medium & long term business plan - ircms.jp share of silicon lapping and polishing ... outline...

1

MEDIUM & LONG TERM BUSINESS PLANFY2017 - FY2022

November 8, 2016

FUJIMI INCORPORATED

2

Contents

I. Competitive Advantage & Core Technology

II. Summary of Current M&L term Business Plan*

III. New M&L Term Business Plan*

*M&L term Business Plan : Medium & Long Term Business Plan

3

I. Competitive Advantage & Core Technology

4

1

2

3

4

5

Strong market position in the semiconductor substrate processing segment providing superior quality materials

Advanced and unique technologies providing solutions for surface processing requirements

Strong R&D commitment to maintain long-term competitiveness

Financial strength supporting aggressive R&D investment

Strategically placed world-wide manufacturing and technology sites near major customers

Competitive Advantage

5

Strong market position in the semiconductor substrate processing segment providing superior quality materials1

Market share of CMP slurry

A 34.6%

B14.9%

C10.2%FUJIMI

9.7%

D 9.2%

E 8.2%

F 2.3%

H 1.0%G 1.7% OTHER

8.0%

As of Mar. 2016, FUJIMI estimation

CMP Slurry Market ($m)

$- $200 $400 $600 $800

$1,000 $1,200 $1,400

2011 2012 2013 2014 2015 2016 2017 2018

Ceria based (all STI and all Oxide) Oxide W Copper Barrier EmergingForecast

Source: LINX-Consulting

Final Polishing

Test Wafer

300mm wafer shipment (mil pcs/month)Forecast

Prime Wafer

Epi Wafer

Current Capacity

Source: SUMCO IR Material

Market share ofSilicon Lapping and Polishing

Others14%

Fujimi86%

Others12%

Fujimi88%

As of Mar. 2016, FUJIMI estimation

Lapping Final Polishing

6

0

5,000

10,000

15,000

20,000

25,000

30,000

35,000

40,000

45,000

'53 '55 '57 '59 '61 '63 '65 '67 '69 '71 '73 '75 '77 '79 '81 '83 '85 '87 '89 '91 '93 '95 '97 '99 '01 '03 '05 '07 '09 '11 '13 '15

New Business

General Industry

Hard Disk

CMP

Silicon

All

Millions of Yen

Advanced and unique technologies providing solutions forsurface processing requirements2

Silicon business started

1982 Hard Disk business started

1997 CMP business started

Optical Lens business started

2012 Advanced Metal Polishing business started

0%

10%

20%

30%

40%

0

200

400

600

800

1000

FY2008 FY2009 FY2010 FY2011 FY2012 FY2013 FY2014 FY2015 FY2016 FY2017F

R&D Manufacturing Others R&D / Total Employee （%）

Numbers of Employees

0%

2%

4%

6%

8%

10%

12%

14%

0

500

1,000

1,500

2,000

2,500

3,000

3,500

FY2008 FY2009 FY2010 FY2011 FY2012 FY2013 FY2014 FY2015 FY2016 FY2017F

R&D Expenses R&D Expenses / Net Sales (%) #REF! #REF! #REF!

7

Strong R&D commitment to maintain long-term competitiveness3

※Numbers in FY2017 are forecasts.

Millions of YenRatio of R&D Expenses to Net Sales

Person

30.5％

※Numbers in FY2017 are forecasts.

10.2%

8,000

6,000

4,000

2,000

0

2,000

4,000

6,000

8,000

10,000

Financial CF Investing CFOperating CF FCF

M JPY

8

Financial strength supporting aggressive R&D investment4

0%

5%

10%

15%

20%

25%

0

1,000

2,000

3,000

4,000

5,000

6,000

7,000

8,000

9,000

FY08

FY09

FY10

FY11

FY12

FY13

FY14

FY15

FY16

EBITDA / EBITDA MarginEBITDAEBITDA Margin

M JPY

74%

76%

78%

80%

82%

84%

86%

88%

90%

92%

Equity Ratio Cash Flow

FUJIMI has no interest-bearing debt

9

Strategically placed world-wide manufacturing and technology sites near major customers5

A strong presence in Asia Pacific to better serve customers. Approximately 80 percent of revenue, fixed assets and employees are in Asia.

