MEMS & Sensors

Vladimir Janousek

November 2011

STMicroelectronics

www.st.com/mems

ST: the one-stop MEMS supplier

ST MEMS

technology is at

the heart of a fast

growing family of

sensors

• MEMS is Micro Electro Mechanical Systems

• MEMS contain movable 3-D structure

• Structure move accordingly to external displacement

• In MEMS not only electrons are moving!

What is MEMS?

SEM* pictures of a capacitive micro-

machined structure manufactured with

THELMA process

*SEM: scanning electron microscope

MEMS

Sensors Mobile, PDAs,

MP4/MP3

Image stabilization, Menu

Navigation, Portrait /

landscape, Shock

monitoring, HDD protection,

Noise cancellation

Robotics

Roll over detection,

Motion & position

sensing, IMU

Consumer

Image scrolling, Shock

detection, Power

Management, Pointing

Automotive

Navigator system, Alarm,

Active/passive safety,

Headlight control, E-call,

Hand-free kit

Gaming

& Sport

Gesture

recognition, Motion,

Position sensing,

Pedometer

Industrial

& Medical

Tilt & Vibration

Measurement, Alarm,

People Monitoring

MEMS Sensors – Applications

MEMS Market by Products

MEMS market share

All segments (extract)

Source: IHS iSuppli Corp. | Jan 2011

4B$ (+11%)

* Magnetometer data source from Yole May 2011

ST Presence:

Microphone: Since end of 2010

Magnetometer: Since 2010

Gyroscope: Since 2009

Pressure Sensor: New in 2012

Accelerometer: Since 2006

ST Investing heavily in MEMS

Sensors (8” MEMS dedicated line)

ASIC Front-end

Assembly & Testing

Calamba

(Philippines)

Agrate (Italy)

Catania (Italy)

Kirkop

(Malta)

Rousset

(France)

Crolles (France)

Global & Outstanding Manufacturing Capability

Increase manufacturing

capacity toward…

3Mpcs/day (by the end of 2011)

Agrate

Catania

MEMS FAB: Dedicated FE + BE

GOOD & COST

EFFICIENT PRODUCT

Testing Manufacturing

Manufacturing Flow

Mech

Testing

Interface

Testing

Packaging Final Test

Final

Testing

&

Calibrat.

ST MANAGES THE COMPLETE SUPPLY CHAIN

CUSTOMER

MEMS Accelerometers

Some ‘g’ references

Passenger car acceleration

Earth’s gravity

Emergency braking (Formula 1)

Running

Bobsleigh rider in corner

Human unconsciousness

Walking down/up stairs

Running

Vibrations

Car Frontal choc high speed

Car Frontal choc high speed

Car Frontal choc high speed

Tennis ball

0.2 / 0.3g 1g (by definition) 1g <5g (shock at low back level) 5g 7g 7.4/8g (shock at ankle level) 8/12g (shock at ankle level) 10/15g 35g (shock at head level, with Airbag) 40g (for the vehicle) 65g (shock at head level, without Airbag) 500/700g

Managed by ST Accelerometers

Group of

inter-

digitized

fingers to

measure the

linear

acceleration

on X-axis

Group of inter-digitized fingers to

measure linear acceleration on Y-

axis

x

y

MEMS - Accelerometer

MEMS sensor

Z-axis linear accelerometer

acceleration

applied to the

sensing

element

torsional axis of

the springs

Z

X

Y

Stator2 Stator1 Selftest

Rotor

MEMS sensor

XYZ -axis linear accelerometer

Z-axis

X-Y axis

Glass frit ring

Pads region

Accelerometer Product Focus – LIS3DH

3-Axis Accelerometer

Digital SPI/I2C output

Able to measure accelerations with 4 selectable Full

Scale: ±2, 4, 8 and 16g

High Resolution (up to12 bit)

Very low power consumption: 2µA in Low power

mode (1Hz), 11µA in Normal mode (50Hz) and .5µA

in Power down mode

High Flexibility:

8 ODR user selectable: 1/10/25/50/100/400/1600/5000 Hz

Bandwidth up to 2.5KHz

32-level FIFO (for16-bit data)

3 ADC Inputs

Wide Power supply range 1.71 to 3.6V

Self test function

Small size package 3x3x1 (in mm)

