intel silicon photonic 100g cwdm4 qfsp28 transceiver ... · in just a few short years, intel has...
TRANSCRIPT
In just a few short years, Intel has alreadyshipped more than 3M units of its 100Gpluggable transceivers. And with itsCWDM4 100G technology, Intel is the firstin the world to offer a silicon photonicsolution up to 10km. The 100G PSM4 andCWDM4 represent the first step, withIntel’s 200G and 400G products expectedto enter volume production in the secondhalf of 2020.
The transceiver reuses a part of the PSM4technology, but many other facetsrepresent new approaches from Intel.
The transceiver comes with two separatedlines with several dies. The transmittersilicon photonic die integrates four InPlasers for the four wavelengths, in adifferent configuration than the PSM4. Onthe same die, a Mach-Zehnder modulator isadded to modulate the signal, but theCWDM MZI is more complex. Lightextraction is performed by the edge of thedie and not by a mirror. Other componentshave been added to the system in order tofocus or isolate the signal. Data isprocessed by using a four-channel 25Goptical Clock and Data Recovery (CDR)component from MACOM.
The receiver function is performed by fourgermanium photodiodes die and aTransimpedance Amplifier (TIA) circuit. TheGe photodiodes are manufactured on adedicated SOI substrate, and an opticaldemultiplexer is assembled between theSiGe photodiode and the fiber optic.
This report describes Intel’s potential interms of packaging and photonics. Within avery small form factor, Intel has managedto integrate four lasers, a photonic driver,optical modules, CDR functionality, high-performance photo-diodes, two advancedsubstrates, and materials for optic. Thisreport shows how the chipset configurationis implemented and describes in detail thetransmitter and receiver line.
Also included in this report is an exhaustiveanalysis of the Intel 100G CWDM4connector’s main components, including afull analysis of the silicon photonic die, theTIA circuit, the Mach-Zehnder Driver circuit,the MACOM circuit, and the germaniumphotodiodes. A cost analysis and priceestimate are furnished too, along with adescription and estimated price for the twofiber optic couplers, the focusing lens, andthe isolator. Lastly, a comparison is madewith Intel’s PSM4 silicon photonic circuit.
COMPLETE TEARDOWN WITH
• Detailed photos• Precise measurements• Materials analysis• Manufacturing process flow • Supply chain evaluation• Manufacturing cost analysis• Comparison with the Intel 100G
PSM4• Didactic explanation of device
operation• Estimated sales price
A deep analysis of the world’s first 100G CWDM silicon photonic transceiver,covering new technologies and the main differences from the Intel 100G PSM4.
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT
Title: Intel Silicon Photonic Transceiver100G CWDM4 QFSP28
Pages: 259
Date: March 2020
Format: PDF & Excel file
Price: EUR 3,990
Reference:SP20544
Intel Silicon Photonic 100G CWDM4 QFSP28 Transceiver
IC – LED – RF – MEMS – PHOTONICS - IMAGING – PACKAGING – SYSTEM – POWER - DISPLAY
TABLE OF CONTENTS
Overview/Introduction
Intel Company Profile
Physical Analysis
• CWDM4 Connector - Teardown• Transmitter Block View, dimensions, light path, cross-section
• MZI Driver Die• Silicon Photonic Die Die overview and dimensions InP laser, MZI, light extraction, waveguide
processes and cross-sections Die process characteristics
• Receiver Block View, dimensions, demultiplexer, cross-
section• Germanium Photodiode Die view and dimensions, process, and cross-
section• TIA Die• MACOM MG37049G DieComparison – Intel’s PSM4 and CWDM4 DiesManufacturing Process Flow• MZI Driver Die - Front-End Process and
Fabrication Unit• Silicon Photonic Die - Process Flow
• Silicon Photonic Die - Front-End Fabrication Unit• Receiver - Fiber-Optic Coupler, Demultiplexer,
Process Flow, and Cost• Germanium Photodiode Die - Process Flow and
Fabrication Unit• TIA and MACOM M37049G Dies - Front-End
Process and Fabrication Unit
Cost Analysis
• Transmitter Block Silicon photonic die Wafer, step and die costs MZI driver die MACOM M37049G Optical elements Assembly
• Receiver Block Germanium photodiode die TIA Die MACOM M37049G Optical element Assembly
Estimated Sales Price Analysis: Transmitter Block and Receiver Block
AUTHORS
INTEL SILICON PHOTONIC 100G CWDM4 QFSP28 TRANSCEIVER
Intel Silicon Photonic 100G PSM4 QFSP28 TransceiverDeep analysis of the first silicon photonic die with Intel’s unique approach for laser integration, the outcome of 15 years of development.March 2019 - EUR 3,990*
MOLEX – Luxtera Silicon Photonic DiePhysical analysis of the device, step by step reconstruction of the process flow, cost of manufacturing and estimation of selling priceNovember 2012 - EUR 2,990*
Silicon Photonics and Photonic Integrated Circuits 2019Silicon photonics: beyond the tipping point!April 2019 - EUR 6,490*
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