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1 1 Link Technology and its Application Deog-kyoon Jeong Seoul National University Microprocessor Architecture Lab. 2 Outline Introduction Problems and Circuit Techniques Oversampling vs. Tracking receiver Gigabit Ethernet PHY Chip-to-chip/Bus Interface Conclusion

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Page 1: Link Technology and its Application - icdevice.co.kr file1 1 Link Technology and its Application Deog-kyoon Jeong Seoul National University Microprocessor Architecture Lab. 2 Outline

1

1

Link Technology and its Application

Deog-kyoon Jeong

Seoul National University

Microprocessor Architecture Lab.

2

Outline

z Introductionz Problems and Circuit Techniquesz Oversampling vs. Tracking receiverz Gigabit Ethernet PHYz Chip-to-chip/Bus Interfacez Conclusion

Page 2: Link Technology and its Application - icdevice.co.kr file1 1 Link Technology and its Application Deog-kyoon Jeong Seoul National University Microprocessor Architecture Lab. 2 Outline

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3

Introduction

z Increasing demand for high speed interconnect– Large data size in multimedia environment– Resource sharing through computer network– Data communication between high speed IC’s

z Applications– Digital video Interface for monitors

• PanelLink

– High bandwidth memory Interface• Rambus

– I/O sub-systems for computers• Network: Gigabit Ethernet, FiberChannel

• P1394

4

Why is Chip to Chip Communication soimportant?

❑ Rent’s Rule for MicroprocessorsNp = Kp Ng

β

Np = Number of Signal Pins

Ng = Number of Gates

Kp = 0.82, β = 0.45 for Microprocessors❑ For Pentium Pro, 387 pins with 5.5M Transistors

(474 pins According to Rent’s Rule)❑ In year 2000, 850 pins with 20M Transistors

Page 3: Link Technology and its Application - icdevice.co.kr file1 1 Link Technology and its Application Deog-kyoon Jeong Seoul National University Microprocessor Architecture Lab. 2 Outline

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5

Basic Electronics

z Transmitter – convert bits to an analog voltage

z Channel (Wire)– propagate the voltage

z Receiver– convert the analog voltage to bits

6

Problems and Circuit Techniques

z Circuit speed

z Interconnect Integrity– Pad capacitance– Bonding wire– Package trace– PCB trace

z PLL & DLL jitter in the receiver

z Wire limits

Page 4: Link Technology and its Application - icdevice.co.kr file1 1 Link Technology and its Application Deog-kyoon Jeong Seoul National University Microprocessor Architecture Lab. 2 Outline

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7

Circuit Speed and Technology Scaling

z Inverter speed scales roughly as L– Delay of most digital gates track an inverter

z Technology Development– 0.8um CMOS with 5V : 500Mbps ?– 0.5um CMOS with 3.3V : 800Mbps ?– 0.35um CMOS with 3.3V : 1.5Gbps ?– 0.25um CMOS with 2.5V : 2.5Gbps ?

8

Multiplexing Transmitter

• Typical Transmitter

• Multiplexing Transmitter

Can operate at lower speed

Page 5: Link Technology and its Application - icdevice.co.kr file1 1 Link Technology and its Application Deog-kyoon Jeong Seoul National University Microprocessor Architecture Lab. 2 Outline

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9

Multiplexing Transmitter

z Maximize the available bandwidth by multiplexing at theoutput

z Bandwidth limitation is where the multiplexing takes placez The other circuits except output escapes circuit speed

limitation

10

Output Multiplexingclk0

clk1

clk2

clk3

D0 D1 D2 D3 D4 D5 D6 D7 D8

clk0

clk1

clk1

clk2

clk7

clk0

D0 D1 D7

clk0

clk1

clk1

clk2

clk7

clk0

D0 D1 D7

out_b out

Page 6: Link Technology and its Application - icdevice.co.kr file1 1 Link Technology and its Application Deog-kyoon Jeong Seoul National University Microprocessor Architecture Lab. 2 Outline

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11

Typical Receiver

z Amplifier restores small swing input– Amplifier must limit on each bit

– If it does not limit, next bit will depend on previous bit → ISI– Single amplifier will limit performance

12

Demultiplexing Receiver

z Sampling and Amplifyingz Regenerative amplifier is highest gain-bandwidth product

amplifierz Demultiplexing at sampling switches

Page 7: Link Technology and its Application - icdevice.co.kr file1 1 Link Technology and its Application Deog-kyoon Jeong Seoul National University Microprocessor Architecture Lab. 2 Outline

