The ESD Association newsletter, published for everyone with an interest in the understanding and control of electrostatic discharge. Volume 25, No. 3 May/June 2009

In this issue

www.esda.org

From the President David E. Swenson, page 2

Standards Meeting Schedule, page 3

Symposium, page 4 2010 BoD Nominations, pages 5-8 ESD on Campus, page 9

Q & A, page 10

Meeting Survey, page 11

Regional Tutorials, page 12-14

Local Sparks, page 15

Calendar, page 16

Symposium ProgramNow Available!

Visit the Associationweb site www.esda.org

to download your 2009 Symposium Program and Registration Guide.

Tutorial C: ESD Protection and I/O DesignThis tutorial is intended to provide the attendees with the tools to take a device level understanding of ESD protection circuits and implement them effectively in I/O designs.

Tutorial L: Impact of Technology Scaling on ESD High Current Phenomena and Implications for Robust ESD DesignThis advanced tutorial will extensively discuss the impact of silicon technology scaling on ESD device behavior and on subsequent optimization of ESD protection design.

Tutorial S: Triboelectrification - Theory and ApplicationsTriboelectrification refers to the process whereby two materials become charged after contact and separation. This tutorial reviews the theory of triboelectrification, its measurement and control.

The latest research and technology is presented with more than 50 technical papers.

A special session of four invited talks by University faculty who work in the field of ESD. Increasing the involvement of both students, and faculty in the field of ESD.

The 2009 EOS/ESD Symposium is the #1 event for the latest technology and information on ESD.

An Event You Can’t Miss!

May/June 2009

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DESCO Industries, Inc.3651 Walnut Avenue, Chino, CA 91710

Tel: 909-627-8178 Fax: 909-627-7449 www.descoindustries.comESD CONTROL PRODUCTS: Charleswater, CMG, Desco, EMIT, Menda,

ESD Systems.com, Protektive Pak, Semtronics, Statguard Flooring

3MElectronic Solutions Division

Tel: 1-800-328-1368 www.3M.com/electronicswww.3M.com/electronicsManufacturer of static control permanent flooring, wrist/heel straps,

static shielding bags & testing/monitoring equipment

In early March of this year, I had the great joy of welcoming a new grandchild into the world (#7). As I held my new grandson for the first time (1 hour old) I had to tell him that unfortunately he was inheriting a national debt of over $3.5 trillion (and still counting). I also told him to hurry up and find a job so he could assist in paying my Social Security monthly stipend.

By the time you read this, we will be well into the year of ESD Association activities. Our 3rd annual International Electrostatic Workshop – IEW – will just about be ready to start and several of our Local Chapters will be hosting regional tu-torials. Events in Germany and India are also being prepared for delivery in June (Device Design Seminars).

At the time of this writing, we are watching the registrations closely so that we have the opportunity to adjust expenses accordingly. We make every possible effort to hold our scheduled educational programs since we do not like to cancel when we have registrations. However, we do need to manage the cash flow position for each event indepen-dently and then fit that event’s profit or loss status into the overall annual educational program plan. In each of the past several years we have had numerous members/certifica-tion candidates’ travel all over the country (and world) to attend tutorials so that they could be ready to sit for the Program Manager exam at the EOS/ESD Symposium. Therefore, we really hate to cancel any of the regional tutorials since several people may need those classes to fit into their educational plans for the year. We will do the best we can to meet everyone’s needs with regards to education availability.

Some very exciting work continues within our Standard’s group. Our joint venture between the ESD Association and JEDEC to harmo-nize the Human Body Model (HBM) standard is nearly finished. The result of this work will be a new document that both the ESDA and JEDEC will publish. We are confident that this successful collaborative effort will lead to additional cooperation

to harmonize the Charged Device Model (CDM) and other device level test methods.

A great deal of work is going on right now on the Human Metal Model (HMM) which will apply the IEC61000-4-2 System level test to components. While there is a lot of discussion about whether or not this is an appropriate test, numerous device customers are asking for it so the working group is trying to define the procedures so the test can be applied with some assurance of obtaining meaningful information.

There is also considerable discus-sion about Charged Board Events (CBE). While this is certainly nothing new (since the CBE has been around since the first component was placed on a printed wiring board), we are now developing methodologies that will lead to proper evaluation and more importantly, proper interpreta-tion of observed failures since CBE often looks like electrical overstress (EOS).

We have a New Business Development activity that is related to Standards. A task team has been assembled to work on a factory level definition for the term “Class 0” since this term is misused today. Many of our members who deal with facto-ries and especially those involved in factory certification to ANSI/ESD

ESDA activities....

From the President

May/June 2009

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Wednesday, May 6 8:30 a.m. - 4:30 p.m. ESD Basics for the Program Manager 8:30 a.m. - Noon System Level ESD/EMI:Testing to IEC and Other Standards 1:00 p.m. - 4:30 p.m. Device Technology and FA Overview Thursday, May 7 8:30 a.m. - 4:30 p.m. How To’s of In-Plant ESD Auditing and Evaluation Measurements 8:00 a.m. - 5:00 p.m. Technical and Administrative Support Committee

Friday, May 8 8:00 a.m. - 5:00 p.m. Technical and Administrative Support Committee 8:00 a.m. - Noon WG-3, Ionization 8:00 a.m. - Noon WG-5.5 (TLP), Device Testing 1:00 p.m. - 5:00 p.m. WG-5.6 (HMM), Device Testing 5:00 p.m. - 5:30 p.m. WG-5, CBE AdHoc 1:00 p.m. - 5:00 p.m. WG-9, Footwear 1:00 p.m. - 5:00 p.m. WG-10, Handlers 1:00 p.m. - 5:00 p.m. WG-13, Handtools 6:00 p.m. - 9:00 p.m. Executive Committee Saturday, May 9 8:00 a.m. - 5:00 p.m. Technical and Administrative Support Committee 8:00 a.m. - Noon WG-53, Compliance Verification/ WG-16, Workstations 8:00 a.m. - Noon WG-2, Garments 8:00 a.m. - 9:00 a.m. WG-5.2 (MM), Device Testing 9:00 a.m. - Noon WG-5.3.1 (CDM), Device Testing 1:00 p.m. - 5:00 p.m. ESDA-JEDEC HBM JWG 1:00 p.m. - 3:00 p.m. WG-11, Packaging 3:00 p.m. - 6:00 p.m. Marketing & Communications 5:30 p.m. - 6:30 p.m. WG Chairs 6:30 p.m. - 7:30 p.m. ESDA Mixer - All Invited Sunday, May 10 8:00 a.m. - 1:00 p.m. Technical and Administrative Support Committee 8:00 a.m. - Noon WG-14, ESD Simulators 8:00 a.m. - Noon WG-15, Gloves 10:00 a.m. - Noon Human Resources 1:00 p.m. - 4:00 p.m. MAR/STDCOM Monday, May 11 8:00 a.m. - Noon Steering 1:00 p.m. - 5:00 p.m. Education Tuesday, May 12 8:00 a.m. - 5:00 p.m. BoD

S20.20, often are asked by their clients - “What is needed to qualify our factory to Class 0?” - Today there is actually no answer to this question since there is no industry accepted definition of what Class 0 means in a factory setting. Hopefully by Symposium time, there will be a definition that is acceptable to the majority (no doubt it will be unlikely to get 100% agreement on this one).

