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  • Novel Materials and Activities for Next Generation Package

    Hitachi Chemical., Hitachi Chemical., Hitachi Chemical., Hitachi Chemical., Co.LtdCo.LtdCo.LtdCo.Ltd....

    Packaging Solution CenterPackaging Solution CenterPackaging Solution CenterPackaging Solution Center

    Hiroaki MiyajimaHiroaki MiyajimaHiroaki MiyajimaHiroaki Miyajima

  • 1. Activities of Packaging Solution Center

    2. Novel Materials for Next Gen. PKGRDL (Redistribute dielectric material)EMC related materials Temporary bonding sheetUltra-Low CTE substrate & Solder resist

  • Epoxy MoldingCompounds

    Die Bonding Film

    Liquid Encapusulant

    Die Bonding Paste

    Package Substrate

    Solder Resist

    Photo SensitiveDry Film

    High Density Interposer

    Printed wiring boards

    CMP Slurryfor STI

    Interlayer DielectricMaterials

    CMP Slurryfor Cu/Barrier Metal

    Materials forBuffer Coating

    Build-up Materials

    Dicing Tape

    HC Production Lineup

    Underfill Material

    QFN Support tape

  • Material development division Tsukuba Research Laboratory

    R&D Structure for Technology Integration

    CMP slurry

    Epoxy mold compound

    Underfill materials

    Die bonding materials

    Buffer coating materials

    Redistributed materials

    Substrate

    Solder resist

    Dry film

    Next generation materials

    Open innovation

    3 years Products 310 years Products

    Assembly & PKG evaluation

    New evaluation methods

    Simulation technology

    Packaging Solution CenterR&D Center (Selangor)

    PKG assembly / Process evaluation / Simulation

  • Activities of Packaging Solution CenterCustomers

    Packaging Materials

    Customer demands Propose the total solution

    MaterialProperties

    ReliabilityEvaluation

    Hitachi ChemicalPackaging Solution

    Center Package

    AssemblyStructureAnalysis

    Hitachi Chemical

    / Stress Simulation/ Warpage FEM : Finite Element Method

    / Adhesion/ Elastic modulus/ CTE etc.

    Current Improvement

    Initial After MSL2 Initial After MSL2

    / Reflow resistance/ TCT resistance/ Warpage etc.

    / Wafer dicing/ D/B , TCB bonding/ Mold (Transfer / Compression)

  • a) FC-BGA ( Chip size : ~ 23mm )b) FC-CSP ( Bare Die, Std. Laser via )c) Stacked-CSP

    a) FC-CSP ( Exposed-Die w/laser via )b) FO-WLP ( 12inch, Panel )c) 2.5D,3D-PKG ( Silicon interposer w/TSV)

    Die

    SubstrateCUF Silicon interposer

    Molding compound

    Die attach film

    Core material

    Solder resist

    Build-up material

    Capillary underfill

    RDL

    High thermally conductive

    Pre-applied underfill

    Fine patterning material

    Ultra low CTE core

    Temporary bonding film

    New Materials for Next Generation

    NextGenerationAvailable

  • Concept Reduce the evaluation time for customer test PKG (Device/PCB etc.) High accuracy analysis with advanced equipment Propose the solution with combination of HC materials Evaluate of new materials for next generation customer PKG Suggest new solution with Equipment maker & consortium

    Device, EquipmentNew process/Evaluation

    ConsortiumAdvanced device/PKG

    Packaging Solution Center Customer

    Fabless/OSAT/Foundry/PCB

    Promote of new materials evaluation/qualificationEvaluate next generation PKG with customer

    / Materials combination/ Assembly test/ Reliability test

    / Simulation

    Tsukuba labo.

    OpenLab.

    Concept of Open Laboratory

  • Conventional Process New Process (Open Lab.)

    Material Presentation

    Submission of Sample

    CustomersEvaluation

    Customers approval

    (Interaction)

    OurSample

    Offered customers

    Device

    Assemble test in Open Lab.

    Fix the process condition & Propose the new materials

    combination / process with customer

    Customers approval

    Supports a materials & process in cooperation with customers

    Activity of Open Laboratory

  • 1. Activities of Packaging Solution Center

    2. Novel Materials for Next Gen. PKGRDL (Redistribute dielectric material)EMC related materials Temporary bonding sheetUltra-Low CTE substrate & Solder resist

  • WLP Related Materials

    FO-WLP

    Material for Fine Pattering/ Dry film, Solder resist

    Temporary bonding film

    Redistribution material(Liquid / Film)

    Ultra-low CTE / High Modulus Substrate(Ex. Substitution of silicon interposer)

    Solid / Liquid EMC

    Wafer Level PKG

    PI, PBO, AH seriesBuffer Coat E-679/700 series

    SubstrateCEL-C series2nd Under Fill

    SR/FZ seriesSolder Resist

    Release sheet

    WLP

    FO-WLP

    WLP

    Back side protection

  • Cure

    d F

    ilm P

    ropert

    ies

    Cure Temperature

    Poly(acrylate)

    AH-3000AH-3000Semiconductor...

