Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass
Pb-Free Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass
14L TSSOP ANAP C7025 8/16/20L TSSOP
44L MQFP
No Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass
Sn-Pb Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass
Pb-Free Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass
14L TSSOP UNIS C7025 8L TSSOP, 24L SSOP
No Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass
Sn-Pb Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass
Pb-Free Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass
14L TSSOP VGT C7025 8L TSSOP, 8L SOIC
No Pass - - - - - - - Pass Pass Pass Pass
Sn-Pb Reflow Pass Pass Pass Pass Pass Pass Pass Pass - - - -
Package Qualification Summary Report
DOCUMENT CONTROL #0703461
Microchip Technology Inc.
23
Tin Whisker
Test Package
Plating Site Tin Whisker Test
Lead Frame Type
Package Qualified
By Tin Whisker Test
Lead Frame Type
Precondition
Pre inspection Tin Whisker Measurement Result
Temperature Cycling (cycles)
High
Temperature & Humidity
Ambient
Temperature & Humidity
500 1,000 1,500 1,000 2,000 3,000 4,000 1,000 2,000 3,000 4,000
Pb-Free Reflow Pass Pass Pass Pass Pass Pass Pass Pass - - - -
16L QSOP UNIS C194
3/5/6L SOT 23
5L TSOT ,5L SC70
14L PDIP, 20L SOIC
28L SPDIP, 3L SOT 223
No Pass Pass Pass Pass Pass Pass Pass Pass(S) Pass Pass Pass Pass
Sn-Pb Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass
Pb-Free Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass
28L SOIC MTAI C194
8L MSOP, 28L SPIDP,
8/18/28/40L PDIP
8/14/18L SOIC
8L EIAJ,3/5/6 LSOT23
20/28L SSOP
No Pass Pass Pass Pass - - - - Pass Pass Pass Pass
Sn-Pb Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass
Pb-Free Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass
28L SOIC MMT C194
8/14/16/20 L SOIC
8/14/16/18/20/24/40L
PDIP
28L SPDIP, 44L TQFP
No Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass
Sn-Pb Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass
Pb-Free Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass
28L SSOP ANAP C194
8/14/16/18/20/24L PDIP
8/10L MSOP,
8/14/16/18/20/24/28L
SOIC ,20/24/L SSOP
80L LQFP, 80L TQFP,
16L QSOP, 5/6L TSOT
No Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass
Sn-Pb Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass
Pb-Free Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass
44L TQFP ANAP EFTEC64T 32/64/80/100/144L TQFP ,
128/144L LQFP
No Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass
Sn-Pb Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass
Pb-Free Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass
64L TQFP ASAC EFTEC64T
44/80/100L TQFP
No Pass Pass Pass Pass - - - - Pass Pass Pass Pass
Sn-Pb Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass
Pb-Free Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass
Package Qualification Summary Report
DOCUMENT CONTROL #0703461
Microchip Technology Inc.
24
Tin Whisker
Test Package
Plating Site Tin Whisker Test
Lead Frame Type
Package Qualified
By Tin Whisker Test
Lead Frame Type
Precondition
Pre inspection Tin Whisker Measurement Result
Temperature Cycling (cycles)
High
Temperature & Humidity
Ambient
Temperature & Humidity
500 1,000 1,500 1,000 2,000 3,000 4,000 1,000 2,000 3,000 4,000
64L TQFP MMT C7025
44L TQFP,
44L MQFP,
8/14L TSSOP
No Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass
Sn-Pb Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass
Pb-Free Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass
64L TQFP MTAI C7025 44/80/100L TQFP
No Pass Pass Pass Pass - - - - Pass Pass Pass Pass
Sn-Pb Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass
Pb-Free Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass
80L TQFP ANAK EFTEC64T 44/64L TQFP
No Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass
Sn-Pb Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass
Pb-Free Reflow Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass
100L TQFP
ASAC
EFTEC64T
44/64/80L TQFP
No Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S)
Sn-Pb Reflow Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S)
Pb-Free Reflow Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S)
8L SOP
LPI
C194
32/40L PDIP, 8/16L SOIC,
8L SOIJ, 8L SOIJ-S,
5L SOT0223
No Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S)
Sn-Pb Reflow Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S)
Pb-Free Reflow Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S)
5L SOT- 89 LPI KFCAG 3L SOT 89
No Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S)
Sn-Pb Reflow Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S)
Pb-Free Reflow Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S)
48L TSOP
LPI
C7025
44L TQFP,
32/40L TSOP
No Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S)
Sn-Pb Reflow Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S)
Pb-Free Reflow Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S)
Package Qualification Summary Report
DOCUMENT CONTROL #0703461
Microchip Technology Inc.
25
Tin Whisker
Test Package
Plating Site Tin Whisker Test
Lead Frame Type
Package Qualified
By Tin Whisker Test
Lead Frame Type
Precondition
Pre inspection Tin Whisker Measurement Result
Temperature Cycling (cycles)
High
Temperature & Humidity
Ambient
Temperature & Humidity
500 1,000 1,500 1,000 2,000 3,000 4,000 1,000 2,000 3,000 4,000
3L SOT-23
LPI
EFTEC64T
No Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S)
Sn-Pb Reflow Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S)
Pb-Free Reflow Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S) Pass(S)
NOTE: All tin whisker reliability testing was performed per the requirements in JEDEC specifications JESD22A121 & JESD201A. The tin whisker acceptance criteria
was based on the class 2 requirements in JESD201A, which is 45 um for the temperature cycling test and 40 um for the ambient/high temperature & humidity tests. Pass
(S) is tin whisker reliability test data from Microchip's assembly subcontractor (whisker testing was performed using a different package type). Sn-Pb and Pb-free
reflows have a peak reflow temperature of 215°C and 245°C respectively and both reflow profiles comply to J-STD-020.
Package Qualification Summary Report
DOCUMENT CONTROL #0703461
Microchip Technology Inc.
26
4.0 CONCLUSION
The assembly using Matte Tin plating, PPF or solder spheres complies with the reliability
guidelines documented in the qualification plan. Compliance was based on passing moisture
sensitivity level (JEDEC J-STD-020 compliance for SMD), package reliability, solderability
(JESD22-B102E compliance for SMD and through hole packages), and JEDEC whiskers growth
test results per the JESD22A121 & JESD201A requirements. Therefore, the assembly using
Matte Tin plating or PPF for these packages is released for production using die from all of
Microchip’s process technologies and product fabricated at silicon foundries for the packages and
assembly sites outlined in table 3.4.