intel silicon photonic 100g cwdm4 - i-micronews · intel’ssilicon photonic 100g cwdm4 qfsp28...
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©2020 by System Plus Consulting | SP20544 Intel Silicon Photonic 100G CWDM4 QFSP28 Transceiver | Sample 1
22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr
Intel Silicon Photonic 100G CWDM4 QFSP28 Transceiver - Ref. SPTSBP3SP20544 - Solid State Lighting report by Sylvain HALLEREAU
Laboratory Analysis by Nicolas RADUFEMarch 2020 – Sample
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
©2020 by System Plus Consulting | SP20544 Intel Silicon Photonic 100G CWDM4 QFSP28 Transceiver | Sample 2
Table of ContentsOverview / Introduction 3
o Executive Summaryo Reverse Costing Methodology
Company Profile 8o Intelo Intel 100G CWDM4 Edition Teardown
Market Analysis 16o Ecosystem & Forecast
Physical Analysis 20
o CWDM4 Connector Teardown Module View Function Identification
o Transmitter Block View, Dimensions and Cross-Section Fiber Optic Coupler, Prism and Rotator Light Way and Lens Module
o MZI Modulator Driver Die Die Overview and Dimensions Die Process and Cross-Section
o Silicon Photonic Die Die Overview & Dimensions InP Laser process and Cross-Section MZI process and Cross-Section Light Extraction and Cross-Section Waveguide process and Cross-Section Die Process Characteristics
o Receiver Block Fiber Optic Coupler Demultiplexer
o Germanium Photodiode Die Die View & Dimensions Die Process and Cross-Section
o TIA Die Die Overview & Dimensions Die Process and Cross-Section
o MACOM MG37049G Die Die Overview & Dimensions Die Process and Cross-Section
Comparison Intel Silicon Photonic Die PSM4 and CWDM4 195
Manufacturing Process 2019o MZI Driver Die Front-End Process & Fabrication Unito Silicon Photonic Die Process Flowo Silicon Photonic Die Front-End Fabrication Unito Receiver Fiber Optic coupler, Demmultiplexer, Process Flow and costo Germanium Photodiode Die Process Flow & Fabrication Unito TIA Die Front-End Process & Fabrication Unito MACOM M37049G Die Front-End Process & Fabrication Unit
Cost Analysis 218o Summary of the cost analysiso Yields Explanation & Hypotheses
o Transmitter Blocko Si Photonic Die
o Wafer costo Step costo Die cost
o MZI Driver Dieo MACOM M37049Go Optical Elementso Assembly
o Receiver Blocko Ge Photodiode Dieo TIA Dieo MACOM M37049Go Optical Element, Demultiplexero Assembly
Feedback 255
System Plus Consulting services 257
©2020 by System Plus Consulting | SP20544 Intel Silicon Photonic 100G CWDM4 QFSP28 Transceiver | Sample 3
Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossary
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
Related Reports
About System Plus
Executive Summary
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of theIntel’s Silicon Photonic 100G CWDM4 QFSP28 Transceiver.
• Intel has already shipped more 3millions units 100G pluggable transceivers in only few years. With their CWDM4 100Gtechnology, Intel is the first to offer a silicon photonic solution up to 10km. The 100G PSM4 and CWDM4 are the first step, Intel’s200G and 400G products are expected to enter volume production in the second half of 2020.
• The Intel's 100G CWDM4 QSFP28 Transceiver allows to communicate up to 10km in Coarse Wavelength Division Multiplexing.The transceiver reuses a part of PSM4 technology, but lot of technical difference solutions have been selected by Intel.
• The transceiver came with two separated lines with several dies. The transmitter silicon photonic die integrates 4 InP lasers forthe 4 wavelengths in a different configuration than the PSM4. On the same die, a Mach-Zehnder modulator is added in order tomodulate the signal but the CWDM MZI is more complex. The light extraction is performed by the edge of the die and not by amirror. Other components have been added to the system in order to focus or isolate the signal. Data are processed by using afour channel 25G optical Clock and Data Recovery (CDR) component from MACOM.
• The receiver function is performed by 4 germanium photodiodes die and a TransImpedance Amplifier (TIA) circuit. The Gephotodiodes are manufactured on a dedicated SOI substrate. An optical demultiplexer is assembled between the SiGephotodiode and the fiber optic.
• The report shows the potential of Intel in terms of packaging, and photonics. In a very small form factor, Intel managed tointegrate four lasers, a photonic driver, optical modules, CDR functionality, high performance photodiodes, two advancedsubstrates and materials for optic. This report shows the implement of the chiplet configuration along with a detaileddescription of the transmitter and receiver line.
