nishizawa research center, tohoku · pdf filehands-on-access fabrication facility at nishizawa...
TRANSCRIPT
Hands-on-access fabrication facility at Nishizawa Research Center, Tohoku University
Kentaro TOTSUMicro System Integration Center,Tohoku University, Sendai, Japan
August, 2013
Examples of commercialized MEMS products under cooperation with Tohoku University
2
Nikei-Sangyo newspaper (2003/12/12) Catheter pH, PCO2 monitor Portable pH sensor Resonating gyroscope (Yaw rate Highest evaluation by industry (Kurare) (Shindengen) Sensor & accelerometer) (Toyota)
Electrostatically levitated rotational gyroscope and multi- Integrated capacitive pressure Diaphragm vacuum gageaxis micro inertial measurement system (Tokyo Keiki) sensor (JTECT) (Canon anelva)
Silicon microphone MEMS switch for LSI tester 2-axes optical scanner LTCC with electrical feedthrough(NHK, Panasonic) (Advantest) (Nippon signal) for MEMS packaging (Nikko)
Requirement for MEMS R&D
- Development of design, process and evaluationin individual cases > No standard !
- Expensive facility (clean room) and equipment
- Trained engineer
- Much know-how
- Human network
Much time and cost
>> Open-access facility reduces the barrier to prototype and production.
3
Barrier
Facility
Human resource
Know-howidea
prototype
Hands-on access fab., an open access facility at Tohoku Univ. 試作コインランドリ
The “Hands-on access fab.” is an open access facility that companies can easily access and utilize for their prototyping or small volume production. The fab. is shared with other users and managed with best efforts.
The fab. will not make contract development like MEMS foundry.Companies which have not own facility can dispatch their people to operate equipments by themselves.
The fab. is equipped with 4 and 6 inch facilities for semiconductor and MEMS.Companies pay fee depending on usage. The users can make investment small, because they are able to achieve prototyping of a device at appropriate cost. As a result, the users can reduce the risk in development, and can bridge R&D stage to manufacture stage more smoothly.
Companies can access accumulated know-howat Tohoku University.
Skilled engineer staffs coach the user.
4
5
Aobayama campus, Tohoku Univ.
Hands-on-access fab. Nishizawa Center (4 and 6 inch MEMS and semiconductor)
Micro-nano Center(20mm, 2inch for MEMS and LSI)
Tohoku University
MEMS lab. (20mm for MEMS) MNOIC, AIST
(8 and 12 inch for MEMS)
Jun-ichi Nishizawa Memorial Research Center
6
1F
2F
3F
1,800m2
1,800m2
1,600m2
Clean roomClass 100~10,000
Experimental room
Super clean roomClass 1~1,000
Utility space
Total space of experimental room : 5,000m2
1F
2F
700m2
700m2
Storage
Clean roomClass 10,000
Office,meeting room
1F
2F
3F
(Former Semiconductor Research Institute)
Sendai MEMSshowroom
Historical Museum of Technology
Layout of the Hands-on access fab. (2nd floor of the Research Center)
7
紹介Video1(2F_CR_R)
6:59
8
Cleaning, drying
Draft chamber Draft chamber Brush scrubber Spin dryer
HF/HNO3/H2SO4/HCl etc. Organic solvent, resist removing
Zenkyopost polishing
SEMITOOL PSC101
CO2 critical point dryer Inert oven Vacuum oven Spin dryer
