mems integration challenges in a semiconductor environment...external use tm mems integration...
TRANSCRIPT
External Use
TM
MEMS Integration challenges in a
Semiconductor EnvironmentFrom self driving cars, to smart homes, and wearables
S e p t e m b e r . 2 3 . 2 0 1 5
Michelle Kelsey | Sensor Solutions Division
Freescale Semiconductor
TM
External Use 1
Quick Introduction
• Freescale Semiconductor
− Product Line Manager Sensor Solutions Division
− >15 years experience driving Sensors products to
market, providing sensor strategy to the engineering
teams for definition, design, and test for NPIs as well as
roadmap strategy, value proposition, and go to market
plans
− A former background in Applications Engineering
supporting sensors in industrial, consumer, medical,
and appliance markets
TM
External Use 2
Agenda
• Key trends driving technology solutions for MEMS
• Smart, connected and contextually aware devices
• MEMS Integration - Motion, temperature and pressure
data transmitted wirelessly
• MEMS test
TM
External Use 3
MEMS has seen continuous growth
• MEMS saw continuous
growth since first
commercialization
• Consecutive growth engines:
driving increasing challenges
− Cost and reliability
− Integration for size and power
− Increasing intelligence and
connectivity
… all with improving
performance
Global SEMI and MEMS (Component) Markets
1975 1980 2020201520101985 1990 1995 2000 2005
$B
illi
on
SEMI
MEMS
Source: Tsensors, 2014
A u t o
C o n s u m e r
Connected
Intelligence
TM
External Use 4
MEMS Sensors in Today’s Home
• Barometer
• Relative humidity
• Smart thermostat
• Smart meter
• Smart appliance
• Room occupancy
• Door/window security
Next Gen Requirements
Longevity: Product refresh rate of eight to 15 years
Self-configuring: Sensors assign themselves
identification, recognize their neighboring sensors and
establish communication paths
Self-maintaining and self-healing: Reroute in case of
new obstacles, reduce the cost of maintenance
Self-calibrating: Maintain their own calibration reliably
throughout lifetimes, reduce cost of field technician
Very low-power or self-powered: Battery that lasts
many years or harvest power from the ambient
environment, reduce cost of field technician changing
battery
TM
External Use 5
MEMS Sensors in Today's Environment
• Self-configuring: Sensors assign themselves identification, recognize their neighboring sensors and establish communication paths
• Self-maintaining and self-healing: Reroute in case of new obstacles, reduce the cost of maintenance
• Self-calibrating: Maintain their own calibration reliably throughout lifetimes, reduce cost of field technician
• Very low-power or self-powered: Battery that lasts many years or harvest power from the ambient environment, reduce cost of field technician changing battery
TM
External Use 6
IoT is More Than M2M
The Internet of Things is about
Machine to Entity (M2E):
• Machine to Human:
− Automatic health monitoring for people: Connected wearables with monitoring services, or
disease management via implantable electronics
• Machine to Infrastructure:
− Automatic bridge monitoring: Sensing and monitoring the structural integrity of a bridge in case of
flooding
• Machine to Nature/Environment:
− Early detection of earthquakes: Distributed sensors to detect early tremors in specific places
• Machine to Machine:
− Automatic diagnostics for cars: Automatic information collection from your car’s engine
management system and sending real-time alerts to drivers or service centers
TM
External Use 7
MEMS Sensors in Today’s Wearable Devices
Lowest Power: for Always on Applications
Higher embedded functions: for Context
Awareness
Algorithms: Development and testing for
Motion Intelligence
Robustness: future with ultrasonic welding
and flexible PCBs
Step Counting
Pedometer
Activity Monitor
Sleep Patterns
Motion detection
Athletic form
Health monitoring
Ubiquitous monitoring
TM
External Use 8
Wearables…A Diverse Market
Vertical Categories
Fitness &
Wellness
Sports & Heart Rate Monitors
Pedometers, Activity Monitors
Smart Sport Glasses
Smart Clothing
Sleep Monitors
Emotional Measurements
Healthcare &
Medical
CGM (Continuous Glucose Monitoring)
ECG Monitoring
Pulse Oximetry
Blood Pressure Monitors
Drug Delivery (Insulin Pumps)
Wearable Patches (ECG, HRM, SpO2)
Infotainment
Smart Watches
Augmented Reality Headsets
Smart Glasses
Wearable Imaging Devices
Industrial &
Military
Hand-worn Terminals
Augmented Reality Headsets
Smart Clothing
TM
External Use 9
Market Challenges
• Sensors are being integrated into a wider variety of “intelligent” devices
• The Internet of Things is creating challenges for transmitting, securing, and analyzing sensor data in new ways
− New architectures
− New protocols
− New security requirements
• Not all of our customers have the resources to develop sensor applications from the ground up
• Multitude of MCU and sensor solutions requires constant investigation and learning to stay up to date
TM
External Use 10
MEMS Sensors in Today's Car
• The next generation of automated driving requires leading edge compute intelligence to exchange and evaluate all the data of the systems involved.
• This level of compute power may not reside in a controller specifically designed for automotive.
TM
External Use 11
MEMS Sensors in Today's Car – Discussion Topics
1. What does it take to support the different Automotive market
requirements (Safety Critical to Infotainment )? What are the
barriers which will need to be overcome?
2. If we align requirements upfront is it possible to implement
changes real time once requirements are met?
