global technology awards winners - global smt & packaging … · the global assembly journal...

Best practices for evaluating selective soldering systems • Choosing the right optiCal inspeCtion system • graphene, the new wonder stuff? • impediments to solder alloy free electronic (safe) assemBly & more

the global assembly Journal for smt and advanced packaging professionals

volume 13 number 3 march 2013

issn 1474 - 0893

www.globalsmt.net

gloBal teChnology aWards Winners

John W. mitchellinterview inside

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Global SMT & Packaging – March 2013 – 1www.globalsmt.net

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Global SMT & Packagingis published monthlyby Trafalgar PublicationsLimited. The journal is FREE to qualified professionals and is available by subscription at a cost of $360 for the current volume (twelve issues).

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Americas editioncontents

Volume 13, No. 3

March 2013

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eDiTorial2 M&A fever marks changing industry Trevor Galbraith

TeChnoloGy FoCuS10 Best practices for evaluating selective soldering systems Albrecht Beck, Ersa16 Choosing the right optical inspection system Patrick Schuchardt, GOEPEL electronics

SPeCial FeaTureS26 Show preview—SMT Hybrid Packaging 28 Interview30 Global Technology Awards—2012’s Big Winners44 Factory tour—The other side of Flextronics

reGular ColuMnS4 Graphene, the new wonder stuff? Keith Bryant20 Outlook brightens: many signs of a modest upturn Walt Custer and Jon Custer-Topai46 Know reliability, no counterfeits Craig Hillmann48 Impediments to Solder Alloy Free Electronic (SAFE) assembly Joe Fjelstad

6 Industry News52 New Products54 Association News55 Regional Spotlight56 International Diary

oTher reGular FeaTureS

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2 – Global SMT & Packaging – March 2013 www.globalsmt.net

editorial officesEuropeTrafalgar Publications Ltd.Globals SMT & PackagingCrown House, 72 Hammersmith Rd, Hammersmith, London, W14 8THUnited KingdomTel: +44 (0) 207 559 1467 Fax: +44 (0) 207 559 1468E-mail: [email protected]: www.globalsmt.net

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Editor-in-ChiefTrevor GalbraithTel: +44 7924 581 523 (Europe)Tel: +44 20 7792 0792 (UK)Tel: +1 (239) 245-9264 x101 (US)E-mail: [email protected]

Managing EditorTel: +1 (239) 245-9264 x108E-mail: [email protected]

China EditorLu ShuzhenE-mail: [email protected]

South East Asia Technical EditorUsha PrasadEmail: [email protected]

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Web DeveloperTorrence GermanyTel: +1 (239) 245-9264 x105E-mail: [email protected] advertisingEuropeAlex KlocksinCell: +49.1577.893.4884 (Ger.) [email protected] AmericaSandy DaneauTel: +1 (239) 245-9264 [email protected] Asia—IndiaAmitava [email protected]

Trevor GalbraithEditor-in-Chief

editorial

m&a fever marks changing industryNothing stays the same. As the EMS indus-try emerges from the latest global correc-tion, the level of M&A activity has reached fever pitch. JUKI is in merger talks with SONY. Like many Japanese companies, SONY is looking to divest some of its non-core businesses.

Closer to home, there has been no formal announcement yet of who will acquire the assets of DEK, OK International or ECT as Dover Technologies Group finally divest the last of their electronics manufacturing equipment portfolio.

So, what is driving these larger equip-ment companies to head out of the elec-tronics industry? Could it be because there is an increasing amount of Chinese and other Asian equipment starting to make its way into the west? Although competitively priced, these Asian predators were kept at bay by patents, lack of CE certification and a general unwillingness to spend the marketing dollars for what, after all, was perceived to be a relatively small market compared to their home turf.

All that changed with the recent down-turn in consumer electronics manufactur-ing in Asia. Many of the patents that pro-tected western manufacturers have expired or will expire soon. Hungry distributors in the west are partnering with Asian manu-facturers to help guide them through the certification needed and the marketing to establish these brands in the west.

However, the acquisitions have not been limited to capital equipment compa-nies. Among the manufacturers of materi-

als and consumables, FCT has acquired Global Stencil and MRC to add to its fairly recent acquisition of the DEK stencil busi-ness in the US and making them one of the largest suppliers of stencils in the country.

Another recent announcement was the acquisition of Ferro Corp.’s solar pastes business by W.C. Heraeus GmbH. Only four years ago Ferro was market leader in silver metallization paste. They were sup-planted by Heraeus, who achieved a half percent greater efficiency and captured the market. Ferro still retains a strong presence in the thick-film microelectronics business.

You only have to cast your eye down the list of Fortune 500 companies to see how many of them didn’t exist 50 years ago and also how many household names from 50 years ago no longer exist. As I said at the beginning of this article: Nothing stays the same!

—Trevor Galbraith.Editor-in-Chief

[email protected]

A BREAKTHROUGH IN AGILE SPEED. Today’s SMT environment is changing - fast. Increasing volumes.Disrupted production schedules. More changeovers. To adapt, manufacturersneed to be more responsive. Not just with higher speeds, but with intelligentmaterial handling and information management. Now, with the MY100e series,MYDATA is proud to offer a total SMT solution that makes your production linemore agile than ever. It’s where high-mix thinking meets high-speed production, to meet the challenges of tomorrow.

www.mydata.com

Be faster, smarter, more agile.

A BREAKTHROUGH IN AGILE SPEED.

Be faster, smarter, faster, smarter, faster, more smarter, more smarter, agile.

Meet us at booth 7-127at SMT Hybrid Packaging 2013.

A BREAKTHROUGH IN AGILE SPEED. Today’s SMT environment is changing - fast. Increasing volumes.Disrupted production schedules. More changeovers. To adapt, manufacturersneed to be more responsive. Not just with higher speeds, but with intelligentmaterial handling and information management. Now, with the MY100e series,MYDATA is proud to offer a total SMT solution that makes your production linemore agile than ever. It’s where high-mix thinking meets high-speed production, to meet the challenges of tomorrow.

www.mydata.com

Be faster, smarter, more agile.

A BREAKTHROUGH IN AGILE SPEED.

Be faster, smarter, faster, smarter, faster, more smarter, more smarter, agile.

Meet us at booth 7-127at SMT Hybrid Packaging 2013.


Know reliability, no counterfeits

Unless you have been lucky enough to be on vacation in the Sahara Desert for the last

15 years, you have probably heard or been affected by counterfeit electronic parts (and, if you’ve been in the desert that long, you probably have other things to be worried about). However, with all the headlines, presentations, courses, articles, and case studies, the basics of counterfeiting can be become slightly opaque.

The very first step in understanding counterfeiting is to understand the funda-mental reason why counterfeiting survives and even thrives in this day and age. And the answer can be identified through the classic root-cause technique of the 5 Whys (ask why five times and you’ll get your answer)

1. Why do counterfeiters counterfeit? Because they can make money (there’s a more devious reason, but we’ll get to that later).

2. Why can they make money? Because people buy counterfeits.

3. Why do people buy counterfeits? Because they cannot find the parts they need from an approved source.

4. Why can they not find the parts from an approved source? Because the parts are obsolete.

5. Why are the parts obsolete? WRONG QUESTION

The process of parts being designed, produced, and then replaced by better (faster, cheaper, smaller) parts has been around since the electronics industry started over 60 years ago. And this process of continual improvement is alive and well in almost every industry (mercury ther-mometers anyone?).

Now some will claim that this part life cycle is shrinking with every new genera-tion technology. The reality is slightly more complex, as a number of technologies see minimal benefit from a smaller process node (analog, power) and a number of large industries do not experience market drivers to reduce size (automotive, enter-

prise). This complexity can be clearly seen in the figure from iSuppli. While the highest revenue process node is 45 micron and smaller, the second highest is 350 micron. This clearly demonstrates that there is far more stability than claimed in a number of sectors within the semiconductor industry.

Regardless of lifecycle, the focus on obsolescence is focusing on the wrong problem. Obsolescence has always and will always be a part of the electronics industry. The bigger question is why organizations are susceptible to obsolescence in the first place. And the answer is…

Reliability

The concern with obsolescence comes about in primarily two areas: Production and Repair (aka Sustainment). If an elec-tronic product or systems is designed and produced over a long period of time, say more than five years, it becomes susceptible to obsolescence. And the primary reason why a product has such a long life cycle is concerns with reliability.

On the front-end, the process for qualifying the design will tend to be so onerous, with numerous qualification tests, that years of production are required to recoup those costs. Customers can also be so conservative and field-performance dependent that they demand no change in the design or materials. On the back-end,

units fail in the field (nothing has 100% reliability) and need to be fixed or replaced. Both drivers, on the front-end and back-end, can be solved with a better ability to predict the reliability and performance of the electronic design.

Qualification testing is theoretically predicated on two concerns: the presence of defects from the manufacturing process and the robustness of the design (this robustness can be electrical, thermal, or mechanical in nature).

Though you might be surprised, there are organizations and academics trying to predict the presence and severity of defects that will appear during the manufacturing process. However, the ability to imple-ment this prediction in a practical way is still several years away. In addition, the value of this predictive ability is relatively limited for two reasons. The first is that only the very earliest part of any qualifi-cation test is concerned with the presence of defects. The longer, and more onerous, portion of the testing is always driven by design robustness. Secondly, the number of samples available for qualification testing is typically so small and produced over such a short timeframe, that there is a statistically small likelihood of detecting of defects of any relevance.

The greater opportunity comes with simulation and modeling of a ‘perfect’ design (no defects). And there is no time


Craig Hillman



like the present to implement these capa-bilities throughout the electronics industry. Many years of experience in building, testing, and fielding electronics has resulted in a virtual cornucopia of data and infor-mation that has been used to develop and validate a variety of electrical, thermal, and mechanical algorithms. In addition, the recent revolution in software user inter-faces and online libraries has democratized the simulation and modeling process. With intuitive commands and part properties available at your fingertips, a PhD is no longer required to model the most complex designs with rigor and completion.

The use of upfront simulation and modeling can not only dramatically reduce the cost and delay of qualification, it also provides the key to eliminating obsoles-cence risks due to long-term field support (sustainment). Parties responsible for repair or sustainment most plan for sparing. Accurate planning requires accurate reli-ability prediction. The historical approach, using an empirical methodology based on handbooks, has been conclusively proven

to be highly inaccurate. However, a combi-nation of understanding the potential defect population and the degradation behavior of the design (due to drifts in electrical parameters, aging, fatigue, etc.) opens the window for highly accurate reliability prediction. With this prediction, procurement of appropriate sparing can be done far in advance of any obsolescence event.

Now, I will admit to some simplifica-tion. For example, one additional issue I did not talk about was the propen-sity to perform repairs at the part level. Developing a sustainment program built around replacement at the board or box level would also go a long ways towards obsolescence, and therefore counterfeit, mitigation.

It is important to note that this concept of using more sophisticated simulation and modeling tools to protect against counterfeit is already happening. A few ‘best-in-class’ OEMs are starting to require comprehensive simulation and modeling from their board / box suppliers. The

results have been nothing short of stunning. Imagine a precipitous fall in warranty returns combined with a reduction, or in rare cases elimination, of numerous quali-fication tests. It almost seems too good to be true.

Of course, there is much more needed to stop counterfeiters (more about that in my next column). But, if we could all do a little more planning in the beginning, that will go a long way towards preventing a lot of pain at the end.

Craig Hillman is CEO and Managing Member for DfR Solutions. Dr. Hillman’s specialties include best practices in Design for Reliability (DfR), Pb-Free strategies for transitioning to Pb-free, supplier qualifica-tion (commodity and engineered products), passive component technology (capacitors, resistors, etc.), and printed board failure mechanisms. Dr. Hillman has over 40 Publications and has presented on a wide variety of reliability issues to over 250 companies and organizations.

Global SMT & Packaging – September 2012 – 45www.globalsmt.net

SMTA International 2012

Vitronics Soltec 6746 is a selective solder-ing automation work cell that has been optimized for maximum throughput and fl exibility, while minimizing its footprint in the factory. It features an inline design that provides parallel processing for fast cycle times, and intuitive program-ming features enhance the automation capacity of the work cell. � e small size of the 6746 allows it to be easily recon-fi gured into a new production cell or line when changing demands require it. www.vitronics-soltec.com

ZESTRON—Booth 311

ZESTRON will feature its latest cleaning agents, HYDRON® WS 325 and VIGON® N 600. Powered by FAST® Technology, HYDRON® WS 325 is specifi cally designed for water-soluble (OA) defl uxing spray-in-air inline and batch cleaning applications. VIGON® N 600 is a revolutionary pH-neutral MPC® Technology based cleaning agent specifi cally developed for various spray-in-air inline and batch defl uxing applications. To have your cleaning ques-tions answered by accredited ZESTRON engineer Umut Tosun at the Doctor’s Hours or to learn more about ZESTRON’s com-plete line of products, stop by the booth. www.zestron.com

Don’t miss Doctors’ HoursSMTA International’s Doctor’s Hours Program provides solutions and guidance from high-level experts at no-charge to SMTA International attendees. Experts will be in exhibitor booths on the show fl oor at designated times for consultations, to answer questions and solve problems that attendees are currently experiencing. View the full schedule of doctors’ hours at www.smta.org/smtai/drs_hours.cfm or check your Show Directory when you arrive at the event.

Global Technology AwardsPresenting the year’s Best of the Best in electronics manufacturing. � e 2011-2012 Global Technology Awards awards ceremony will be held at SMTA International on Tuesday, October 16th in the Show Floor � eater. http://awards.globalsmt.net

THEREARENOSHORTCUTSTOA5-MILDOTSmall, repeatable volumes area challenge. But not impossibleif you have been creating them aslong as we have. However, to doit well, you need three things:

Dispensing Expertisein a variety of applications:micro-attach, precision fill,highly-repeatable patterns;

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Product Development for patented valves,dispensing cartridges, needles, and accessories.

For Micro Dispensing, there is oneproduct line that is proven and trustedby manufacturers in semiconductorpackaging, electronics assembly,medical device, and electro-mechanicalassembly the world over.

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www.dltechnology.comDL Technology is a registered trademark of DL Technology LLC. DispenseLink is a registered trademark of DL Technology LLC.HY-FLO is a trademark of DL Technology LLC.

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DispenseLink® Dispensing Controller

DispenseLink® is DL Technology’s cost-effective controller for micro volume dispensing of dot arrays, lines, fill routines, and custom patterns on any standard dispensing platform. DispenseLink® provides totally programmable increment and velocity control necessary for today’s dispense requirements.

DispenseLink® features password-secure programming and touch screen control. The user-friendly software and easy integration allows fast setup and total control of the dispensing process. DispenseLink® also provides the flexibility needed to run difficult multi-task applications.

www.dltechnology.comDL Technology is a registered trademark of DL Technology LLC. EZ-FLO is a trademark of DL Technology LLC.

DispenseLink® dispense controller

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© 2013 Panasonic Corporation of North America. All rights reserved.

“Panasonic equipment delivers best-in-class

accuracy and PanaCIM® drives operational effi ciency”

“ Panasonic equipment delivers the best-in-class accuracy, repeatability, and dependability needed to manufacture the high-quality products our customers expect.

PanaCIM software drives operational effi ciency throughout our high-mix, low-to-medium-volume process—from quick changeovers to real-time production monitoring and reduced rework.

Selecting Panasonic has helped us to keep overall manufacturing costs down, maintain our competitiveness, and allow us to pass cost savings to our customers.”

Dave SpeharDirector of Operations

As a manufacturer, Panasonic understands the evolving demands of today’s electronics assembly manufacturing environment. And that uniquely enables us to provide scalable, integrated, and effi cient solutions that help our customers remain viable in a competitive market.

No matter if you’re high mix/low volume, low mix/high volume, or anything in between, Panasonic equipment, MES software, and other services can help improve throughput and effi ciency while keeping quality reliably high.

