Novel Materials and Activities for Next Generation Package
Hitachi Chemical., Hitachi Chemical., Hitachi Chemical., Hitachi Chemical., Co.LtdCo.LtdCo.LtdCo.Ltd....
Packaging Solution CenterPackaging Solution CenterPackaging Solution CenterPackaging Solution Center
Hiroaki MiyajimaHiroaki MiyajimaHiroaki MiyajimaHiroaki Miyajima
1. Activities of Packaging Solution Center
2. Novel Materials for Next Gen. PKGRDL (Redistribute dielectric material)EMC related materials Temporary bonding sheetUltra-Low CTE substrate & Solder resist
Epoxy MoldingCompounds
Die Bonding Film
Liquid Encapusulant
Die Bonding Paste
Package Substrate
Solder Resist
Photo SensitiveDry Film
High Density Interposer
Printed wiring boards
CMP Slurryfor STI
Interlayer DielectricMaterials
CMP Slurryfor Cu/Barrier Metal
Materials forBuffer Coating
Build-up Materials
Dicing Tape
HC Production Lineup
Underfill Material
QFN Support tape
Material development division Tsukuba Research Laboratory
R&D Structure for Technology Integration
CMP slurry
Epoxy mold compound
Underfill materials
Die bonding materials
Buffer coating materials
Redistributed materials
Substrate
Solder resist
Dry film
Next generation materials
Open innovation
3 years Products 310 years Products
Assembly & PKG evaluation
New evaluation methods
Simulation technology
Packaging Solution CenterR&D Center (Selangor)
PKG assembly / Process evaluation / Simulation
Activities of Packaging Solution CenterCustomers
Packaging Materials
Customer demands Propose the total solution
MaterialProperties
ReliabilityEvaluation
Hitachi ChemicalPackaging Solution
Center Package
AssemblyStructureAnalysis
Hitachi Chemical
/ Stress Simulation/ Warpage FEM : Finite Element Method
/ Adhesion/ Elastic modulus/ CTE etc.
Current Improvement
Initial After MSL2 Initial After MSL2
/ Reflow resistance/ TCT resistance/ Warpage etc.
/ Wafer dicing/ D/B , TCB bonding/ Mold (Transfer / Compression)
a) FC-BGA ( Chip size : ~ 23mm )b) FC-CSP ( Bare Die, Std. Laser via )c) Stacked-CSP
a) FC-CSP ( Exposed-Die w/laser via )b) FO-WLP ( 12inch, Panel )c) 2.5D,3D-PKG ( Silicon interposer w/TSV)
Die
SubstrateCUF Silicon interposer
Molding compound
Die attach film
Core material
Solder resist
Build-up material
Capillary underfill
RDL
High thermally conductive
Pre-applied underfill
Fine patterning material
Ultra low CTE core
Temporary bonding film
New Materials for Next Generation
NextGenerationAvailable
Concept Reduce the evaluation time for customer test PKG (Device/PCB etc.) High accuracy analysis with advanced equipment Propose the solution with combination of HC materials Evaluate of new materials for next generation customer PKG Suggest new solution with Equipment maker & consortium
Device, EquipmentNew process/Evaluation
ConsortiumAdvanced device/PKG
Packaging Solution Center Customer
Fabless/OSAT/Foundry/PCB
Promote of new materials evaluation/qualificationEvaluate next generation PKG with customer
/ Materials combination/ Assembly test/ Reliability test
/ Simulation
Tsukuba labo.
OpenLab.
Concept of Open Laboratory
Conventional Process New Process (Open Lab.)
Material Presentation
Submission of Sample
CustomersEvaluation
Customers approval
(Interaction)
OurSample
Offered customers
Device
Assemble test in Open Lab.
Fix the process condition & Propose the new materials
combination / process with customer
Customers approval
Supports a materials & process in cooperation with customers
Activity of Open Laboratory
1. Activities of Packaging Solution Center
2. Novel Materials for Next Gen. PKGRDL (Redistribute dielectric material)EMC related materials Temporary bonding sheetUltra-Low CTE substrate & Solder resist
WLP Related Materials
FO-WLP
Material for Fine Pattering/ Dry film, Solder resist
Temporary bonding film
Redistribution material(Liquid / Film)
Ultra-low CTE / High Modulus Substrate(Ex. Substitution of silicon interposer)
Solid / Liquid EMC
Wafer Level PKG
PI, PBO, AH seriesBuffer Coat E-679/700 series
SubstrateCEL-C series2nd Under Fill
SR/FZ seriesSolder Resist
Release sheet
WLP
FO-WLP
WLP
Back side protection
Cure
d F
ilm P
ropert
ies
Cure Temperature
Poly(acrylate)
AH-3000AH-3000Semiconductor...