LIS33DE

6/8-bit

±2 / ±8g

3 x 3 x 0.9

Cost

effective LIS331DL

8-bit

±2 / ±8g

3 x 3 x 0.9

LIS331DLM

8-bit

±2 / ±4 / ±8g

3 x 3 x 0.9

LIS331DLH

12-bit

±2 / ±4 / ±8g

3 x 3 x 0.9

Hig

h

perf

orm

ance

LIS35DE

6/8-bit

±2 / ±8g

3 x 5 x 0.9

Cost

effective

LIS302DL

8-bit

±2 / ±8g

3 x 5 x 0.9

LIS3LV02DL

12-bit

±2 / ±6g

4.4 x 7.5 x 0.9

LIS344ALH

50µg/Hz

±2 / ±6g

4 x 4 x 1.5

Hig

h

perf

orm

ance

LIS352AX/AR

100µg/Hz

±2g

3 x 5 x 0.9

LIS332AX/AR

100µg/Hz

±2g

3 x 3 x 0.9

Digital interface I2C/SPI Analog interface

Higher resolution / Embedded Features Lower noise / higher performances

Sm

alle

r siz

e

Hig

h r

unner

Accelerometers - Portfolio

3 x 3 x 0.9

Hig

h

perf

orm

ance

Hig

h r

unner

LIS3DH

12-bit

±2, 4, 8, 16g

Hig

h

perf

orm

ance

AIS328DQ

12-bit

±2 / ±4g / ±8g

4 x 4 x 1.8

AE

CQ

-100

LIS331HH

12-bit

±6 / ±12 / ±24g

3 x 3 x 0.9

Hig

h

perf

orm

ance

MEMS Gyroscopes

Gyro product focus - L3G4200D 3-Axis Gyroscope, Digital SPI/I2C output

High precision, 16 bit resolution

Able to measure rotations with 3 selectable

Full Scale: ±250°/s, ±500°/s and

±2000°/s

Power down and Sleep modes

Interruption and Data Ready output lines

High performances:

High Sensitivity: 8.75m°/s @ 250°/s FS

High Resolution: 0.03°/s/Hz @ 40Hz

High Thermal Stability (0.08°/s/°C)

Programmable Low and High pass filters

High Shock Survivability: 10000g for 0.1ms

High number of embedded Features:

4 Output Data Rates:100, 200, 400, 800Hz

Wide power supply range: 2.4 to 3.6V

8-bit temperature output

32-level FIFO

Self test function

Small package 4x4 LGA

Drive

Yaw sense

Pitch sense

Roll sense

MEMS Gyroscopes – Key Products

Single axis Dual axis

4x5x1

LPR430AL

±300dps

±1200dps

4x5x1

LPY430AL

±300dps

±1200dps

4x5x1

LPR410AL

±100dps

±400dps

4x5x1

LPY410AL

±100dps

±400dps

4x5x1

LPR403AL

±30dps

±120dps

4x5x1

LPY403AL

±30dps

±120dps

4x5x1

LPR450AL

±500dps

±2000dps

4x5x1

LPY450AL

±500dps

±2000dps

4x5x1

LPR4150AL

±1500dps

±6000dps

4x5x1

LPY4150AL

±1500dps

±6000dps Gaming

Pointing devices

Gesture recognition

Signature

Robotics

Image Stabilization

People Monitoring

Car Navigation

IMU

3x5x1

LY330ALH

±300dps

Yaw Pitch & Roll Pitch & Yaw

3x5x1

LY3100ALH

±1000dps

Yaw, Pitch & Roll

Tri axis

4x4x1

L3G4200D

L3GD20

±2000dps

±500dps

±250dps

3x5x1

LY3200ALH

±2000dps

3x3.5x1

L3G3250A

±2500dps

±625dps

MEMS E-compass

MEMS Module (SIP System in Package)

LSM303DLM & LSM303DLHC* MEMS Compass

Targeted applications Compensated compass

Location based services (LBS)

Map rotation and Position detection

Magnetic Signature recognition

6 Degrees of Freedom for Movement reconstruction, recognition and intelligent power saving

E-compass – LSM303DLx:

MEMS Accelerometer + Magnetic sensor

3-axis accelerometer

3-axis magnetic sensor

I²C digital interface

Power-down mode

Interrupt line

* Available in Q4 2011 for MM

MEMS Microphones

Transduction principle is the

coupled capacity change between

a fixed plate and a movable plate.