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13

Demultiplexing Receiver

z Each receiver– Sample, amplify, reset

– If reset is complete, no ISI possible

Receiver

Din

Din

DataAlignment

D[0:7]

clk0

clk1

clk7

Receiver

Receiver

14

Input Receiver

Din Din

clk

clk clk

sb ssb

s

out

out_b

Page 8: Link Technology and its Application - icdevice.co.kr file1 1 Link Technology and its Application Deog-kyoon Jeong Seoul National University Microprocessor Architecture Lab. 2 Outline

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15

Signal Reflection & Wave Diagram

VS

RS

RL

Z0

V1+

V1-

V2+

V2-

V1+

V1+ = VS

Z0

RS + Z0V1

- = V1+

RL - Z0

RL + Z0

V2- = V1

-

RS - Z0

RS + Z0

16

Unterminated Linetd

P

P

0 td/2 3td/2

VS

VS

ZO

td

2td

VS

5td/2

Page 9: Link Technology and its Application - icdevice.co.kr file1 1 Link Technology and its Application Deog-kyoon Jeong Seoul National University Microprocessor Architecture Lab. 2 Outline

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17

Parallel Termination

RL = ZO

td

td

2td

VS

P

P0 td/2 3td/2

VS

VS

ZO

18

Series Termination

openRS= ZO

td

td

2td

VS/2

VS

P

P0 td/2 3td/2

VS/2 VS

VS

ZO

Page 10: Link Technology and its Application - icdevice.co.kr file1 1 Link Technology and its Application Deog-kyoon Jeong Seoul National University Microprocessor Architecture Lab. 2 Outline

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19

Signal Transmission Methods

V

V

Parallel Termination with Voltage Drive

Series Termination with Voltage Drive

Zo

Zo

RTERM = Zo

RTERM = Zo

20

Signal Transmission Methods

Parallel Termination with Current Drive

Source Termination with Voltage Drive

Zo

Zo

RTERM = Zo

RTERM = Zo

I

I

Page 11: Link Technology and its Application - icdevice.co.kr file1 1 Link Technology and its Application Deog-kyoon Jeong Seoul National University Microprocessor Architecture Lab. 2 Outline

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21

Power Issues

z Signal Power in the Transmission Line

– Current Drive with Parallel Termination

Vdd ISIGNAL Pr(1)

– Voltage Drive with Series Termination

C Vdd VSWING Pr(transition)

– Voltage Drive with Parallel Termination

Vdd2 / Zo

Zo2 Zo

Vdd

2 Zo

Vdd

22

Interconnection Topology

z Point-to-Point vs Bus Structure– Stub introduces additional impedance discontinuity– Even a 5-cm stub causes excess distortion

in 500Mbps signal

Page 12: Link Technology and its Application - icdevice.co.kr file1 1 Link Technology and its Application Deog-kyoon Jeong Seoul National University Microprocessor Architecture Lab. 2 Outline

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23

Point-to-Point and Bus Structure

z Stub is really a Problem in a Bus Structure

24

Signal Driver Circuits

z Unidirectional vs Bidirectional– 1x BW with Simple Circuit vs

2x BW and Circuit Complexity

z Differential vs Single-Ended– High SNR with Robustness vs

Low Pin Count with Accurate Reference

z Voltage Driver vs Current Driver– ECL-like vs Open Drain

Page 13: Link Technology and its Application - icdevice.co.kr file1 1 Link Technology and its Application Deog-kyoon Jeong Seoul National University Microprocessor Architecture Lab. 2 Outline

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25

Clock Receiving Schemes and Circuits

z PLL– High Order → Stability problem– Frequency synthesis easy

z DLL– Unconditionally stable– Frequency synthesis problematic– Narrow operating frequency range

26

Block Diagram & Basic Concept of PLL

VoltageControlledOscillator

Loop FilterCharge PumpPhase

FrequencyDetector

UP

DOWN

REF_CLK

VCO_CLK

Frequency Control

fREF

fVCO

Basic Concept : A clock generator whose frequency and phase are exactly synchronized to reference clock