Semiconductor Industry AreaHDD Industry AreaSmartphone Assembly Industry Area

R&DManufacturingSalesSupport Center

KoreaGermany

China

Malaysia

USAJapan

Taiwan

FY2008 FY2009 FY2010 FY2011 FY2012 FY2013 FY2014 FY2015 FY2016 FY2017FAcquisition of treasury stock 0 755 675 1,028 1,918 0 0 902 345 644Cash dividends 1,275 875 868 989 801 907 778 1,022 1,008 1,232Total return ratio 39.2% 271.6% 132.9% 110.8% 500.8% 40.8% 97.3% 52.1% 57.7% 67.0%Payout ratio 39.2% 146.8% 75.0% 54.8% 150.7% 40.8% 97.3% 27.8% 43.2% 43.9%

0%

50%

100%

150%

200%

250%

300%

0

500

1,000

1,500

2,000

2,500

3,000

*2

Dividend History

10

Total cash dividends / Acquisition of treasury stock

20,000

22,500

25,000

27,500

30,000

FY2007 FY2008 FY2009 FY2010 FY2011 FY2012 FY2013 FY2014 FY2015 FY2016FY2014 FY2015 FY2016 FY2017FY2013FY2012FY2011FY2010FY2009FY2008

Number of shares(excluding treasury stock)

(millions of yen)

(thousand)

*2 : Forecast as of May 10, 2016 *1 : Actual from Apr 1, 2016 to May 31, 2016

*1

*2

Reference

11

Chemistry- Dispersion

- Dissolution

- Surface protection

Powder Technology- Powder shape control

- Agglomerated powder

Core Technology

Large size

Middle size

Fine size

Particle

Particle distribution curve

Core Technology – TRF : Technology Platform

Filtration, Classification,

Purification - Particle grading- Large particle

& impurity removal

Abrasive Surfactant - Dispersion, Wetting

Chemistry :Acid, Alkali, Oxidant

Inhibitor - Protectant

Chelating AgentIon capture

12

II. Summary of Current M&L Term Business Plan

13

（Existing business）

Seeding(New business)

Develop Infrastructure

（Existing business）

Raise Planted SeedRaise Planted Seed(New business)

Strengthen Infrastructure

(Existing business)

Flower Blooms reap the fruits

of what was planted

Human Resource CultivationEnhancement of MFG PowerEnhancement of QA PowerEnhancement of PDCA Cycle Execution

Human Resource CultivationEnhancement of MFG PowerEnhancement of QA PowerEnhancement of PDCA Cycle Execution

Understand and Realize Customer Requirements Achieve Higher Customer SatisfactionUnderstand and Realize Customer Requirements Achieve Higher Customer Satisfaction

Build up Stronger Financial FundamentalsBe Environment Friendly CompanyBuild up Stable Business Portfolio

Build up Stronger Financial FundamentalsBe Environment Friendly CompanyBuild up Stable Business Portfolio

Start2009/3

2012/3

2015/3

2018/3

Outline of Current Medium & Long Term Business Plan Formulated in 2009

1st Stage （Done）Self-analysis, Strategy formulation

2nd Stage （Done）Enhancement, Execution

3rd StageSpread, Jump

Execute Corporate Philosophy

Achieve Corporate Vision

Execute Corporate Philosophy

Achieve Corporate Vision

14

Operating Income Ratio Improvement : 12.6％

Embodied “Meet and Exceed Customer Expectations” in Management Philosophy

Enhanced quality assurance capability and manufacturing master mind

Improved Work-Life-Balance : More leave days, Strengthening family care plan

Improved Personnel System : Strengthening family care plan, Education/Training system

Sales and Operating Income Targets : Not achieved

Realizing new business developments but, need more diversified new businesses

Operation efficiency and effectiveness improvement

Work-Life-Balance : Did not meet target for reduced overtime work

Achievement Review for Current Medium & Long Term Business Plan

Highlights

Lowlights

15

Business Environment

III. New M&L Term Business Plan

16

1. More mature semiconductor market

2. Smartphone market growth has slowed down.

3. More alliances in semiconductor industry.

To share increasing R&D costs

Macro economy

Micro economy

1. More uncertain in the world economic outlook

2. Slowdown of emerging economic growth

3. Shorter and more volatile economic cycle

4. More uncertain geopolitical risk

Changes of Business Environment

17

297

473

680

968

1,245

1,424 1,475

1,573 1,654

59.3%

43.8%42.6%

28.5%

14.4%

3.6% 6.6% 5.2%

0%

10%

20%

30%

40%

50%

60%

70%

0

200

400

600

800

1,000

1,200

1,400

1,600

1,800

2010 2011 2012 2013 2014 2015 2016F 2017F 2018F

Smartphone shipments YoY

Number of smartphone shipments in 2016 has slowed down due to China economy maturation. The latest forecast says YoY 3.6%.