Add value, add sustainability, add Panasonic.

For more information, visit www.panasonicfa.com/pennatronics

pfsa_globalsmt_jan13.indd 1 12/19/12 11:36 AM

industry newsindustry news

panasonic factory solutions company of america selects restronics as a value-added sales repPanasonic Factory Solutions Company of America has selected REStronics New England, Inc. as a Value-Added Sales Representative for its any-mix electron-ics assembly manufacturing solutions throughout Massachusetts, Connecticut, New Hampshire, Vermont, Maine, and Rhode Island. Represented solutions will include Panasonic’s surface mount, screen printing, through-hole insertion, MES (Manufacturing Execution System) soft-ware, and enterprise consulting services.www.restronics.com, www.panasonicfa.com

parmi opens new facility in massachusettsPARMI’s new technology center, located in Marlborough, MA, is led by Jeff Mogensen, former VP Sales of Speedline Technologies. Joined by industry experts Joe Perault and John Morini, the facility provides a unique range of analytical and technical services with decades of solder paste screen printing

and inspection experience. In addition to its own product line, the facility integrates equipment from premier industry partners Asys, DEK and MPM. The office officially opened in December 2012. www.PARMI.com

suntron corporation increases placement and inspection capabilities for miniaturized medical devicesSuntron Corporation announces that it has the capability to place and inspect the tiny packages needed for miniaturized medical device electronics. Suntron builds highly complex boards with 01005 components

requiring the control of many variables during assembly process. The 01005 case size is half the size of the 0201, previously considered to be the smallest case size in surface mount technology. Due to the component’s tiny size, well-planned modi-fications to the paste application and place-ment processes are necessary to achieve success. www.suntroncorp.com

roger cox to lead new component services division at aceACE Component Services announces the appointment of Roger Cox to the position of Operations Manager. In his new position, Roger will oversee the day to day operations and planned growth of ACE’s new division, which provides a range of component-related services including lead tinning, sol-derability testing, and much more. Roger previously worked for Hewlett-Packard/Agilent for 23 years, serving as a manufac-turing, process, R&D, and quality engineer. His experience includes management roles in engineering, operations, quality and supply chain. He also served KeyTronicEMS as the Director of Corporate Quality and Director of Engineering. www.ace-protech.com

inovar chooses Juki again Juki Automation Systems announces that Inovar, Inc., recently purchased three KE-1080EN High-Speed Flexible Mounters. A premier contract electron-ics manufacturer (CEM), Inovar uses Juki equipment throughout its state-of-the-art facility in Logan, UT. Juki has been the placement equipment of choice for Inovar since the company was founded in 1998. The modular design of the Juki

computrol installs assembléon aX-501 pick-and-place system at its utah plantComputrol, Inc. has installed an Assembléon AX-501 pick-and-place system with a 47 Tray TEM unit at its Orem, Utah facility. With the implementation of the AX-501, Computrol benefits from the highest placement accuracy with constant component monitoring from pick-to-place and on-the-fly laser alignment. Additionally, the system features a fully software controlled, service-driven pick-and-place cycle: con-trolled pick, optimum acceleration and deceleration process, and controlled place-ment. The new AX-501 is fully modular with an output of up to 121,000 components/hour (IPC9850) and 260 feeding inputs. www.computrol.com

© 2013 Panasonic Corporation of North America. All rights reserved.

“Panasonic equipment delivers best-in-class

accuracy and PanaCIM® drives operational effi ciency”

“ Panasonic equipment delivers the best-in-class accuracy, repeatability, and dependability needed to manufacture the high-quality products our customers expect.

PanaCIM software drives operational effi ciency throughout our high-mix, low-to-medium-volume process—from quick changeovers to real-time production monitoring and reduced rework.

Selecting Panasonic has helped us to keep overall manufacturing costs down, maintain our competitiveness, and allow us to pass cost savings to our customers.”

Dave SpeharDirector of Operations

As a manufacturer, Panasonic understands the evolving demands of today’s electronics assembly manufacturing environment. And that uniquely enables us to provide scalable, integrated, and effi cient solutions that help our customers remain viable in a competitive market.

No matter if you’re high mix/low volume, low mix/high volume, or anything in between, Panasonic equipment, MES software, and other services can help improve throughput and effi ciency while keeping quality reliably high.

Add value, add sustainability, add Panasonic.

For more information, visit www.panasonicfa.com/pennatronics

pfsa_globalsmt_jan13.indd 1 12/19/12 11:36 AM


industry news

ALPHA® ASPEN

ALPHA® ASPEN Identifies Low Temp Processing Value

alpha

ASPEN is an interactive Fitness for Use assessment tool that willhelp you determine if Low Temp processing is a good fit for yourcurrent process.

It will:

• Navigate through seven areas of interest relevant to low-temperatureSMT processing of electronic assemblies

• Capture the key technical information appropriate to your processand create a customized report based on your input that can beautomatically emailed to you

• Quantify the areas of value creation your company could expect byswitching to low-temp processing

|ASPEN

Worldwide/Americas Headquarters • 109 Corporate Boulevard • South Plainfield, NJ 07080 • USA • +1-814-946-1611 – Dial 0 • www.alpha.alent.com European Headquarters • Forsyth Road • Sheerwater • Woking GU215RZ • United Kingdom • +44-1483-758-400Asia-Pacific Headquarters • 8/F, Paul Y. Centre • 51 Hung To Road • Kwun Tong • Kowloon, Hong Kong • +852-3190-3100

© 2013 Alpha

aspen_non-apex_ad_countercards.qxp 2/15/13 3:12 PM Page 1

machines makes it easy to expand or rear-range existing lines to meet the demands of a changing market. The purchase of the three new Juki KE-1080EN machines provides Inovar with more capacity for its growing business. www.inovar-inc.com, www.jukiamericas.com

aqueous technologies appoints new field sales managerScott F. Cain recently joined Aqueous Technologies as field sales manager after spending the last six years as the global sales manager for InsulFab PCB Tooling. During that time, Scott cultivated out-standing relationships throughout North America with customers and sales rep-resentatives alike. Additionally, Scott has been involved with the SMTA on a local and national level, including speaking at tabletop shows and serving on the exhibi-tor committee for SMTA International. www.aqueoustech.com

chip inventory at semiconductor suppliers reaches worrisome highChip inventory held by semiconductor suppliers reached alarmingly high levels in the third quarter of 2012 amid weak market conditions, according to an IHS iSuppli Semiconductor Inventory Insider Market Brief from information and analyt-ics provider HIS. Overall semiconductor revenue declined by 0.7 percent sequen-tially during the fourth quarter last year. The poor results came after inventory reached exceedingly high levels by the end of the third quarter in 2012, amounting to 49.3 percent of total semiconductor reve-nue—more elevated than at any point since the first quarter of 2006. www.ihs.com

spectrum assembly enhances manufacturing capabilitySpectrum Assembly Inc. announced that it is enhancing its manufacturing capabil-ity with the purchase of Mydata’s MY500

jet printer. The new printer is expected to integrate well with SAI’s highly automated, paperless factory strategy. www.saicorp.com

new dispensing equipment selector guide simplifies product selectionDymax Corporation has released a new selector guide for manual and automated fluid-dispensing systems. This compre-hensive guide provides detailed product information and is organized in a manner that makes comparison easy. Specifications such as dispense modes, viscosity range, and material compatibility are included, as well as the type of supply reservoir that each unit can accommodate. Dymax, in alliance with some of the world’s lead-ing dispensing companies, has developed high-quality, field-proven dispense systems to fit many dispensing applications. www.dymax.com

vitronics soltec promotes Khoh Kar heong to product manager - selective line asiaVitronics Soltec is pleased to announce the promotion of Khoh Kar Heong to the newly created position of Product Manager, Selective Asia. Khoh will be based out of the Vitronics Soltec Penang, Malaysia facil-ity with a responsibility for developing and growing the Selective product business throughout the Asia Pacific region. The cre-ation of the position is part of an effort by Vitronics Soltec to invest more resources to what is a rapidly growing selective business in Asia. www.vitronics-soltec.com

flex interconnect technologies re-certified as lockheed martin’s approved supplier for flex and rigid-flex circuits Flex Interconnect Technologies announces that it has been re-certified by Lockheed Martin Missiles and Fire Control as its approved supplier for producing flex and rigid-flex circuits to IPC-6011 class 3 and IPC-6013 class 3. The certification allows FIT to continue to produce parts for all of the Lockheed Martin divisions. To accom-plish this, FIT demonstrated that its quality system conforms to both AS9100C stan-dards and the company completely imple-mented IPC-6011 class 3 and IPC-6013 class 3 specifications as part of its day-to-day operations in manufacturing flexible circuits. www.fit4flex.com

Best expands rework services with automated non-contact scavengingVJ Electronix, Inc. announces the installa-tion of a new 400ST Automated Scavenger System into BEST’s Rolling Meadows, IL facility. The VJ Electronix 400ST provides an automated approach to residual solder removal (site dressing), a process that is commonly performed by hand. The sys-tem’s unique Dynamic Height Sensing ensures consistent process while prevent-ing damage to the delicate solder mask and pads. Automated sequences address large BGA sites, densely spaced QFNs or PoPs, and even through-hole connectors.www.vjelectronix.com

Btu international promotes Bruce Quigley to director – customer serviceBTU International, Inc. announced the promotion of Bruce Quigley to the position of Director – Customer Service. In his new role, Quigley will lead BTU’s global parts and service organizations to strengthen the company’s consistent support of its cus-tomers in all regions. Additionally, Quigley will work with BTU’s global customer base to develop new multi-tier programs to further increase their utilization, and successful use, of BTU’s equipment and service networks. Quigley has extensive background in managing customer sup-port organizations around the world, and holds a bachelor’s degree in business man-agement. www.btu.com

Jason maupin promoted to Vice president, enthone americas Mr. Maupin has over fifteen years experience in sales management and business develop-ment. Prior to his pro-motion, Mr. Maupin was the Vice President Sales, Enthone North America, where he was instrumental in working with the com-pany’s regional sales managers and busi-ness development teams to grow market share by leveraging Enthone’s technical and market expertise at new and existing key accounts. Most recently, he also was appointed General Director for Enthone Mexico. www.enthone.com

ALPHA® ASPEN

ALPHA® ASPEN Identifies Low Temp Processing Value

alpha

ASPEN is an interactive Fitness for Use assessment tool that willhelp you determine if Low Temp processing is a good fit for yourcurrent process.

It will:

• Navigate through seven areas of interest relevant to low-temperatureSMT processing of electronic assemblies

• Capture the key technical information appropriate to your processand create a customized report based on your input that can beautomatically emailed to you

• Quantify the areas of value creation your company could expect byswitching to low-temp processing

|ASPEN

Worldwide/Americas Headquarters • 109 Corporate Boulevard • South Plainfield, NJ 07080 • USA • +1-814-946-1611 – Dial 0 • www.alpha.alent.com European Headquarters • Forsyth Road • Sheerwater • Woking GU215RZ • United Kingdom • +44-1483-758-400Asia-Pacific Headquarters • 8/F, Paul Y. Centre • 51 Hung To Road • Kwun Tong • Kowloon, Hong Kong • +852-3190-3100

© 2013 Alpha

aspen_non-apex_ad_countercards.qxp 2/15/13 3:12 PM Page 1


best practices for evaluating selective soldering systems

introductionThe continuous drive through-out the electronics industry to design and manufacture new and innovative products has resulted in competitive designs that decrease physical size, consolidate componentry and increase performance char-acteristics. As a result of these new designs manufacturers of electronic products are forced to contend with the challenge of soldering through-hole components in high thermal mass printed circuit board assemblies (PCBA) together with miniaturized SMT com-ponents. Very often these high thermal mass PCBA designs involve thick printed circuit boards with either high layer

counts or thick copper ground planes.

While the introduction of selective soldering has proven to be a valuable tool for over-coming many of the challenges associated with soldering of through-hole components in these mixed-technology assemblies, excellent process control is required to ensure the ability to solder high thermal mass PCBAs with a high degree of repeatability. Demanding applications have proven that advancements in flux application, preheating capability and soldering tech-niques are essential to achieve excellent vertical through-hole fill when soldering high thermal mass PCBAs. These

Selective soldering is certainly not a new process, having been used to solder through-hole components by various industries such as automotive electronics, medical, aerospace and telecommunications. In recent years, many electronics manufacturing companies have continued the use of selective soldering technology during the prototype process to solder newly designed products of greater component density and complexity. This paper examines the evaluation of entry-level selective soldering systems including the benchmarking of key attributes that result in highly flexible selective soldering systems capable of soldering assemblies to the highest quality standards.

Albrecht Beck, Ersa, Plymouth, Wisconsin, USA

Best practices for evaluating selective soldering systemsKey aspects of the selective soldering process and benchmarking of entry-level platforms

Features Platform A Platform B Platform C Platform D Platform E

Drop-jet spray fluxer ● □ ● ● ●

ultrasonic fluxer □ ─ □ ─ ─

Dual flux heads □ □ □ ─ ─

bottom-side preheating □ ─ □ □ ●

Topside preheating □ □ □ □ ─

Closed loop preheat control ● □ □ □ □

lead-free solder module ● □ ● ● ●

Maintenance free electromagnetic solder pump ● ─ ─ ─ ─

Solder wave height control ● ● □ ● □

auto solder wire feeder ● ● ● □ u

Second solder pot □ □ ─ ─ □

Process monitoring camera □ □ □ □ □

bar code reader □ □ u u u

Fiducial recognition □ □ □ □ □

board warpage detection and auto compensation □ ─ □ ─ □

notes: ● = Standard □ = optional ─ = not available u = unspecified

Table 1. Comparison of primary features for major entry-level selective soldering systems



same demands must be met by entry-level selective soldering systems when soldering thermal challenging PCBAs in a prototype or new product introduction (NPI) envi-ronment.

comparing equipment choicesThere are many selective soldering systems available in the marketplace, ranging from fully automated high-volume systems to entry-level systems for lower volume applications. In addition, several features and options are available for these systems which should be considered based on the demands of a particular application.

Regardless of the selective soldering system utilized, it is essential that the soldering process variables including flux deposition, topside board preheat temper-ature, solder pot temperature and contact time, as well as the interactions between these process variables, be fully optimized in order to develop a robust process for thermally challenging high mass PCBAs.

When conducting a side-by-side comparison of the major entry-level selective soldering system available in the market today, it becomes apparent that many system features are available as addi-tional options, which should be consid-

ered when comparing capital investment (Table 1). Recently some globally sourced low-cost selective soldering machines have become available in the North American market. We do not advocate the use of these machines since they have limited

process capability as well as questionable process repeatability.

In additional to comparing the avail-able features of the major entry-level selec-tive soldering systems, it is recommended that a review of the specifications also be conducted to determine which of these systems will meet the specific require-ments of a given application in terms of board size, component clearance and preheating capability (Table 2).

During the evaluation process, a side-by-side analysis should also be done of the fluxer, preheat control methodology and solder bath temperature range to deter-mine which platforms will best meet the product requirements foreseen for both current and future production needs1.

Beyond reviewing the specifica-tions of the candidate entry-level selec-tive soldering systems, it is also recom-mended that sample PCBAs be soldered and undergo cross sectional analysis using either potting and polishing with optical inspection or X-ray inspection to verify through-hole vertical fill as a final step in the evaluation process leading up to a purchase decision2. X-ray analysis is an excellent tool to confirm that the final system chosen is capable of achieving vertical through-hole fill of greater than 75% and that the platform chosen is

Regardless of the selective soldering system utilized, it is essential that the soldering process variables and the interactions between these variables be fully optimized.

Specifications Platform A Platform B Platform C Platform D Platform E

Maximum PCb width 16" (406mm) Std.20" (508mm) Opt.

12" (305mm) Std.18" (457mm) Opt.

18" (457mm) 19.6" (500mm) 16.1" (410mm)

Maximum PCb length 20" (508mm) Std.24" (610mm) Opt.