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27

VCO

Loop FilterCharge PumpPhase

FrequencyDetector

UP

DOWN

VCO_CLK

Vctrl

fREF

fVCO

fVCO = fREFDelay Cells

28

VCO Characteristics

f

Vctrl

Linearity

fVCO

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29

Signal Waveforms of PLL

: P h a s e D i f f e r e n c e

R E F _ C K

V C O _ C K

S E T B

U P

D O W N

When VCO_CLK is slower than REF_CLK, the duration of UP is larger than that of DOWN

30

Signal Waveforms of PLL

: P h a s e D i f f e r e n c e

R E F _ C K

V C O _ C K

S E T B

U P

D O W N

When VCO_CLK is faster than REF_CLK, the duration of DOWN is larger than that of UP

Page 16: Link Technology and its Application - icdevice.co.kr file1 1 Link Technology and its Application Deog-kyoon Jeong Seoul National University Microprocessor Architecture Lab. 2 Outline

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31

Zero Delay Buffer

Oscillator

chip0 chip1

REF_CLK

Oscillator

chip0 chip1

REF_CLK

: PLL/DLL

32

Pre-Scalar

VoltageControlledOscillator

Loop FilterCharge PumpPhase

FrequencyDetector

UP

DOWN

REF_CLK

VCO_CLK

Frequency Control

fREF

fVCO

N

fVCO

N= fREF fVCO = N fREF

Page 17: Link Technology and its Application - icdevice.co.kr file1 1 Link Technology and its Application Deog-kyoon Jeong Seoul National University Microprocessor Architecture Lab. 2 Outline

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33

Multi-Phase Clocking

REF_CLKVCO_CLK0

PLL

VCO

VCO_CLK1

VCO_CLK2

VCO_CLK3

34

delaycell0

Idummy Ivctrl

delaycell1

Idummy Ivctrl

delaycellN-1

Idummy Ivctrl

PhaseDetector

UP

DOWN

ChagePump

LoopFilter

Control Voltage (Vctrl)

Voltage Controlled Delay Chain

REF_CLK DLL_CLK

Block Diagram of DLL

Page 18: Link Technology and its Application - icdevice.co.kr file1 1 Link Technology and its Application Deog-kyoon Jeong Seoul National University Microprocessor Architecture Lab. 2 Outline

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35

REF_CLK

DLL_CLK

UP

DOWN

REF_CLK

DLL_CLK

UP

DOWN

( a )

REF_CLK

DLL_CLK

UP

DOWN

REF_CLK

DLL_CLK

UP

DOWN

( b )

36

Wire Frequency Limits

z Not perfect conductor– Series resistance

• Skin Effect

– Dielectric loss

z Loss depends on:– Frequency

• Effective resistance larger at high frequencies

– Aspect ratio• Length/width

– Materials• Teflon better than FR4

• Conductor material

Page 19: Link Technology and its Application - icdevice.co.kr file1 1 Link Technology and its Application Deog-kyoon Jeong Seoul National University Microprocessor Architecture Lab. 2 Outline

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37

Cable Properties

Transmission through 6 or 12 meters of RG55U cable

38

Effect of LossLow pass filtering effect

Filtering effect leads to intersymbol interference (ISI)

• Long sequence of ‘1’ will get to full rail

Page 20: Link Technology and its Application - icdevice.co.kr file1 1 Link Technology and its Application Deog-kyoon Jeong Seoul National University Microprocessor Architecture Lab. 2 Outline

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39

Effect on Data Eyes

Bandwidth of channel = 80ps = 2GHz bit time(ps)

40

Overcoming Wire Limitation

z Equalization– Output data is run through FIR filter, which is inverse filter of cable

– Use binary weighted current source transistors

z Multibit symbols– Transmit more than 1 bit per symbol

– Encode bits in amplitude level

z Channel coding– Transition maximization, DC balance

Page 21: Link Technology and its Application - icdevice.co.kr file1 1 Link Technology and its Application Deog-kyoon Jeong Seoul National University Microprocessor Architecture Lab. 2 Outline

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41

Equalization

Example of transmitter equalization

Relatively less ISI

Relatively larger ISI

42

Multiple Bits per Symbol4 PAM

Multiple

Bit Eye

Page 22: Link Technology and its Application - icdevice.co.kr file1 1 Link Technology and its Application Deog-kyoon Jeong Seoul National University Microprocessor Architecture Lab. 2 Outline