3. Others?
TM
External Use 12
Scale: From 1BU in 5 years to 1BU or more per year
Mix: sensor type, sensitivity, range, bandwidth
Product Life Cycle: < 2 years (consumer) to 15+ (automotive)
Technology challengesProcess technology
Design efficiency
System in package
Test platforms
EcosystemsConnectivity
Software frameworks
Algorithms and sensor data analytics
Sensor Trends
TM
External Use 13
Sensor Process Technologies
MEMS Processes
×Voltage tolerance
Low Leakage current
Operating temperature
Feature geometry
12+ process combinations in production
0
0
0INERTIAL
PRESSURE
MAGNETICS
Over-damped
Vacuum
Piezo-Resistive
Transducer
Capacitive pressure cell
Hall effect
Magneto-resistive
ASIC Processes
TM
External Use 14
Design Efficiency
Design reuse driven by
• Level of integration
• Shortening product life cycle
• Proven record for functional safety
Monolithic
Block Diagram
Dual-Die Block Diagram
Triple-Die with MCU Block Diagram
TM
External Use 15
MEMS Testing
• Environmental considerations
− Temperature
− Voltage
− Pressure
− Mechanical shock
• Physical stimulus
− Acceleration
− Rotation
• SIP complexities
− RF performance
− Magnetic interference
TM
External Use 16
Freescale FXTH87xx Integration
Tire implementationVehicle
implementation
QFN 7x7 Cross section
TM
External Use 17
System in Package: TPMS Example
Industry Smallest Tire Pressure
Monitoring Sensor
• MEMS capacitive pressure cell
• MEMS 2-axis accelerometer
• CMOS ASIC with
− Microcontroller with 16 kB flash, 512 B
SRAM
− Temperature sensor and thermal restart
− 1-channel LF detector and decoder
− Integrated RF transmitter: 315/434 MHz
• 7 x 7mm2 Film Assisted molded QFN
package
TM
External Use 18
Ecosystems for connectivity and layered intelligence
• Connected, smart sensors
• Fragmented data interchange frameworks
• Integrating sensor data with Big Data
• Sensor data analytics
TM
External Use 19
Use Case: Rapid Prototype Using ISF R2.1 on FRDM Platforms
Gyro
I2C/SPI
PC with IDE
and
customizable
GUIs
Freescale
Freedom Board
Sensor
Development Kit
Serial Comms
via
USB/OpenSDA
Embedded middleware
(ISF) and application
target the Kinetis
processor family
Multi-B
10DOF
Advantage:
Get something to evaluate fast
Identify and eliminate as many risk areas as possible
Expansion
connectors to
interface to
prototype
hardware
TM
External Use 20
ISF 2.1 Software Architecture “Layer Cake”
Applications
MXQLite
RTOS
Power
Manager
Bus
Manager
UART Protocol
Adapter
Device Messaging
HDLC Protocol
Host
Communications
SPI Protocol
Adapter
I2C Protocol
Adapter
SPI Sensor
Adapter
I2C Sensor
Adapter
Sensor Manager
I2C
SDK
PEx
I2C
LDD
Shim
PEx
I2C
LDD
SPI
SDK
PEx
SPI
LDD
Shim
PEx
SPI
LDD
UART
SDK
PEx
UART
LDD
Shim
PEx
UART
LDD
PIT
SDK
Pex
PIT
LDD
Shim
PEx
PIT
LDD
SMC
SDK
PEx
LDD
Set
Operation
Functions
System
Tick
LDD
Kinetis Microcontroller and Remote Intelligent Sensors
Application
ISF Core
Services
Drivers
Hardware
TM
External Use 21
Pro
ce
sso
r E
xp
ert
ISF
Ba
se
d E
mb
ed
de
d A
pp
lica
tio
n
ISF_Emb_App
Main
Settings
Subscription
List
Host
Interface
Config
ISF_Core
Core
Services
Sensor
Config
Comm
Channels
I2C LDD
UART
LDDMMA8652
MAG3110
Bus
Manager
Protocol
Adapter
Embedded Application
Task
ISF
Library
Sensor
Adapters
Protocol
Adapters
Ge
ne
rate
s
Ge
ne
rate
s
Ge
ne
rate
s
Ge
ne
rate
s
DSA
Direct API
Bus
Manager
Command
Interface
Power
Manager
MMA8652
Accelerometer
MAG3110
Magnetometer
DS
A
Dire
ct A
PI
I2C
UART
Sensor
State
Machine
CI Callback
DSA
Direct API
Bus
Manager
Command
Interface
Power
Manager
App Data Processing
Code
App Initialization
Code
App Shutdown Code
App Host Command
Handing Code
Primary Component Properties Linked Component
TM
External Use 22
Summary
• System-in-package, high level of integration
• Wide selection of sensors: absolute
pressure sensors, acceleration sensors,
temperature sensors, battery voltage sensors
• MCU with embeddable firmware and
software services
• Low power RF link
• Ultra low-power system wakes up on
specific physical event detection
P-cell
g-cell
8-bit MCU + RF/LF
Wireless Sensor
TM
External Use 23
Summary
Expanding applications and accelerated adoption
brings challenges scale, mix and life cycles
Improvements in process design, test and packaging
methodologies are needed
Ecosystem for connectivity and layered intelligence
TM
© 2014 Freescale Semiconductor, Inc. | External Use
www.Freescale.com