12" (305mm) Std.24" (610mm) Opt.

20" (508mm) 19.6" (500mm) 16.1" (410mm)

Topside PCb clearance 4.7" (120mm) *7.5" (190mm) **

u 7.4" (190mm) 2.4" (60mm) 3.5" (91mm)

bottom-side PCb clearance 2.4" (60mm) u 1.5" (40mm) 1.2" (30mm) u

PCb edge clearance 0.1" (3mm) u 0.1" (3mm) u 0.15" (4mm)

Maximum PCb/pallet weight 18 lb. (8 kg) u u u 11 lb. (5 kg)

bottom-side preheat method Infrared Latent heating Heated nitrogen Halogen lamp Infrared

bottom-side closed loop pre-heat control method

Thermocouple ─ ─ u u

bottom-side preheat output 12 kW u u 900 W 9 kW

Preheat temperature range 0-200 ºC u u u u

Topside preheat method Convection Infrared Infrared Infrared ─

Topside closed loop preheat control method

Thermocouple Optical pyrometer u u ─

Topside preheat output 5 kW 3 kW 2.5 kW 7.5 kW ─

Solder volume (tin-lead) 29 lb. (13.1 kg) 30 lb. (13.6 kg) 18 lb. (8.1 kg) 42 lb. (19 kg) 88 lb. (40 kg)

Maximum solder temperature 320 ºC Std. 450 ºC Opt.

400 ºC 350 ºC 320 ºC u

notes: ● = with top preheating □ = without top preheating ─ = not available u = unspecified

Table 2. Comparison of specifications for major entry-level selective soldering systems



capable of delivering consistent through-hole fill across all pins regardless of the heat sinking effects of ground planes or inner layers. For certain critical applications manufacturers require and are inspecting for 100% vertical through-hole fill. It may also be recommended to add thermal reliefs in heavy copper ground planes or inner layers since experience shows that in some cases it may not be possible to achieve 100% vertical through-hole fill without using this type of design feature.

Since maximum flexibility is required in many production environments, entry-level selective soldering systems that have the ability to process different flux types or different solder alloys at the same time should be considered (Table 3). System capabilities that provide a high level of process control, such as dynamic wave height control, volumetric flux control and automatic solder replenishment should also be considered.

An additional factor to consider when comparing entry-level selective soldering systems is the use of servo motor drives versus stepper motors. While servo motor drives are slightly more costly, they make a selective soldering system more capable and reliable in terms of positioning.

preheat selectionTypically the preheating method and its parameters are chosen according to the

thermal demands of the PCBA as well as the flux chemistry. High density PCBAs or board assemblies with a high layer count or a high number of interlayers or high thermal mass components will place an additional burden upon the preheating

system. It is of particular importance that the temperature profile recommended by the flux manufacturer be maintained during the solder process despite the ther-mal demands of a high mass PCB or high thermal mass components.

There are four primary methods of preheating available for selective soldering systems including, latent heating, infrared (IR) heating, convection heating, or combi-nation IR/convection heating. Latent heating is the heat radiated from the solder pot and solder nozzle, is of limited capability and is slow to heat a PCBA to the required temperature. Medium wave length IR heating has a rapid response rate and is flexible enough for most types of flux. Convection heating has a lower gradient and heat transfer rate while exhib-iting greater uniformity. Combination IR/convection heating is beneficial for high thermal mass applications such as PCBAs with high thermal mass through-hole components, high layer count multi-layer circuit boards or assemblies with heavy ground planes.

The type of preheat control is also very important to assure proper control over the preheating process. Closed loop control is essential with feedback from a thermo-couple to control the heating source and compensate for different thermal loads and operating conditions. An ideal situation is to have sufficient closed loop control

Capabilities Platform A Platform B Platform C Platform D Platform E

Dual flux heads to run different flux types in mixed production □ □ ─ ─ ─

Dual flux heads adjustable to flux two boards at same time □ ─ ─ ─ ─

Segmented top preheating □ ─ ─ ─ ─

Closed loop heated nitrogen □ ─ ─ ─ ─

Dynamic solder level monitoring ● ● ● ● □

Dynamic wave height monitoring ● ● □ ● □

Dual integrated solder pots for different alloys or nozzle sizes □ □ ─ ─ □

Dual solder pots adjustable to solder two different boards at same time

□ ─ ─ ─ u

auto solder pot exchange □ □ ─ ─ □

wave soldering nozzle □ □ ─ u u

Compatible with hMP solder alloys □ □ ─ u u

operation via touch screen □ ─ ─ ● ─

SMeMa interface □ ─ ─ ─ ●

CaD data download □ □ □ u □

off-line programming □ □ □ □ □

optical solder wire feeder for poka-yoke detection □ u u u u

Traceability per Sae/ZVei standards ● ─ ─ u u

notes: ● = Standard □ = optional ─ = not available u = unspecified

Table 3. Comparison of principal capabilities for major entry-level selective soldering systems

High density PCBAs or board assemblies with a high layer count or a high number of interlayers or high thermal mass components will place an additional burden upon the preheating system.

Troubleshooting SMT Assembly?

Interface Analysis Software enables In-Depth review of the attachment interface between two surfaces, such as package to PCB

For more information send an email to: [email protected]

Dual Surface Comparison at Any Temperature

Shape Matching Identifies Where Opens/Shorts May Appear

Gap and Root Cause Analysis _ Resolution

akrometrix-GSP13.3_v1.indd 1 2/21/13 12:57 PM

Troubleshooting SMT Assembly?

Interface Analysis Software enables In-Depth review of the attachment interface between two surfaces, such as package to PCB

For more information send an email to: [email protected]

Dual Surface Comparison at Any Temperature

Shape Matching Identifies Where Opens/Shorts May Appear

Gap and Root Cause Analysis _ Resolution

akrometrix-GSP13.3_v1.indd 1 2/21/13 12:57 PM



so that a Cpk (capability process index) of greater than 1.00 can be achieved with the surface temperature across the entire PCBA varying no more than ±5.0˚C from the mean. This type of entry level selective soldering system can achieve very good board-to-board thermal repeatability.

Some entry level systems utilize an optical pyrometer to measure the surface temperature of the PCBA and use this

measurement method to control the preheating process. These systems typically can only control the average PCBA surface temperature within a range of ±15.0˚C and only within the field-of-view (FOV) of the optical pyrometer rather than the entire area of the PCBA. Since an optical pyrom-eter senses the average infrared energy emitted from the surface it is aimed at, it is susceptible to different colors of PCB

material, reflective components, closely packed light colored SMT components, as well as numerous other factors that can result in a PCBA temperature range of as much as ±20.0˚C.

An improved method of preheating is an entry-level selective soldering system equipped with a full area bottom-side infrared preheat module with emitters that can be switched in groups to match their output to the thermal requirements as well as the size of the PCBA (Figure 1).

When used in conjunction with a topside convection preheating module, this combination of bottom-side infrared and topside convection preheating yields highly effective and reproducible results for thermally demanding applications of high layer count and/or high thermal mass assemblies. Studies have shown that the use of topside convection preheating together with bottom-side infrared preheat allows the PCBA to reach soldering temperature without destroying the flux activators prior to soldering.

sustained preheatSome large or high thermal mass PCBAs can be challenging for any through-hole soldering process and particularly trouble-some for certain selective soldering sys-tems where the preheating is applied only to the bottom of the board assembly. The ability to apply topside preheating continu-ously throughout the entire soldering cycle is critical to achieving high quality results when soldering thermally challenged assemblies. The use of sustained topside convection preheating promotes capillary action of the molten solder and increases the vertical hole fill within plated through-hole barrels as well as the formation of topside solder fillets (Figure 2). In addition, the use of sustained topside convection preheating improves the thermal distribu-tion as well as the solderability of difficult assemblies. Topside convection preheat is not practical or possible for selective sol-dering systems that grip and robotically move the PCBA since the topside preheater would have to travel with the PCBA and gripper mechanism.

To maintain solder joint quality the control of the topside convection preheating is critical. Systems that use closed loop feedback from a thermocouple to control the heating source can control the topside surface temperature of the PCBA within a range of ±5.0˚C.

It should be noted that while the use of sustained preheat is an advantage for improving solder joint formation and

Figure 1. Full area bottom-side IR preheat module with emitters switchable to match preheat requirements.

Figure 2. Topside convection preheat module ensures sustained preheat throughout soldering cycle.



through-hole vertical fill, sustained preheat does not alter the intermetallic thickness or intermetallic microstructure.

Wave dynamicsThe solder pot and solder pump mecha-nism of a selective soldering system should be of a good design in order to deliver reli-able performance as well as being easy to maintain. The solder pump should deliver uniform and stable control of solder flow so that the wave dynamics create a smooth flow at the solder nozzle tip. Solder nozzles should also be of a good design since they can reach operating temperatures of 290˚C when operating with tin-lead solder alloy and to as high as 420˚C when used with high melting point (HMP) solder alloys. At the same time solder nozzles should have minimal thermal deformation and inner stress making their removal and cleaning easy to perform.

There are three primary types of solder pumps available for selective soldering systems including, impeller pumps, vane pumps and electromagnetic pumps. Impeller solder pumps are low in cost but generate a vortex in the solder bath and are susceptible to wave height fluctuation. Vane solder pumps create less of a vortex and therefore maintain a somewhat more stable wave height. Electromagnetic solder pumps have the significant advantage of having no moving parts, do not create a vortex thus having a very stable wave height and also create very little dross. Frequency controlled, servo driven elec-tromagnetic solder pumps ensure very constant flow rates and offer precision control over solder wave height (Figure 3). Since an electromagnetic solder pump has no moving parts it has the added benefit of being virtually maintenance free.

An important process control capa-bility is dynamic wave height control. This control system should have the capability to maintain the height of the solder at the solder nozzle tip within a range of ±0.005” or ±0.13 mm which is critical when selec-tive soldering fine-pitch through-hole components. Dynamic wave height control is particularity effective when working with smaller diameter solder nozzles or when soldering in tight adjacent clearance areas.

traceabilityThe high quality demands placed upon the electronics manufacturing industry, espe-cially automotive electronics, medical and aerospace, have created greater empha-sis on traceability and a secure means of

tracing and documenting product and manufacturing processes. The Society of Automotive Engineers (SAE) in con-junction with the German Electrical and Electronic Manufacturers’ Association (ZVEI) has developed a SAE/ZVEI trace-ability standard commonly used in Europe and North America.

Entry-level selective soldering systems are available that ensure full compliance with the SAE/ZVEI standard including an extensive alarm management file structure. All occurring traceability messages are time stamped and coded with user iden-tification and stored in an XML protocol making all traceability data available to higher level systems such as a management execution system (MES).

conclusionThe continued use of selective soldering is increasing the development of entry-level selective soldering systems. While many entry-level systems are available in the marketplace, it should be kept in mind that you do not have to sacrifice machine qual-ity as some entry-level selective soldering systems use the same core technologies as leading edge technology high-volume selective soldering systems.

references1. Fernandez, Francisco, Tang, Eddie

and Lu, Feng, “Selective Soldering Technology Selection,” 2010 SMTA International conference proceedings

2. Krauss, Bernd and Friedrich, Jürgen, “Quality Improvement and Enhanced Flexibility in Electronic Manufacturing through the Deployment of a modern Selective Soldering Process Technology,” EPP Europe magazine, September 2009

Figure 3. Maintenance free electromagnetic solder pump produces vortex-free, stable wave height.


Choosing the right optical inspection system

in or out?One of the most impor-tant questions regarding the machine itself is whether it should be in-line or an off-line machine. In-line systems are integrated into the exist-ing production process and therefore needs to be able to match up with the current line-speed. Often, low-cost in-line AOI systems are the bottle-neck of the whole production cycle. Off-line machines on the other hand are stand-alone or benchtop solutions, which are independent from the actual production cycle. The prices of these solutions are lower, because conveyer transporta-tion systems and automatic PCB handling is not needed.

how fast?The inspection speed of a system is based on several fea-tures and capabilities. First, of course, the speed of the posi-tioning system: how fast does the camera move across the

test area? Second, how many images from different positions, angles or cameras are required by the application? Third, how fast is the software: are the algo-rithms applied in real-time or does the systems need addi-tional “processing time” after all images are taken? Additional elements that impact the over-all inspection time include PCB load/unload speed, top/bottom inspection ability and the imag-ing hardware. As a guideline, vendors often advertise the inspection speeds in the form of surface area examined per unit of time. For example, cm²/sec or in²/sec. These should be considered average values, because they depend on the density of the populated area and the test being performed. As a result, each manufacturer might specify different inspec-tion times for the same effective performance. The best way to determine the right value is to perform benchmarks with your own boards.

The sheer number of vendors that offer AOI systems can make finding the right solution a very challenging task. The challenge begins with differentiating the various products, which usually involves understanding the different technical terms for the exact same features on each product and then comparing the various upgrade options, the ease-of-use and programming effort and the specifics regarding service and maintenance along many other possibilities.

It is essential to read between the lines of the brochures, flyers and datasheets. Vendors will highlight their key features but will not mention capabilities that are not available in their portfolio. A careful comparison of all manufacturers is the key to finding an AOI system that will continue to meet your needs into the future.

The price on the first quote is often the main criteria for the final purchase decision, but extra costs, such as training, maintenance, software licenses or service contract, can make a big difference in the long term. As a guideline, it is always good to understand “How much this system will cost me in the next 5 years?”

Patrick Schuchardt, GOEPEL electronics LLC, Austin, Texas, USA

choosing the right optical inspection system

Seek and you shall find—

Figure 1. Short on an IC pin.



false calls rateIn the end, any speed rating is futile if the machine lacks accuracy and stable results. “False calls rate” is a well-known term for a machine’s ability to find real failures with a low percentage being false calls—wrongly detected errors that should be passes. The false calls rate depends on many different factors, such as the recognition algorithm, the quality of images, or the production process. A perfectly adjusted high-end AOI machine will cause many false calls if the production of the PCB is not correct. For example, if the solder process is fluctuating, the pick and place machine is faulty, or the components vary in their appearance. An AOI system with a low camera resolution will have problems inspecting small com-ponents, for example the 01005 packages. An incorrect parameterized algorithm for solder joints will not be able to find shorts. Any of these factors can result in a high false calls rate. It is therefore not easy to say where a current high false calls rate comes from. An AOI system is, when it is well adjusted and capable of today’s inspection tasks, not only an additional test step but a very good indicator of the quality of the production process. To make this informa-

tion useable, a modern AOI system should be able to create failure statistics, store results, and offer interfaces to existing pro-cess control software (SPC).

light!An often-overlooked key feature is the illu-mination system. At least as important as the camera and lenses themselves, the light source is the basis for a high rate of fault detection on PCBs. Flexible illumination is necessary to cover specifications for the huge range of electronic components and their fault variants. Because of their inher-ent long-term stability and illumination

power, LEDs in various configurations and colors have become widely accepted as the norm in recent years. Illumination can be arranged or configured in a wide variety. Examples for illumination arrangements include:

Ring illumination vertically from above, mostly arranged around the lens• Useful configuration for checking

the presence of components and the quality of solder joints

• Disadvantage: in case of shorts between IC pins, false calls may occur because of fluxes or solder masks

Angled illumination from various direc-tions and different incidence angles:• Appropriate for solder-short checks,

reduces false calls• Enables high-contrast display of laser

labeling, a precondition for the effec-tive utilization of true-OCR functions as well as polarity check

Illumination with different colors:• Enables high-contrast display of

colored polarity marks as well as distinguishing components from the PCB background

• Causes reduction of fault slip and false calls rate

Additionally, for different board mate-rials or component colors, a brightness control is necessary for certain test tasks. Because of the huge number of permuta-tions possible for illumination settings, there are numerous parameters that must be provided and the AOI software must make this as fast and easy as. A reliable AOI system series unites all possible varia-tions listed above, and provides easy access to these features via predefined settings based on the test task. Even better if there is a special illumination design devel-oped to allow a safe solder-short check at minimum pitches despite possible contam-ination by fluxes or solder masks The user can select between different color varieties that provide safe detection of incorrect polarity, i.e. colored marks.

pixelmaniaA typical optical inspection system has at least one top camera with a main illumi-nation module, but often test tasks require additional features such as angled view cameras to inspect from a 45˚ angle. One common application is the inspecting of solder joints of IC Pins, especially J-leads. Sometimes obstacles such as THT com-

Figure 2. Angled view.