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43

Oversampling vs. Tracking Receiver

z Tracking system– Architecture– Problems

z Oversampling system– Architecture– Merits & limitation

z Performance comparisons

44

Data Receiving Schemes and Circuits

z 1X sampling– Most systems– RAMBUS

z 2X over-sampling– GigaBlaze(TM) SerialLink: LSI Logic

z 3X over-sampling– PanelLink: Silicon Image

Page 23: Link Technology and its Application - icdevice.co.kr file1 1 Link Technology and its Application Deog-kyoon Jeong Seoul National University Microprocessor Architecture Lab. 2 Outline

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45

3X over-sampling Architecture

z Digital Phase Tracking– No Storage Capacitance => Fast Acquisition

z Overcoming circuit skew and channel skewz Power Consumption

Data

0 0 0 1 1 1 0 0 0

Data

? 0 ? ? 1 ? ? 0 ?

(a) (b)

46

Tracking System

TX clock

TransmitterTXdata

Transmission media

Clockrecovery(PLL)

Datasampler

Serial toparallel

converter

RXdata

RecoveredTX clock

Receiver

÷N Systemclock

Clock recovery circuit: recovers clock from high-speed signal through transmission media

Clock recovery, data sampler:Operates in data transfer rates

Page 24: Link Technology and its Application - icdevice.co.kr file1 1 Link Technology and its Application Deog-kyoon Jeong Seoul National University Microprocessor Architecture Lab. 2 Outline

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47

Data/Clock Recovery in Tracking Receiver

UP/DOWN signals are used for frequency control in PLL

D QDFF

D QDFF

UP

DOWNSerial data

Recovered clock

Serial data

Recovered clock

UP

DOWN

0 1 1 1 0 1

Uncertain region of data sampling

Recovered dataRecovered data

48

Tracking System�Û� ÷ÛÏz 3¬ Û�

– Serial data� ��¿ �S |o(¯LÛ 0 ÏS 1)� ´� 3¬� 3¬»Ë× G�Ô

– Serial data� `� Î Intersymbol Interference� 7� 3¬� jitter Û�

z /3ï ´�– ´�Û 3¬» £Û� /3ï¿ �Ë�×S �Ï3 £C:

• 3¬� ���Ã(rise/fall time)3 /3ï ¬� ��« / |o� Û��S /3ï �Ë�� �Ï ��

• /3ï �Ë«� logic threshold �� (ç�, Ã�, ´Ô °)

• K�; �WS �¯ �Ã

• ïß� �WS �¯ �Ã

Page 25: Link Technology and its Application - icdevice.co.kr file1 1 Link Technology and its Application Deog-kyoon Jeong Seoul National University Microprocessor Architecture Lab. 2 Outline

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49

Oversampling System

3¬ Û�K�S×�§� �c� 3¬��ïTX clock

TransmitterTXdata

Transmission media

Multi-phasePLL

Over-sampler

RXdata

RX clock

Receiver

Parallelconverter

Digitalclock/data

recovery Systemclock

M 1M

TX 3¬» RX 3¬ÿ100ppmÔ�� »Ë× ç3¿¿d: plesiochronous system

50

Data/Clock Recovery in Oversampling Receiver

Serial data

0 1 1 1 0 1Data

1 0 0 0 1 1 1 1 1 1 1 1 1 0 0 0 0 1 1

Multi-phaseoversampling

Oversampleddata

Data transitionpositions

Recovereddata 0 1 1 1 0 1

� /3ï [3 �Ï� k3�Û /3ï; ß�' /3ï ß�Ã�¿ ã7|û�� Ã��; 3�ç

Page 26: Link Technology and its Application - icdevice.co.kr file1 1 Link Technology and its Application Deog-kyoon Jeong Seoul National University Microprocessor Architecture Lab. 2 Outline

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51

»�·� /3ï/3¬ ´� ïß: d§Ï

z dÏ

– Serial data� ó¿�K ´�Û 3¬ÿ ,� ;Ô

– �Ë� 3¬» £Û� »�·�×S �Ï� ç3� ó¿: »�·� �Ë�Ãh3 ÐS

z §Ï: »�·�� ï7 /3ï ´� �Ï ãç(δ)

– S: »�·� �Ë� Ãh

z 3o�

– »�·�ç� QC: ��§s� ´`� \¿

20

S≤≤ δ

52

g� £�� t� ðd ��

Parameter Default valueData rateData streamPulse transition timeSNR at receiver sideTransmitter jitterReceiver jitterChannel bandwidth

