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Simulation of Thermal-Structure Interaction
Kyle C. Koppenhoefer, Ph.D. Principal
ALTASIM TECHNOLOGIES
© Copyright 2014 COMSOL. COMSOL, COMSOL Multiphysics, Capture the Concept, COMSOL Desktop, and LiveLink are either registered trademarks or trademarks of COMSOL AB. All other trademarks are the property of their respective owners, and COMSOL AB and its subsidiaries and products are not affiliated with, endorsed by, sponsored by, or supported by those trademark owners. For a list of such trademark owners, see www.comsol.com/trademarks
Shankar Krishnan, Ph.D. Applications Engineer
COMSOL
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Agenda
• Introduction to Thermal-Structure Interaction
• Simulating with COMSOL Multiphysics® • Thermal-Structural Examples, Design
Challenges, and Solutions • Live Demo
– Shrink Fitting • Q&A Session • How To
– Try COMSOL Multiphysics – Contact Us
Electric current and heat flow through the contacting surfaces of a switch
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Thermal-Structure Interactions
Power generation Electronics and MEMS Automotive
Biomedical Aerospace
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Simulating an Application
• Conception and understanding – Enables innovation
• Design and optimization
– Achieve the highest possible performance
• Testing and verification
– Virtual testing is much faster than testing physical prototypes Heating Circuit
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Model tree Provides instant access to any part of the model settings • CAD/Geometry • Materials • Physics • Mesh • Solve • Results
The COMSOL Desktop®
Graphics Ultrafast graphic presentation, stunning visualization
COMSOL Desktop Straightforward to use, it gives full insight and control over the modeling process
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Poll Question #1
How important is Thermal-Structure Interaction in your simulations?
• Very important - most of my simulations require some form of thermal-
structure interaction
• Important – when it is present, the interaction is important
• Somewhat important – but I don’t tend to work on coupled analysis
• Not important – None involve thermal-structure interaction
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Thermal Expansion
l l + Δ l
Δ l = α(T-Tref)l
Heat
α
T-Tref
Δ l/l
Cool
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Automatic and Manual Couplings Between Thermal and Structural Simulations
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Nonlinear and Anisotropic Material Properties
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Plastic, Viscoelastic, Viscoplastic Materials and Creep
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Dynamic Effects
σ
ε
Tensile stress cools down Compressive stress heats up
Structural damping manifests as vibration-induced heating
Thermoelastic damping in MEMS devices
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Adding More Physical Effects
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Electromagnetic Heating and Thermal Expansion
Joule heating in electronics Induction heating furnace RF heating in a waveguide
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Customized Multiphysics Interactions
Stress-optics: Thermal-stress-induced difference in refractive index between x and y-directions
Heating circuit: Electrical, thermal, and structural coupling between solid and shell
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Thermal-Structure Interaction
Kyle C. Koppenhoefer, Ph.D. Principal
AltaSim Technologies, LLC
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Overview
• Thermal-structural interaction examples • Design challenges • Coupling of temperature/deformation • Computational tools necessary for solving • Structural example problem • Shrink fit demonstration
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THERMAL-STRUCTURAL EXAMPLES
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Thermal-Structural Interaction Electronics
Turbines
Heat Treatment of Metals
Pressure Vessels Shrink-Fitting
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THERMAL-STRUCTURAL DESIGN CHALLENGES
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Thermal-Structural Design Challenges
• Material damage that is a function of temperature (e.g., yielding, creep)
• Mechanical damage due to constrained thermal growth – Mechanical constraints – Spatial temperature gradients – Material property variations (e.g., CTE)
• Spatial variations • Variations with temperature
Turbines
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Constrained Thermal Growth
Δ l = α(T-Tref)l
∆𝒍𝒍
= 𝜶 𝑻 − 𝑻𝒓𝒓𝒓
𝜺𝒕𝒕𝒓𝒓𝒕𝒕𝒍 = 𝜶 𝑻 − 𝑻𝒓𝒓𝒓
𝜺𝒕𝒓𝒎𝒕 = 𝜺𝒕𝒕𝒕𝒕𝒍 − 𝜺𝒕𝒕𝒓𝒓𝒕𝒕𝒍
𝝈 = 𝑬𝜺𝒕𝒓𝒎𝒕
l l + Δ l
Heat
Cool
Thermal strain produces displacement Mechanical strain produces stress
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THERMAL-STRUCTURAL COUPLING
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Thermal-Structural Interaction
Sequentially Coupled
Turbines
Fully Coupled
Loosely Coupled
Temperature → Deformation Examples: • Pressure vessel w/ different fluids • Beam buckling due to thermal load
Temperature ↔ Deformation Examples: • Forging • Contact changes due to deformation
Examples: • Frictional heating (e.g., disk brakes)
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COMPUTATIONAL TOOL – KEY FEATURES
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Key Features
• Thermal and structural analysis within same software – Thermal analysis includes conduction, convection, and
radiation – Elastic, plastic structural response – Ability to model phase changes – Solution methods
• Steady state analysis • Transient analysis
– Sequential coupling • Apply temperatures from thermal analysis to structural
– Two-way coupling • Mechanical contact • Thermal contact • Heat source due to plastic strain
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Key Features
• Material properties – Thermal
• Thermal conductivity • Density • Specific heat (transient) • Latent heat of transformation (temperature range)
– Structural • Elastic modulus • Poisson’s ratio • Yield Strength
– Temperature dependent material properties
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Thermal Contact
• Evaluates heat conduction across two contacting surfaces
• Contact localized at asperities due to surface roughness
• Heat flux on boundaries
Tu
Td
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Thermal Contact
• Three components of conductance
– Constriction conductance (hc) – Gap conductance (hg) – Gap radiation (hr) – h = hc+ hg+ hr
• Friction heat , Qfric, is a heat source term that is partitioned between the two surface using the surface roughness term, r – r=0.5 for identical surfaces
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Thermal Contact
• Cooper-Mikic-Yovanovich (CMY) Correlation – Isotropic surface roughness – Plastic deformation of the surface asperities
• Mikic Elastic Correlation – Isotropic surface roughness – Elastic deformation of the surface asperities
• User Defined – Define constriction conductance directly
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Cooper-Mikic-Yovanovich
• Constriction conductance
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THERMAL-STRUCTURAL EXAMPLE
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Example Problem – Shrink Fitting
• Railroad wheels assembled via shrink fit onto axle
• Axle critical for railway vehicle safety
• Fretting fatigue at fit interface is significant failure mode
• Safety insured by regular inspection of axels
• High contact stress can accelerate fretting fatigue
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Example Problem – Key Features
• Two-way coupled problem due to contact – Mechanical contact – Thermal contact
• Temperature-dependent plasticity • Transient thermal and mechanical analysis • Parametric studies on geometry variations
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Live Demonstration
• Please wait while the content is loading • Demonstration of shrink fit problem setup
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Poll Question #2
What type of thermal-structure interaction are you interested in simulating?
• Thermal expansion – including thermal stress
• Nonlinear materials – viscoelastic, creep, etc.
• Thermal contact – to account for surface effects
• Other multiphysics – involves electromagnetic heating, convective cooling, etc.
• More than one of the above
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Q&A Session
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Product Suite – COMSOL 4.4
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Try COMSOL Multiphysics
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