In the end, any speed rating is futile if the machine lacks accuracy and stable results.



ponents or heat sinks block the view to certain areas of the board. Vendors try to solve this problem by adding more than one angled view camera to the system with the effect that there are currently up to 8 fixed cameras possible. GOEPEL electronic has developed a better way by letting the angled view camera rotate around the object. The module named “Chameleon” can rotate with a step size of 1˚ and a total of 360˚.

Standard camera resolutions range from 1 up to 16 megapixels, but focusing on only the camera itself would be a mistake. Increasing the resolution of the camera alone will not necessarily lead to more detail in captured images. One possible solution for these increasing require-ments is adapting the lens to the camera being used. Specifically, the lens has to be designed to the pixel size of the applied

camera in terms of its optical resolution capability.

Another important feature for a modern AOI system is the use of telecen-tric lenses, which avoid the typical distor-tion of non-telecentric lenses.

Use of telecentric lenses produces extremely high quality and dramatically reduces the distortion found in the vertical view at each position of the inspected area, resulting in a significantly reduced debug effort during test program creation and also a reduced false call rate in production tests. This system characteristic proves to be a decisive benefit particularly for higher components but also multi-pin and fine-pitch ICs,

softwareAOI vendors use typically two differ-ent ways for detecting failures. The first approach is to store images of good samples and simply compare the current camera image with the recordings. The user can set certain quality thresholds and adjust the system in order to define the pass/fail threshold.

The far superior approach is the use of neuronal networks. Attributes and test parameters are stored and the system learns with each new teaching process. This principle is more flexible and faster over the time.

In order to provide a fast and easy start for a new user, vendors typically provide

component libraries in which test parame-ters, dimensions and variations of the most common components are predefined.

GOEPEL electronic’s OptiCon systems also include such ready-to-use library entries. Despite the huge variety, test programs can be created and optimized in the shortest time; making for rapid deploy-ment to production.

All inspection parameters can be changed on four different levels: for a single component on the PCB, a model type in the current test program, in all new test programs or in all new and existing test programs. The OptiCon concept is based on the important goal to obtain a stable, reliable test program within the shortest time, and to provide flexible adaptation possibilities to allow for specific quality requirements and supplier conditions.

flexibility and options A flexible system configuration is not just about the system software and its param-eter management; it also includes the pos-sibility to integrate additional modules. Because of the high variety of electronic assemblies likely to be seen in a production environment, add-on modules can be very helpful to increase fault coverage. Possible additional optional components to achieve higher fault coverage are:• Camera for THT with an enhanced

clearance of 50mm for safe inspection of tall components (e.g. encased-elec-trolytic capacitor)

• Laser height measurement system that allows co-planarity inspection with micrometer range accuracy (e.g. for BGA components)

• Camera with angled view that enables inspection of critical components (e.g. shorts and solder joint inspection at PLCC and SOJ components)

• Boundary Scan add-on that consists of the 1149.x controller and the software to perform Boundary Scan test on the PCB

• Solder paste inspection camera that can be added next to the main camera to increase the test coverage before the pick & place step

• Integrated barcode reader for board tracing and quality control purposes

decision processA typical process begins with an online search or trade show visit, and continues with the contacting of the vendors and a so-called paper benchmark, where the customer asks certain questions about technical specifications, prices, mainte-

A flexible system configuration is not just about the system software and its parameter management.

Figure 3. Image capturing with common lens.

Figure 4. Image capturing with pixel adapted lens



nance and support. A real-time benchmark could follow these first steps where the customer visits the vendor with his own board, often prepared with faults, where programming effort, false calls rates and accu-racy can be assessed and a gen-eral impression of the machine can be developed. A visit to the vendor can also provide an impression of the company and people involved. The results of both benchmarks in combina-tion with an official quote and the experience and instincts of the test engineer should lead to a smart purchase decision. As a last step, it is not uncommon to rent or borrow an AOI system for a certain amount of time, typically four weeks, before pur-chasing to help assure the right final decision.

conclusionThe selection of an AOI system means a lot of work based on the many different criteria and options. It is important to know which features are needed now and in the near future. That basically depends on the PCB itself and the test requirements for the components used and includes questions about inline or offline, required speed, accu-racy and options. Special atten-tion should be placed on the image recording module and illumination unit since they are critical for high-flexibility with a high mix of PCB types. An effective and user-friendly library management environ-ment allows time-saving han-dling of newly learned PCBs, which is necessary for a high variant diversity.

It is essential to compare the different vendors for their strengths and weaknesses and the best way to discover this is to perform benchmarks. Besides the available options at the time of purchase, it is interesting to know what update options are possible in six to 24 months. It is also important to under-stand the requirements and costs for maintenance and how well the vendor can assure fast

and comprehensive technical support.

Patrick Schuchardt graduated from the University of Applied Science at Jena, Germany in 2004.

For 3 years he worked as production and quality control engineer in Hong Kong, supervising and adjusting the production lines of reed relays, reed sensors and PCBs.

In 2007 he started working with GOEPEL electronic GmbH as an Application engineer in Plymouth, MI, providing tech-nical support for the automotive customers in North America.

Since 2009 Patrick is supporting JTAG/Boundary Scan customers of Goepel Electronics LLC in the US and Canada and is currently orga-nizing the sales and support activities for the Automated Inspection department from the US headquarter in Austin, TX.

AtlantaOffice:

SEIKA MACHINERY, INC1580 Boggs Rd., #900Duluth, GA, 30096Phone: (770) 446-3116Fax: (770) 446-3118Email: [email protected]

LA Office:

SEIKA MACHINERY, INC3528 Torrance Blvd. Suite 100, Torrance, CA 90503Phone: 310-540-7310Fax: 310-540-7930Email: [email protected]

Europe Agent:

SEIKA SANGYO GMBHHeltorfer Straße 16, D-40472 DüsseldorfPhone: 0211-4158-0 Fax: 0211-4791428Email: [email protected]


outlook brightens: many signs of a modest upturn

2012 was a difficult year, but business con-ditions generally improved at year-end. Global electronic equipment revenues returned to “very modest growth” in the fourth quarter (Chart 1) driven by smart phones, media tablets and communication equipment infrastructure. And as equip-ment revenues rose the excessive inven-tories throughout the supply chain were brought to lower, healthier levels.

Chart 2 provides our preliminary estimate of 4Q’12 vs. 4Q’11 revenue growth for key sectors of the world electronics supply chain. Most groups saw a fourth quarter increase although SEMI and PCB capital equipment are lagging (normal business cycle behavior), military spending has been cut and traditional EMS compa-nies have lost share to the large ODMs such as Foxconn. In a few cases (PCB laminate, passive components) 4Q’12 demand was still soft but the double-digit growth in

Chart 2 was measured relative to a very bad fourth quarter of 2011.

Per Chart 3 global semiconductor shipment growth has resumed (3/12 >1). Typically when electronic equip-ment demand improves, component sales increase at a faster rate as inventory levels are increased.

PCB global shipments also appear to be headed towards real growth in 2013. Although highly seasonal (with a typi-cally weak first quarter), Custer Consulting groups world PCB shipment model (Chart 4) currently points to 4% growth in 2013 with further acceleration possible as supply chain optimism improves.

Looking forward the PMI leading indi-cators are improving for most countries (Chart 5) with the world, USA, China and Taiwan already in expansionary territory (PMI >50) in January. These leading indica-tors typically predict electronic equipment

supply chain growth by about two months and capital equipment increases by about six months.

Chart 6 summarizes the current growth outlook of various prognosticators of the global electronic supply chain for 2013. We’ll keep this updated as the year progresses.

As a final thought scan the news items below to note how many companies are revising upward their planned CAPEX for 2013. Business confidence must be improving! We are still cautious but the outlook has brightened.

end marketsComputers & peripherals• Global PC shipments declined 4.9% to

90.3 million units in 4Q’12.—Gartner• Ultra-slim PC shipments are expected

to reach 44.2 million units in 2013, making up 21.4% of the total notebook PC market.—NPD DisplaySearch

• Worldwide tablet shipments reached 52.5 million units in 4Q’12.—IDC

• Global tablet shipments are forecast to grow from 130 million units in 2012 to 170-180 million units in 2013.—Digitimes

• Micro server shipments are expected to grow 230% y/y from 88,000 units in 2012 to 291,000 units in 2013.—IHS

• Hard disk drive market revenue is fore-cast to drop 11.8% y/y to $32.7 billion in 2013.—iSuppli

• Worldwide SSD shipments are forecast to grow from 39 million in 2012 to 83 million units in 2013.—IHS iSuppli

• Touch screen shipments is forecasted to grow from over 1.34 billion in 2012 to 1.8 billion units in 2013.—Displaybank

• Global OLED display market is expected to grow at a 31.7% CAGR from UD$ 4.9 billion in 2012 to US$ 25.9 billion in 2018.—Transparency Market Research

Mobile communication• Worldwide mobile phone shipments

grew 1.9% y/y to 482.5 million mobile

Walt Custer and Jon Custer-Topai


Electronic Equipment SuppliersComposite of 116 Public Companies

Quarterly Revenue Growth

1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 401 02 03 04 05 06 07 08 09 10 11 12

0.0

5.0

10.0

15.0

20.0

25.0

-5.0

-10.0

-15.0

% Growth (quarter vs same quarter in prior year)

20130206

Computer 11, Internet 5, Storage 10, Communication 11, SEMI 13, Medical 24, Instruments 6, Military 6

Chart 1.



phones in 4Q’12. – IDC• Smartphone market grew 37% to 216.5

million units in 4Q’12.—Canalys• Worldwide “phablets” shipments are

forecast to increase 136% y/y from 25.6 million in 2012 to 60.4 million units in 2013.—IHS

Consumer electronics• Global 4K×2K TV market will grow

from 500,000 units in 2013 to 7 million units in 2016.—NPD DisplaySearch

• Worldwide digital camera shipments are expected to decline 11.3% to 87 million units in 2013.—Camera & Imaging Products Association

ems, odm & related assembly activityOutsourced manufacturing industry is forecast to grow 4.5% y/y to $404.5 billion in 2013.—IHSTaiwan-based ODM’s notebook shipments fell 2.8% y/y to 174 million units in 2012.—Digitimes ResearchACW International terminated opera-tions.Bittele Electronics began offering proto-type PCB assembly.Burton Industries acquired two Universal Instruments’ Advantis® surface mount plat-forms.Cirtronics received ISO 13485:2003 Medical Manufacturing certification.Computrol installed an Assembléon AX-501 pick & place system with a 47 Tray TEM unit in Orem, Utah.Darekon acquired Apelec.Datest employees achieved PRO-STD-001 certification.EPIC Technologies added a SMT line in Juarez, Mexico consisting of a Dek Horizon 02i screen printer, Koh Young KY8030-2 3D in-line solder paste inspection system,

three ASM SX-2 placement machines, a Vitronics Soltec XPM3i reflow oven and an ORPRO Vision Vantage-S22 AOI system.Etek Europe invested in a Parmi SPI HS70 solder paste inspection system for its Technology Center in the UK.FCT Assembly acquired Global Stencil and MRC.Flextronics • renewed its lease for more than 1 mil-

lion SF at 12455 Research Blvd in Austin, Texas.

• laid-off 150 employees in Stafford, Texas

• joined the MIT Forum Advisory Board.• closed its Creedmoor, North Carolina

plant.

Foxconn/Hon Hai • invested in 16,500 m2 in facilities at

Pardubice CTPark, Czech Republic.• added representative labor union elec-

tions in China.• workers went on strike in Beijing over

end-of-year holiday privileges and bonuses.

• issued 5-year bonds at 1.33% yield.Inovar purchased three KE-1080EN high-speed flexible mounters from Juki.Inventec expects to have 90% of its note-book orders fulfilled from Chongqing, China by 2014.Jabil • acquired Nypro.• Board Chairman Bill Morean stepped

down.

Global Electronic Supply Chain Growth 4Q'12 vs. 4Q'11 (Preliminary)

1-8

-244

32

-218

-9

410

-0-0

-72

-14

13

Electronic EquipmentMilitary

Business & OfficeInstruments & Controls

MedicalCommunication

InternetComputer

StorageSEMI Equip

Semiconductors (SIA)Passive components

PCBsComponent Distrib

EMS (excl Foxconn)ODM

PCB Process EquipmentMaterials

Rigid & Flex Laminate0 5 10 15 20 25-5-10-15

% Change

20130209

US$ equivalent at fluctuating exchange; based upon industry composites including acquisitions

Chart 2.

World PCB Shipments (with forecast)converted at constant 2011 exchange rates

1 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 911199 00 01 02 03 04 05 06 07 08 09 10 11 12 13 14

CALENDAR YEAR

20

30

40

50

60

70

80$ Billion

Source: Custer Consulting Group - 2010 base year expanded by monthly growth of N. American, European, Japanese & Taiwan/China monthly PCB shipments

20130124

Growth calculations:Europe = composite European SIA & local PCB assoc dataJapan & N. America from JPCA & IPC dataTaiwan/China:46 rigid & flex company compositeRest of Asia growth = Taiwan/China 44 company composite

-19%+19% -1%

-4%+4%

Global Semiconductor Shipments3-Month Growth Rates on $ Basis

Total $ Shipments from All Countries to an AreaSIA website: www.sia-online.org/

1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 184 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 00 01 02 03 04 05 06 07 08 09 10 11 12 13

0.4

0.6

0.8

1

1.2

1.4

1.63/12 Rate of Change

1

2 3

4

5

6

7

8

9

10

20130205

11 12

13

Chart 3. Chart 4.



• former employee admitted to creating fake employees to defraud company.

• was named to Hungary’s strategic part-ner list.

• named William Peters as President and William Muir, Jr. as COO.

Kongsberg received a NOK 300 million (approximate EUR 40.6 million) con-tract to deliver an upgrade to the Royal Norwegian Air Force NASAMS II air defense system.Lifco withdrew its offer for Note.Lite-On Technology acquired Lite-On IT.MTI Electronics received an ISO 9001:2008 and AS9100C certification update.NBM production, one of 3CEMS’ South China facilities, received ISO14001 certi-fication.NBS moved its manufacturing HQ to Milpitas and expanded floor space for assembly and test operations by an addi-tional 50%.Nemco opened a 25,000 SF manufacturing facility in Stevenage, UK.Neways terminated activities at Neways Electronics Echt, Holland.OnCore Manufacturing opened its first medical Center-of-Excellence in Fremont, California.PartnerTech relocated its HQ and Vellinge unit to Malmö, Norway.SMT Developments installed an Inertec selective soldering machine and an Ultravision AOI machine.SMTC named Fernando Ibanez VP & GM for its Chihuahua, Mexico manufacturing facility.Sparton and USSI JV received $17.9 mil-lion and $4.0 million Sonobuoy manufac-turing contracts from the U.S. Navy.Spectrum Assembly purchased a Mydata MY500 jet printer.Stadium Electronics closed its Rugby

facility and transferred production to Hartlepool and Asia.Tropical Assemblies installed a second Mirtec AOI system.

pcB fabricationAccurate Circuit Engineering manufac-tured its first “3D” PCB.Advanced Circuits • is expanding its Aurora corporate

headquarters by 52,000 SF.• received ISO9001 certification.Apex International is increasing its 2013 CAPEX to install equipment at its new Thailand plant with production capacity of 500,000 SF of PCBs/ month.AT&S • Chairman of the Board Andreas

Gerstenmayer will assume interim CFO responsibilities when Thomas Obendrauf resigns at the end of fiscal year 2012/2013.

