metrology solutions for very large probe cards - …€¦ · june 6 to 9, 2010 ieee sw test...

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Metrology Solutions for Very Large Probe Cards

June 6 to 9, 2010

San Diego, CA USA

Mark McLarenIntegrated Technology Corporation

June 6 to 9, 2010 IEEE SW Test Workshop 2

CONTENT

• INTRODUCTION

• BACKGROUND

• HISTORY

• NEW DEVELOPMENTS

• METROLOGY TOOL CHALLENGES

• FUTURE?

• ACKNOWLEDGEMENTS


Introduction• Large format probe cards have traditionally been seen in memory arena – one touch 300mm

• Last 18 months Advantest, Teradyne and Verigy(presented in alphabetical order throughout presentation) all moved to large format cards in the non‐memory arena

• Different approaches taken but in each case the goals appear to be improved signal integrity and increased applications space

• This presentation does not attempt to assess the merits of each approach but is an attempt to outline the probe card metrology challenges


Background

• Wafer test goals– Process feedback

– Improve yield at final test

– KGD

• The industry has constantly tried to put more test capability at the wafer level, for example– One touch memory probe cards

– Multi‐DUT logic/SOC/processor/mixed signal

– Dynamic testing of power devices


Background

• Push toward “at speed” testing on logic/SOC/processor/mixed signal applications at the wafer level– Requires more “local” test resources close to the DUT’s

– Improved signal integrity

• All this requires more real estate

• SOLUTION – Make the probe card bigger


Background

• Cost/Performance trade off

– Downside• Bigger probe cards = higher initial card cost

• Higher replacement cost

• Metrology solution cost

– Upside• Improved testing at wafer level• Replaceable head probe technologies help with replacement costs


History

• More detailed look at previous interfaces and the metrology solutions on Probilt

• Advantest– T2000 round probe card

• Teradyne– 300mm Tiger/FLEX probe card

• Verigy– 9.5” and 12” 93K probe cards


ITC’s Design Guidelines

• Emulate Tester Mechanical Conditions– Same Forces on Probe Card– Same Connector Control Methods

• Emulate Wafer Prober Card Holding Conditions

– Same Forces on Probe Card– Maintain Same Reference Surface

• Requires detailed information from test system manufacturer and custom hardware


MUX to Motherboard Connections• Rugged, reliable

connections

• Simple MB installation

• Gold pads on MB are connection to ITC test channels


HistoryAdvantest T2000 round probe card


HistoryTeradyne 300mm probe card Tiger/Flex


HistoryVerigy 93000 9.5” probe card


HistoryVerigy 93000 12” probe card


Metrology Tool Challenges• Three distinct customer types

– Probe card manufacturer • Needs “universal” solution for all potential customers• High channel count needed

– Test House• Needs multiple solutions depending on number of customers supported on a given platform

• Typically lower “managed” channel count, but may have multiple PIB designs

– IDM’s• More dedicated lower channel count solutions


Metrology Tool Challenges

• Increasing probe count– Electrical

• Channel count ok so far even cards with >12K probes are being tested on 1800 channels systems

• Circuitry on probe card needs to be driven by metrology tool

– Mechanical• Probe forces climbing to >250Kg• Metrology tool must handle the force otherwise tests have to be run at decreased overdrive


New Developments

• All three companies introduced new large probe card solutions in last 18 months

• Advantest– T2000 RECT550

• Teradyne– FLEX 440mm

• Verigy– V93000 Direct‐ProbeTM


New DevelopmentsAdvantest T2000 RECT550


Metrology solution challenges

• Mechanical/Pneumatic– Physical size of probe card

• 550mm x 480mm – flipping to probe repair position

• Increased stroke on elevator

– Outside normal vacuum areas on Probilt• Had to use additional mechanism to secure retainer

– Mechanical Insertion force• Uses special actuators

• Full population requires motorized actuators

• Reduced population can still use pneumatic actuators



• Electrical Challenges– Tester resources not always in same location

– Each instrument has different connector pin‐out

– Shields are not always ground

– Two different types of connector – PCB routing issues caused by RECT550 connectors sitting almost on top of Probilt board to board connections


New DevelopmentsTeradyne 440mm Flex

Picture from SWTW2009 - Daniel Watson, Teradyne Inc



• Mechanical

– More traditional type of interface

– Very large application space requires height clearance for components

– Alignment of tall individual interconnect blocks



• Electrical

– No definition of function of 6400 pins

– Re‐designing PIB could change definition of the pins on the interface

– PCB routing issues ‐ very large application space causes interconnect blocks to overlay board to board connectors


New DevelopmentsVerigy V93000 Direct‐ProbeTM



• Mechanical– Physical size of probe card

• 600mm x 480mm – flipping card to repair position

– Complex docking• 4 Reference surface locations

– Mechanical force• Interconnect blocks have to float so no force on outside of probe card. Each block mechanically docks to counteract force.


Future?

• Higher probe counts– Forces up to 500Kg?

– Higher analyzer channel counts

• More circuitry on probe card– Metrology tool needs logic drive capability

• Probe card manufacturers sell more replacement heads – less complete cards– Need test vehicle and metrology tool that allows heads to be tested


Acknowledgements

• ITC– Jay Geist, Rod Schwartz

• Advantest– Dave Komma

• Teradyne– John Whittaker, Bill Wyckoff

• Verigy– Daniel Lam, Larry Dibattista

metrology solutions for very large probe cards - …€¦ · june 6 to 9, 2010 ieee sw test...

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