Number of smartphone shipments in 2016 has slowed down due to China economy maturation. The latest forecast says YoY 3.6%.

Millions of pieces

Source : (Forecast) Daiwa Securities Co.Ltd. Electronics Quarterly (Autumn), 2016/9/23(Actual) Gartner , 2016/8/15

Slowdown Smartphone Growth to Single Digit Percentage

18

In a long term perspective, CAGR* in semiconductor industry growth is slowing down mature. In a long term perspective, CAGR* in semiconductor industry growth is slowing down mature.

- Growth drivers have shifted from PC to tablet and smartphone.

- IoT, AI and in-vehicle equipment are expected as next growth drivers, however the potentials are uncertain.

Smartphone, Tablet

Smartphone, TabletPCPC

IoT, AI, In-Vehicle Equipment

IoT, AI, In-Vehicle Equipment

？

2020 2025

Growth driver

*CAGR : Compound Annual Growth Rate

Source : Above graph is developed by Fujimi based on original source NOMURA SECURITIES CO., LTD. on 9/18/2015

More Mature Semiconductor Market

SemiconductorSemiconductorprocessing equipment

Unit : Million of USD

19

Non-Semiconductor Business: New Business Expansion

→ Business Portfolio Optimization

Non-Semiconductor Business: New Business Expansion

→ Business Portfolio Optimization

Existing Business Expansion + Progressing New Business + Next New Business

Challenge Items

Semiconductor : Existing Business Expansion and Penetration into Periphery Business FieldSemiconductor : Existing Business Expansion and Penetration into Periphery Business Field

Silicon Wafer30%

CMP35%

Hard Disk13%

GI*22%

New Business Expansion (Image)

SemiconductorBusiness（65%）

Non-Semiconductor Business（35%）

FY2016 Actual

Mar

ket s

ize

Time

Existing business

New Business A

New Business B

New Business C

New Business D

*GI : General Industry

Business Portfolio Optimization with New Business Expansion

20

M&L Term Corporate Vision

Quantitative Target


21

FY2016Actual

FY2017Forecast

Before or afterFY2019

Dividend Payout Ratio 43.2% 43.9% 50%

Medium & Long Term Corporate Vision

FY2016Actual

FY2017Forecast

FY2022Plan

Net Sales in Billion of Yen 31.7 33.0 60.0

New Business Sales Ratio 6% 7% ≧25%

Non-Semiconductor Sales Ratio 35% 35% ≧45%

Non-Polish Business Sales Ratio 6% 7% ≧15%

Operating Income Margin 10.4% 11.5% ≧15%

ROE 5.3% 6.3% ≧10%

ROA 4.6% 5.5% ≧8%

We support your forward-looking ideas and challenges.We support your forward-looking ideas and challenges.