• will invest up to EUR 350 million over the next three years to add IC-substrates to its existing product portfolio.

Atotech • added a clean room for its ENEPIG

pilot line for semiconductor applica-tions, pilot lines for desmear / PTH, panel / pattern plating, surface treat-ment technology, final finishes and Uniplate at its TechCenter in Jangan, South Korea.

• expanded its TechCenter to approxi-mately 5,000 m2 in Shanghai, China.

• added a TechCenter to its existing Guanyin, Taiwan manufacturing plant.

BEST added a 400ST automated scaven-ger system from VJ Electronix in Rolling Meadows, Illinois.Cambridge Nanotherm introduced Nanotherm MBPCB (Metal-Backed Printed Circuit Board) that reduces LED device temperatures by up to 20°C.

Circuit Solutions added a Europlacer iineo I machine in Hemingford Abbots, UK.Cirexx International (Santa Clara, California) purchased an Excellon COBRA hybrid laser system.Compeq is increasing its CAPEX to NT$2-3 billion in 2013 to install produc-tion facilities at its new plant in Chongqing, China which is scheduled for commercial runs in mid-2014 with an initial produc-tion of 200,000-300,000 SF of HDI boards.DAISHOMICROLINE shares were sus-pended following a fire at its PCB produc-tion plant in Huizhou, China.Electronic Interconnect introduced Direct Thermal Exchange, a PCB construction methodology for highly-efficient heat removal or thermal dissipation.Epec Engineered Technologies acquired UPE.ERE (Etudes et Réalisations Electronique) purchased an additional Paragon LDI system from Orbotech.Flex Interconnect Technologies was re-certified by Lockheed Martin Missiles and Fire Control as its approved supplier for flex and rigid-flex circuits, IPC-6011 class 3 and IPC-6013 class 3.Flexium Interconnect expects its CAPEX for 2013 to top NT$1.7-1.8 billion (US$58.73-62.18 million).Global Brands Manufacture is doubling its notebook board production in Chongqing, China to 600,000 SF in April, 2013.Incap entered a EUR 1.5 million financ-ing arrangement to strengthen its working capital.Intel withdrew from the global own-brand motherboard market.MicroConnex added an Orbotech Paragon 9800m LDI system.Murrietta Circuits, Anaheim, CA • added a LTS200 lead tinning system

Global Electronic Supply Chain Forecast 2013 vs 2012

3

4

4

6

-2

Combined GDP

Electronic Equipment

Rigid & Flex PCBs

Semiconductors

Semi Capital Spending

0 5 10% Change

20130209

SEMI

Henderson Ventures

Henderson Ventures

Henderson Ventures

CusterConsulting

Chart 6.

Purchasing Managers' Indices December 2012 vs. January 2013

50.2

50.2

46.0

51.5

50.1

50.6

45.0

51.5

53.1

47.9

52.3

49.9

51.5

47.7

World

USA

Europe

China

S Korea

Taiwan

Japan

43.0 44.0 45.0 46.0 47.0 48.0 49.0 50.0 51.0 52.0 53.0 54.0 55.0 56.0PMI

DecemberJanuary

20130205

Above 50 = GrowthBelow 50 = Contraction

Markit Economics, JPMorgan and ISM

Chart 5.

KEEP YOUR WORLDCONNECTED

Tooling Solutions TE Connectivity has long been recognized as a leader in providing the tools for wire har-ness and printed circuit board manufacturing. There’s a good reason. Our products are designed to meet and anticipate our customers’ ever-changing requirements and are built to the highest quality standards for long, productive performance.

Every Connections CountsWhatever your production volume and job mix, TE will continue to develop the innova-tions needed to help solve the world’s toughest connectivity challenges. It all derives from our commitment to your manufacturing challenges, giving you the advantage in your marketplace.

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KEEP YOUR WORLDCONNECTED

Tooling Solutions TE Connectivity has long been recognized as a leader in providing the tools for wire har-ness and printed circuit board manufacturing. There’s a good reason. Our products are designed to meet and anticipate our customers’ ever-changing requirements and are built to the highest quality standards for long, productive performance.

Every Connections CountsWhatever your production volume and job mix, TE will continue to develop the innova-tions needed to help solve the world’s toughest connectivity challenges. It all derives from our commitment to your manufacturing challenges, giving you the advantage in your marketplace.

For a full demonstration of TE Connectivity’s innovative products and services contact your local tooling specialist

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TECHNOLOGIES TO

by visiting www.tooling.te.com or calling 1-888-777-5917.



from ACE Production Technologies.• began offering environmental testing.Printed Circuits, Inc. added new die punch, a conveyorized microetch line, improved its lamination layup clean room and overhauled its HVAC system.Sierra Circuits added a COBRA Hybrid Laser System from Excellon.SMS Electronics partnered with Routability to supply bespoke PCB design services.Spirit Circuits appointed Rupert Harzendetter as its sales agent for Germany.Sunstone Circuits began offering slots and cutouts on its quickturn service.Teknoflex, UK entered administration.TTM Technologies • appointed Todd Schull Executive VP

and CFO.• signed a letter of intent with minority

partner Shengyi Technology to dispose of TTM’s 70.2% equity interest in the SYE plant and acquire Sytech’s 20% equity interest in the DMC.

Unimicron increased its 2013 CAPEX budget to NT$10-11 billion (US$338-372 million) to expand IC substrate, HDI board and flexible PCB capacity.United Printed Circuit Board increased its 2013 CAPEX budget by 50% to NT$1.5 billion to upgrade its manufacturing pro-cesses for capacity ramps.

materials & process equipment3M opened a green R&D center in Taoyuan County, Taiwan.BTU International promoted Bruce Quigley to Director—Customer Service.CCI Group and Isola Europe are dis-continuing their collaboration. CCI will now distribute EMC laminate in Europe, Middle East & Africa.CyberOptics promoted Allen Phung to Americas Sales Manager.Data I/O celebrated its 40 years anniver-sary.Digitaltest named Paul Groome VP of Sales for the Americas.Dow Corning and IBM scientists devel-oped a flexible silicone polymer material to create optical waveguides on PCBs that can withstand extreme operating heat and humidity with no measurable degradation in performance.Dow Electronic Materials and Nanoco Group entered a global licensing agree-ment for Nanoco’s cadmium-free quantum dot technology.Elektrobit sold its test tools business to Anite.Enthone named Dr. Stream Chung to Global Product Line Manager, WLP & TSV

and Jason Maupin to VP, Americas.FLEXcon received ISO Class 7 cleanroom certification.H.B. Fuller introduced its FH1438AB epoxy potting compound for electronics manufacturing.Inseto assumed all sales and technical sup-port for Kulicke & Soffa’s Orthodyne wedge bonder products in the Nordic region.INVENTEC Performance Chemicals named Helen LI Sales Manager for China.JUKI and Sony signed a memorandum of intent regarding integration of SMT equip-ment and related businesses.LPKF Japan appointed Bernd Strauss to manage LPKF Laser & Electronics K.K. in Yokohama.MatriX Technologies established a pro-duction and service subsidiary MatriX Inspection Systems in Singapore.MIRTEC Europe moved to a new facility in Plymouth, UK.Nordson named Joseph Stockunas Group VP for Electronic Systems.Orbotech opened new office with R&D and production for direct imaging in Jena, Germany.Oxford Instruments calibration laboratory in Concord, Massachusetts received ISO 17025 accreditation.Panasonic Factory Solutions Company of America named REStronics as its value-added sales representative for Massachusetts, Connecticut, New Hampshire, Vermont, Maine, and Rhode Island.Park Electrochemical appointed Mark Gable Director of Strategic Situations.PARMI opened a facility in Marlborough, Massachusetts.Rainbow Technology introduced a desktop coating, laminating and imaging system, designed for laboratory R&D prototyping and small scale PCB production.RD Chemical assets were acquired by RBP Chemical Technology.Speedline Technologies appointed CRM synergies as its distributor in Spain and Portugal.Taiwan Union is expanding its High Tg CCLs to 30-35% of its total sales in 2013 on increased demand for high-end servers and 4G/LTE base stations.TeamChem Materials began mass produc-tion of photoimageable coverlays.Vitronics Soltec promoted Khoh Kar Heong to Product Manager, Selective Line.

semiconductorSemiconductor R&D spending rose 7% to US$53 billion in 2012.—IC InsightsWorldwide semiconductor sales decreased

2.7% y/y to $291.6 billion in 2012 but increased 3.8% y/y to $24.7 billion in December.—SIAWorldwide PC microprocessor revenues will rise 1.6% y/y to $40.7 billion in 2013; tablet processor sales are expected to grow 50% y/y from $2.3 billion in 2012 to $3.4 billion in 2013 and cellphone application processor sales are forecast to increase 28% y/y from $13.3 billion in 2012 to $17.0 bil-lion in 2013.—IDCChina’s IC market will grow at a 16.5% CAGR from $81 billion in 2012 to $148 billion in 2017.—IC InsightsDRAM revenues are forecast to grow 14% y/y to US$30 billion in 2013.—IHSGlobal multimedia chipset market is expected to grow from $19.8 billion in 2012 to $27.7 billion by 2017.—BCC

Walt Custer is an independent consultant who monitors and offers a daily news service and market reports on the PCB and assembly automation and semiconductor industries. He can be contacted at [email protected] or visit www.custerconsulting.com.

Jon Custer-Topai is vice president of Custer Consulting Group and responsible for the corporation’s market research and news analysis activities. Jon is a member of the IPC and active in the Technology Marketing Research Council. He can be contacted at [email protected].

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Show preview—SMT hybrid Packaging

SMT Hybrid Packaging is Europe’s leading event on system integration in micro elec-tronics. The event’s conference is perhaps the most important platform for informa-tion and networking in the field of micro electronics assembly in Europe. This years’ exhibition and parallel conference will be held at the Exhibition Centre Nuremberg in Nuremberg, Germany, April 16t-18, 2013.

The SMT Hybrid Packaging confer-ence program consists of two high-class, user-oriented half days in German, on Wednesday April 17 and Thursday April 18, along with a large number of practice-oriented half-day tutorials in German and English on all three days of the event. International experts will present current and future developments in electronics manufacturing. Delegates are invited to discuss and exchange experiences. A full-day workshop in additive manufacturing is also offered on opening day, with both 2D and 3D printing for electronics manufac-turing covered over the course of the day.

On the exhibition floor, the forums provide an ideal platform to access infor-mation on the newest trends and devel-opments, through vendor presentations

and panel discussions. For many visitors, the forum is one of the annual highlights of the event, providing a perfect overview of recent trends and product develop-ments. The forums take place each day of the event from 10:00 am through 5:00 pm. Admission is free for all visitors. The program, which was not available at press time, can be accessed on the SMT Hybrid Packaging website at www.mesago.de/en/SMT/For_visitors/Exhibition_Forum/index.htm.

Of course the exhibition floor will also be crowded with exhibitors and the latest technologies available for production prep-aration and preproduction, circuit carriers and processing equipment, manufactur-ing equipment for micro electronic com-ponents and modules, test equipment for assemblies, process and equipment testing technologies, material testing, reliability test equipment, manufacturing support equipment, cable and cable assembly prod-ucts, materials and components for thermal management, components and modules, computer-aided design (CAD) tools, devel-opment services, manufacturing services and more. From design and development to PCB production, components, assembly,

soldering, packaging and test systems SMT Hybrid Packaging offers a comprehensive presentation of products and services, all under one roof.

The production line “Future Packaging—Technologies, Products, Vision” will also be a feature on this year’s exhibition floor. The theme for 2013 is “Power at the Line—Combined Strength of 16 Technology Partners.” Visitors will be treated to a close-up look at all stages of PCB placement on site. This feature is organized by the application center Smart System Integration at Fraunhofer IZM.

In cooperation with beratungsgruppe wirth + partner, career center and job board will also be available on the floor where experienced personnel consultants will offer free-of-charge career coaching.

Global SMT & Packaging will be at the show, filming on the show floor. Stop by our booth, 7-148 and say hello.

smt hybrid packagingShow preview—

F I L L I N G T H E V O I D

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F I L L I N G T H E V O I D

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Welcome John, thanks for joining me today. Congratulations on your appoint-ment. Could you maybe tell us what were your first impressions of IPC when you joined the association?

First off, it’s an organization that’s rich in history. Not many organizations have been around for over half a century, so that was wonderful. It also has a great following, and I was especially intrigued by its interna-tional nature. Most of my career has been working with organizations that are work-ing around the globe; that we have a global footprint was very important to me, and I was excited about that as well.

You’re an engineer by trade, and not typi-cally an association type of guy. A lot of these associations are run by people who are professional association people. What strengths do you think you background brings to the job and to IPC?

As I was interviewing for this position, it was almost like it was the juxtaposition of all of my past career work. I started off as you mentioned as an electrical engi-neer, and I’ve run business projects in the electronics industry at various places from aerospace at GE to automotive at Alpine, and most recently I ran a non-profit. Then coupling that with my international work,

it seemed like with this position I can lever-age a lot of my different strengths.

When I was interviewing with the board, one of the interviewers asked me,

“Are there are any questions we didn’t ask that we should have?” and I said, “Well, you didn’t ask me where should I place a via or how many ground planes does a printed circuit board need.” He goes, “The fact that you even know what those things mean is a good sign.” So, at least I think I can speak a little bit of the same language, although I’ve been in management for a lot longer than I’ve been designing printed circuit boards.

That’s got to give you some insight as well. Understanding the technology is a key part of knowing where to drive the asso-ciation, as we’ll talk about later in this interview.

Obviously you’ve had some time now, you’ve had some months into the job, so having done so, what are your BHAGs, your Big Hairy Audacious Goals?

I’m hoping within ten years to double the impact of the organization. I’d like to be helping twice as many companies, I’d like to see twice as many people certified, I’d like to see standards being used in twice as many places around the globe. So, we’re really trying to collaborate to help the

entire electronics manufacturing industry, to really strengthen it as well as advancing it as technology changes.

You’re fairly well established here in the United States, so I assume you’re expect-ing to see a lot of that membership growth come from overseas.

Wherever electronics manufacturing is, I expect we’ll have growth. I do expect some growth in the US, but as you say we’re more mature here, we’ve been here for all of those 55 years. I expect we’ll see growth coming from Asia as well as Europe.

I’ve noticed that you’ve been talking a bit more with SMTA. Do you envisage a closer working relationship with SMTA going forward?

I hope so, yes. We’ve been trying to find ways where we can collaborate that will help the industry. That’s really the focus of an association, it’s “What can we do for the industry?” So whether it’s SMTA or organi-zations in Europe or wherever, whoever is out there to help the industry, I’m happy to and excited about working with them.

What about staffing levels at IPC? Is it top heavy in the US, given your global aspira-tions?

Interview—

In 2012, John Mitchell was appointed president and CEO of IPC—Association Connecting Electronics Industries® His background includes an engineering career that began with General Electric Aerospace and led to management positions in both nonprofit and electronics industry organizations, including Bose Corporation and Alpine Electronics of America. As IPC’s chief staff officer, Mitchell leads the association’s global operations and staff. Working with IPC’s Board, he helps develop, refine and implement the Board’s strategic vision and goals. He and Trevor Galbraith recently had the opportunity to speak over Skype.

dr. John W. mitchell—ipc


The majority of our members are still based in the US. It’s like 65 or 70 percent or so US, so the organization here needs to be about this size to support that, so I don’t really see that we’re top-heavy per se given the membership demographic. As we grow elsewhere, we’ll continue to grow staff else-where as well.

One of the things you did when you first came on board was you quickly repaired the relationship with the Hall of Famers. Was this political or do you think they actually bring real value to the associa-tion?

