mems & sensors led & optoelectronics advanced packaging … · business model customer...

SiP Conference China 2018Oct. 17-19, 2018Shanghai, China

Romain FrauxCEO – System Plus Consulting

Electronic Costing & Technology Experts

Power electronics – MEMS & Sensors – LED & Optoelectronics – Advanced Packaging – System

TRENDS IN AUTOMOTIVE SIP SYSTEMS: REVIEW BASED

ON TEARDOWN OF ACTUAL SOLUTIONS

2SiP Conference China 2018, September 17, 2018

6 COMPANIES TO SERVE YOUR BUSINESS

Due diligence

www.yole.fr

Manufacturing costs analysis

Teardown and reverse engineering

Cost simulation tools

www.systemplus.fr

Market, technology and strategy

consulting

www.yole.fr

IP analysis

Patent assessment

www.knowmade.fr

Innovation and business maker

www.bmorpho.com

Design and characterization of

innovative optical systems

www.piseo.fr

Yole Group of Companies


OUR GLOBAL ACTIVITY

30%of our business

40%of our business 30%

of our business

Greater

China office

Yole Japan

HQ in Lyon

Nantes

Paris

Nice

Vénissieux

Europe office

Frankfurt

Hsinchu

Tokyo

Yole Inc.

Phoenix

Yole Korea

Seoul

Palo Alto


BUSINESS MODEL

Customer Specific

Catalog

Costing Tools Training

Reverse Costing

Teardown + Cost Analysis


FIELDS OF EXPERTISE

Pressure SensorGyro/AcceleroIMU/ComboOscillators/CompassEnvironmentGas SensorFingerprintMicrophoneLight/Optic

UV LEDLampWhite/Blue

InfraredVisible

WLPSiP

Embedded3D Packaging/TSV

Automotive Consumer

EnergyMedical Telecom

DiscreteModule

Compound (GaN, SiC)Power RF


OUTLINE

❑ Introduction

❑ System in Package in Automotive

▪ Power Modules

▪ Sensors

▪ Transmission

▪ RF

▪ Computing

System in Package illustrationSource: Amkor


INTRODUCTION

❑ Advanced Packaging


INTRODUCTION

❑ Automotive Electronics

Source: Bosch


System in Package in Automotive▪ Power Modules▪ Sensors▪ Transmission▪ RF▪ Computing


❑ Power Modules Market

▪ This Market forecast shows that the market for the Power Module devices will follow a rising trendwith an estimated 1.5 billion increase in the next five years.

POWER MODULES


❑ Molded IGBT Modules

▪ IGBTs and Diodes molded in a package.

▪ Strong presence in EV/HEV power units (VW, Toyota,

POWER MODULES

Bosch T-PM IGBT Module Infineon HybridPACKDSC Module

Toyota Prius DSC ModuleMitsubishi TPM IGBT Module


❑ Molded IGBT Modules

▪ Exemple of Internal Structure

POWER MODULES

Toyota Double Side Cooling Module Cross-Section

Copper Spacer

IGBT Diode

Emitter plate

Collector plate

Top copper leadframe

Thick copper leadframe

IGBT

Diode

Mitsubishi TPM Module Opening


❑ ADI µModules

▪ µModules offer real SiP integration

POWER MODULES

µModule Top View, X-Ray View, Opening View & Cross-Section View


POWER MODULES

❑ Linear Technology µModules

▪ 40A DC/DC Regulator with:

➢ Integrated constant-frequency current mode regulator

➢ Power MOSFETs

➢ 0.18μH Stacked Inductor

➢ Protection circuitry

➢ 5V regulator and other supporting discrete components.

LTM4636 µModule Cross-Sections

LTM4636 µModule

Package Molding

Stacked Inductor


POWER MODULES

❑ Linear Technology µModules

▪ Triple 10A Step-Down DC/DC μModule Regulator

➢ Included in the package are the switching controllers, power FETs,inductors, and most support components

Inductors

Controller

MOSFETs

Switching mode DC/DC converters

LTM4633 µModule Top View & Opening View


❑ Infineon DrBlade – Integrated Power Stage

▪ ASE aEASI Packaging Platform (Advanced Embedded Active System Integration)