Quantitative Targets

Policy on Shareholder Return

Medium & Long Term Business Plan from FY2016 to FY2022

22

Conversion from Abrasive Manufacture to Surface Creator

Silicon Wafer30%

CMP35%

Hard Disk13%

GI*（Polish）

11%

GI*（Non-Polish）

5%

New Business

6%

【FY2016 (Actual)】Existing : 94% New : 6%

【FY2016 (Actual)】Existing : 94% New : 6%

Silicon Wafer24%

CMP29%Hard

Disk９%

GI*（Polish）

8%

GI*（Non-Polish）4%

【FY2022 (Target)】

Existing : 75% New : 25%


Existing : 75% New : 25%

New 6%New 6%

Existing 94%Existing 94% Existing 75%Existing 75%

New 25%New 25%

New Business25%

Expand New Business

【FY2016 (Actual)】【FY2022 (Target)】

Conversion from Abrasive Manufacture to “Powder & Surface” Company

*GI : General Industy

23

0%10%20%30%40%50%60%70%80%90%

100%

FY2015 FY2016 FY2017 FY2018 FY2019 FY2020 FY2021 FY2022

Semiconductor relatedNon-Semiconductor related

35%

65%

Over 45%

Business Portfolio between Semi and Non-Semi Businesses

Business Portfolio Optimization


In FY2022, Non-Semiconductor Sales Ratio : over 45%

24

【FY2016 (Actual)】Polish : 95% Non-Polish : 5%

【FY2016 (Actual)】Polish : 95% Non-Polish : 5%


Polish : 85% Non-Polish : 15%


Polish : 85% Non-Polish : 15%

Polish 85%Polish 85%

Non-Polish15%

Non-Polish15%

Non-Polish5%

Non-Polish5%

Polish 95%Polish 95%

Silicon Wafer30%

CMP35%

Hard Disk13%

GI*（Polish）

11%

GI+（Non-Polish）

5%New

Business 6% Silicon Wafer

24%

CMP29%

Hard Disk９%

GI*（Polish）

8%

New Business

25%

GI*（Non-

Polish）4%

【FY2016 (Actual)】【FY2022 (Target)】

Conversion from Abrasive Manufacture to Surface Creator Expand Non-Polish Business


25

Growth Strategy


26

1. Re-acknowledge Fujimi’s Business Domain

2. Expand new applications and search for new businesses opportunities

3. Aggressive R&D investment and cooperation with other companies

– Expand “Powder & Surface” field as Fujimi’s business domain

– Conversion from abrasive manufacture to “Powder & Surface” company

Key words : “Powder & Surface”, Surface Processing Solution

– Expand existing businesses and invest medium and long term growth

– Enhance material design capability

– Aggressively seek alliances with other companies, as well as merger & acquisition opportunities

– Short to medium term : Expand existing businesses and search for new

business opportunities

– Medium term : Develop Non-polish applications and businesses

– Long term : Incubate new business themes in the 10 year time range

Growth Strategy Policy

27

ATRC* : Search for new business fields of “Powder & Surface”

Existing Business : Expand new application and business opportunities

New Business : Search for new business opportunities

– Silicon Wafer : Take next generation semiconductor applications

– CMP : Take beyond 5nm semiconductor applications

– Specialty Materials : Expand applications in powder field

– Thermal Spray Materials : Expand business areas with complex

technologies

– Complex shape polish rather than planar polish,

New polish method, Providing solution

– Search for new business fields of “Powder & Surface” applications

– Increase investments in venture companies (ex. CVC)

– Aggressively seek alliances with other companies (ex. M&A)

*ATRC : Advanced Technology Research Center

Growth Strategy Policy of Each Business Unit

28

Existing Periphery New

Exi

stin

gPe

riphe

ryN

ew

Tech

nolo

gy

Market

Expand existing business,search new biz opportunities

New businessunit

Target more periphery areas（short-mid term search：〜3 years）

ATRC*Target further more periphery areas

（mid-long term search：〜10 years）

Activity in existing business units-Expand existing and search new business opportunities

Activity in new business unit-Target more periphery areas rather than existing ones-Search for new opportunities in the short and medium term perspective

Activity in ATRC*-Search for new business in medium and long term perspective

-Incubate new business projects and provide feedback

ExistingBusiness

units

Growth strategy-Existing business units expand existing business

and seek new opportunities-New business unit expand into more periphery

areas.-ATRC* gives business units project feedback from

extended periphery areas.

Domain of Existing Business Units, New Business Unit and ATRC*

*ATRC : Advanced Technology Research Center

29

Surf

ace

Powder

Abrasive

Silicon

MCF(Magneto-Compound

Fluid)

Functional materials

Catalyst

Insulating materials

AgglomeratedComposite

SiC

GaN

Complex shape

Hard materials

Processing solution

Thermal spray・Plating・Painting・

Chemical processing

Next generation substrate

New surface processing

needs

Fine powder

Mesoporouspowder

Nano powder

Polish

Coating

Non-Polish

Filler materials

Blasting

Lapping / Polishing

Thermal spray


30

-Powder & Surface-CVC-Cooperation with industry,government, university

-M&A-Joint development-Open innovation

MobileDisplay-related

New polishing

field

Creating surface of

things

Expansionof TPF*

Material in-housedevelopment

Present

20222025

2019

Strategic pipeline

-Silicon Wafer-CMP

-Compound semi (SiC、GaN)

-CMP consumable

Next generation wafer（ex. Diamond Wafer)

-Hard Disk-Thermal Spray-General Industry

-Globalexpansion-Application expansion

High value added powder development

Coretechnology

High Quality

Powdertechnology

Filtration, Classification,

Purificationtechnology

Chemistry

Development

capability

NicheTop

Fujimi’sStrength

ATRC

Semi-related

New business

Specialty

Expansion of

core-tech.