To me, we’re a membership organization, and we’ve highlighted the Hall of Famers as the ultimate contributors to this organi-zation, so I don’t really view it as political. These are individuals who have contrib-uted more than IPC could ever repay, and we’ve recognized them as that. Personally I’ve gained from their individual knowl-edge. Yes, I think they contribute, and I hope to involve them in many more of our events and activities going forward.

I think they do a superb job. A huge amount of experience, as you say.

You’re boosting your efforts in China at the moment. That’s one of the things that’s on your to-do list, as it were. Is this a little “too little, too late”? China in many ways, is I’ll not say it’s peaked, but it’s slowing down a little bit.

Wherever there’s electronics manufactur-ing, IPC needs to be there to support that effort, even if it’s not growing at the rate it was five years ago, even if it’s stopped grow-ing, there’s still a great presence over there that we should be supporting as a global association.

It’s certainly going to be the future for many years to come, that’s for sure.

IPC started off as an association pretty much of PCB manufacturing companies, and as you developed later in your history, you sort of merged with SMEMA, Surface Mount Equipment Manufacturers Association, which rep-resents the assembly side of the business. Who has the more influence in IPC? Is it more driven by the PCB guys, or is it more driven by the assembly people?

My view is that IPC is serving all segments of that value chain, whether it’s the board guys or the assembly guys or the materi-als guys, the equipment suppliers, even the OEMs, so we have assembly-based standards, we have PCB-based standards—

the influence is determined by what thing we’re working on, as well as by location. As you know the PCB market is largely in Asia now, and so I’d say the PCB market is much stronger influence over there than say the assembly, but over here I’d say maybe the assembly because there is more of that here. It really just depends on the context in which you’re operating at that moment.

Standards are the lifeblood of IPC. How do you plan to improve on that with international participation into this key resource?

For a long time now IPC has been involved with the entire community globally; it’s just been a little bit more difficult to get some of the international participation because a lot of the work happens over here. We are currently working on three standards that were actually begun in Asia, and some of those are coming close to being completed. I envision that there will be standards starting over there as new things come up and that is the area where the expertise is, and we’ll be getting people from the US or Europe participating in those standards, and vice-versa, and same with Europe as well.

Standard making has always been a slow process, even over here. So trying to expand that to an international platform, does that make it even slower?

It could. And that’s one of the things we’re watching as we go, because the whole lan-guage thing, making sure everybody has good understanding—we’re trying to take a look at that. If anything, we want to move things a little faster, but it’s tough because standards are backwards looking, it’s best practices, so you actually have to have practices before you can build a standard. You can’t just say, “Hey, here’s a new tech-nology, and here’s the standard that goes with it.” There’s some blood sweat and tears that goes into it, and the industry collabo-rates to help generate those standards.

Wherever that technology is being developed is probably where the source ought to start, at least the impetus ought to start. But you’re right, some of the trans-lation efforts could slow it up, so we’re working to try to use some technology. We’ve implemented a new online collabo-ration tool in our standards committees that hopefully will help with that.

As I mentioned earlier, all associations tend to be born on the back of a new technology. You have a few scientists in

a room who want to collaborate on this new technology, so they get together, form an association, the association grows, you suddenly need administra-tors to handle the workings of the asso-ciation, the technology grows—and then it reaches a point where it plateaus. The association really has to keep reinvent-ing itself, in many ways. What technology directions do you think you’ll be driving in?

As you mentioned, we started off focused primarily on printed circuit boards, and we’ve advanced to look at the entire value chain. We have assembly standards and things like that. We’ve working on a new standard to be launched this coming year on box build, so we’re advancing in that direction. We’ve been looking at printed electronics and working together with the print industry to collaborate on standards in that area. As long as there’s something going on in the electronics manufactur-ing industry, I look at IPC as being well positioned to help generate standards and certification and training around those, whether it’s collaborating with another organization as technologies merge, or whether it’s taking a stand on our own.

Printed electronics encompasses things like OLEDs for example, which is very akin to PCB manufacturing; it’s sort of a chemistry-based technology. Are you doing much in the solar business? Solar manufacturing, the cell production and module assembly at least, has pretty much all gone to China. You had started down that road, is that something you’re still going to get involved in?

We’re looking at it. We’re staying involved, but have limited resources as IPC to look at things, and we’re so we try to focus those resources on the area that is going to have the greatest benefit across the industry. As solar grows, so will our activity in that area. Same with any technology.

Well, John, thank you very much for taking the time to join us today. It’s been interesting to hear your views and get to know you a bit better. And we hear lots of good reports about your impact already in the industry. Thanks again.

—Trevor Galbraith


Global Technology awards—2012’s big winners

Best product—americas (tie)

Sherlock Automated Design Analysis from DfR SolutionsSherlock Automated Design Analysis software is the first-of-its-kind tool for analyzing, grading and certifying the expected reliability of products at the circuit card assembly level. For the first time, electronics manufacturers can design-in reliability earlier in the product devel-opment process contributing to quicker time to market, reduced development costs, improved customer satisfaction, and higher profits. Sherlock incorporates Physics of Failure, which uses knowledge of the causes of product failure to predict reliability and improve product perfor-mance and produce more reliable products. www.dfrsolutions.com

Best product—americas (tie)

Ultra 850G DWMS from Machine Vision Products (MVP)The Ultra 850G DWMS provides full inspection for post die-bonder and post ball-bonder processes. The system provides capability to inspect Au, Al, Ag, and Cu wires down to 15 µm in diameter. In the same inspection, the system also delivers full bond layer, die surface, die position, edge and substrate inspection. The system uses resolutions between 1 µm and 6 µm to allow detection of all process defects. Typically the Ultra 850G DWMS supports 5 to 20 ball-bonders and 4-10 die-bonders. www.visionpro.com

2012’s Big WinnersGlobal Technology Awards—

Recognizing the best new innovations in the printed circuit board assembly and advanced packaging industries since 2005, the Global Technology Awards are the only truly global awards in the industry, with independent judges weighing in from three contintents. The 2012 awards were presented at SMTA International, held in Orlando, Florida, last October. Here we celebrate the winning companies and technologies.

Global SMT new system launch Ad 203x275 feb 2013 f.indd 1 20/02/2013 17:26:50

Global SMT new system launch Ad 203x275 feb 2013 f.indd 1 20/02/2013 17:26:50



congratulations to the winners

Contract Services—over $25 Million

Pick & Place— high Volume

environmentally Friendly Product

Cleaning equip.& Printing equip.

PANTONE SOLID COATED7477

PANTONE SOLID COATED630

PANTONE SOLID COATED158Contract Services—

under $25 Million

best Product—americas

best Distributor adhesives & encapsulants

inspection—SPi inspection—aoi

best Product— americas

Pick & Place—low to Medium Volume

Solder Paste Dispensing

best Product—asia & Software—Process

Control

Storage equipment

best Product—europe inspection—X-ray

Best product—asia

Jade FP X-Ray Inspection System from Nordson DAGEThe Nordson DAGE XD7500VR Jade FP x-ray inspection system uses the latest technology flat panel detector to provide the market-leading, cost effective approach where high quality real-time imaging is needed for production tasks. The new and improved system, with its enhanced Flat Panel detector captures images much faster and the result is crisper, allowing the production operator to make deci-sions on acceptable quality faster. This increase in actual inspection speed gives a resulting increase in throughput. www.nordsondage.com

Best product—europe

SPI-AOI Uplink from ViscomSPI measurement data is typically only used to classify paste print, allowing high toler-ances of up to ±50% volume. Viscom’s new SPI-AOI Uplink feature enables the use of this data later in the process for better post-reflow AOI defect detection with the lowest false alarm rates while allowing high variability of the paste print process. The Process Uplink Software tool uses available highly accurate measurement data of the paste print to optimize post-reflow auto-matic optical inspection (AOI) at the end of the production line. Fewer missed defects, improved throughput and fewer false alarms create a huge cost benefit with very little investment for the SPI-AOI Uplink software tool that comes with Viscom’s SPI and AOI systems. www.viscom.de

Best distributor

Etek Europe LtdEtek has built its success on strong relation-ships with both customers and suppliers, which ensures that they continue to deliver the latest premium solutions. Etek have a proven ability to provide unrivalled service and support that focuses on quick response times, clear communication and complete customer care. Etek Europe have dedicated themselves to training their staff to the highest levels, sending their sales, service and application teams to our factory to receive extensive training on both products and applications, and they have a committed marketing campaign utilizing advertising, press releases, blogs, social media and e-mail marketing to reach both new and existing customers. www.etek-europe.com

adhesives & encapsulants

LOCTITE ABLESTIK CDF 200P from Henkel ElectronicsLOCTITE ABLESTIK CDF 200P is ground-breaking conductive die attach technology that enables semiconductor packaging specialists to realize the proven advantages of film-based die attach mate-rials in a conductive, pre-cut film format. LOCTITE ABLESTIK CDF 200P is the first and only pre-cut conductive die attach film on the market and addresses multiple next-generation requirements, including the ability to enable design flexibility by providing tighter clearance between the die and the die pad, handle ultra-thin wafers as compared to paste processes, deliver uniform bondlines with no bleed or kerf creep, and provide robust reliability performance comparable to many market-leading die attach paste formulations. www.henkel.com

... and the most reliable defect detection .

Viscom's new XM camera module with 65 Megapixel,

angular view and 3D capability inspects the most demanding

electronic assemblies reliably and faster than ever.

AX

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PIAO

I

It's all about speed ...

www.viscom.com

130212_Anz_Global_SMT_Packaging_203x275mm_Apex_geaendert_neues_XM_Modul.indd 1 2/12/2013 4:22:23 PM

... and the most reliable defect detection .

Viscom's new XM camera module with 65 Megapixel,

angular view and 3D capability inspects the most demanding

electronic assemblies reliably and faster than ever.

AX

I3-

D S

PIAO

I

It's all about speed ...

www.viscom.com

130212_Anz_Global_SMT_Packaging_203x275mm_Apex_geaendert_neues_XM_Modul.indd 1 2/12/2013 4:22:23 PM

Except as otherwise noted, all marks used are trademarks and/or registered trademarks of Henkel and/or its affiliates in the U.S. and elsewhere. © Henkel Corporation, 2013. All rights reserved. 10017 (2/13)

Award Winning

LOCTITE ABLESTIK CDF 200P is the world’s first conductive dicing

die attach film (2-in-1, precut format)

designed for semiconductor packaging. World’s First!LOCTITE ABLESTIK CDF 200P is an innovative material developed

to be both electrically and thermally conductive, and it can be used

for a wide range of die sizes from 0.2 mm x 0.2 mm to 5.0 mm x 5.0

mm. It can be applied to various wafer metalizations (such as bare Si,

TiNiAg and Au) and also on various leadframe finishes (NiPdAu, Ag

Spot or Cu). LOCTITE ABLESTIK CDF 200P enables the miniaturization

of packages while providing a clean and robust process, leading to a

more reliable package.

Across the Board, Around the Globe. www.henkel.com/electronics

For more information, visit www.henkel.com/electronics



cleaning equipment

Nano-ProTek from DEKDesigned to overcome the challenges of smaller aperture sizes, Nano-ProTek offers a unique solution to improve cleaning effec-tiveness and reduce cleaning frequency leading to increased process control, increased through put and reduced costs to the end user. Nano-ProTek reduces the ability of solder paste to smear or bridge on the underside of the stencil, reduces flux bleed and solder balls transfer from stencil to PCB, and improves the efficiency of understencil cleaners to clean the stencils, ultimately achieving a greater first pass yield. www.dek.com

contract services— under $25 million

Digicom’s Diamond Track Cleaning ProcessDigicom Electronics’ innovative Diamond Track Cleaning Process uses a special combination of chemicals, tempera-ture, wash cycles, timing, and equipment that results in printed circuit boards with superior quality and cleanliness. Independent tests show that Digicom’s Diamond Track process results in boards that are 75% cleaner than the IPC’s highest level of clean. The process is also completely “green.” www.digicom.org

contract services— over $25 million

ACD’s Flight StatusACD’s Flight Status system leverages state-of-the-art programming techniques to track the progress of circuit boards throughout the manufacturing process internally for ACD’s use. This also is visible for customers to track the status of the order at any point in the manufacturing process. Touch-screen displays present a real-time list of projects and board counts within specific process centers, including the quantity of boards in previous and subsequent process centers. An assembler can touch the line for a specific project to drill down into information relevant to that specific project in process, such as the route and contact information. www.acdusa.com

dispensing

NexJet System™ with Genuis™ Jet cartridge from Nordson ASYMTEKThe NexJet System is a significant advance-ment in jetting technology that makes fluid jetting in electronic applications faster, easier, and smarter. Central to the new dispensing system is the Genius Jet Cartridge, an innovative, one-piece jet. With just a few simple steps the Genius Jet Cartridge can be quickly and easily removed for cleaning without requiring any tools or handling of small parts. Fewer parts, less training, and more production up-time all deliver a cost of ownership that is up to 20% lower than with other jets. www.nordsonasymtek.com

environmentally friendly product

FumeCAB 700 from BOFA InternationalThe FumeCAB 700 integrated filtration system has been designed to ensure opera-tional compliance with HSG258 guide-lines. The innovative Cam filter change and auto-sensing flow control enables safe and simple front loading filter replacement providing minimum downtime between filter changes and ensures the pre-set minimum flow is maintained throughout filter life for operator safety. The auto-flow is pre-set to flow control requirements laid down by HSE guidelines, giving efficient energy consumption and extending filter life. www.bofa.co.uk

inspection—aoi

MV-9 from MIRTECThe MV-9 2D/3D AOI series features the exclusive Omni-Vision® 3D inspection technology, which combines MIRTEC’s exclusive 15 megapixel 2D ISIS vision system with the company’s revolutionary digital multi-frequency quad moiré 3D system to provide precision inspection of SMT devices on finished PCB assemblies. The system also includes MIRTEC’s inte-grated 10 megapixel Side Viewer® system and advanced six-phase color lighting technology. www.mirtecusa.com Find out more now: advancedjetting.com

USA | China | Europe | Japan | Korea | India | Singapore | Taiwan

You can rely on our award-winning support network. Visit our website to contact your local office:

Faster, Easier, Smarter Jetting

* PATENTS PENDING

The NexJet® System* featuring the one-piece Genius™ Jet Cartridge*

The Genius Jet Cartridge is the only system part that con-tains fluid — the only piece that needs to be changed

and cleaned. It is easily removed in seconds without tools. Built-in memory tracks and stores usage data, thereby increas-ing quality and consistency in precision manufacturing applications such as adhesive dispensing, precise

coating and underfill.

Find out more now: advancedjetting.com

USA | China | Europe | Japan | Korea | India | Singapore | Taiwan

You can rely on our award-winning support network. Visit our website to contact your local office:

Faster, Easier, Smarter Jetting

* PATENTS PENDING

The NexJet® System* featuring the one-piece Genius™ Jet Cartridge*

The Genius Jet Cartridge is the only system part that con-tains fluid — the only piece that needs to be changed

and cleaned. It is easily removed in seconds without tools. Built-in memory tracks and stores usage data, thereby increas-ing quality and consistency in precision manufacturing applications such as adhesive dispensing, precise

coating and underfill.

See Nordson ASYMTEK at SEMICON China Booth #3663 and at NEPCON China Booth #1F61

We’re In It To Win It …

ARE YOU?MV-9 2D/3D In-Line AOI Series configured with MIRTEC’s exclusive OMNI-VISION® 3D inspection Technology provides unprecedented speed and performance to the electronics inspection industry, setting a new standard by which all other inspection equipment will be measured. The advanced technology system combines MIRTEC’s exclusive 15 Mega Pixel 2D ISIS Vision System with a proprietary 3D Digital Multi-Frequency Moiré System to provide unparalleled precision inspection of SMT devices on finished PCB assemblies. The Six Phase Lighting System uses multicolor LEDs to illuminate inspection areas from six different angles and features four 10 Mega Pixel Side-View Cameras.