1GbaudPseudo random number sequence (no coding)200ps12dB70ps70ps667MHz

¿Ô:- �Û� �c�ÿ �;� 3¬ jitter � P» »Ë× ¿¬¬� ¿�- �Ï� ¿¬¬ÿ 3�À7 ¿¿¬ t» �ï xð� ¿�- g� jitterÿ noiseS Gaussian random number� g7�- TX 3¬» RX 3¬� »Ë× ç3S 100ppm- ðdÿ BER(Bit error rate)� àÔ

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53

ðd ��: »�·�ç

1.0E- 06

1.0E- 05

1.0E- 04

1.0E- 03

1.0E- 02

3 4 5 6 7 8 9 10

O versampling ratio

BE

R

BS _i LJ_ i HS _ i

BS _f LJ_ f HS _ f

Prefix: �P /3- BS: 12dB-70ps- LJ: 12dB-30ps- HS: 18dB-70ps

Suffix: ×�ï Ô�- i: 3�À7 /3ï ´�- f: £ÛÀ7 /3ï ´�

* o�- ÿ×ç� »�·�¿�×ç³£ ßk- `�3 �ïÀ7 |o�S 5ï 3��»�·�S ó�'

54

ðd ��: »Ë× ç3

1 .0E- 04

1 .0E- 03

1 .0E- 02

1 .0E- 01

1 .0E+0 0

-1 60 0 -1 20 0 -8 00 -4 00 0 4 00 8 00 1 20 0 1 60 0

F requency d ifference [ppm]

BER

x3_ i x4_ i x5_ i

x3_ f x4_ f x5_ f

Prefix: »�·�ç- x3: 3ï »�·�- x4: 4ï »�·�- x5: 5ï »�·�

Suffix: ×�ï Ô�- i: 3�À7 /3ï ´�- f: £ÛÀ7 /3ï ´�

* o�- ÿ×ç »�·�ç; �,£ÛÀ7 /3ï ´�ÿ»Ë× ç3� �ÿ�«ðd ¿� (èdðÿ ��)

Page 28: Link Technology and its Application - icdevice.co.kr file1 1 Link Technology and its Application Deog-kyoon Jeong Seoul National University Microprocessor Architecture Lab. 2 Outline

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55

ðd ��: `�

1 .0 E -06

1 .0 E -05

1 .0 E -04

1 .0 E -03

1 .0 E -02

1 .0 E -01

1 .0 E +0 0

0 5 1 0 1 5 2 0SN R [d B ]

BE

R

x3_ i x5_ i

x3_ f x5_ f

T_ 0% T_ 10 %

T_ 20 %

×�ï Ô�- T_0%: �Ë� ãç¿0%7 Tracking �c�- T_10%: �Ë� ãç¿10%7 Tracking �c�

* �Ë� ãç:- 0%: ¿d BER3 mÿÏ�Û �Ë�- 50%: /3ï� [3�Ï�Û �Ë�

* o�3ïÿ 5ï� »�·��c�ÿ 12%ÿ 7%��Ë� ãç; ÕStracking �c�� 3¸

56

Gigabit Ethernet PHY

z Major circuits– Multiphase PLL (phase-locked loop)– Serializer– Line driver– On-chip terminator

z Block diagramz Chip

Page 29: Link Technology and its Application - icdevice.co.kr file1 1 Link Technology and its Application Deog-kyoon Jeong Seoul National University Microprocessor Architecture Lab. 2 Outline

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57

Multiphase PLL

Phase-frequencydetector

Chargepump

LoopfilterSystem

clock

Multiphase clocks: 0 15 1 16 13 28 14 29

Up

Down

�¯ �à Ûs �÷

Differentialdelay cell

58

Serializer

ck4

ck0

d0

ck5

ck1

d1

ck3

ck9

d9

ck4

ck0

d0

ck5

ck1

d1

ck3

ck9

d9

M1

M2 M3

Dout- Dout+

- d0 ~ d9: 10-b parallel data- ck0 ~ ck9: 10-phase clocks from multiphase PLL

(30Û� multiphase 3¬ Ð�Û 10Û; kh)

Level shifter (logical high level)P-MOS resistive load

Page 30: Link Technology and its Application - icdevice.co.kr file1 1 Link Technology and its Application Deog-kyoon Jeong Seoul National University Microprocessor Architecture Lab. 2 Outline

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59

Line Driver

Din- Din-

TX-TX+

Currentcontrol

Din- Din-

TX+ TX-

Voltage mode driver: - Active pull-up/pull-down - Driving current is not constant

