intigrated circuit
DESCRIPTION
Pakistan Zindabad.....TRANSCRIPT
![Page 1: Intigrated circuit](https://reader033.vdocuments.mx/reader033/viewer/2022061220/54bb8cb34a7959ac558b4591/html5/thumbnails/1.jpg)
![Page 2: Intigrated circuit](https://reader033.vdocuments.mx/reader033/viewer/2022061220/54bb8cb34a7959ac558b4591/html5/thumbnails/2.jpg)
INTEGRATEDCIRCUITS by KHURRAM IMTIAZ 03F-EE-39
![Page 3: Intigrated circuit](https://reader033.vdocuments.mx/reader033/viewer/2022061220/54bb8cb34a7959ac558b4591/html5/thumbnails/3.jpg)
CONTENTS
SCALE OF INTEGRATION CLASSIFICATION MONOLITHIC IC THICK & THIN FILM IC MULTICHIP IC LINEAR IC DIGITAL IC ADVANTAGES & AND DISADVANTAGES
![Page 4: Intigrated circuit](https://reader033.vdocuments.mx/reader033/viewer/2022061220/54bb8cb34a7959ac558b4591/html5/thumbnails/4.jpg)
WHAT IS AN INTEGRATED CIRCUIT?
An IC is complete electronic circuit in which both the active & passive components are fabricated on a tiny single chip of SLICON.
Active components are those components which are able to produce gain.
Passive components are those components which do not have this ability.
![Page 5: Intigrated circuit](https://reader033.vdocuments.mx/reader033/viewer/2022061220/54bb8cb34a7959ac558b4591/html5/thumbnails/5.jpg)
HISTORY
Tremendous changes in Electronic circuitry starts after the invention of Triode by L.D Forest in 1907.
Invention of Transistor in 1948 by W.H Bardeen & I.Bardeen electronic circuit became reduced in size.
In early 1960 field of microelectronic born to meet the requirement of Military.
![Page 6: Intigrated circuit](https://reader033.vdocuments.mx/reader033/viewer/2022061220/54bb8cb34a7959ac558b4591/html5/thumbnails/6.jpg)
CONTD…
J.S Kilby was first person who develop IC.
Soon after Robert Noyce fabricate a complete IC including interconnection on single chip.
![Page 7: Intigrated circuit](https://reader033.vdocuments.mx/reader033/viewer/2022061220/54bb8cb34a7959ac558b4591/html5/thumbnails/7.jpg)
SCALE OF INTEGRATION
SSI – small scale integration
MSI – medium scale integration
LSI – large scale integration
VLSI – very large scale integration
ULSI – ultra large scale integration
GSI – giga scale integration
![Page 8: Intigrated circuit](https://reader033.vdocuments.mx/reader033/viewer/2022061220/54bb8cb34a7959ac558b4591/html5/thumbnails/8.jpg)
CIRCUITS PER CHIP
SSI < 12 (No. of comp.less than 50) MSI 12 – 99 (No. of comp. 50 – 5000) LSI 100 – 9999 (No. of comp. 5000 – 100000) VLSI 10000 – 99999 (No. of comp. 100000 –
1000000) ULSI 100000 – 999999 (No. of comp. 1000000 –
10000000) GSI >1000000 (No. of comp. 100000000)
![Page 9: Intigrated circuit](https://reader033.vdocuments.mx/reader033/viewer/2022061220/54bb8cb34a7959ac558b4591/html5/thumbnails/9.jpg)
CLASSIFICATION OF IC’s
On structure basis On function basis
![Page 10: Intigrated circuit](https://reader033.vdocuments.mx/reader033/viewer/2022061220/54bb8cb34a7959ac558b4591/html5/thumbnails/10.jpg)
ON STRUCTURE BASIS
MONOLITHIC INTEGRATED CIRCUITSTHICK & THIN FILM INTEGRATED
CIRCUITSHYBRID / MULTICHIP INTEGRATED
CIRCUITS
![Page 11: Intigrated circuit](https://reader033.vdocuments.mx/reader033/viewer/2022061220/54bb8cb34a7959ac558b4591/html5/thumbnails/11.jpg)
MONOLLITHIC IC
The word monolithic means “SINGLE STONE” or more appropriately “Single solid structure’.
In this all circuit all components are fabricated within single continuous piece of silicon crystalline material called “WAFER” or “SUBSTRATE”
![Page 12: Intigrated circuit](https://reader033.vdocuments.mx/reader033/viewer/2022061220/54bb8cb34a7959ac558b4591/html5/thumbnails/12.jpg)
ADVANTAGES & DISADVANTAGES OF MONOLITHIC IC’s
These have advantage of lower cost and high reliability.
However they have poor isolation between the components, short range of passive components, no flexibility of circuit design.
INDUCTORS cannot be fabricated.