• This report is an exhaustive analysis of the main components of the Intel 100G CWDM4 connector, including a full analysis of theSilicon Photonic die, the TIA circuit, the Mach-Zehnder Driver circuit, the MACOM circuit and the germanium photodiodes alongwith a cost analysis and price estimate. The 2 fiber optic couplers, focusing lens and the isolator are described and the price isestimated. Moreover, a comparison with Intel PSM4 silicon photonic circuit is performed.
©2020 by System Plus Consulting | SP20544 Intel Silicon Photonic 100G CWDM4 QFSP28 Transceiver | Sample 4
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
o 100G CWDM4 Teardowno Transmitter Block
o View, Dimensions, Cross-Section, Fiber Optic Coupler
o MZI Modulator Driver Dieo Die View & Cross-section
o Silicon Photonic Dieo InP Laser Cross-Sectiono MZI Modulator Cross-Secto Light Extractiono Waveguide Cross-Section
o Receiver Blocko Fiber Optic Coupler o Demultiplexer
o Ge Photodiode Dieo View & Processo Die Cross-Section
o TIA Dieo Macom M37049G Die
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
Related Reports
About System Plus
Intel 100G CWDM
Intel 100G CWDM Front side©2020 by System Plus Consulting
Intel 100G CWDM Front, Side and Back View©2020 by System Plus Consulting
Dimensionso Height: 126 mmo Width: 18.5 mmo Thickness: 8.6 mm
Weighto 69g
126 mm
76 mm
8.6 mm
12 mm
72.5 mm
©2020 by System Plus Consulting | SP20544 Intel Silicon Photonic 100G CWDM4 QFSP28 Transceiver | Sample 5
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
o 100G CWDM4 Teardowno Transmitter Block
o View, Dimensions, Cross-Section, Fiber Optic Coupler
o MZI Modulator Driver Dieo Die View & Cross-section
o Silicon Photonic Dieo InP Laser Cross-Sectiono MZI Modulator Cross-Secto Light Extractiono Waveguide Cross-Section
o Receiver Blocko Fiber Optic Coupler o Demultiplexer
o Ge Photodiode Dieo View & Processo Die Cross-Section
o TIA Dieo Macom M37049G Die
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
Related Reports
About System Plus
Intel 100G CWDM Teardown
©2020 by System Plus Consulting | SP20544 Intel Silicon Photonic 100G CWDM4 QFSP28 Transceiver | Sample 6
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
o 100G CWDM4 Teardowno Transmitter Block
o View, Dimensions, Cross-Section, Fiber Optic Coupler
o MZI Modulator Driver Dieo Die View & Cross-section
o Silicon Photonic Dieo InP Laser Cross-Sectiono MZI Modulator Cross-Secto Light Extractiono Waveguide Cross-Section
o Receiver Blocko Fiber Optic Coupler o Demultiplexer
o Ge Photodiode Dieo View & Processo Die Cross-Section
o TIA Dieo Macom M37049G Die
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
Related Reports
About System Plus
Die View & Dimensions – Silicon Photonic Die
• Die area: XXmm² (XX x XX mm)
• Nb of PGDW per 12-inch wafer: XX
• Pad number: XX
XX toward the Driver IC assembled in flip chip
XX in wire bonding toward the PCB
XXmm
XX
mm
Die Overview©2020 by System Plus Consulting
PGDW: Potential Good Dies per Wafer.