SCFluids CPD1100 Yamato DN63H Yamato DP-31 Toho Kasei
Photolithography
Pattern generator Spin coater Spin coater Coater/developerNSK TZ-310
For emulsion / Cr mask making, up to 7inch
Mikasa 1H-DXII etc. Actes ASC-4000 Canon CDS-630For positive resist
Coater/developer Hot plate Clean oven Curing furnaceScreen
For negative resistYamato DE62 Yamato DN43H
For polyimide
9
Stepper Double-side aligner x2 Single-side aligner EB lithography
Canon FPA1550M4Wg-line, 0.65µm、4inch
Suss MicrotechMA6/BA6
Canon PLA-501-FA Reith 5030nm, up to 3inch
Draft chamber UV curing Spray developer EB lithography
For development Ushio UMA-802 Actes ADE-3000S-8 inch, vacuum/mechanical
chuck
Elionix ELS-G125SMax130keV, 4nm, up to 6”
Photolithography
10
Oxidation, diffusion, ion implantation, annealing
Oxidation/diffusion furnace
Middle-current ion implanter
High-current ion implanter Annealing
TEL XL-7 Nissin ion NH-20SRMax. 180keV, 0.6mA
Sumitomo eaton nova NV-10Max. 80keV, 6mA
AG Associates AG41001000OC
11
Deposition (CVD, sputtering, evaporation, etc)
LP-CVD Thermal CVD PE-CVD PE-CVD
KokusaiSiN, Poly-Si, NSG
KokusaiEpi-Poly Si, 1200OC
JPEL VDS-5600SiN, SiO2
Sumitomo MPX-CVDSiN, SiO2
W-CVD Sputtering Sputtering EB evaporation
Applied materialsPrecision 5000
Anelva SPF-7305inch target x 3
Shibaura CFS-4ESII x 23inch target x 3
Anelva EVC-1501
12
Thermal CVD for Epi Poly-Si
13
Power supply: 150kHz, 100kW
4” x 8 or 6” x 4Rotatable SiC susceptor Max. temp. :1100OC
Source gas: SiH2Cl2Doping gas: PH3(5%)Carrier gas: H2Cleaning gas: HCl
Epi Poly-Si deposition
14
Si
SiO2 1µm
Poly-Si 100nm
Epi Poly-Si
Deposition rate :45 μm / 60min = 0.75µm / minStress : 40MPa, compressiveResistivity : 0.002 Ω・cm
1000oCSiH2Cl2: 200 sccmPH3(5%): 10 sccmH2 : 15 SLM
Thermal oxidation
Poly-Si CVD, 800oC
Epipoly-Si CVD
SiSiO2
Random SmallPoly-SiGrains800 OC
Columnar Epi Poly-Si1000 OC
Deposition (CVD, sputtering, evaporation, etc)
Automatic sol-gel deposition Electroplating MOCVD
Technofine PZ-604 YamamotoCu, Ni, Sn, Au
Wacom Doctor-TPZT, up to 8inch
15
PZT deposition
16
Technofine, PZ-604
Wafer station
Dispenser and spin-coater Furnaces for drying and pyrolysis Annealing furnace
Etching
Si Deep-RIE Dry etcher Dry etcher Al RIE
Sumitomo MUC-21 Anelva DEA-506 For SiN, SiO2 etching
Anelva L-507DLFor Si etching
Shibaura HIRRIE-100
ECR etcher Asher Asher RIE
Anelva ECR60013 inch GaAs
ULVAC UNA20002.45GHz, 1kW
Branson IPC400013.56MHz, 600W
Ulvac RIH-1515ZCl2、BCl3、SF6、CF4、CHF3、Ar、O2、N2
17
Measurement
Wafer dust counter Film thickness measurement Surface profiler Surface profiler
Topcon WM-3 NanometricNanoSpec 3000
Dektak 8 Tenchor AlphaStep 500
Depth measurement 4-terminal probe Spreading resistance measurement Wafer prober
Union Hisomet Solid State Measurements SSM150
Accretech EM-20A
18
Measurement
Digital microscope with automatic XY stage SEM X-ray micro CT Ellipsometry
Keyence and Kunoh Hitachi S3700NMax. 12 inch, EDX
Comscan technoScanXmate D160TS110
ULVAC
Ultrasonic microscope IR microscope Ellipsometry
Insight IS350 Olympus, Hamamatsu Photonic Lattice SE-101
19
Bonding, packaging, etc.
