Malzeme Tanımı: Boş Baskı devre kartı (R-08)

Açıklamalar: Aşağıdaki özellikleri sağlayacaktır.

Teknik Özellikler: BOARD TYPE : 14-Layers Rigid END PRODUCT SPECIFICATION : IPC-6012 Class II S.M.C.'s : Both Sides ASSEMBLY PANEL SIZE : 260.1 x 188.6 mm. SINGLE BOARD SIZE : 240 x 168.5 mm. NUMBER OF PCBs IN PANEL : 1 MATERIAL LAYUP (Component side at top) : MATERIAL LAYER# THICKNESS & TOL SPECIFICATION ---------------- -------- ------------------ ------------------- Solder Mask Copper Plating 25 mic. Copper Layer-1 18 mic. FR4 150 mic. IPC-4101/26 Copper Layer-2 18 mic. FR4 150 mic. IPC-4101/26 Copper Layer-3 18 mic. FR4 150 mic. IPC-4101/26 Copper Layer-4 18 mic. FR4 150 mic. IPC-4101/26 Copper Layer-5 18 mic. FR4 IPC-4101/26 Copper Layer-6 70 mic. FR4 IPC-4101/26 Copper Layer-7 70 mic. FR4 IPC-4101/26 Copper Layer-8 70 mic. FR4 IPC-4101/26 Copper Layer-9 70 mic. FR4 IPC-4101/26 Copper Layer-10 18 mic FR4 150 mic. PC-4101/26 Copper Layer-11 18 mic FR4 150 mic. PC-4101/26 Copper Layer-12 18 mic FR4 150 mic. IPC-4101/26 Copper Layer-13 18 mic. FR4 150 mic. IPC-4101/26 Copper Layer-14 18 mic. Copper Plating 25 mic. Solder Mask PCB PROCESS REQUIREMENTS : TOTAL BOARD THICKNESS : 2.30 mm. MIN. INSULATOR THICKNESS : 50 um. MATERIAL TG MINIMUM : 170'C FINAL FINISH : ENIG/ENEPIG (Suitable for Lead-Free Reflow-Soldering) (ENEPIG preferred) GALVANIC GOLD PLATING : None

SOLDER RESIST : Liquid Photo Imageable (SMOBC-LPI), Side: Both, Color: Green LEGEND PRINT : None MIN. LINE WIDTH : 4.5 mils. MIN. SPACING : 4 mils. BARE BOARD TEST VOLTAGE : 25 VDC. BLIND-VIA : NO BURIED-VIA : NO CONTROLLED IMPEDANCE : NO DEFAULT TOLERANCES (BASED ON IPC-6012 Class II) : PTH Hole : +/- 0.100 mm. None-PTH Hole : +/- 0.050 mm. Routing : +/- 0.200 mm. Board Thickness : +/- 10% RULES AND NOTICES: 1.Dielectric materials should be Lead-Free compatible. 2.The given dielectric thicknesses between layers are expected values on finished PCBs.