The ESD Association will now allow Members to post your resume’ on the Association web site if you are looking for a new position. Any company may post their positions available notices on the web site as well. We hope that this will assist folks in finding new opportunities.

While I wait for my government stimulus check, I sincerely hope this column finds you still employed (if you need to be) or that you have opportunities for new employment (if you need it). If you are hiring, I have a bunch of young grandchildren that will need work to help support their grandpa. I hope you have a good summer.

May 2009 Meeting Schedule May 7-12, 2009

Hilton, Minneapolis, MN

From the President

ESDA activities....cont.

www.esda.org

May/June 2009

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TREK, INC.11601 Maple Ridge Road, Medina, NY 14103

Tel: 585-798-3140 Fax: 585-798-3106 www.trekinc.com

Designer and manufacturer of instrumentation and sensors for measuring surface voltage, ionizer performance, and surface resistivity

ACL Staticide1960 E. Devon Avenue, Elk Grove Village, IL 60007

Tel: 847-981-9212 Fax: 847-981-9278www.aclstaticide.com

Anti-static mats, topical anti-stats, floor finishes and coatings, static meters, cleanroom products

2009 EOS/ESD Symposium in Anaheim, California

As General Chairman of the EOS/ESD Symposium, it is with great pleasure that I would like to invite you to join us at the 2009 EOS/ESD Symposium in Anaheim, California from August 30th - September 4th, 2009.

This year, there will be a good selection of technical publica-tions, workshops, and exhibits. Students, faculty, technicians, development engineers, and re-search scientists can see state-of-the-art technology in the field of electrostatic discharge (ESD).

The conference this year will open with a Keynote talk in the biomedical field. Today, there is interest of ESD issues in both medicine and the biomedical

fields. To increase the involve-ment of students and faculty, this year we will launch the Sym-posium Technical Sessions with four invited talks. This is a spe-cial session of university faculty who work in the field of ESD. The ESDA Board of Directors have gone forward to initiate this new concept, and hope to con-tinue this in future years. This is to increase the involvement of both students, and faculty in the field of ESD. I have visited thirty universities in the last three years, and discovered there is great research in the ESD field in the US, Europe, China, Taiwan, Thailand, Israel, and other coun-tries. In future years, we hope to make this a tradition and have the opportunity to invite more faculty allowing our ESD society to grow.

Despite economic times, the ESD Symposium will have a full symposia of papers, and the Ex-hibit Hall will be also be full. In the Exhibit Hall, the latest-and-greatest advancement in ven-dor materials and equipment will

be available for perusing, pick-ing, and purchasing. As in prior years, the “ESD book store” will be open with the newest titles on Electrostatics; this year, there are many new ESD texts in 2008 and 2009 from semiconductor devices, transient latchup, ma-terials, and failure mechanisms. So, there are many good reasons to come to the ESD Symposium this year, since it is not a show to be missed.

And for those that have attending families, there is always Disney-land for dining, fun, and a little adventure.

Best Regards,

Dr. Steven H. Voldman, General Chairman EOS/ESD Symposium 2009,ESD Association Board of Directors, IEEE Fellow

General Chairman EOS/ESD Symposium 2009 Dr. Steven H. Voldman

Symposium

2009 Symposium Information

Look for this icon for a quick link to:

May/June 2009

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Wolfgang WarmbierUntere Giesswiesen 21, D-78247 Hilzingen, Germany

Tel: 49-7731-86880 Fax: 49-7731-868846 www.warmbier.com • E-mail: wolfgang.warmbier�warmbier.comwolfgang.warmbier�warmbier.com

ISO 9001:2000 certified for consulting, manufacturing and supply of static control materials and systems, ESD test Instrument calibration

Monroe Electronics100 Housel Avenue, Lyndonville, NY 14098

Tel: 585-765-2254 Fax: 585-765-9330E-mail: electrostatics�monroe-electronics.com

www.monroe-electronics.comFull line manufacturer of static measurement equipment

2010 Board of Directors Nominations

Nominations are placed and ballots have been distributed via US Mail to ESD Association members to fill four seats on the Association’s Board of Directors. The term for each seat is January 1, 2010, through December 31, 2012. Each member may select up to four candidates and return the envelopes provided with the ballots. Members may also place “write-in” votes by writing a person’s name(s) on separate paper and placing in the return envelope provided in the mailing. Members may cast from one to four votes. DO NOT SEND COPIES: ONLY ORIGINALS WILL BE COUNTED. If a member sends in more than four votes, their vote becomes invalid.The following individuals are seek-ing a seat on the Board of Directors for the next term:

Steve HeymannSteve is Senior Director Product Marketing for MKS, Ion Sys-tems. Previously he was CEO and co-founder of

Novx Corporation, head-ing Novx for ten years until Novx was acquired by MKS, Ion Systems. During that time, Steve was actively involved with the ESDA and the Silicon Valley

ESD Association. Steve was also involved for many years with the IDEMA ESD Task Force. He has successfully served in senior man-agement positions with a number of startup companies in the Semi-conductor Equipment Industry. Steve has held numerous board positions with startup companies, non-profit organizations and pri-vate county service areas. He has a BS in IT from Cal Poly San Luis Obispo, 1977, and enjoys an active family life.Vision:These are tough economic times for all involved with the ESDA as well as our customers. We must think “outside the box” to be cre-ative and flexible to survive these challenging times. I have been involved with the ESDA Board of Directors for the past year specifi-cally looking at new directions and opportunities for the organization to pursue. The Association must look develop additional programs to bring in new members and volunteers to serve new and exist-ing markets. I want to bring my management and organizational expertise to the team and help propagate the success of the or-ganization. Specifically, I want to work on expanding the markets that are actively involved with the ESDA and to promote a plan to

attract “new” individual involvement in committees and working groups. Promoting interest and involvement of new participants with new ideas is key to continued ESDA growth.