Polisher Polisher Wafer bonder Dicer
BN technologyBni62
BN technologyBni52
Suss MicrotechSB6e
Disco DAD522, DAD2H/6T
Wire bonder Reflow furnace Laser marker Sand bluster
West BondAl, Au
Shinko FB-260H/TE GSI WM-II Shinto
20
21
How to use Hands-on access fab.
1. Consultation2. Send application to the Univ.3. Use facility at Hands-on access fab.4. Receive bill from the Univ.5. Payment
FeesFacility (CR, office, etc.) usage fee : JPY 570 /hTechnical assistant fee : JPY 5,565 /hEquipment usage fee : max. JPY 15,000 /hMaterials cost
If a company uses the Hands-on-access fab for a week, the average payment will be JPY100,000. At the end of each month, the university calculates the fee for one-month usage of each company. Then in the middle of next month, the university sends a bill to each company.
0
100
200
300
400
500
600
Use
rs/ m
onth
2010 2011 2012 20134 5 6 7 8 9 10 11 12 1 2 3 4 5 6 7 8 9 10 11 12 1 2 3 4 5 6 7 8 9 10 11 12 1 2 3 4 5 6
22
Users
Company user
Tohoku Univ. user
Recovery from earthquakedisaster
Company users list (~110 companies)
23
MiyagiKuramotoFurukawa NDKSmart SolarMGRIKEN
Mems CoreAdvantestICRTechnofineRicohAbelieve
Nakatani SangyoPacal Technologies JapanMitsumaruPhotonic LatticeDexerialsTohoku Univ.
IbaraikiRicho Printing SystemsEUVL
FukushimaEMC SemiconductorMunekataAGC Electronics
Nihon Univ.Maruwa Quartz
HokkaidoKyosemiFine Crystal
AkitaAkita Epson
YamagataChinoMitsumiYamagata Univ.Yamagata Research Institute Of Technology
Tsuruoka NTC
ChibaFurukawa Electric
TDKYoutec
TokyoTakionInfinity Storage MediaBN TechnologyYuka IndustriesMD Innovations
Namiki Precision JewelUniv. of TokyoBEANS LaboratoryRionASET
Yokogawa ElectricNanox JapanOji Holdings
KanagawaNTT-ATTokyo Polytechnic Univ.
JVC KenwoodSuss Micro TechM.T.CNLT Technologies
Kyodo InternationalNICTToshiba
ShizuokaHamamatsu PhotonicsAZ Electronic MaterialsShizuoka Univ.
AichiNGK
NiigataInstitute of Niigata Pref.
GunmaTaiyo YudenShin-Etsu
FukuokaKyusyu Univ.
HyogoSumitomo Precision ProductsYamamoto Electric Works
OsakaSumitomo Electric IndustryPanasonic
ShigaRitsumeikanUniv.Toray Research Center
KyotoTecdia Toyama
Hokuriku Electric Industry
IwateLightomFTC Corporation
Iwate Univ.Ricoh Optical
TochigiKeihin
KagawaAoi Electronics
SaitamaNippon Signal
Wacom
KoreaSamsung
SingaporeInstitute of Microelectronics (IME)
Overseas
NaganoSeiko Epson
24
User cases
• Single process (deposition, etching, etc.)
• Total process (sensor, semiconductor, etc.)
• Evaluation (observation, measurement, etc.)
• Equipment manufacture’s demo
• Training
Prototyping
25
• Acceleration sensor• Pressure sensor• Si microphone• Magnetic sensor• Gas sensor• Photo diode• Solar cell• Quartz device• Piezoelectric device• Micromirror device• Microfluidic device• Radiation sensor(already commercialized)
etc.
