VANGUARD ELECTRONICS

Inductors and Transformers For

Demanding Environments

Since 1952

2007-07

Manufacturing Facilities

HQ - Huntington Beach, California (1952)

• Product Design, Research & Development

• Qualification Test Laboratory

• Failure Analysis

• Tool & die fabrication

• AS9100, ITAR, C-TPAT Certified

• Center of Excellence for Space and Military

• Authorized by DLA to perform Qualification Testing

Mexicali, Mexico (1968)

• 300+ employees ; 40,000 square feet

• Cell Manufacturing and Lean manufacturing

• Orders from single pieces to thousands

• In House Tool & die design & fabrication

• AS9100, ITAR, C-TPAT Certified

• Center of Excellence for Space, Military, high temp and

Hi-rel.

• Authorized by DLA to perform Qualification Testing

New Expansion

• Purchased new building in

Huntington Beach

• MIL-STD-981

• AS9100

• Full turn Machine Shop

• Class 100,000 Level Clean Room

• Additional areas designated for research, development

and prototypes

• Mechanical, Electrical and Environmental Testing

Agency Approvals & Certifications

Certifications/Qualifications

• AS9100

• ISO 9001:2008 Certified

• ITAR Compliance (Registration and MLA)

• Soldering:• IPC- 610

• J-STD-001ES

• NASA-STD-8739.3

• DLA authorized for qualification testing

• MIL H 38534 (Hybrid Microelectronics)

• MILSTD 981

• NASA EEE INST 002

• TORR

Military Standards

• MIL PRF 27

• MIL PRF 55631

• MIL PRF 83446 (T level Pending)

• MIL PRF 15305

• MIL PRF 21038

• MIL PRF 39010 (pending)

• MIL STD 1553

• DSCC 93027

• COTS, COTS+

Markets Served

DEFENSE

AEROSPACE

SPACE

HIGH TEMPERATURE

INDUSTRIAL

MEDICAL

60+ YEARS OF HERITAGE(abbreviated list)

Defense & Aerospace Oil & Gas Industry Space

APS

Baker Hughes

Benchtree

Cissoid

Chevron

Datacan

GE Energy

Halliburton

Houston Sigma

Hybrid Design

Innova

JAE

Microtesla

Sensorwise

TI

Weatherford

X-Rel Semi

Airbus

BAE

Ball Aerospace

Boeing

Exelis - ITT Corp.

General Dynamics

General Electric

Goodrich Corp.

Harris

Honeywell

India Space Agency

L-3 Communications

Lockheed Martin

Moog

Northrop-Grumman

Parker Hannifin

Raytheon

Rockwell

Sagem

Sandia National Laboratories

Thales

Aeroflex

BAE

Ball Aerospace

Boeing Satellite Sys.

EADS

ESA

Exelis – ITT Corp.

General Dynamics

Honeywell

JPL/NASA

L-3 Communications

Lockheed Martin

Mitsubishi

Japan Aerospace

Moog

NEC Toshiba

Orbital Sciences

Raytheon

SEAKR Engineering

Sierra Nevada

Space Systems Loral

Vanguard Supported Programs

Defense Aerospace Space

787 Dreamliner

Airbus

C-130

Hawker 4000

Euro Fighter

F-35 JSF

F-22

F-16

V22 Osprey

LRDR

EKV

GPS III

ICESAT-2

Orion

Osiris

Insight

Block III

Space Clock

Iridium Next

GOES-R

World View 3

Space Fence Deep Space Atomic Clock

OBC - On Board Computer

Aegis AN/SPY-1 Navy Radar

AGS - Advanced Gun System

ALPHA

AN/TPQ-53 Radar

ARS F-15 Air Refueling

ATDL - Advanced Tactical Data

Link

CARA

ISIS - Integrated Sensor is

Structure

JDAM - Joint Direct Attack

Munitions

LANTIRN ER

Nuclear Fuses

OIMU

Sniper

SPIRIT

Viper

AMRAAM

Griffin

Patriot

Capabilities Range

3Ø 2KVA

From milli-watt chips…

To high power…

One piece to thousands.

Capabilities

Tooling

– CNC tooling

– Powdered Iron Core fabrication

– Header and Case fabrication

– Resistance Micro Welding

– Lead-frames

– Shipping Trays

▪ Protects Co-planarity

▪ Suitable for Irregular Shapes

Finishing

– Vacuum Impregnation

– Pressure Curing

– Transfer Molding

– Epoxy

– Paint/Varnish

Testing and Process Capability

• Testing

• Corona/partial discharge Testing ( 50,000V)

• Thermal Shock - 55 to 200+

• Thermal Chambers -55 to 215

• Electrical Parameter Characterization

• High and Low Frequency

• High Voltage to 50Kv

• Shock and Vibration

• Signal Injection

• Transient Injection

• Real Time X-Ray

Technical Expertise

• Magnetic core materials

- Standard ferrites, powdered iron, MPP, Kool Mu, silicon steel, nickel, cobalt alloys, amorphous metals ,nanocrystalline & more

• Magnetic core geometries

- All standard shapes & sizes

- Custom shapes & sizes

• Winding geometries

- Form/air, annular, hybrid, Sector, Distributed

- Litz, foil, specialty wire & windings, multifilar

- Conventional

• Cross-functional Design Review Team

• Formalized NPI process

• Advanced design tools & methods

• Mechanical CAD

• Thermal simulation

• Process Documentation

• Specialized Magnetics design & optimization tools

• Product Depth

• Catalog Items (Commercial to Space)

• Build to SCD, MIL Spec, ESCC, customer Requirement

• Customized Versions of Catalog items

• Build to Print ability

• Build to Concept

• 10,000+ SCDs

Technical Expertise

RF Inductors

• RF Family

– RF Chips• M83446 Slash 4/5/6/8/9/10/11

• MS21423

• Vanguard “S” Level

– Air Core Inductors

• *** NEW AC2 & AC3****

• Formed Wire , Coax, Triax

– Leaded RF Toroids

– Hermetically Sealed

– Termination option for Gold

– Competitors-• Limited Offering

• No or little distribution practive

RF Inductors

• Wideband Transformers– Thru Hole

– SMD

– Gull Wing

– Tailored to meet your needs

– Expanding catalog offering ~ 3GHz

• Offering– Commercial

– Military/COTS+

– Space

Designs for

RF Applications

Small RF Transformers,

High DWV Ethernet Transformer

Power Products

Power Products

• Dual Wound Inductors (M27/DSCC 93027)• Series

• Parallel

• 1:1 Isolation

• Single Wound Inductors

• Current Sense

• Gate Drive

• Flyback

• Isolation

• EMI

• Common/Differential Mode

• Build to print.

Communication , Pulse & Data BusApplications

• Communications

– Isolation

– Ethernet

– 10BaseT

– 100BaseT

• 1553 Data Bus

• M21038

• Pulse Transformers

• Build to Print

• All are offered in commercial, military, space, hirel and high temp

Power Magnetics

• Transformer Topologies:

– Flyback, Buck, Boost, Forward, Bridge, Current Sense, Gate Drive, Resonant, Isolation other

– Space, Medical, Industrial, High Temp

– Custom designed to suit needs

– mW to MW

– Single Phase – Multi Phase

– Wire Bondable /Ceramic Substrate

• Inductors

– Bobbin Wound

– Toroid

– Single / Dual

– Custom Wound

– SMD or Thru Hole

– Wire bondable

Integrations/Assemblies

• Sub Assemblies, Substrates

• Embeddable Parts

• Environmental Testing of OEM Components

• Transfer Molding (over molding)

DesignsFor Power Applications