Kathleen Muhonen Kathleen Muhonen is currently an as-sistant professor of electrical and computer engineer-ing at Penn State Erie, The Behrend

College. She received a B.S. in Electrical Engineering in 1991 from Michigan Technological University, an M.S. in Electrical Engineering in 1994 from Syracuse University, and her Ph.D. in Electrical Engi-neering in 1999 from Penn State University. Kathleen has over twelve years of industry experience, mainly as an RF power amplifier design en-gineer, first working at Lockheed Martin (formerly GE Aerospace) in Syracuse NY. She was a micro-wave engineer at Hewlett Packard in Folsom CA, a technical staff member at Lucent Technologies Bell Laboratories in Murray Hill NJ, and senior design engineer and staff systems engineer for RF Micro Devices in Greensboro NC.Kathleen is a member of the ESD

2010 Board of Directors NominationsESD Association Members Can Cast Votes Before July 1, 2009

Association

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May/June 2009

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Static Solutions Inc.331 Boston Post Rd.-East, Marlboro, MA 01752 USA

Tel: 508-480-0700 Fax: 508-485-3353 www.staticsolutions.comWorldwide manufacturer of patented ESD Cleanroom products, including Ohm-StatTM combination/

resistivity meters, Ohm-ShieldTM coatings/floor finishes/paints, Ohm-CideTM EPA cleaners, Stat-o-FlexTM Class Zero wriststrap, and UltimatTM Class Zero out-gassing rubber.

Proline10 Avco Rd., Haverhill, MA 01835

Tel: 800-739-9067 Fax: 978-374-4885www.1proline.com E-mail: Bench�1proline.com

Manufactures ESD modular and ergonomic workstations

Association, serves on all standards workgroups involved in device test-ing, and is a member of the IEW management committee. Currently her research at The Behrend Col-lege is in ESD testing and RF on-chip protection. Her involvement in round robin testing for standards development has generated several papers presented at the EOS/ESD Symposium in recent years.Vision:My involvement in the ESD Asso-ciation is directed to several areas. First, we must attract more people to the Association who are directly in need of ESD research and solu-tions. This will allow them to interact with the leaders in ESD testing and circuit design. This interaction fosters collaboration that helps the Association originate standard practices and standard test meth-ods. Second, I want to encourage research at universities that allows students to be involved in real world issues and solutions. This benefits the university, as well as benefiting industry. By encouraging academic connections, more students will graduate with knowledge about the current ESD concepts and chal-lenges in industry. This gives new graduates a better foundation for contributing to this field once they start their careers, as well as a reason for joining the ESDA in the future. New members are key to our success. As a representative of

academia participating in the ESDA, l will bring a unique perspective and approach to solving problems. This perspective will contribute to the Association’s development of their standards, educational programs, publications and the overall goal of advancing the state of the art in ESD avoidance.

Nathaniel PeacheyNathaniel Peachey received his Ph.D. in 1994 from the Uni-versity of Nebraska at Lincoln and then was awarded a Director’s Funded

Postdoctoral Fellowship at the Los Alamos National Laboratory. In 1996 he joined Atmel Corporation in Colorado Springs. Over the next several years, Dr. Peachey held various positions at Atmel including process engineer, technology de-velopment engineer, device engi-neer, and circuit design engineer. In 2003 he began focusing exclusively on ESD protection and I/O design issues. In 2005 Dr. Peachey accepted the position of engineering manager for the newly formed ESD design group at RF Micro Devices. In this capacity he was responsible for the development of ESD protection for all of the technologies that RFMD designed, including both silicon and

GaAs. Besides developing on-chip protection strategies, he led the de-velopment and improvement of the RF antenna ESD protection.Dr. Peachey has authored several papers discussing various aspects of ESD. He also has several patents pending related to ESD protection structures. In December 2007 he and his co-authors were given the “Best Paper” award at the ESD Forum in Munich Germany. He is a member of the ESD Association as well as IEEE. He is currently serv-ing as a member of TAS and is the work group chair for HMM WG5.6. Vision: The ESD Association exists to serve industry by expanding ESD aware-ness through standards develop-ment, educational and certification programs, and symposia. I will be committed to sharpening this vision and to helping the Association bet-ter fulfill its core mission. In the development of standards, I support the recent cooperation that is evolving with the other stan-dards bodies. I will be committed to encouraging and enabling that cooperation. ESDA has developed educational materials through tutorials and other methods that are unmatched in the industry. I will be dedicated to continuing that emphasis and to reviewing how ESDA can improve on its educational commitment in a

2010 Board of Directors Nominationscontinued

Local ChaptersAssociation

Continued on page 7

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Local Chapters

Molded Fiber Glass Tray Co.6175 US Highway 6, Linesville, PA 16424

Tel: 800-458-6050 Fax: 814-683-4504 E-mail: info�mfgtray.comManufacturer of static dissipative and conductive trays and containers for

static protection of sensitive parts.

TOPLINE-ELME7331A Garden Grove Blvd., Garden Grove, CA 92841

Tel: 800-776-9888 E-mail: info�ESD.TV www.ESD.TVFull line ESD products including shoes, garments, chairs, brushes, mats,

gloves. Maximum comfort.

2010 Board of Directors Nominationscontinued

Association

rapidly changing industry. I am committed to highlighting the core vision and mission of ESDA. I want to direct my energies to improving what ESDA does best and that is the development of standards in a professional and timely manner, providing educa-tional programs that are second to none, and organizing symposia that are internationally recognized in the ESD field. I will help ESDA continue to set the standard for excellence in these core areas.