Medical Healthcare

Drug delivery system

Artificialbone Nano

medicalRegenerative

medical

Advanced materials・Manufacturing technology

Advanced materials

Nano-material

Compositematerial

Transportequipment

Bullettrain

Othertransfervehicle

AircraftAutomobile Environment

Energy

Geothermalenergy

Wind powergeneration

ThermalPower

generation

Nextgenerationautomobile

Next generation

power device

Robot

IoTMobileinternet

Information & communication

Target field (ex.)

*TPF：Technology Platform

Other field

Unlimited field

AgricultureWater

Desalination soil amelioration

Growth Strategy

31

Growth Strategy in Existing Business


32

Field

Existing field New(Potential) field

Tech

nolo

gy Existing/Core

+αIntensify

Existing Business

PrimaryTarget

Expand existing business and periphery business

Existing Business : Expand New Application and Business Opportunities

330

1,0002,0003,0004,0005,0006,0007,0008,000

2014/3 2015/3 2016/3 2017/3 2022/3

M&A F Business E Business D BusinessC Business B Business A Business

Penetrate into new applications in semiconductor business with polishing technologies and know-hows

Expand to polishing peripheral materialsNew polishing objects／

technologies

MEMS*1 TSV*2

SiC GaN

*1：Micro Electro Mechanical Systems:A technology that in its most general form can be defined as miniaturized mechanical and electro-mechanical elements (i.e., devices and structures) that are made using the techniques of micro-fabrication*2：Through-Silicon Via:One of the semiconductor processing technologies which is a vertical electrical connection (via) passingcompletely through a silicon wafer or die..

Existing Business : Growth Strategy in Semiconductor Business

Oil Grinding wheel PadCleaning

Filtration/Classification

Purification technology

Chemistry

(Dispersion/

Dissolution/

Surface protection)

Powder

technology

(Particles/

Abrasives)

Core technologies

34

【New Application】【New Application & Region】

【Existing Field】【New Region】Region Strategy

（積極展開できていない）Appl

icat

ion

Region

Optics, Grinding Wheel, Coating, Quartz, Insulator,

Glass, Catalyst Career, Plastic, LN/LT, Others

Enhance Powder Technology

North America

Europe

New Remarkable Field

Blast

Expand existing business with enhance powder technology and global spread

Existing Business : Growth Strategy in Specialty Materials Business

Global Spread

Be a global powder companyFunctional

Materials

Mid & South America

FUJIMI known as powder expert

35Penetrate into growth marketPenetrate into growth market

Increase market share in Thermal Spay marketIncrease market share in Thermal Spay market

Existing Business : Growth Strategy in Thermal Spray Materials Business

1. Semiconductor / Liquid Crystal- Focus on HVM establishment and next generation materials

development.

- Establish HVM of Slurry Thermal Spay

2. Aeronautical and Power Industry- Develop good customer relationship

- Develop materials for TBC/EBC, Abrasion resistant coatings and 3D printers

3. New Business/3D Printer etc.R&D） Develop materials and molding technologies for “extremely hard materials” and “molds”

R&D） Marketing advanced technology for the medical, antibacterial treatments, Rechargeable battery and Nano-cellulose industries.

Source : NEDO

Source : NEDO

36Penetrate into growth marketPenetrate into growth market

Increase market share in Thermal Spay marketIncrease market share in Thermal Spay market

Existing Business : Growth Strategy in Thermal Spray Materials Business

1. Semiconductor / Liquid Crystal- Focus on HVM establishment and next generation materials

development.

- Establish HVM of Slurry Thermal Spay

2. Aeronautical and Power Industry- Develop good customer relationship

- Develop materials for TBC/EBC, Abrasion resistant coatings and 3D printers

3. New Business/3D Printer etc.R&D） Develop materials and molding technologies for “extremely hard materials” and “molds”

R&D） Marketing advanced technology for the medical, antibacterial treatments, Rechargeable battery and Nano-cellulose industries.

Source : NEDO

Source : NEDO

WC primary size: 0.2μm 6.3μm

Morphology of particlesAgglomerated Powder

Oxide, Carbide, Boride, Nitride , Metal Plastic, etc…

Process

Agglomerated Composite

37

Growth Strategy in New Business


38

Field

Existing field New(Potential) field

Tech

nolo

gy Existing/Core

+αIntensify

PrimaryTarget

Creating Surface（create new surface）

Targeting more periphery fields rather than existing fields. Seek short-medium term themes creating specific surface.