0
100
200
300
400
500
600
700
800
900
1000
Inco
me
( x10
,000
JP
Y)
/ mon
th
26
Income
Company user
2010 2011 2012 2013
4 5 6 7 8 9 10 11 12 1 2 3 4 5 6 7 8 9 10 11 12 1 2 3 4 5 6 7 8 9 10 11 12 1 2 3 4 5 6
Tohoku Univ. user
27
Activity
Providing the fab. serviceInstallation, modification and maintenance
Development of system including softwareBooking system, information sharing, safety course
Process developmentFundamental technology (CVD, photolithography, etching, etc.)New materials installationEvaluation
TrainingOn the job trainingPractical training program organizedby MEMS Park Consortium (3 months)
Training program for semiconductorindustry in Tohoku region
MEMS Training Program
• Originally started as a part of METI program in 2007 and operated by MEMS Park Consortium since 2008
• Comprehensive training program containing planning, design, fabrication, testing, report for MEMS R&D
• Practical training and lecture-based training
• The fee is approx. JPY 1M.
Planning,design
Fabrication(4 inch process) Testing Presentation,
report
10 ~ 20 d 30 ~ 60 d ~ 10 d 3 d
Participants:RICOH, MEMS CORE, PENTAX, ADVANTEST, ALPS ELECTRIC, NIPPON DENPA, SYSTEC INOUE, YAMAHA, TOPPAN, KONICA MINOLTA, SEKISUI, MURATA, FUJI MACHINE, DENSO, AHIKO, YAMAMOTO ELECTRIC WORKS, JAXA
Ex. Capacitive 3-axis accelerometer
28
Products fabrication
• Products fabrication by company user is available since June 2013.• The purpose of this production is
We prove University’s R&D result as a product in the market and society. Result or problem through production accelerates University’s R&D and education.
<Requirement>• The device should be developed under University’s cooperation, and should be
continuously developed at the fab.• Occupied area and time should be less than 5% of total capacity.• A report to University is required every 6 months. • Maximum period for one type of device production is 3 years.
<Note>• University states exemption from responsibility.
29
Challenge
30
Since starting of the Hands-on-access fab in April 2010, we re-start and modifyold equipment, and install new equipment. Many company users have alreadyaccessed the fab. This result reveals that the hands-on system (open-accessfacility) is accepted by companies. We try to find out a sustainable model bymaking efforts to increase the number of uses. The fab continues supportingcompany to accelerate commercialization.
• Build up sustainable system• Develop and keep skillful engineers• Improve and maintain quality of equipment• Accumulate practical know-how
Hands-on-access fab, a part of your home facility
紹介Video1(2F_CR_R) 6:59
紹介Video2(2F_CR_L, 1F) 4:05
Sendai MEMS Show Room, renewal open on May 16th, 2012 31
Exhibition room poster, case1. From Semiconductor Research Institute to NishizawaMemorial Research Center2. Hands-on access fab. (K..Totsu et.al.)3. What is MEMS ?4. Mechanical sensors (M.Esashi et.al.)5. Micromachining and packaging (M.Esashi, S.Tanaka et.al.)6. RF MEMS (S.Tanaka, M.Esashi et.al.)7. MEMS for production, testing, environment and safety(S.Tanaka, M.Esashi et.al.)8. Optical MEMS (K.Hane, Y.Kanamori et.al.)9. Nanomachining (T.Ono et.al.)10. Micro sensors for medical monitoring (T.Matsu, M.Esashiet.al.)11. Minimal invasive medicine (Y.Haga et.al.)12. Sensor network (H.Kuwano et.al.)13. Power MEMS (S.Tanaka et.al.)14. Formation of Innovation Center for Fusion of AdvancedTechnologies on : Tohoku University R&D Center of Excellencefor Integrated Microsystems15. Funding Program for World-Leading Innovative R&D onScience and Technology (FIRST) on : Integrated Microsystems16. Open collaboration andμSIC17. iCAN18. MEMSPC19. Richo20. Fraunhofer (1)21. Fraunhofer (2)22. Fraunhofer (3)23. Fraunhofer (4)24. Advantest IMEC25. U.C.Berkeley26. MEMS Core (1)27. MEMS Core (2)28. IMEC (1)29. IMEC (2)
30 posters and 100 samplesEnglish/Japanese, double side
Tatami zone
32