Tim Prass Tim Prass has been working for the Raytheon Technical Ser-vices Company in Indianapolis for 5 years. His company respon-

sibilities are Quality Engineer and ESD Subject Matter expert for the Technical Services division. Tim conducts compliance audits to AS9100, ISO9001, CMMI, to inter-nal Engineering processes, and to the Missile Defense Agency’s Mis-sion Assurance Provisions. Tim is also Junior Technical Lead for the Raytheon Corporate ESD Council. Tim holds a BSME from Michigan State and an MBA in Finance from Butler University. Professionally, Tim is an ASQ certified Six Sigma Blackbelt, an AS9100 Lead Internal

Auditor, and has recently attained RABQSA certification as Quality Management System Auditor. He will be pursuing Aerospace Experi-enced Internal Auditor certification. Tim was also a member of the first group of six to earn the “ESDA Cer-tified Professional Program Man-ager” designation in the certification program’s inaugural year. Tim’s participation in the Association has steadily increased since he became an active member in 2005. His standards activities include several ESDA Working Groups: Hand Tools (Chair), Ionization, Packaging, and Gloves. Tim contributes his Six Sig-ma experience to ESDA Standards by acting as the “statistics lead”, in charge of coordinating round robin testing for the working groups.Vision: 1. I see a tremendous need to bridge the gap between theory and application. It has become a personal mission of mine to be able to demonstrate the foundational principles of ESD in practical ways to all who ask. This, I have found turns skeptics into instant believers. Providing practical demonstrations may well attract new members. 2. I endeavor while working on vari-ous Association documents to put myself in the reader’s place, view-ing the document from that vantage point. I want our documents to be relevant, readable, and reliable. The Association’s products (docu-

ments) must be clear and precise, but they must also appeal to the user (customer). 3. I would like to put my experience in Compliance, Six Sigma, and Process Improvement to full use for the ESDA to increase efficiency. As with all businesses, there is ample opportunity for cycle time reduc-tion, and waste elimination. As the standards market becomes more competitive – “time to market” will become a key factor. In conclusion, the background, experience and enthusiasm I have expressed above position me well to help the Association achieve its objectives through service as a member of the Board of Directors. Please vote for Tim Prass.

Donn Pritchard Donn Pritchard has worked for manufacturers of electrostatic in-strumentation for over 30 years in various positions including QC,

sales and marketing, and engineer-ing. Donn is currently employed by Monroe Electronics, Inc. of Lyndon-ville, New York as an applications engineer.Donn has been a member of the ESD Association since 1994,

Continued on page 8

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Local Chapters

MicroStat Laboratories/River’s Edge Technical Service3612 3rd Pl. NW, Rochester, MN 55901

Tel: 507-292-0230 Fax: 507-292-0698 www.microstatlabs.comESD materials testing laboratory, ESD & contamination control auditing,

consulting • S20.20 program development

SIMCO ElectronicsWorldwide Headquarters

1178 Bordeaux Drive, Sunnyvale, CA 94089Tel: 800-432-2351 • sales�simco.com/www.simco.com

Accredited ESD testing, auditing, evaluation & training. Calibration and repair of ESD testing equipment.

2010 Board of Directors Nominationscontinued

ing programs and encourage local chapter development wherever ESD professionals are in need of our support. Finally, it is important to maintain the value, relevance, and importance of the ESD Association standards as our subject matures.”

Terry WelsherDr. Terry L. Welsher is cur-rently Senior Vice President of Dan-gelmayer Associ-ates. He began his career at Bell Labs in 1978 where he

worked on electrolytic corrosion failure mechanisms in electrical interconnection materials. In 1986 he began directing Bell Laborato-ries’ core expertise in electrostatic discharge (ESD). The newly formed group produced a string of ground-breaking contributions to the field and played a key role in advancing industry standards. Dr. Welsher has served as Chairman of the ESDA Standards Committee and Techni-cal Program and General Chair of the EOS/ESD Symposium. He has served as member of the EOS/ESD Symposium Committee and the ESDA Board of Directors. He has also been active in the JEDEC Quality and Reliability Committee and the JEDEC Board of Directors. Most recently he has led the effort to harmonize and merge JEDEC

and ESDA device testing stan-dards. He holds a B.S. in Chemistry from Florida State University and Ph.D. in chemical physics from the University of Texas at Austin. Terry and his wife, Karyl, live in Suwanee, Georgia.

Vision:The next several years will be a challenging time for the ESDA as its members and the industry respond to rapid changes in the technical and business environment. Changing times also bring great opportunities and I am enthusiastic about being involved in guiding and transform-ing the ESDA. My vision of a vital and focused volunteer organization is one that keeps in perspective three key areas: People – serving the membership in ways that make the return on an investment of time clear to the members and their companies, and promoting honesty and integrity in all that ESDA under-takes. Process – insuring that the organization supports and delivers through effective communication to its members, consistency in its policies and procedures. Purpose – defining a clear direction for the organization to promote its long term-success in difficult times, en-courage growth of its markets, con-tinue its technical excellence and influence, and assure its financial sustainability.

and is an active volunteer in sev-eral standards working groups and other committees, such as Human Resources, Marketing and Commu-nications, the Symposium Steering Committee, and the Symposium Technical Program Committee. Donn has been a member of the ESDA Board of Directors for the past three years and has been the ESDA Treasurer for the past two years.Donn has also been involved in electrostatic topics with other or-ganizations including IDEMA, the SEMI ESD Task Force, the Electro-static Society of America, and the Society for Imaging Science and Technology. He has authored or co-authored several white papers and magazine articles related to electrostatics.Vision: “I have a very high regard for the accomplishments of the past and present leadership in establishing the ESD Association as a global resource for ESD standards and education. I wish to remain a mem-ber of the Board of Directors to continue our efforts to expand our membership, global presence, and relevance. It is my vision to con-tinue the ESD Association’s efforts to deliver education and training to those ESD professionals who can-not attend our educational venues in the United States. I want to see the ESD Association increase train-

Association

May/June 2009

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ESD On Campus

ESD on CampusBy Steven H. Voldman

Beijing UniversityMega-structures to Nano-structures

Tech Wear, Inc.2205 Faraday Ave., Suite B, Carlsbad, CA 92008

Tel: 760-438-7788 Fax: 760-438-6868Email: kay�techwear.com www.techwear.com

Industry leader in static control garments, including groundable cleanroom garment systems.

Dur-A-Flex Inc.95 Goodwin St., East Hartford, CT 06108Tel: 800-253-3539 www.dur-a-flex.com

With over 40 years of experience and innovation. Dur-A-Flex manufactures epoxy, urethane and acrylic seamless flooring and wall systems for commercial,

industrial and institutional applications.

Inscripted on a stone by the Great Wall in Badaling is the famous quote of Mao -- “ Bu Tao Chang Chung Fei Hao Han” -- If you have not gone to the Great Wall, You are not a “Han Man.” In 2008, The Great Wall now is joined by the old and new mega-structures of Beijing. The massive Ming Tombs (from the Ming Dynasty) are placed and ori-ented with perfect feng-shwei with their back to the mountains, and facing the water to allow the energy of its Ming emperors flow toward the city of Beijing. As one enters the new Beijing airport, one notes the expanse of a great domed mega-structure of glass and steel. Heading toward Beijing University, one passes the Olympic Village, the Bird’s Nest, and the Water Cube; a weave of steel and open space; as one enters deeper into the massive city of Beijing, one approaches the Summer Palace, and at the center, the Forbidden City, and Tiananmen Square.

