P13623: Conductive Heat Transfer Lab Equipment

Detailed Design ReviewMay 2nd, 2013

Project ParticipantsProject Sponsor : RIT KGCOE, Chemical Engineering Dept.

Dr. Karuna S. Koppula Mr. Paul Gregorius

MSD 1 Team Guide: Michael Antoniades

Project Members:• David Olney - (ChemE) Project Manager• Todd Jackson - (ME) Project Engineer• Alysha Helenic - (ChemE) Documentation Engineer• Edward Turfitt - (ChemE) Design/Concept Engineer• Charles Pueschel - (ChemE) Data Acquisition Specialist• Ian Abramson - (ChemE) Customer Liaison

Agenda• Introduction

– Quick recap of objective and customer needs

– Recap of system design review feedback

– Main problems that were addressed • Detailed Design

– Review final design – Talk about the improvements – Talk about overall functionality – Discuss educational value – Review pros and cons

• Controls and electronic schematics – High level overview of functionality – LED visual – Data acquisition

• BOM – Indicate high cost

items – Review material

disposition • Risk Assessment

– High level concerns • Test and Assembly

Plans• Questions

Project OverviewProblem Statement:• Build an apparatus that can demonstrate thermal conductivity

reliably to students for educational purposes.Resources:• The only limitation we have is the set budget for the project. • (space, cart, current lab equipment, donations) excluded from

budget.Expectations:• The purpose of this detailed session is for constructive

criticism, and validation by the customer for some of our final design that we have derived.

Heat Transfer and Thermal Conductivity

• Heat transfer can take place from three methods (Conduction, Convection , Radiation).

• The most valuable method to calculate a constants for one specific mode of heat transfer is to reduce or eliminate the other two modes.

Customer Needs

Engineering Specifications I

Engineering Specifications II

Functional Decomposition

System Design Review Recap

Key Features• Device will contain use a disk heater,

and cold plate to induce a heat gradient.

• Ability to use different length samples with multiple shapes and sizes.

• Ability to use different insulations for educational purposes.

• Usage of a DAQ and labview.• Transparent outer shell to see inside.

System Design Concerns

• Thermocouple mounting• Inserting samples• Functionality (having a visual model of our

design to convey exactly what we are building and how it will function)

Detailed Design

Controls & Electronics Overview

Schematic

Temperature Sensors

• Higher Temperature Thermistorso Operating Temperature Range of -55°C ~ 200°Co Accuracy of ±1%

• Lower Temperature Temperature Sensoro Operating Temperature Range of -40°C ~ 125°Co Accuarcy of ±0.5°C

Other Sensors

• Pressure Sensor (100 lb)o Application of proper pressure to the samples for

good contact.

• Current Sensoro Current rating of 25 A

• Magnetic Door Sensoro Detects if door is left open and signals to close the door

while running experiment to prevent convection losses.

Visualizing Data

• LCD Screeno Backlit LCD screen to display temperature

readings for manual data collection.

• Labviewo Display temperature readings and digital data

collection.

• LEDso Visualise the temperature

difference across the sample.

Improvements1. Educational Value

• Dynamic, can vary:• Size, shape, and material of

sample• Type of insulation• Orientation of instrument• Contact resistant• Cooling fluid

• Visual• LED lights to indicate changing

temperature of the sample• Plexiglass slides to allow for

viewing inside• Data Collection

• Manual through LCD screen or through LabView

• Thermal Conductivity Calculation• Vary heat flux or temperature

2. Ease of Use (Intuition)• Open-fail safety feature• Pressure sensor to prevent over-

tightening• Ability to remove side panel for

easy access• Adjust temperature sensor

placement after sample placement

3. Originality• Dynamic• Liquid boat option

Bill of Materials - Main ID Description Manufacturer Unit price Quantity Subtotal

Cold plateStainless steel ( for use with high purity liquids) Mcmaster-carr $100.8 1 $100.8

Heater

Ultra-Thin Heat Sheet 115 VAC, Square, 3" X 3", 90W @ 10W/SQ Inch McMaster-Carr $45.79 1 $45.79

Heater Cover8"x8"x0.5" Aluminum Alloy 6061 Sheet McMaster-Carr $27.89 1 $27.89

Temp Sensors -25 to +125 °C Digikey $1.16 20 $23.20

Flexiforce Pressure Sensor - 100lbs.