New Business : Search for New Business Opportunities in Polishing Fields

Existing Business

39

Existing Periphery Others

Existing

Periphery

New

Market

Technology

High technology and Unique

PolishingTotal Solution

New Market

Challenging Field

Business expansion with below 2 axes- Market axis： Mobile, Display, LED, Design, Exterior- Technology/Material axis： Challenging Fields (Hard brittle materials, Alloy, 3D polishing)

Hard brittle materials,

Alloy↓

3D

SemiconductorHard Disk

Non-Surface Polishing

？

Explore new markets with new technologies

New Market

・New Material + 3D Polishing

・Seramic , Ti alloy

Mobile / Display / LED / Design / Exterior etc.

New Business : Search for New Business Opportunities in Polishing Fields

40

Materials

2D2D

2.5D2.5D

3D3D

Lapping/ PolishingLapping/ Polishing

MCF*MCF*

Fixed Abrasive

Fixed Abrasive

CMPCMP AlloyAlloyCeramicCeramicGaNGaN SiCSiCDiskDisk Compound Materials

Compound Materials

Provide not only polishing materials but also polishing

methods

More Various Polishing Methods

More Complicated

Surface

Shapes

SiliconSilicon

Harder Materials

p gFujimi contribute to creating new surfaces of things by not only providing polishing materials but also polishing methods.

SolutionsPolishing methods

Creating new surface

of things

New Business : Penetrate into New Polishing Fields

*MCF: Magneto Compound Fluid

41

Growth Strategy in “Powder & Surface” Field


42

Market

Existing New(Potential) field

Tech

nolo

gy

ExistingCore

Enhancement

+New

Existing

Business

Primary Target

Primary Target

Technology enhancementby CVC, M&A and industry-academia

partnership etc.

New market researchthrough trade shows and customer information etc.

Search for new application and business in “Powder & Surface” field.

ATRC incubates new business projects and gives business units project feedback in new fields from a medium and long term perspective.

ATRC* : Search for New Business Fields of “Powder & Surface”*ATRC : Advanced Technology Research Center

43

Mission ＝ Development of new business and technology

・To strengthen and expand core technologies,

・To perform market research of new business area in a medium and long term perspective,

・To pursue possible business alliance and M&A

Mission ＝ Development of new business and technology

・To strengthen and expand core technologies,

・To perform market research of new business area in a medium and long term perspective,

・To pursue possible business alliance and M&A

ATRC*

R&D PlanningSection

Business PlanningSection

Core Technology Development Section

Organized in April 2015

With new technologies of “Powder & Surface” Toward new business fields

ATRC* : Organization and Function*ATRC : Advanced Technology Research Center

44

ATRC* : Technology Development Policy*ATRC : Advanced Technology Research Center

The more highly functional materials we have, the better we become able to take advantage of engineering.

To brush up core-technologies such as :To strengthen material technologies

EngineeringHighly

functionalmaterial

such as :- sol-gel synthesis,- hydrothermal synthesis,

and - mechano-chemical

synthesis.

In what direction?・finer,・more complex and・more variety

fusionCreation of customer

value

Continue creating the world’s best technology in “Powder & Surface” fields.

In what direction?・finer,・flatter and smoother and・more variety

- classification,- filtration,- surface modification,- evaluation, and- 2D,3D polishing

and add new engineering technologies.

45

Mesoporous Alumina has three fourths pores in total volume compared to same weight normal Alumina block.

Features- Fine pore from some nm to 1x nm in diameter,making it possible to capture and support fine substances.

- Controllability of pore diameter and size,leading to low density due to a lot of pores and high

surface areaex. pore volume: 1.1 cc/g; surface area: 265m2/g

Expectation of Non-polish applications with Alumina powders

Mesoporous Alumina

50nm

Application (ex)

Supporting substances

~12nm

~5.4nm

~14nm

20nmPore diameter

Density Comparison

Al2O3Ingot Al2O3

Pores

ATRC* : New Powders in Examples *ATRC : Advanced TechnologyResearch Center

Alumina vs Mesoporous Alumina

Substance

Pore

Mesoporous Alumina

Adsorbingharmful substances

Thermal conductive fillers

medium & long term business plan - ircms.jp share of silicon lapping and polishing ... outline...

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