It was only a few months ago, ESD

on Campus watched the Olympic torch being passed through the streets of Hong Kong, and now the Olympics of Beijing are gone, but its mega-structures looming over the City of Beijing.

What also still stands is the great university of Beijing. Beijing Uni-versity campus is known as “Yan Yuan” for the Gardens of Yan, and not far from the Summer Palace. As one enters Beijing University, the paths and courtyards have students walking and riding bicycles. Rows and rows of bicycles; bicycles are everywhere!

Beijing University, “Beijing Da Xue” consists of 30 colleges, 12 de-partments, 93 specialties for un-dergraduates, 199 specialties for Master candidates, and 179 doc-toral candidate specialties - 216 research institutes, 81 key national disciplines, 12 national key labora-tories, and two national engineering research centers – this is for 15,000

undergraduates, and 15,000 gradu-ate students.

At the Electrical Engineering de-partment of this mega-campus (aka “Bei Da” for short), the fo-cus shifts from mega-structures to nano-structures -- Micro-machines (MEMs), FinFETs, Carbon Nano-tubes (CNTs) and Carbon Nano-wires (CNWs). My host was “Bei Da” Professor Ru Huang, and grad-uate student Zhang Li Jie, and fel-low graduate student Su Sie for the ESD on Campus talk. Before my talk, for this mini-colloqium, Profes-sor Paul Yu of UCSD talked about InP growth of nano-tube structures. This was followed by the ESD in Nano-structures talk, for approxi-mately 40 Beijing University stu-dents; many were active members of the IEEE Electron Device Soci-ety (EDS) Student Chapter at Bei-jing University. The students said the talk was of interest to them, and were excited to talk about future op-portunities for research in ESD from

May/June 2009

10

Q&A

Bu Tao Chang Chung; Fei Hao Han !

“You are not a real man; if you haven’t climbed the Great Wall” … Mao Ze Dong

Steven H. VoldmanESD AssociationESD on Campus Program CoordinatorESD Board of DirectorsIEEE Fellow

California Micro Devices Corp.490 N. McCarthy Blvd. #100 • Milpitas, CA 95035

Tel: 800-325-4966 Fax: 408-263-7846 www.cmd.com

Leading supplier of application specific analog and mixed signal semiconductor products, protection devices

Winifred Int’l Technology Ltd.399 Cailun Road, Pudong New Area, Shanghai, Chinawww. winifred-hk.com • e-mail: steve�winifred-hk.com

Leading supplier for ESD and contamination control products, wrist straps, rubber mats, test equipment, packaging products, clean gloves, garments,

chairs, and ionizers.

FinFETs to nano-devices. The talk was followed by Beijing tsai (Beijing dishes) lunch for all the speakers, faculty and guests.

It is amazing to start the beginning of my week on the Great Wall (Chang Chung), gazing over the mountains, and Fall colors surrounding the Great Wall and its great expanse…and end-ing the week discussing the future of ESD and Nano-Technology. Gradu-ate students said to me, “I will not for-get your visit”; neither will I.

ESD On Campus

Beijing University Mega-structures to Nano-structures - continued

likely be lower than shown. If the resistance to ground was higher, the voltage shown would likely be higher than shown. Voltage readings of people can vary depending on the resistance to ground measurements for individual people. An insulating material with a measured electrostatic potential <2,000 measured at one inch, has a small electrical impact on other objects, even if in contact. Studies have been done in support of the Roadmap and IEC as well as the ESD Association documents that show a material with less than 2,000 volts at one inch is a very small risk for susceptible items with a sensitivity greater than 100 volts. As I mentioned, if you have more sensitive items in your process, the 2,000 volt level needs to be reduced. An insulator can only discharge from a small area, even if in contact with a grounded conductor, so the amount of charge transfer is very

Q ‘I read the ESD roadmap, but I do not understand Figure 8. Does this figure indicate that the voltage on a person’s body will be controlled below 50 volts if the person walks across an ESD floor while wearing ESD footwear without wrist straps? I thought it had to be higher than 50 volts. Also, S20.20 defines that items measuring 2,000 volts at one inch should be kept 12 inches away from sensitive items. Does this mean that we can accept items that generate or potentially generate a voltage less than 2,000 volts, and touch devices with HBM sensitivity more than 100 volts?

A ‘Figure 8 in the Roadmap document is only an example of the control that can take place with a good floor and footwear system. If the resistance to ground from the person were lower, peak voltage generated would most

small. Even though 2,000 volts at 1 inch seems like a lot, it is not viewed as a significant hazard for >100 volt HBM parts. An isolated conductor with an electrical field of 2,000 volts at one inch would be a hazard if allowed to touch a sensitive item since the whole charge would go into the item- that does not happen with an insulator.

To download a copy of the ESD Technology Roadmap visit www.esda.org and look for the above icon

May/June 2009

11

CONTROLLED ENVIRONMENTS MAGAZINE4 Limbo Lane, Amherst, NH 03033

Tel:603-672-9997 Fax:603-672-3028 www.cemag.us info�cemag.us

Leading source of information on contamination prevention,detection, and control for cleanrooms and critical environments.

StAtico541 Taylor Way, #1, San Carlos, CA 94070 USA

Tel: 650-592-4733 Toll Free: 1-800-261-4149 Fax: 650-508-0761 • sales�statico.com • www.statico.com

Global supplier of static control & cleanroom products

The Meeting survey ESDA sent to all ESDA volunteers centered around a few things. The realization that the economic conditions are impact-ing all facets of business, some re-quests for web conference accom-modations by a few volunteers, and the desire to establish relationships with other organizations that could be mutually beneficial to ESDA, its volunteers and other groups. The main goal was to determine the val-ue volunteers place on face-to-face meetings, ascertain how many oth-er groups they are actively involved with, capitalize on any opportunities for collaboration with other groups by way of meeting partnerships or other opportunities and gauge inter-est in web based meetings. While everyone is impacted by travel re-strictions and funding issues, the survey overwhelmingly supported the value of face-to-face meetings. It also confirmed that the ESDA vol-unteers are committed to ESDA and the work that they do within various committees. There were comments that indicated some groups who had eliminated face-to-face meet-ings are actually moving back to face-to-face meetings as their main avenue for committee work. Over-whelming comments relayed that the ESDA meetings are the primary meetings our volunteers attend, and while they are involved in other

committees there was no one group that had any significant attendance in common.

Here are some of the comments made by Association members:

“Face-to-face meetings are how you get to know people so there is more incentive to complete an ac-tion for a friend instead of a voice on a phone”.