Display, PWB...
Polyimide & PBO
Low Temperature Curable Photosensitive Dielectric ; AH series
Cross Section (5m Mask)
Features
Positive-Tone Photo Definable
Alkaline (2.38% TMAH) Developable
Low Temperature Curable (180250oC)
Low Residual Stress
Low Cure Shrinkage
High Resolution
Structure of Trevia DF series
Feature
Process flow
Base Film
Photosensitve layer
Cover Film
1. Lamination(100 oC) 2. UV exposure
Photomask
UV3. PEB (75 oC/8 min)
4. Development 5. Curing (180 oC/1 h)
-High resolution: Via < 10 m -Developable by 2.38 % TMAH or 1.0%KOH aqueous-Excellent heat-resistant properties -Suitable for trench and photovia process-Available for Semi-additive process
DIF
SubstrateWafer
-Trench/Via Formation Film ; Trevia(Under development)
10 m(Spray)
DIF-03
Substrate
L/S = 4/4 m
Cu
Low warpage WLP resin for Printing typeCEL-C-7700, C-7732
Low warpage WLP resin for Compression typeCEL-C-1980 series
Liquid Encapsulant for WLP
SEM image (X1000)
High filler loading(86~88wt%) by close packing.
Average silica size is approx. 5um
Low thermal expansion coefficient Low modulus Shrinkage reduction
Low warpage
Low die shift
Low stand-off
High Tg
Low Mold shrinkage
Low CTE
Low modulus
High activity at low temp.
14Approach from Solid EMC
Tg : 160oC
Mold shrinkage : -0.05
CTE 1 : 7ppm/K
E : 2-3GPa
Molding time120oC: 350s125oC: 300s130oC: 250s150oC: 100s
Low temp. cure
Features of TM-X series
Concepts & Features of TM-X series
Film type (1 Layer Type & 2 Layer Type)- Easy handling- Good thickness uniformity- Thickness is controlled at HC (not at customer)
Mechanical debonding at room temperature- Equipment cost is lower.- Both Si wafer and glass wafer can be used.
2 Layers film: thermosetting film (hard) + thermoplastic film (soft) - Compatibility of good BG with de-bonding performance
Chip/Device wafer
Carrier wafer
Temporary bonding film
Layer 2
Layer 1Layer Temporary bonding film
TSV Related Materials
Pre-applied under Fill3D PKG
2.5D PKG Good gap filling
Good connection Short cure bonding
Temporary bonding film Easy debonding Heat resistance
Low warpage High insulation
Low CTE Substrate ; MCL seriesHigh Tg Solder resist ; SR/FZ series
Fine patterning
Good molding
CMP ; HS series High removal rate Good planarity
High resolution Trench/Photo-via
Capillary flow underfill
High thermal Good adhesionThermally conductive film
Materials for Fine Pattering
High resolution
Dry film resist for Cu pillar
Redistribution material
Solid / Liquid EMCEmbedded sheet
New low CTE Core Materials
Lo
w
CT
E
Hig
h
Low Elastic Modulus High
E-700G(R)
New super low CTE resin system
S-glass
Positioning of materials for PKG application
E-705GHD S-glass
HD S-glass
S-glass
E-770GHD S-glassS-glass
E-777G
New material (E777G) have super low CTE New material (E777G) have super low CTE
Product Current Status PlannedHVM Year
Concept
FZ-2700GFinal stage of sample work with
several customers 2013 High TCT & HAST Durability
SR-F Final stage 2013 Film Ver. of SR7300G
SR-FA R&D Sample Working 2014 Film Ver. of SR7400G
Film Type
Liquid Type
Product Current Status PlannedHVM Year
Concept
SR7200G Current main product - Halogen Free
SR7210G HVM - HAST Durability, Fewer Air Voids
SR7300G HVM - High TCT & HAST Durability
SR7400GSample working with several
customers 2014 Ultra Low CTE
SR-M Sample working 2013Better Usability for Wider
Applications
Hitachi Solder Resist Line-up
CuO
Cu
Oxidation
Precious metal
Dissolution of CuOMicroscopic indentation is formed
Dry treatment
Activation
Thin CuO film is formed
High resolution Photosensitive Film RY/RD series
Ultra fine pitch primer AirFoil, Cobraflat surface
Ultra Low CTE LaminateE-700G series
Free volume = 0.214 cm3/ cm3MCL-E-770G;CTE=1.8ppm
MCL-E-705G;CTE=2.8ppm
L/S=3/3m Ultra fine line
Rz=0.04-0.06um
X : functional group of interaction with Cu
XX XX X
[High adhesive energy material](Chemical bonding)
Primer
Prepreg
Core
Thinner seed copperNewly Copper treatment NFTNano copper treat