    Display, PWB...

    Polyimide & PBO

    Low Temperature Curable Photosensitive Dielectric ; AH series

    Cross Section (5m Mask)

    Features

    Positive-Tone Photo Definable

    Alkaline (2.38% TMAH) Developable

    Low Temperature Curable (180250oC)

    Low Residual Stress

    Low Cure Shrinkage

    High Resolution

  • Structure of Trevia DF series

    Feature

    Process flow

    Base Film

    Photosensitve layer

    Cover Film

    1. Lamination(100 oC) 2. UV exposure

    Photomask

    UV3. PEB (75 oC/8 min)

    4. Development 5. Curing (180 oC/1 h)

    -High resolution: Via < 10 m -Developable by 2.38 % TMAH or 1.0%KOH aqueous-Excellent heat-resistant properties -Suitable for trench and photovia process-Available for Semi-additive process

    DIF

    SubstrateWafer

    -Trench/Via Formation Film ; Trevia(Under development)

    10 m(Spray)

    DIF-03

    Substrate

    L/S = 4/4 m

    Cu

  • Low warpage WLP resin for Printing typeCEL-C-7700, C-7732

    Low warpage WLP resin for Compression typeCEL-C-1980 series

    Liquid Encapsulant for WLP

    SEM image (X1000)

    High filler loading(86~88wt%) by close packing.

    Average silica size is approx. 5um

    Low thermal expansion coefficient Low modulus Shrinkage reduction

  • Low warpage

    Low die shift

    Low stand-off

    High Tg

    Low Mold shrinkage

    Low CTE

    Low modulus

    High activity at low temp.

    14Approach from Solid EMC

    Tg : 160oC

    Mold shrinkage : -0.05

    CTE 1 : 7ppm/K

    E : 2-3GPa

    Molding time120oC: 350s125oC: 300s130oC: 250s150oC: 100s

    Low temp. cure

  • Features of TM-X series

    Concepts & Features of TM-X series

    Film type (1 Layer Type & 2 Layer Type)- Easy handling- Good thickness uniformity- Thickness is controlled at HC (not at customer)

    Mechanical debonding at room temperature- Equipment cost is lower.- Both Si wafer and glass wafer can be used.

    2 Layers film: thermosetting film (hard) + thermoplastic film (soft) - Compatibility of good BG with de-bonding performance

    Chip/Device wafer

    Carrier wafer

    Temporary bonding film

    Layer 2

    Layer 1Layer Temporary bonding film

  • TSV Related Materials

    Pre-applied under Fill3D PKG

    2.5D PKG Good gap filling

    Good connection Short cure bonding

    Temporary bonding film Easy debonding Heat resistance

    Low warpage High insulation

    Low CTE Substrate ; MCL seriesHigh Tg Solder resist ; SR/FZ series

    Fine patterning

    Good molding

    CMP ; HS series High removal rate Good planarity

    High resolution Trench/Photo-via

    Capillary flow underfill

    High thermal Good adhesionThermally conductive film

    Materials for Fine Pattering

    High resolution

    Dry film resist for Cu pillar

    Redistribution material

    Solid / Liquid EMCEmbedded sheet

  • New low CTE Core Materials

    Lo

    w

    CT

    E

    Hig

    h

    Low Elastic Modulus High

    E-700G(R)

    New super low CTE resin system

    S-glass

    Positioning of materials for PKG application

    E-705GHD S-glass

    HD S-glass

    S-glass

    E-770GHD S-glassS-glass

    E-777G

    New material (E777G) have super low CTE New material (E777G) have super low CTE

  • Product Current Status PlannedHVM Year

    Concept

    FZ-2700GFinal stage of sample work with

    several customers 2013 High TCT & HAST Durability

    SR-F Final stage 2013 Film Ver. of SR7300G

    SR-FA R&D Sample Working 2014 Film Ver. of SR7400G

    Film Type

    Liquid Type

    Product Current Status PlannedHVM Year

    Concept

    SR7200G Current main product - Halogen Free

    SR7210G HVM - HAST Durability, Fewer Air Voids

    SR7300G HVM - High TCT & HAST Durability

    SR7400GSample working with several

    customers 2014 Ultra Low CTE

    SR-M Sample working 2013Better Usability for Wider

    Applications

    Hitachi Solder Resist Line-up

  • CuO

    Cu

    Oxidation

    Precious metal

    Dissolution of CuOMicroscopic indentation is formed

    Dry treatment

    Activation

    Thin CuO film is formed

    High resolution Photosensitive Film RY/RD series

    Ultra fine pitch primer AirFoil, Cobraflat surface

    Ultra Low CTE LaminateE-700G series

    Free volume = 0.214 cm3/ cm3MCL-E-770G;CTE=1.8ppm

    MCL-E-705G;CTE=2.8ppm

    L/S=3/3m Ultra fine line

    Rz=0.04-0.06um

    X : functional group of interaction with Cu

    XX XX X

    [High adhesive energy material](Chemical bonding)

    Primer

    Prepreg

    Core

    Thinner seed copperNewly Copper treatment NFTNano copper treat

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