FACEFacetoMeeting

“I will continue to pursue collaborative relationships with other groups and look forward to actively participating with these groups. I am committed to serving the work of the ESDA com-mittees and the value they have confirmed, one that I passion-ately believe in, that face-to-face meetings are an invaluable tool and asset to the work that we are all committed to do”. Lisa Pimpinella, Director of Operations

120 people surveyed

Value of Face to Face Meetings

“A lot of networking goes on at face-to-face meetings that benefits all in-volved. This can’t be done on the telephone”.

“Face to face meetings are very important to keep focus on the work and team aspect”.

Association

May/June 2009

12

Local ChaptersEducation

NORTH CENTRAL REgIONAL TuTORIALMay �-�, Minneapolis, MN

ESD Basics for the Program Manager*May �, 2009 • �:�0 a.m. - �:�0 p.m. Instructor: Steve Halperin Stephen Halperin & Associates, Ltd.This tutorial provides the foundation ma-terial for understanding electrostatics and ESD and their role in the manufacture and handling of ESD sensitive devices. The fundamental properties of charge, electric fields, voltage, capacitance and current are discussed with a view towards un-derstanding key electrostatic phenomena and electrical processes. These include charge generation and decay, material properties and induction. An overview of device failure mechanisms is presented, including how these models impact ESD control programs. Finally, the course pro-vides an overview of ESD control proce-dures during handling and manufacture and an overview of ESD S20.20 program requirements.

How To’s of In-Plant ESD Auditing and Evaluation Measurements* May �, 2009 • �:�0 a.m. - �:�0 p.m. Instructor: Steve Halperin Stephen Halperin & Associates, Ltd.This program was designed to support S20.20 in-plant verification requirements. It reviews the evaluation and audit mea-surement procedures for S20.20 ESD controls listed in the S20.20 document, Table 1-ESD Control Program Technical Requirements Summary. These recom-mended measurement procedures con-firm the proper operation and use of ESD control products and materials selected as part of a facility’s S20.20 ESD control program.

System Level ESD/EMI: Testing to IEC and Other Standards* **May �, 2009 • �:�0 a.m. - 12:00 p.m.Instructor: Michael Hopkins Amber Precision InstrumentsThis tutorial is intended to help those tasked with testing products to IEC and other system level ESD standards by providing detailed information on IEC 61000-4-2, the most widely used standard, and highlighting the harmo-nization and differences between IEC, ANSI, Telcordia, and some automotive ESD standards. We will answer com-mon questions regarding test setups, test points and procedures.

Device Technology and FA Overview*May �, 2009 • 1:00 p.m. - �:�0 p.m.Instructor: Leo g. Henry, Ph.D. ESD/TLP Consultants, LLC.This tutorial is designed to give a broad overview of ESD device technol-ogy, the ways circuit designers protect against ESD, and the failure analysis techniques that are likely to be encoun-tered in reports about ESD failures. Af-ter completing this tutorial you should be able to understand the basics of de-vice protection design and some of the trade-offs inherent in that process. You should also be familiar with some of the most commonly used failure analysis techniques that can help identify fail-ing circuit components - in other words “what does a semiconductor manufac-turer do with the units I return for failure analysis?” The topics covered include the three most common ESD models, characteristics of ideal ESD protection, typical ESD protection schemes, key characteristics of ESD protection, fail-ure analysis flow, and failure analysis tools and their uses.

To register visit http://www.esda.org/documents/NCRTPMay09flyer.pdf

REgIONAL TuTORIALS

*Course credit applies to the ESD Certified Professional-Program Manager certification curriculum. **Course credit applies to the ESD Certified Professional-Device Design certification curriculum.

NORTHEAST REgIONAL TuTORIALMay 19-20, 2009 • Tewksbury, MA

ESD Standards Overview for the Program Manager* May 19, �:�0 a.m. - 12:00 p.m. Instructor: David E. Swenson Affinity Static Control Consulting, LLCThe ESD Association’s introduction of the Program Manager Curriculum cre-ated a need to modify the Standards tutorial that has been presented for a number of years, mainly to help individ-uals prepare for the iNARTE Engineer-ing and Technician Exams. Many of the ESDA Standards and Standard Test Methods are discussed in depth in the individual tutorials related to the spe-cific subject matter. This Standards Tutorial provides an overview of all the Standards, grouped into com-mon test types, based on measure-ment probe and test instruments. A common methodology is used in this tutorial to cover the requirements, ap-plications and specifications for each Standard and Standard Test Method.

Packaging Principles for the Program Manager*May 19, 1:00 p.m. - �:�0 p.m. Instructor: David E. Swenson Affinity Static Control Consulting, LLCShipping electronic parts within a fac-tory, to another factory, distributor, or to an end-user has always been an area of uncertainty within the manu-facturing process. To provide clear-cut information on what type of con-trolled packaging should be used in any situation, the ESD Association has recently released a comprehen-sive revision of the obsolete industry standard EIA 541-1988. The new doc-ument, ESD S541, is the focus of this session. It provides information and guidance, as well as material speci-fications, to assist in the design and

Continued on page 13

May/June 2009

1�

implementation of a packaging plan for use within an ANSI/ESD S20.20 based ESD control program. Current and newly released test method standards suitable for packaging material evalua-tion will be described.

Cleanroom Considerations for the Program Manager*May 20, �:�0 a.m. - 12:00 p.m. Instructor: Chris Long, IBMCleanrooms and clean environments are enabling technologies required for the manufacture of many products that have exacting contamination control requirements in order to achieve defined yield and reliability targets. Clean manufacture is required in the semiconductor, hard disk drive, flat panel display, and pharmaceutical industries, to name a few. Requirements of cleanroom/clean environments and tooling therein result in low humidity levels, low surface contamination levels, use of process-required insulators, and a lack of natural ions in the controlled environment. These factors can contribute to development of elevated static charge levels in close proximity to sensitive product, presenting both a contamination and electrostatic discharge exposure. Ionization Issues and Answers for the Program Manager* May 20 1:00 p.m. - �:�0 p.m. Instructor: Arnie SteinmanThe primary method of static charge control is direct connection to ground for conductors, static dissipative materials, and personnel. But a complete static control program must also deal with isolated conductors, and insulating materials, and moving personnel that cannot be grounded. Air ionization can neutralize the charge on insulated and isolated objects.