![Page 13: Intigrated circuit](https://reader033.vdocuments.mx/reader033/viewer/2022061220/54bb8cb34a7959ac558b4591/html5/thumbnails/13.jpg)
THICK & THIN FILM IC
The difference between between thick & thin film are not their relative thickness but method of depositing film.
These IC’s are not formed within single silicon wafer but surface of an insulating substrate such as glass or ceramic materials.
Only passive components are formed through thick or thin film.
![Page 14: Intigrated circuit](https://reader033.vdocuments.mx/reader033/viewer/2022061220/54bb8cb34a7959ac558b4591/html5/thumbnails/14.jpg)
THIN FILM IC
Such circuits are constructed by depositing film of conducting material through a mask on the surface of substrate made of glass or ceramic.
Following methods are used to produce thin film.
VACUUME EVAPORATION CATHODE SPRUTTERING
![Page 15: Intigrated circuit](https://reader033.vdocuments.mx/reader033/viewer/2022061220/54bb8cb34a7959ac558b4591/html5/thumbnails/15.jpg)
THICK FILM IC
These are printed thin film circuits.Silk screen printing techniques are
employed to create the desired circuit pattern on the surface of substrate
![Page 16: Intigrated circuit](https://reader033.vdocuments.mx/reader033/viewer/2022061220/54bb8cb34a7959ac558b4591/html5/thumbnails/16.jpg)
ADVANTAGES & DISADVANTAGES OF FILM IC’s
These have advantages of forming passive components of broader range.
High tolerance Isolation is betterBetter high frequency performance.
![Page 17: Intigrated circuit](https://reader033.vdocuments.mx/reader033/viewer/2022061220/54bb8cb34a7959ac558b4591/html5/thumbnails/17.jpg)
CONTD…
Not able to fabricate active componentsComparatively higher costLarger physical size
![Page 18: Intigrated circuit](https://reader033.vdocuments.mx/reader033/viewer/2022061220/54bb8cb34a7959ac558b4591/html5/thumbnails/18.jpg)
HYBRID IC
These IC’s are formed either by interconnecting a number of individual chips or by combination of film & monolithic ICs
They have chief advantage high flexibility but too much expensive for mass production and least reliability.
![Page 19: Intigrated circuit](https://reader033.vdocuments.mx/reader033/viewer/2022061220/54bb8cb34a7959ac558b4591/html5/thumbnails/19.jpg)
ON FUNCTION BASIS
LINEARDIGITAL
![Page 20: Intigrated circuit](https://reader033.vdocuments.mx/reader033/viewer/2022061220/54bb8cb34a7959ac558b4591/html5/thumbnails/20.jpg)
LINEAR IC’s (LICs)
These also referred as “Analog IC”.They possess much high reliabilityTheir use is much less as compared to
digital and mostly used in military and industrial application
![Page 21: Intigrated circuit](https://reader033.vdocuments.mx/reader033/viewer/2022061220/54bb8cb34a7959ac558b4591/html5/thumbnails/21.jpg)
USE OF LIC’s
Operational amp. Power amp. Microwave amp. Voltage comparators
Small – signal amp. RF & IF amp. Multipliers Voltage regulators
![Page 22: Intigrated circuit](https://reader033.vdocuments.mx/reader033/viewer/2022061220/54bb8cb34a7959ac558b4591/html5/thumbnails/22.jpg)
DIGITAL IC’s
About 80% of IC market has been captured by digital IC which is mostly used in computer IC
Digital IC contain circuits whose input and output voltages are limited to 2 possible level – high and low
![Page 23: Intigrated circuit](https://reader033.vdocuments.mx/reader033/viewer/2022061220/54bb8cb34a7959ac558b4591/html5/thumbnails/23.jpg)
USES OF DIGITAL IC’s
Digital circuits Flip – flops Counters Clock chips
Calculator chips Memory chips Microprocessors
![Page 24: Intigrated circuit](https://reader033.vdocuments.mx/reader033/viewer/2022061220/54bb8cb34a7959ac558b4591/html5/thumbnails/24.jpg)
ADVANTAGES OF IC’s
Extremely small physical size
Very small weight Reduced cost Extremely high reliability Increased response time &
speed Low power consumption Easy replacement Higher yield
![Page 25: Intigrated circuit](https://reader033.vdocuments.mx/reader033/viewer/2022061220/54bb8cb34a7959ac558b4591/html5/thumbnails/25.jpg)
DRAWBACK OF IC’s
Coils & inductors cannot be fabricated IC’s function are fairly low voltageThey handle only limited amount of powerThey are quite delicate and cannot
withstand rough handling or excessive heat
![Page 26: Intigrated circuit](https://reader033.vdocuments.mx/reader033/viewer/2022061220/54bb8cb34a7959ac558b4591/html5/thumbnails/26.jpg)