Pressure Sensor for Applying proper amount of force Sparkfun $19.95 1 $19.95

Threaded Rod 0.5"-10 ACME Rod 14" long Mcmaster-carr $16.16 1 $16.00

Insulation

Johns Manville 384-in L x 15-in W x 3-1/2-in D 13R Fiberglass Insulation Roll Lowe's $9.98 1 $9.98

THERMISTOR NTC 100K OHM +-0.50 C -55 - 300 °C Digikey $1.83 4 $7.32Heatsink Pad Copper Shim Heatsink Pad Copper Shim Ebay $6.98 1 $6.98

Heater Insulation Silicon Carbonate Edward Turfitt $0.00 1 0

Bill of Materials - ElectronicsID Manufacturer Unit price Quantity Subtotal

Adjustable temperature switch McMaster-Carr $146.91 1 $146.91Arduino Mega 2560 R3 Sparkfun $58.94 1 $58.94

RGB LED Chain 20 Led Sparkfun $34.95 1 $34.95

Graphic LCD 128x64 STN LED Backlight Sparkfun $19.95 1 $19.95

BOX ABS 6.13X8.70X3.94" GRY Digikey $18.5 1 $18.5

Compact ABS Electronics Enclosure McMaster-Carr $15.17 1 $15.17

Magnetic Sensor Digikey $8.21 1 $8.21

BREADBOARD 2.13X3.3 SLDLESS Digikey $7.18 1 $7.18

Solder Digikey $4.65 1 $4.65

TRIMMER 10K OHM 3/8" CERMET TH Digikey $1.47 2 $2.94Hook-up Wire - Black Sparkfun $2.5 1 $2.50Hook-up Wire - Red Sparkfun $2.5 1 $2.50Hook-up Wire - yellow Sparkfun $2.5 1 $2.50

TRANSF 55MH CRNT SENSE Digikey $2.31 1 $2.31Labels Digikey $0.11 1 $0.11

Bill of Materials - StructuralID Description Manufacturer Unit price Quantity Subtotal

Frame T rail Connectors McMaster-Carr $3.39 24 $81.36

Frame Slotted T rail McMaster-Carr $55.49

Al sheet case ends McMaster-Carr $43.1 1 $43.10Connecters Extra parts $40.00

Bolts 0.25"x20 Lowe's $20.00

Rodplastic rod 1/2in diameter Mcmaster-carr $3.92 2.5 $9.80

Nylon 6/6 Female Threaded Round Standoffs

Threaded Casing (7/32 with 4-40 screw size) McMaster-Carr $1.09 6 $6.54

RailHolder for thermocouples Mcmaster-carr $0.71 4 $2.84

Box Material Plexiglass David Olney/Edward Turfitt 0 1 0

Coupling nuts 0 2 0

Plexi glass donated 0 1 0

Temperature In Sample versus Length

• Assumptions: Steady State, No conduction or convection from the air on the sample.

q = Q/A =-k(dT/dx)Given Targets: Q = 500 W, Target ΔT = 120 K

Chosen Parameters: T0 = 273 K, D = ¾”, L = ½’

0 50 100 150 200 250 300 350 400 450 5000

500

1000

1500

2000

2500

3000

3500

4000

Q W/(m.K)

Tem

pera

ture

(K)

AluminumCopperIron

Bill of Materials - SampleID Description Manufacturer Unit price Quantity Subtotal

Test SampleCopper rod alloy 110 unpolished miss finish 1" dia 1ft long Mcmaster-carr $50.54 1 $50.54

Test SampleAluminum 6061 (1" dia 3 ft) k = 167 W/mk unpolished mill finishe Mcmaster-carr $19.34 1 $19.34

Test Sample Copper rod alloy 110 unpolished miss finish 1/2" dia 1ft long Mcmaster-carr $14.80 1 $14.80

Bill of Materials – TotalElectronic sum $788.21Structural sum $15.70Main sum $107.12Sample sum $18.17Subtotal $929.20Tax & Shipping 28%Estimated total $1189.38

High Cost ItemsCold Plate - $100.80

Heater - $45.79

DAQ - $58.94

Temperature Controller- $146.91

Assembly Overview• Week 10 begin ordering parts• Parts should arrive over the break and will be stored until the fall

semester.• Build all mechanical parts first then begin assembly of the mechanical

press by building the frame first, drilling and threading all holes and parts assembling the top last

• Enclose the structure with plexi-glass.• Once assembled confirm that the device will be operational and will

function as desired.• Start assembling electronic components and assembling them to the

frame etc.• Begin testing of the device and ensure everything is running optimally.• Begin improvement phase for device performance.

Test Plans: Cold Plate

Test Plans: Heater

Test Plans: Container

Test Plans: Sensors and Operation

Test Plans: Electrical and Controls

Risk Assessment

Project Schedule for QuarterGoal Week Completed

Revise System Design based on Review feedback

Week 6

Create assembly plans Week 7/8

Create test plans Week 7/8

Write BOM Week 9

Hold Detailed Design Review Week 9

Order Material Week 10

Project Organization Define Customer

Needs and Specs Develop Concepts Create System

Level Design Create Detailed Design

Update Project Plan with parts

obtained Design Verification Write Technical

Paper Create PosterFinal

Presentation

•Hold System Design Review

•Revise design based on Review

•Create test and assembly plans

•Write BOM

•Order Materials

•Hold Detailed Design Review

•Execute test plans

•Build system

•Verify design through testing

MSD I and MSD II Goalsand Deliverables

Week 1 - 2Week 2-10

Week 10-13Week 12-14

Week 14

Questions?