▪ Organic Substrate Process Flow Modified to Meet High Power Applications

▪ 2 Power MOSFET + 1 Driver

▪ RDL: 2+1 Layer

POWER MODULES

Infineon TDA21320 Cross-Section

Infineon TDA21320 Top View, Bottom View & X-Ray View

MOSFET MOSFET

Copper HS

Copper LineCopper Line

Copper Line

Solder



Source: Bosch


❑ Around 50 MEMS Components in a Car

SENSORS

Source: Bosch



SENSORS

Source: Bosch


❑ TPMS: Tire Pressure Monitoring System

▪ Mendatory in several countries

SENSORS

TPMS Integration TPMS Opening

TPMS Sensor



▪ Freescale (NXP) TPMS

SENSORS

Freescale FXTH87 TPMS Package Views, Opening & Cross-Section

Package Molding

Metal lid

AccelerometerASIC

Pressure Sensor

Silicone gel

Leadframe

Package Molding



▪ Infineon TPMS

SENSORS

Infineon SP37 TPMS Package Views, Opening & Cross-Section

ASIC MEMS

MEMS

Package molding

ASIC

Copper leadframe


❑ Airbag ECU

▪ Airbag ECU uses multiple inertial sensors

SENSORS

Continental Airbag ECU TRW (ZF) Airbag ECU


❑ Airbag ECU

▪ Continental Airbag ECU

➢ 2 x Panasonic Combo Sensors (Single-Axis gyro + 2-Axis Accelerometer)

➢ 2 x NXP Accelerometer (Single + Dual-Axis Accelerometer)

SENSORS

Panasonic Combo Sensors NXP Single & Dual-Axis Accelerometers

Accelerometer

Gyroscope

ASIC

Accelerometer

ASIC


SENSORS

❑ Airbag ECU

▪ TRW (ZF) Airbag ECU

➢ 1 x Panasonic Gyroscopes (Single-Axis)

➢ 2 x NXP Accelerometer (Single + Dual-Axis Accelerometer)

NXP Single-Axis Accelerometer NXP Dual-Axis AccelerometerPanasonic Single-Axis Gyro

Accelerometer ASIC

Gyroscope ASIC


TRANSMISSION CONTROL UNIT

Bosch TCU (Source: Bosch)

❑ Transmission Control Unit (TCU)

▪ Standard ECU


❑ Continental TCU

▪ Double Clutch Transmission (DCT)

▪ Bare-Die High-Density Interconnect (BD-HDI) substrate technology

▪ 13 ICs, 10+ MOSFETs, Diodes, Passives

TRANSMISSION CONTROL UNIT

Continental Advanced TCU

ICs

MOSFETS


RF

❑ GPS IC

▪ Multi-die integration

Ublox GPS Chip


❑ Vehicle Central Infotainment Unit

▪ Network Access Device Module (NAD)

▪ 2G, 3G, 4G LTE, GNSS

RF

xxxxx


❑ Vehicle Central Infotainment Unit

▪ Network Access Device Module (NAD)

▪ 2G, 3G, 4G LTE, GNSS

RF

Wistron NeWeb Corp. NAD ModuleCross section of Electronic Board (10 layers)


❑ Single-Chip Module

COMPUTING

Single-Chip Module Introduction (Source: NXP)


❑ nepes Roadmap

COMPUTING

Nepes Roadmap (Source: Nepes)


COMPUTING

❑ nepes System in Fan-Out WLP

▪ System-in-Package at wafer-level

▪ LPDDR2 Package-on-Package Configuration

▪ Embedded Flash

▪ Embedded PMIC

Discrete passives components

Flash Memory(SPI NOR )

PMIC

i.MX6Q or iMX6DApplication Processor

Via Frame (Through Package Via)

Source : Nepes

DRAM Package

SiP (AP + Flash + PMIC)

Package Cross-Section ©2017 by System Plus Consulting

APFlash


COMPUTING

Package Cross-Section – Bumps & RDLs©2017 by System Plus Consulting

Application Processor

Package Molding

SMD Capacitor

4-Layer RDL

Solder Ball

Redistribution Layers©2017 by System Plus Consulting

❑ nepes System in Fan-Out WLP

▪ Chip first type Fan-Out

▪ 4 Redistribution Layers (RDLs)

▪ Via Frame (Through Package Via) formed from a PCB panel for theredistribution of the memory but also to increase the strength of thepackage


AVAILABLE REPORTS

And many more !www.systemplus.fr

http://www.systemplus.fr/


THANK YOU!

Customer Specific

Catalog

Costing Tools Training

Reverse Costing

Teardown + Cost Analysis

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