For more information, visit www.mirtecusa.com.

3 Morse Road, Oxford, CT 06478

P: 203-881-5559 F: 203-881-3322

MW/MI/22/Global double page ad.indd All Pages 2/20/13 1:31 PM



inspection—spi

aSPIre 2 from Koh YoungaSPIre 2 is the world’s first 3D in-line solder paste inspection (SPI) system, offering true 100% 3D shadow-free solder paste measurement. aSPIre 2’s most significant innovation, Closed Loop Interface, brings the inspection system and the printer together via a closed-loop communications link to not only identify defects but correct them at the printer, preventing soldering defects downstream that result in excess rework, productivity delays, and lower yields. www.kohyoung.com

inspection—X-ray

V810 from ViTroxViTrox’s V810 in-line 3D automated x-ray inspection system (AXI) provides the fastest inspection speed and widest test coverage. V810’s state-of-art technology is based on Digital Tomosynthesis method-ology. The advanced Digital Reconstruction Technology reconstructs x-ray images from multiple angled cameras and effectively separates the top and bottom-side of the board images clearly. Proprietary Hybrid Auto Focus technology enables the system to intelligently focus on desired z-height without any mechanical movement from x-ray or stage, which has significantly reduced the measurement uncertainty of the system. www.vitrox.com

pick & place—low to medium volume

Agilis Flex from MYDATAThe new Agilis Flex feeder system from MYDATA is a robust, compact and light weight design that makes it possible to handle any component on tape, from 8 to 152 mm in width, with pocket depths that accommodate even the thickest, tallest components. Whatever tape components arrive on the production floor, Agilis Flex is built to handle them. With its built-in intel-ligence, Agilis Flex helps manufacturers improve production efficiency by taking setups and changeovers to the next level. www.mydata.com

pick & place—high volume

iFlex from AssembléoniFlex is a modular machine concept, with a scalable production up to 400,000 cph capable of handling component sizes from 0.4 x 0.2 mm (01005) up to 120 x 52 mm. iFlex provides offline preparation tools to create error free programs and active-force-controlled placement to achieve the indus-try’s highest first pass yield, with less than 1 defect per million. iFlex also improves productivity by introducing independent dual lane with dual sided feeding, making it possible to produce multiple types of products simultaneously per line. www.assembleon.com

printing equipment

Horizon iX DL RTC from DEKHorizon iX DL RTC comprises two dual lane printers configured in a series. Each printer has a core cycle time of 4 seconds, with the ability to print boards on one lane while in parallel passing boards through the machine on the other lane, doubling the throughput rate of the printer. Users are able to configure the printers between single and dual lane modes. DEK Horizon iX print platforms offer a comprehensive array of sophisticated features as standard, including optimised printer frame tech-nology, fast product changeover, 2 Cpk print process capability and proven 6-sigma production performance. www.dek.com

software—process control

X-Plane™ Analysis from Nordson DAGEThis revolutionary option for the Nordson DAGE range of industry-leading X-ray inspection systems uses a proprietary, patent applied for, tomosynthesis technique to create 2-D x-ray slices in any plane of a printed circuit board assembly without the need to cut or destroy the board. In this way, the superior image quality that Nordson DAGE x-ray systems always provide can now be extended into separating individual layers at a level of excellence that traditional laminography techniques cannot achieve. This system option provides significant cost savings over traditional CT systems, and since it is non-destructive, represents a significant ongoing cost saving for the user. www.nordsondage.com

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Part No 215449 Issue 01 April 12 Page 1

Description

This dual lane solution comprises of two dual lane printers configured in series.

Each printer has a core cycle time of 4 seconds, with the ability to print boards on one lane whilst

in parallel passing boards through the machine on the other lane, doubling the throughput rate

of the printer.

The DEK Dual Lane solution provides:

• Ability to configure between single and dual lane mode

• Rails 2 and 4 fully adjustable under software control

• Rail 3 factory set to suit customer requirements (see page 3)



solder paste

SN100C P810 from Nihon SuperiorIn developing SN100C P810 D4 no-clean lead-free solder paste, Nihon Superior took a new approach to the design of a solder paste that would minimize voiding in the large solder joints that provide a critical thermal path for heat dissipation from power semiconductors. As well as opti-mizing the balance of low boiling and high boiling solvents, Nihon Superior looked specifically at the effect of the flux medium on the surface tension of the solder. High surface tension inhibits the escape of flux volatiles by limiting the size of the bubble formed by a given amount of volatile material. By formulating the flux system to reduce surface tension the bubble size is increased and bigger bubbles are more likely to escape than small ones even with the benefit of vacuum reflow. www.nihon-superior.co.jp

storage systems

Super Dry® XSD Series from TotechDesigned to exceed the formidable chal-lenges associated with IPC J-STD-033C and 1601 for handling Moisture Sensitive Devices, XSD desiccant cabinets deliver a process combining ultra low humidity (<0.5%) and mild temperatures (40-60C) proven to replace traditional oven baking of components and boards at a fraction of the cost. (10%) Unlike other desiccant cabinets with heaters, the Super Dry XSD cabinets can dry BGAs, PCBs and other moisture sensitive devices at oven-equiv-alent speeds without oxidation and inter-metallic growth induced by traditional baking temperatures. www.totech.eu.com

global technology awards: 2013The 2013 Global Technology Awards is open for entries. Entry forms and online entry registration are available at http://awards.globalsmt.net. The Global Technology Awards are open to new technologies and services introduced between August 1, 2012 and July 31, 2013. Equipment, materials and EMS providers of all sizes are encouraged to enter. Entries are judged by an independent, global panel of judges. Companies can enter as many categories as they wish.

This year’s ceremony will be held at productronica in Munich, Germany in mid-November. The ceremony will be streamed live online and archived at tv.globalsmt.net for later viewing.

For more information and to see previous years’ winners, visit awards.globalsmt.net.

Watch the ceremony!

congratulations 2012 Winners

YouTube video u7le7pgiUsU&f goes here

Koh Young won a conveted Global Technology Award for the company'saSPIre2 Solder Paste Inspection machine and its new Closed Loop Inerface thatbrings the SPI system and solder paste printer in a manufacturing line togeth-er via a closed-loop communications link to not only identify defects but tocorrect them at the printer. It is the first such system of its kind.

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Zenith, the world's first true 3Dpre-and-post reflow AOI system

Linda Gao and Koh Young America's General Manager, Bill Astle, with the Global Technology Award at SMTAI 2012.

Award-Winning 3D AOI and SPI Technologyfrom Koh Young America...Award-Winning 3D AOI and SPI Technologyfrom Koh Young America...

Coming to a Facility Near You!Coming to a Facility Near You!

Koh Young brings the best and the latest advances in 3D AOI and SPI technology on a whirlwind North American tour to a location near you!

Koh Young won a conveted Global Technology Award

for the company's aSPIre2 Solder Paste Inspection

machine and its new Closed Loop Interface that brings

the SPI system and solder paste printer in a manufacturing

line together via a closed-loop communications link to not

only identify defects but to correct them at the printer.

It is the first such system of its kind.

Koh Young America, Inc. 6505 W. Frye Rd., Suite #14 � Chandler, AZ � 85226

Tel. 480-403-5000 � [email protected]

3D profilometric solder paste inspection.

Global Technology Award

KYSpread Ad/b 2/17/13 3:14 PM Page 1

Title


Mention the name Flextronics to anyone in the electronics manufacturing industry and instantly they think of the contract manu-facturing behemoth with 200,000 employ-ees in 30 countries: hundreds of lines of manufacturing equipment operated by thousands of employees, making products from the tens of thousands to millions of the same device.

Today, we got to see a different side to this manufacturing giant through their Flextronics SBS (Special Business Solutions) Division. Living up to the name of its parent company, the SBS Division will take on virtually any size of project from single article up to 500 pieces and beyond. As you would expect, some of these smaller article items are higher in value, such as the six prototype electric vehicles they built for one customer.

The range of projects handled by the SBS Division is wide and varied. On our visit to the South Carolina facility at Columbia, we saw evidence of networking

systems (they built the world’s largest data warehouse (36 petabytes)), a fuel-cell and hydrogen-powered portable energy system, and at the other end of the spectrum, photo booths and ticket machines. The Columbia facility is housed in the former NCR/Selectron building and is ISO9001, ISO14001, TL9000, AS9100 approved. The factory is conveniently located half a mile from the Columbia airport, which is a UPS hub. They are also only two hours from the Charleston deep water port. They proudly claim that two-thirds of the US population is within a two-day drive.

Columbia is the state capital and home to the large Ft Jackson army base and the USC, Midlands Technical College, which provides an excellent local labor pool.

the other side of flextronics

Factory tour—

Flextronics SBS built the world’s largest data warehouse.


The other side of Flextronics

Flextronics SBS operates a “Factory in Factory” concept, where each customer is allocated 2, 3 or 4 assembly lines. These lines are immediately adjacent to the stores at one end of the line and shipping at the other. I interviewed the general manager, Marty Wilson about this concept. You can view the full interview at tv.globalsmt.net.

The Flextronics SBS Division has 3-4 sites across the United States, plus other locations in Europe and Asia, providing customers with the flexibility to move their projects to different manufacturing loca-tions around the world as needed. And when the projects go into mass production, it is a simple transition to move them over to the high volume manufacturing plants.

But Flextronics SBS fits into a bigger part of the electronics manufacturing puzzle. In recent months there has been an undeniable drift of manufacturing back from Asia to regional centers of excellence in Eastern Europe and Mexico. I discussed the dynamics of this shift with Bob Conway, business development manager for Flextronics SBS. He confirmed the geographical shift and explained some of the drivers behind it. You can watch the full interview online at tv.globalsmt.net.

Embed Marty Wilson interview here

Embed Bob Conway interview here.


Graphene, the new wonder stuff?

I guess many of you will have heard about this stuff, but to bring us all up to speed: Graphene is a substance

composed of pure carbon, with atoms arranged in a regular hexagonal pattern similar to graphite but in a one-atom-thick sheet. It is very light, with a 1 square meter sheet weighing only 0.77 milligrams.

It is an allotrope of carbon whose struc-ture is a single planar sheet of sp2-bonded carbon atoms, that are densely packed in a honeycomb crystal lattice. Graphene is most easily visualized as an atomic-scale chicken wire made of carbon atoms and their bonds. Only identified in 2004, graphene is the thinnest material ever created and offers huge promise for a host of applications from IT to energy to medicine. Flexible touch screens, lighting within walls, and enhanced batteries are among the likely first applications.

Early work on graphene by two Russian-born scientists at the University of Manchester UK, Andrei Geim and Konstantin Novosolev, earned them a shared Nobel Prize in 2010 and then knighthoods. The material—described as being far stronger than diamond and as flexible as rubber—is now at the heart of a worldwide contest to exploit its proper-ties and develop techniques to commer-cialise it. About 100 times stronger than steel, it conducts electricity better than copper and is touted as a possible replace-ment for silicon in electronics. About 1% of graphene mixed into plastics could make them conductive.

The UK Chancellor of the Exchequer, George Osborne, announced further funding for graphene research last month, bringing the total of UK government support to more than £60m ($94.5m), so the UK, known as a hot bed for new tech-nology and great innovation, should be ahead of the curve. People have said for a long time that the UK was great at ‘ideas’ but often not good at implementing them, but with Nobel Prize winners and funding the UK Research Institutes should be filing patents like they were going out of fashion.

Table 1 shows the sad truth of the situ-ation.

But that is only part of the story.The tally of patents—an essential first

step to turning a profit from a substance still based in the lab—shows how intense the worldwide competition has become.

According to new figures from CambridgeIP, there were 7,351 graphene patents and patent applications across the world by the end of last year—a remarkably

high number for a material only recog-nized for less than a decade.

Of that total, Chinese institutions and corporations have the most with 2,200—the largest number of any country and clear evidence of Chinese determination to capi-talise on graphene’s future value.

The US ranks second with 1,754 patents. The UK, which kick-started the field with

graphene, the new wonder stuff? Keith Bryant


Graphene, the new wonder stuff?

the original research back in 2004, has only 54, of which 16 are held by Manchester University.

UK science minister David Willetts, who has identified graphene as a national research priority, said the figures show that

“we need to raise our game,” but there are no UK based multinational companies taking up this challenge it seems. Our institutes are not closely linked to the commercial world, so moving from idea to commercial reality will be tough.

Most striking of all the figures is that the South Korean electronics giant Samsung leads the corporate field with an

immense total of 407 patents. America’s IBM is second with 134.

There is a huge gap between most of academia and industry in Europe, and this gap has broadened during the last few decades. We killed or sold all of the famous labs. Companies have slimmed down, and they can no longer afford top research institutes. So much is happening in Korea because Samsung have such an institute; there is nothing like that in the UK now. We can’t see beyond a 10-year horizon, often not even five years, and graphene is beyond this horizon.

The lesson is that there needs to be

much stronger links between institutes and the commercial world, Samsung are streets ahead here; as they file patents and develop this material, they will have one eye on its commercial value. Soon their R and D teams will be looking closely at this ‘wonder material’ and for real world uses for it. Graphene may have slipped through our fingers, but our governments need to understand that short-termism does not work in our industry, and research takes time and is only fruitful when linked to something new and exciting which a market wants or needs.

While I was pulling together this article, scientists at Moscow State University have discovered a property of graphene that can be used for absorbing radiation and mining rare earth metals and shale hydro-carbons. Work carried out in laboratories has revealed that graphene can extract radioactive materials from water solu-tions with great efficiency. This property can be harnessed to rid places of radiation contamination—places like Fukushima, for example—or to improve technology for extracting rare earth metals and shale hydrocarbons.

research institute (country) number of graphene patent publications

Sungkyunkwan university (South Korea) 134

Zhejiang university (China) 97

Tsinghua university (China) 92

rice university (uS) 56

Massachusetts institute of Technology (uS) 34

Manchester university 16

Table 1. Graphene patents by universities. Source: Q Tannock, CambridgeIP 2013


impediments to Solder alloy Free electronic (SaFe) assembly

For the last 5+ years, following the introduction of what has become widely known as the Occam Process,

this column has from time to time presented updates and renewed argu-ments relative to the many benefits that the process has to offer both user and customer alike. In the last year or so, a publicly avail-able standard covering the subject of embedding active and passive devices into printed circuit substrates promulgated by various Japanese standards groups was finally published. It is a fine document providing solid information on methods both proposed and practiced in Japan and elsewhere.

As has been often noted by myself and others, the concept of embedding devices into printed circuit boards is not new. Its roots reach back to the 1970s when the concept of the embedded resistor and embedded capacitor were first described. Following shortly thereafter in the 1980s, technologists began to explore methods for first using bare die on the surface of printed circuit boards and wire-bonding chips to them, followed by an encapsula-tion. This was called chip on board (COB) technology. The idea of embedding bare die into cavities within printed circuits followed during the heyday of multichip technology and there was even being performed some early package on package assembly. These were prescient technolo-gies ahead of their time. However there is certain nuance to the Occam Process that separates it from earlier work and most of the matter in the recent standard in that its major emphasis is on reducing the number of process steps required for elec-tronic assembly, mostly through the elimi-nation of solder. The overarching term for this general concept is being referred to as SAFE, which stands alternately for solder alloy free electronics or solderless assembly for electronics.

The potential savings possible by using such a process are substantial. Back of the napkin calculations by respected electronics industry experts suggest that exclusive of the cost of the components

and depending on the complexity of a given application, manufacturing cost could run anywhere from 10 to 30% less than standard solder assembly. That would seem a highly compelling number in terms of manufacturing cost savings, yet in more than five years nothing much has happened in terms of broad-scale implementation. This begs a thoughtful individual to ask

“Why?” What follows is a brief review of what are believed to be the major impedi-ments to the advance of SAFE technologies.