To register visit http://www.esda.org/documents/NERTP09.pdf

Local ChaptersEducation

REgIONAL TuTORIALS continued

ESD PROgRAM MANAgER SEMINARDeveloping a program based on ANSI/ESD S20.20*June 1�-1�, �:00 a.m. - �:00 p.m. Austin, TX Instructors: Ron gibson & John Kin-nearThe seminar provides instruction on designing and implementing an ESD control program based on ANSI/ESD S20.20. The course provides participants with the tools and techniques to prepare for an ESD facility audit. This two-day course is an ESDA certification requirement for in-plant auditors and program managers who are working toward professional ESD certification. The first day of the course will take you from a blank sheet of paper to an entire ESD control process that will meet the requirements of ANSI/ESD S20.20. The second day is focused on how to assess an ESD control process to ANSI/ESD S20.20.

To register visit http://www.esda.org/documents/TXPMSeminar6_09.pdf

TECHNICAL TuTORIAL FOR LATCHuP/ ESD-DEVICE DESIgN AND ESD-TESTJune 2�-2�, Munich, germany WEDNESDAy, JuNE 2� Instructors: Charvaka Duvvury, Texas Instruments and James W. Miller, Freescale

ESD in the Industrial Semiconductor IC ContextWhat is ESD? Why is it important? What methods are used to control it? Who is responsible for ESD? What is the role of the design engineer? De-velopment of library cells and more.

ESD Models and ESD TestingDescription of the three models and model issues from the designer’s point of view, for example, tester-device interaction.

ESD Device OperationFundamentals of MOS device operation, its behavior under high current mode, latch-up effects and SCR devices, transistor snapback behavior, emission analysis, process effects, diode physics and operation, the role of the PMOS, BiCMOS and the similarity of the techniques for CMOS, bipolar devices, DENMOS and LDMOS devices and protection techniques.

ESD Circuit OperationOperation of and issues with NMOS circuits, active clamping versus snap-back, self-protection versus parallel protection; static (Zener based) trigger-ing, dynamic gate-coupling, substrate pumping, and multi-finger turn-on; includes discussion of implementation, simulation, and experimental results.

THuRSDAy, JuNE 2�Technology Impact on ESD Design ChoicesReview of ESD protection de-sign options as a function of tech-nology and process fluctuations.

Special Circuit Requirements, Including RF, and Their Impact on ESDMixed voltage protection, RF and ana-log protection, BiCMOS, high voltage protection, and new latchup effects.

CDM ESD ProtectionConcerns and considerations; fast enough diodes, transistors, and SCRs; the on-chip CDM event; the golden rules; an application example.

Design Examples and Case StudiesLayout methods, ESD rules, new de-sign methods, case studies of protec-tion design problems, class exercises.

Continued on page 14

May/June 2009

1�

FRIDAy, JuNE 2� Advanced ESD Characterization and Test Methods Instructors: Dr. Horst A. gieser and Dr. Heinrich (Henry) Wolf Advanced ESD CharacterizationHow to gain accurate insight in the electrical behavior of protection ele-ments and of elements to be protected. DC characterization, electrothermal characterization, (very fast) transmis-sion line pulsing, Repetitive ps-Pulsing. Failure criteria leakage and RF-degra-dation.

ESD Failure Reproduction and Alternative ModelsHow to look at a failure and how to reproduce it. CDM-Pitfalls; Capaci-tive Coupled TLP: Cable Discharge. Charged Board Model. ESD from Out-side - straight through passivation.

To register visit http://www.esda.org/documents/MunichJune09Courseflyer.pdf

DEVICE DESIgN SEMINARJune 29-�0, Bangalor India MONDAy, JuNE 29Instructors: Charvaka Duvvury, Texas Instruments and James W. Miller, Freescale

ESD in the Industrial Semiconduc-tor IC ContextWhat is ESD? Why is it important? What methods are used to control it? Who is responsible for ESD? What is the role of the design engineer? Devel-opment of library cells and more.

ESD Models and ESD TestingDescription of the three models and model issues from the designer’s point of view, for example, tester-device in-teraction.

ESD Device OperationFundamentals of MOS device opera-tion, its behavior under high current mode, latch-up effects and SCR devic-

Local ChaptersEducation

REgIONAL TuTORIALS continued

es, transistor snapback behavior, emis-sion analysis, process effects, diode physics and operation, the role of the PMOS, BiCMOS and the similarity of the techniques for CMOS, bipolar de-vices, DENMOS and LDMOS devices and protection techniques.

ESD Circuit OperationOperation of and issues with NMOS circuits, active clamping versus snap-back, self-protection versus parallel protection; static (Zener based) trigger-ing, dynamic gate-coupling, substrate pumping, and multi-finger turn-on.

TuESDAy, JuNE �0Technology Impact on ESD Design ChoicesReview of ESD protection design op-tions as a function of technology and process fluctuations.Special Circuit Requirements, Including RF, and Their Impact on ESDMixed voltage protection, RF and ana-log protection, BiCMOS, high voltage protection, and new latchup effects.CDM ESD ProtectionConcerns and considerations; fast enough diodes, transistors, and SCRs; the on-chip CDM event; the golden rules; an application example.Design Examples and Case StudiesLayout methods, ESD rules, new de-sign methods, case studies of protec-tion design problems, class exercises.To register visit http://www.esda.org/documents/DDseminarIndiaJune09.pdf

To register visit http://www.esda.org/docu ments/ChargeBoardEventsAGrowingIn dustryConcern.pdf

ONLINE CLASS

Charged Board Events: A growing Industry Concern June 4, 2009 • 2:00 p.m. Eastern Time

Developed by,Leo G. Henry, Ph.D. ESD&TLP Consultants, LLC Terry Welsher Danglemayer Associates, LLC

Course length - one hourPresenter: Leo G. Henry

In this seminar, this board-level ESD event will be compared with the component level CDM ESD event. The waveforms from both ESD events will be compared and it will be shown that for the same voltage, the current in the board-level ESD event will be much higher than that from the chip-level ESD event. A summary of literature and industry data will be given.

Visit ESDA on the Web

www.esda.orgLook for these icons for quick

links to:

For a complete educational schedule http://www.esda.org/documents/

2009EducationSchedule.pdf

ESD Positions and Resumes

ESDA Meetings

Electronic Order Form

May/June 2009

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AssociationLocal Chapters

“Local Sparks” The Local Chapter Connection

The ESD Association takes pride in recognizing its local chapters across the country and abroad. The activities of local chapters provide both education and networking op-portunities on a regular basis. New chapters are always forming and we will let you know how to get in touch with them through this col-umn. Contact the ESD Association for information on starting a local chapter in your area.

If your local chapter has news or information that you would like to publish in this article, please send your information to tfinn�esda.org.