Current mode driver: - Constant current pull-down - Resistive pull-up by load

60

On-Chip Terminator

RX+

RX-

N-MOSControl

P-MOSControl

Resistancecontrol

RX+ RX-

Io-Io0

Vm

Vl

Voltage

Current

Current in N-MOS

Current in P-MOS

NetCurrentVh

Current

Voltage

Linear-regionin P-MOS

Center-taptermination

Vddtermination

I-V characteristicsCircuits

Page 31: Link Technology and its Application - icdevice.co.kr file1 1 Link Technology and its Application Deog-kyoon Jeong Seoul National University Microprocessor Architecture Lab. 2 Outline

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61

Gigabit Ethernet SERDES Chip Block

30-phasePLL

Serializer

On-chipTermin-

nator

Framealigner

PhaseTracker

30-phaseoversampler

10bTX data

125MHzTX clock

10bRX data

ClockSelector

RX clock

1.25GbaudTX signal

1.25GbaudRX signal

62

Gigabit Ethernet SERDES Chip Photo

- Process: 3-metal 0.35µm CMOS- Die size: 2.49x2.65mm2 - Package: 64-pin PQFP- Total power consumption: 500mW

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63

State-of-the-Art Pin Interfaces

Bandwidth Signaling TechnologyInstitution Reference

Rambus 660Mbps Open Drain 0.3um CMOS ISSCC-96

IBM 1062Mbps ECL 0.5um CMOS ISSCC-95

Intel 2x450Mbps Bidirectional 0.6um CMOS ISSCC-95

Hitachi 2x300Mbps Bidirectional 0.5um CMOS ISSCC-95

Rambus 500Mbps Open Drain 0.6um CMOS ISSCC-94

Stanford 500Mbps 1V-CMOS 0.6um CMOS Symp-94

Seoul NU 770Mbps Open Drain 0.9um CMOS Symp-94

NEC 125Mbps GTL/LV-TTL 0. 5um CMOS Symp-93

ISSCC-980.35um CMOSOpen Drain800Mbps

Symbios

Rambus,Intel

Silicon image

1.25Gbps Open Drain? 0.5um CMOS? ISSCC-97

3x1.5Gbps Open Drain 0.35um CMOS ISSCC-98

64

RAMBUS System

ClockGenerator

CPU DRAM0 DRAM1 DRAM31

Vterm=2.5

SOut Sin SOut Sin SOut Sin

9 Z=Z0

R=Z0

BusData[8:0]

BusCtrl

BusEnable

ClockFromMaster

ClockToMaster

Vref=2.2V

Gnd(8)

Vdd(5)

Data Bandwidth: 500Mb/sSwing Voltage: 600mV

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65

RAMBUS signaling

Bus Clock

DataChannel

TX_DLL

PhaseDetector

XOR

Tclk

Output Driver RX_DLL

PhaseDetector

Rclk

Input Receiver

Input Receiver

Bus Clock

Tclk

Rclk

DATA DN DN+1 DN+2 DN+3

66

RAMBUS Output Driver

8

Tclk

Tclk_b

6 Current ControlRegister

Current ControlCircuit

W2W4W8W16W32W

Pad

0 2 4 6 1 3 5 7

Vterm

Vref

Von

“0”

“1”

Page 34: Link Technology and its Application - icdevice.co.kr file1 1 Link Technology and its Application Deog-kyoon Jeong Seoul National University Microprocessor Architecture Lab. 2 Outline

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67

RAMBUS Input Receiver

Data

Clock_b

Clock_b

Clock

Vref

Clock

Vbias

Clock_b

Out_b

Out

68

Conclusion

z o�

– CMOS high speed interconnect� Oversampling ïT3h� dÏ

• £7 ´Ôû�� �7 3�ð

• Ó�÷ è�� �� �7 3¬ ´� dä

• �Ï �d� �_�· K�� ´ß� 7� �Ïà Ãì �K�

– ãw�+, �Óã Ã`, �L �gk 7ïW3c� 3h

z d� Ã�– ³§ïÿ »� ïï Ã� ïß §Û�: Pèd �L �Ï +ð» data

multiflexing ïT� kh�« »�ïï ïß� �W� t(

– ³§ï�c��Û s? Cc �ô +/ §Û�: Ã�÷Û Cc, �gk Cc, �c� Cc °� �L� §; Cc� ��