©2020 by System Plus Consulting | SP20544 Intel Silicon Photonic 100G CWDM4 QFSP28 Transceiver | Sample 7
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
o 100G CWDM4 Teardowno Transmitter Block
o View, Dimensions, Cross-Section, Fiber Optic Coupler
o MZI Modulator Driver Dieo Die View & Cross-section
o Silicon Photonic Dieo InP Laser Cross-Sectiono MZI Modulator Cross-Secto Light Extractiono Waveguide Cross-Section
o Receiver Blocko Fiber Optic Coupler o Demultiplexer
o Ge Photodiode Dieo View & Processo Die Cross-Section
o TIA Dieo Macom M37049G Die
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
Related Reports
About System Plus
InP Laser Diode – Silicon Photonic Die
©2020 by System Plus Consulting | SP20544 Intel Silicon Photonic 100G CWDM4 QFSP28 Transceiver | Sample 8
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
o 100G CWDM4 Teardowno Transmitter Block
o View, Dimensions, Cross-Section, Fiber Optic Coupler
o MZI Modulator Driver Dieo Die View & Cross-section
o Silicon Photonic Dieo InP Laser Cross-Sectiono MZI Modulator Cross-Secto Light Extractiono Waveguide Cross-Section
o Receiver Blocko Fiber Optic Coupler o Demultiplexer
o Ge Photodiode Dieo View & Processo Die Cross-Section
o TIA Dieo Macom M37049G Die
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
Related Reports
About System Plus
InP Laser Diode – Silicon Photonic Die
©2020 by System Plus Consulting | SP20544 Intel Silicon Photonic 100G CWDM4 QFSP28 Transceiver | Sample 9
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
o 100G CWDM4 Teardowno Transmitter Block
o View, Dimensions, Cross-Section, Fiber Optic Coupler
o MZI Modulator Driver Dieo Die View & Cross-section
o Silicon Photonic Dieo InP Laser Cross-Sectiono MZI Modulator Cross-Secto Light Extractiono Waveguide Cross-Section
o Receiver Blocko Fiber Optic Coupler o Demultiplexer
o Ge Photodiode Dieo View & Processo Die Cross-Section
o TIA Dieo Macom M37049G Die
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
Related Reports
About System Plus
Light Extraction– Silicon Photonic Die
Light extraction after delayering – Optical view©2020 by System Plus Consulting
©2020 by System Plus Consulting | SP20544 Intel Silicon Photonic 100G CWDM4 QFSP28 Transceiver | Sample 10
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
o 100G CWDM4 Teardowno Transmitter Block
o View, Dimensions, Cross-Section, Fiber Optic Coupler
o MZI Modulator Driver Dieo Die View & Cross-section
o Silicon Photonic Dieo InP Laser Cross-Sectiono MZI Modulator Cross-Secto Light Extractiono Waveguide Cross-Section
o Receiver Blocko Fiber Optic Coupler o Demultiplexer
o Ge Photodiode Dieo View & Processo Die Cross-Section
o TIA Dieo Macom M37049G Die
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
Related Reports
About System Plus
Die Cross-Section – 4x Ge Photodiode Die
Die Cross-Section – Metal Layers©2020 by System Plus Consulting
©2020 by System Plus Consulting | SP20544 Intel Silicon Photonic 100G CWDM4 QFSP28 Transceiver | Sample 11
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flowo Optical Elementso MZI Driver Die Fab Unito Si Photonic Process Flowo Si Photonic Fabrication Unito Ge Photo Fabrication Unito TIA Die Fabrication Unito MACOM Die Fabrication Unit
Cost Analysis
Feedbacks
Related reports
About System Plus
Silicon Photonic Die Wafer Process Flow (4/5)
©2020 by System Plus Consulting | SP20544 Intel Silicon Photonic 100G CWDM4 QFSP28 Transceiver | Sample 12
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
o Cost Analysis Summaryo Yields Explanation &
Hypotheseso Transmitter Block
o Si Photonic Dieo Wafer Costo Step costo Die Cost
o MZI Driver Dieo MACOM M37049Go Optical Elementso Assembly
o Receiver Blocko Ge Photodiode Dieo TIA Dieo MACOM M37049Go Optical Elemento Assembly
o Cost Comparaison
Feedbacks
Related Reports
About System Plus
Silicon Photonic Wafer Front-End Cost
©2020 by System Plus Consulting | SP20544 Intel Silicon Photonic 100G CWDM4 QFSP28 Transceiver | Sample 13
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
o Cost Analysis Summaryo Yields Explanation &
Hypotheseso Transmitter Block
o Si Photonic Dieo Wafer Costo Step costo Die Cost
o MZI Driver Dieo MACOM M37049Go Optical Elementso Assembly
o Receiver Blocko Ge Photodiode Dieo TIA Dieo MACOM M37049Go Optical Elemento Assembly
o Cost Comparaison
Feedbacks
Related Reports
About System Plus
Intel Silicon Photonic Dies Comparison – PSM4 and CWDM4
Intel 100G PSM4 connector©2020 by System Plus Consulting
Intel 100G CWDM4 connector©2020 by System Plus Consulting
©2020 by System Plus Consulting | SP20544 Intel Silicon Photonic 100G CWDM4 QFSP28 Transceiver | Sample 14
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
Related Reports
About System Plus
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
Related Reports
MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
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REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
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©2020 by System Plus Consulting | SP20544 Intel Silicon Photonic 100G CWDM4 QFSP28 Transceiver | Sample 15
COMPANYSERVICES
©2020 by System Plus Consulting | SP20544 Intel Silicon Photonic 100G CWDM4 QFSP28 Transceiver | Sample 16
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
Related Reports
About System Pluso Company serviceso Contacto Legal
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Custom Analyses(>130 analyses per year)
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©2020 by System Plus Consulting | SP20544 Intel Silicon Photonic 100G CWDM4 QFSP28 Transceiver | Sample 17
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
Related Reports
About System Pluso Company serviceso Contacto Legal
Contact
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