MEMS microphone structure

22

MEMS Microphone – MP45DT02 Top Digital microphone, Pulse Density Modulation

single bit output with stereo support

Omni-directional sensitivity

High level performance for :

Signal to noise ratio: 58dB (@1KHz)

Acoustic overload point: 120 dBSPL

Power supply rejection: -70 dBFS

10ms wake-up time

High Frequency response :

Voice / Hearing range 20Hz to 10 kHz

23

STM32

Low power consumption

(normal / low power):

650µA / 20µA

Small Package, 4x5x1.5

HLGA package

Single supply voltage

from 1.64 to 3.6V

MEMS Microphone – MP34DT01*

Top-port Digital microphone, Pulse Density

Modulation single bit output with stereo support

Omni-directional sensitivity

High level performance for :

Signal to noise ratio: 62dB (@1KHz)

Acoustic overload point: 120 dBSPL

Sensitivity of -26dBFS

Power supply rejection: -70 dBFS

10ms wake-up time

High Frequency response :

Voice / Hearing range 20Hz to 20kHz

Low power consumption

(normal / low power):

650µA / 20µA

Small Package, 3x4x1

HLGA package

Single supply voltage from

1.64 to 3.6V

* Available in H1 2012 for MM

NEW

MEMS Pressure Sensors

26

Pressure sensor: LPS331AP*

260 – 1260mbar Absolute digital output

Barometer

From 0.45 to 0.02 mbar resolution

Embedded temperature sensor

Embedded Offset and Span temp

compensation

Supply voltage 1.71 to 3.6 V

Low power consumption (@1Hz)

45µA @ 0.02mbar resolution

6µA @ 0.16mbar resolution

1µA power down

ODR from 1 to 25Hz, one shot possible

SPI / I2C, 2x Interrupt lines

Operating range: -20° to 105°C

* Available in Q4 2011 for MM

NEW

Tools, SW & Evaluation Kits

MEMS support tools Possible Daughter boards:

STEVAL-MKI109V1

STM32-based

MEMS motherboard

compatible with ST

MEMS adapters

LIS3DH

MKI105V1

L3G4200D

MKI107V1

LSM303DLM

MKI113V1

High

Runner

LSM303DLHC

+

L3G4200D

MKI108V1

AIS328DQ

MKI110V1

And

many

others…

10-DegreesOfFreedom platform:

3-Axis Accelerometer

3-Axis Gyroscopes

3-Axis Magnetometer

1 Dimension of pressure information

STLM75: temperature sensor with –55 to +125°C

range and I2C

MCU - STM32F103RE

STEVAL-MKI062V2 – iNEMO – 10-DOF

http://www.st.com/internet/evalboard/product/250367.jsp

STM32 F4 Discovery kit

• Develop your applications

easily with everything required

for beginners and experienced

users to get started quickly with

CortexTM-M4

• Based on STM32F407 in

LQFP100 package

• Includes on-board ST-LINK/V2

http://www.st.com/stm32f4discovery

LIS302DL - Accelerometer

MP45DT02 – Microphone

… on the board

300,-

CZK

Key Messages & Conclusion

Products focus for 2011

3-axis Digital Accelerometer: LIS3DH (LIS331DLH)

3-axis Digital Gyroscope: L3G4200D

6-axis Digital e-Compass: LSM303DLM (LSM303DLHC*)

Absolute Pressure Sensor: LPS331AP*

Digital Microphone: MP45DT02 (MP34DB01)

* Available in Q4 2011 for MM

>1.5 billion motion sensors already sold in

the market by ST

Continuous challenges

MEMS Mechanical structure design:

Die shrink with superior or equal Mechanical properties

ASIC electronic design:

Reduce power consumption

Increase available features

Technology & Packaging

Increase Manufacturing and Test equipments capacity

Develop new products and Modules (System in Package)

Many applications & domains are still to investigate for

MEMS

ST is the company to provide you a complete set of sensors