Quick Links to ESD Local Chapters

ASEMEP ESD Council • aec.asemep.com.phAsociación ESD de Mexico • www.esdmexico.com

Indian Chapter no website availableNorth Central Chapter • www.esdnorthcentral.org

Northeast Chapter • www.nechapter-esda.orgSilicon Valley EOS/ESD Society • www.esdiscovery.org

Southwest Chapter • www.southwestesd.comTexas Chapter • www.Centxesdassoc.homestead.com

CHAPTER NEWS - In the last issue of Threshold we introduced the Texas local chapter link for ESD related questions called ESDTALK! Well, there have been emails about esd issues, and there have been emails about events that are scheduled for the chapter. All in all ESDTALK is talking! Congratu-lations Texas on a great concept! Keep up the good work! Visit the Texas capter website to sign up.

Northeast ChapterMay 19 & 20, NC Regional TutorialHoliday Inn Tewksbury, MA Day 1: Standards, Packaging Day 2: Cleanroom Considerations, Ionization

North Central ChapterWhile perusing the NC Chapter website I checked out the latest issue of their newsletter Common Ground. Did you know that the NC chapter has a membership of 64 members, 41 Users, and 23 Vendors.

Silicon Valley EOS/ESD Society The SiVa Website is back...The website states, Yes, we have been gone for a while and we are pleased to say we are back with a new web address.Bookmark the Silicon Valley EOS/ESD Society at: www.esdiscovery.org

You can find all of the chapter meetings and events in the online calendar. Print it out for your desktop reminder. www.esda.org

Your Listing Can Appear HereContact ESD Association for details

7900 Turin Road, Building 3, Rome, NY 13440-2069Tel: 315-339-6937 Fax: 315-339-6793

info�esda.org

Your listing will also appear in the online calendar

Contact ESD Association for detailsinfo�esda.org

India ChapterJune 29-30, Device Design Semi-narIndian Institute of Science, Bangalore, India

Texas ChapterJune 16-17, S20.20 Regional Tutorial 3M Innovation Center, Austin, TXInstructors: John Kinnear Ron Gibson Seminar provides instruction on designing and implementing an ESD program based on ANSI/ESD S20.20, including tools and tech-niques to prepare for an audit. Course is an ESDA requirement for in-plant auditors and program man-agers working toward professional certification. Establishing an ESD control program that can be certified to ANSI/ESD S20.20, the premier ESD control program development standard, requires an understand-ing of not only the basics of static control but how to evaluate manu-facturing process interactions. In additon, having an understanding of what an auditor looks for certainly simplifies the control plan prepara-tion process.

May/June 2009

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T Calendar

Threshold

ThresholdTM is published six times a year by the ESD Association, a not-for-profit corporation. It strives for the advancement of theory and practice of electrical overstress avoidance and of allied arts and sciences and the maintenance of a high professional standing among its members and others.

©Copyright 2008, ESD Association, Rome, NY

ThresholdTM Publication Schedule Issue Deadlines January/February ......................Nov. 19 March/April .................................. Feb. 1 May/June ..................................... April 1 July/August ..................................June 1 September/October .....................Aug. 1 November/December ...................Oct. 1

Threshold Institutional ListingsSpace in the Threshold Institutional Listings, which appear at the bottom of newsletter pages, can be purchased for $600.00 for six consecutive issues. Listings will also appear in the online calendar. Larger contributions are welcome. No agency fee is granted for soliciting such contributions. Inquiries, or contributions made payable to the ESD Association, should be sent to:ESD Association, 7900 Turin Rd., Bldg. 3, Rome, NY 13440-2069 Tel: (315) 339-6937, Fax: (315) 339-6793, e-mail: info�esda.org.

Newsletter StaffBoard of Directors SponsorCraig ZanderProstat CorporationTel: 952-426-2611E-mail: czander�prostatcorp.com

EditorTerry FinnESD Association7900 Turin Road, Bldg. 3, Rome, NY 13440Tel: 315-339-6937 Fax: 315-339-6793E-mail: info�esda.org

Associate EditorsDevelopmentDavid E. Swenson, PresidentAffinity Static Control Consulting, LLC

Production Design and TestSteve Voldman, Dr. Steven H. Voldman LLCLeo G. Henry, ESD/TLP Consultants

TechnologyCharvaka Duvvury, Texas Instruments

Editorial Advisory BoardBoard of Directors SponsorCraig Zander, Prostat Corporation

PresidentDavid E. Swenson, Affinity Static Control Consulting, LLC

Sr. Vice PresidentDonn Bellmore, Advanced ESD Services +

Vice PresidentLeo G. Henry, ESD/TLP Consultants, LLC.

TreasurerDonn Pritchard, Monroe Electronics

Human ResourcesArnie Steinman, Electronics Workshop

Additional Editorial AssistanceMarti Farris, Intel Corporation

ESD Association Headquarters StaffLisa Pimpinella, Director of Operations Christina Earl, Standards Administrator Terry Finn, Marketing AdministratorCarrie Fragapane, Administrative AssistantKaren Macri, Administrator

7900 Turin Road, Bldg. 3, Rome, NY 13440-2069Tel: (315) 339-6937 • Fax: (315) 339-6793E-mail: info�esda.org • Web: www.esda.org

May 6-7 Regional Tutorial Program Hilton, Minneapolis, MN http://www.esda.org/documents/NCRTPMay09flyer.pdf

May 7-12ESD Association Meeting Series, Hilton, Minneapolis, MN

May 18-213rd Annual International Electrostatic Discharge Workshop (IEW),Stanford Sierra Conference Center, Lake Tahoe, CAhttp://www.esda.org/IEW_registration.html

May 19-20 Regional Tutorial Program Holiday Inn, Tewksbury, MAhttp://www.esda.org/documents/NERTP09.pdf

June 4 Online Charged Board Eventshttp://www.esda.org/documents/ ChargeBoardEventsAGrowing IndustryConcern.pdf

June 16-17 S20.20 Seminar 3M Innovation Center, Austin,TX http://www.esda.org/documents/TXPMSeminar6_09.pdf

June 24-26 Device Design SeminarTesting and Smart PowerMunich, Germany http://www.esda.org/documents/MunichJune09Courseflyer.pdf

June 29-30 Device Design SeminarBangalor, Indiahttp://www.esda.org/documents/DDseminarIndiaJune09.pdf

August 27- 31ESD Association Meeting Series, Disneyland Hotel, Anaheim, CA

August 30 - September 4EOS/ESD Symposium and Tutorials, Disneyland Hotel, Anaheim, CA

October 13-14S20.20 Seminar ESDA Headquarters, Rome, NY