“We don’t do it that way”This is of course always the first response of the manufacturing floor to the proposed introduction of any new manufacturing method. Most people want to believe them-selves as individuals who are both open-minded and open to change. We welcome change so long as it is not something that will happen on our watch. As one sage wisely put it “everyone wants to go to heaven, but no one wants to die.” Overcoming inertia is a major challenge but it is not impossible. I have collected and shared my thoughts on the subject of implementing change here in the past (“Occam Update,” November 20071). However, until one is ready for change, change will not happen.

Fortunately there is a small but growing number of those out there who understand the importance of change and who are willing to adapt to and even promote change within their organizations. I recently had the great personal pleasure

of working with one such company whose president invited me to work with his staff to build some prototype Occam assemblies. They are not abandoning traditional manu-facturing yet; they are simply preparing themselves for what they believe will be an inevitable part of the future, and I am most grateful to them. These people have gotten beyond the “we don’t do it that way” frame of mind, and I’m certain they will do well in the future. Their efforts are also helping to cut through the “chicken or egg” conun-drum that has plagued the development of SAFE technologies as designers have repeatedly said, “I can design such assem-blies but who will build them?” while at the same time most manufacturers have no interest in considering the exploration of next generation manufacturing processes if no one is designing product in a manner that will make it possible.

“occam won’t work with (this or that) type of component”In his play Anthony and Cleopatra, Shakespeare wrote: “Make not your thoughts your prison.” This is a trap that we all tend to get caught in from time to

Joe Fjelstad

impediments to solder alloy free electronic

(safe) assembly

Its major emphasis is on reducing the number of process steps required for electronic assembly, mostly through the elimination of solder.

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impediments to Solder alloy Free electronic (SaFe) assembly

time. We build walls around our minds with our own thoughts and preconceived notions. Along the same line, the words of another sage also resonate on this topic:

“It’s not what you don’t know that kills you, it’s what you know for sure that ain’t true.” Those were the words American humorist and philosopher Mark Twain. In my expe-rience the vast majority of objection to the concept of solderless assembly has come from those seeking to close doors rather than to open them.

For example, the component most often cited as incompatible with the Occam concept is the electrolytic capacitor (which is also by the way one of the most vulnerable when it comes to high tempera-ture soldering such as is required for lead free). The reason is that these devices tend to be rather large and of an odd form factor. They also tend to be designed for through-hole mounting. These and other types of components are of the legacy variety designed to be suited to the needs of legacy design concepts.

This begs the question “Can capaci-tors be designed in a different fashion?” Of course if one is rooted in traditional thinking there is little opportunity for improvement. The old ways have gotten us to where we are and today, but can they also carry us into the future? New ways, not old ways, of thinking are required to build a future.

Circling back to the opening comment of this section, we must release ourselves from our prisons and think more of what a component might be rather than simply what exists today to achieve a better future.

“surface mount components are too diverse in terms of their physical dimensions and lead pitch”This is sadly a very true statement. The fact is that surface mount components are much too diverse. This was pointed out in a previous column (“Small matters: Is a standard lead pitch for components possible?” June 20122) which illustrated the wide diversity of IC package structures as defined by JEDEC registered outlines that are in use today. The allowance of varia-tion in terms of thickness for example for the various different registered outlines for BGAs opens the doors to a continuum of package thicknesses from a couple of milli-meters down to a few tens of micrometers. This is largely because the height of solder balls placed on packages can vary widely.

As stated in the previous column, there is no intrinsic value in having such

diversity. The argument put forth here is that a single common pitch for compo-nent terminations for land grid arrays (LGA) is not only possible but desirable. Furthermore exercising discipline and locking into a standard component thick-ness (which is quite possible with LGAs) rather than a range is of high value to the design and manufacturer solder alloy free assemblies. The operative word in the forgoing sentence is “discipline.” Thus the challenge goes out to designers seeking to take advantage of SAFE concepts to make thoughtful, conscious decisions about the components they would use in their designs. Those who have taken any time to consider the arguments that have been laid out multiple times over the last few years should be able to easily appreciate the prospective benefits that come with disci-pline in design.

The foregoing offered but a few of the impediments that are holding back the development of solder alloy free

assembly. No doubt the reader can with a little thought create arguments of their own. It is likely that one of them would be that you cannot easily rework or repair such assemblies as have been described. However, as has been pointed out in previous discussions on this topic, the need for rework and repair is predicated on the fact that traditional solder assembly is a complex process fraught with opportu-nities for defects and failure. Moreover in the brave new world of lead-free solder the high temperatures associated with lead-free assembly has proven itself capable of damaging components that might have otherwise survived more traditional assessment methodologies.

In summary, safe manufacturing methods offer significant benefits in terms of cost savings, improved performance and greater reliability. However, to garner those benefits will require change, change in the way one thinks about electronics

design and manufacturing. One must also be willing to open their eyes to the possi-bilities, and with that thought in mind I should like to quote another sage of the past, Marcel Proust, who wrote: “The real voyage of discovery consists not in seeking new landscapes but in having new eyes.” It is a simple thought but one well worth remembering….

1. “Occam update,” Joe Fjelstad, Global SMT & Packaging 7.11, November 2007 http://www.globalsmt.net/smt/index.php?option=com_c o nt e nt & v i e w = a r t i c l e & i d = 3 1 2 8 & Itemid=409

2. “Small matters: Is a standard lead pitch for components possible?” Joe Fjelstad, Global SMT & Packaging 12.6, June 2012 http://www.globalsmt.net/smt/index.php?option=com_content&view=article&id=17072&Itemid=409

Verdant Electronics founder and president Joseph (Joe) Fjelstad has more than 40 years of international experience in electronic interconnection and packaging technology in a variety of capacities from chemist to process engineer and from international consultant to CEO. Mr. Fjelstad is also a well known author writing on the subject of electronic interconnection technologies. Prior to founding Verdant, Mr. Fjelstad co-founded SiliconPipe a leader in the development of high speed interconnection technologies. He was also formerly with Tessera Technologies, a global leader in chip-scale packaging, where he was appointed to the first corporate fellowship for his innovations. He has 150 US patents to his credit.

Manufacturing cost could run anywhere from 10 to 20% less than standard solder assembly.

Organizer:Mesago Messe Frankfurt GmbHRotebuehlstr. 83 – 8570178 Stuttgart, GermanyTel. +49 711 61946-828Fax +49 711 [email protected]

The place to be!smt-exhibition.com

Nuremberg, 16 – 18 April 2013

International Exhibition and Conferencefor System Integration in Micro Electronics

Organizer:Mesago Messe Frankfurt GmbHRotebuehlstr. 83 – 8570178 Stuttgart, GermanyTel. +49 711 61946-828Fax +49 711 [email protected]

The place to be!smt-exhibition.com

Nuremberg, 16 – 18 April 2013

International Exhibition and Conferencefor System Integration in Micro Electronics

Title


henkel debuts high-reliability pb-free solder alloy for high-temperature applications Henkel Electronic Materials announces the commercial availability of 90iSC, a high-reliability, lead-free solder alloy for demanding high-temperature appli-cations. Henkel’s new high-reliability solder alloy, 90iSC, is a multi-component alloy based on traditional SAC but with improved temperature resistance and reli-ability characteristics. The alloy has a wide temperature cycling range from -40°C to 155°C, optimized creep resistance at high temperature, vibration and drop test performance comparable to SAC and has printing and reflow behavior consis-tent with alternative lead-free materials. www.henkel.com/electronics

mentor graphics delivers emulation solutions for arm cortex-a9 mpcore productsMentor Graphics Corp.’s hardware emula-tion solution for ARM Cortex-A9 MPCore processor-based System-on-Chip designs enables designers to test an embed-ded system containing ARM Cortex-A9 dual core processors, and accelerate their system-level verification to signifi-cantly increase their overall productivity. The Mentor® iSolve™ solution for ARM Cortex-A9 dual core designs combines the speed and accuracy of ARM-certified IP with the visibility and debug capabilities of the Veloce emulator, delivering solu-tions for verifying a variety of applications. www.mentor.com

precision benchtop selective soldering system improves quality & efficiencyManncorp’s new ULTIMA TR2 selective soldering machine offers superior per-formance in a compact, benchtop design

and at a price point that puts its advanced features within reach of low- to medium-volume assemblers. TR2’s 35-lb-capacity solder pot handles lead-free or conven-tional Sn/Pb solders while an integral nitrogen hood with micro pre-heater inerts the solder site and stabilizes the wave tem-perature. Point-to-point and drag soldering functions, along with solder pump speed, wave height control, dip height and dwell parameter settings, are fully programmable to ensure perfect, highly repeatable solder joint quality. www.manncorp.com

hitachi printers, Koh young spi systems interface for ‘on-the-fly’ process optimizationHitachi high-speed, high performance solder paste printers and Koh Young Technology’s 3D Solder Paste Inspection (SPI) systems can now “talk” to one another via Koh Young’s Closed Loop Interface process control software. The process control software brings the SPI system and the printer together via a closed-loop communications link to not only identify defects in solder paste printing, but correct them at the printer. This powerful process optimization tool, the first such system of its kind, prevents soldering defects downstream that result in excess rework, productivity delays, and lower yields. www.hitachi-hta.com, www.kohyoung.com

new productsnew products

rehm thermal systems introduces next-generation vacuum soldering systemsRehm Thermal Systems announces its next-generation advanced packaging and semiconductor solutions with no atmo-sphere—the Vacuum Soldering process. Rehm offers three VS Series Vacuum Soldering system models. The VS320, the VS160UG, and the VS160S benchtop each feature fast heating and cooling rates with easy profile setup and editing plus data log-ging. The use of different gases as well as formic acid and microwave plasma is sup-ported. All of the models offer a small foot-print, and all are low cost to rapidly turn increased productivity into profitability. www.rehm-group.com

Title


association & institutes news

association & institutes news

smta announces 2013 smt certification dates and locationsThe SMTA announced upcoming offer-ings of SMT Certification in Pennsylvania, Oregon, Wisconsin, Texas, and California. The SMTA Certification program is unique as it recognizes and certifies the entire SMT assembly process at an engineering level.

Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma/Greenbelt. The program concludes on days two and three with an open and closed book examination.

March 19–21, 2013—SMT ProcessesPhiladelphia, PA (ACI Technologies)

April 30–May 2, 2013—SMT ProcessesLake Oswego, OR (Micro Systems Engineering)

June 4–6, 2013—SMT ProcessesAppleton, WI (Ducommun LaBarge Technologies, Inc.)

October 15–17, 2013—SMT Processes or Six Sigma/Green BeltFort Worth, Texas (Fort Worth Convention Center) In conjunction with the SMTA International Conference and Electronics Exhibition

November 5–7, 2013—SMT ProcessesSan Jose, CA (DoubleTree by Hilton San Jose) In conjunction with IWLPC

SMTA Certification is intended for manufacturing and process engineers. Additionally, production, design, test and quality engineering personnel, as well as SMT assembly managers who want to con-firm their current competence at a funda-mental level of overall process technology should also consider participating.

For information on certification or to register, contact Patti Hvidhyld at 952-920-7682 or [email protected], or visit www.smta.org/certification/certification.cfm.

smta atlanta expo returns to gwinnett center april 18The Surface Mount Technology Association (SMTA) announced that the Atlanta

SMTA Expo would return to the Gwinnett Civic Center in Duluth, Georgia for its 17th annual event on Thursday, April 18, 2013 from 9:30 AM to 3:30 PM. This free, one-day event will feature suppliers to the electronics industry displaying products and services for the high technology and surface mount markets, as well as free tech-nical presentations.

Special events of note for 2013 include a keynote presentation from Mike Buetow, Circuits Assembly/Printed Circuit Design & Fab Editorial Director, that looks at a little-discussed but potentially game-changing trend taking place among OEMs and EMS companies. In addition, Georgia FIRST Robotics will provide live demonstrations on the exhibit floor.www.smta.org/expos/#atlanta

new ipc commodities report predicts rising price trend to resume in 2013IPC — Association Connecting Electronics Industries® launched a new series of monthly market research reports this week with the publication of the February 2013 edition of IPC Commodities Report for the Electronics Industry. This new report is designed to help electronics manufacturers track trends affecting manufacturing costs and anticipate changes in the supply base.

The 19-page report provides current data on the prices of nine commodities of particular importance to the electronics industry, showing both historical trends and five-year forecasts, from secondary sources. It also includes commentary on trends in supply and consumption of those commodities. The commodities reported on include tin, copper, nickel, lead, silver, gold, indium, crude oil and natural gas.

According to the February 2013 report, with the exception of gold, all of the metals IPC tracks for the electronics industry experienced double-digit (percentage) price decreases in 2012. After a rally in the second half of 2012, most prices now appear to be holding steady as markets await the outcome of economic develop-ments in Europe, the USA and China. The forecast for 2013 is a moderate resumption of rising prices for most metals, with the

exception of nickel.Oil prices are expected to decline in

2013, but resume their upward trend in the years following. Natural gas prices dipped in 2012, and are expected to begin an upward trend in 2013.

IPC Commodities Report for the Electronics Industry is updated from secondary sources at the beginning of each month.

A one-year subscription to the monthly report is available for $500 per year, with a discounted annual price of $250 for IPC members. All subscriptions offer a money-back guarantee in the first month. Subscriptions may be purchased at www.ipc.org/subscription-order. Information about all of IPC’s market research subscrip-tion services can be found at www.ipc.org/market-research-subscriptions.

revised Bga guideline features expanded focus on mechanical reliabilityDesign, assembly, inspection and repair personnel have a new tool to help improve reliability of ball grid arrays (BGAs) and fine-pitch ball grid arrays (FBGAs) in high density applications, thanks to the newly released C revision of IPC-7095, Design and Assembly Process Implementation for BGAs.

Published by IPC — Association Connecting Electronics Industries® and developed with input from representatives from OEMs, fabricators, EMS companies and others in the electronics manufacturing industry, IPC-7095C addresses design and process considerations of particular impor-tance to portable handheld products in which BGAs are a dominant interconnec-tion technology.

IPC-7095C, Design and Assembly Process Implementation for BGAs, is 165 pages long. IPC members may purchase a hard copy of the document for $55; the industry price is $110. Single-user, site and global licenses are also available. For more information or to purchase a copy of IPC-7095C, visit www.ipc.org/7095.


regional Spotlight

regional spotlightGlobal SMT & Packaging makes its global presence local through regional websites, enewsletters and magazine editions. Here are recent news highlights from our regional centers:

环球仪器推出自动插件平台升级版Generation 88HT“我们推出的Radial 88HT 及VCD 88HT不单产能更高，插件范围更广，用户体验也更佳。”环球仪器插件设备市场总监Scott Gerhart称。”为了照顾已经使用Generation 8 及 88设备的客户，我们将这些增强功能打包，让客户可以应用在Generation 8 及 88平台上。此举确保客户在购买环球仪器的设备时，能获得最佳的投资保障。这个也是我们的设计理念，在研发平台升级时，所有增强的功能，都可以与现有的Generation 8 及 88平台兼容。”现时世界各地的电子产品生产商，都在努力追求能减少劳动力、提升产品质量及加快投资回报的方案。据Gerhart称，跟10年前的自动插件机比较，新推出的Radial 88HT 及VCD 88HT平台，产能足足翻了一倍。因此，这两个平台大大提升了厂家更换旧有设备的意欲，以加快投资回报的速度。

ð www.globalsmt.cn

Revista de Focus e Orientação do IPC BGA Features expandiu a confiabilidade mecânicaO pessoal de design, montagem, inspeção e reparo têm uma nova ferramenta para ajudar a melhorar a confiabilidade da rede de matrizes de esferas (BGAs) e multa de passo matrizes Ball Grid (FBGAs) em apli-cações de alta densidade, graças à revisão C recém-lançado do IPC-7095, Design e Implementação processo de montagem para BGAs.ð www.globalsmtbrasil.net

Cambridge Nanotherm and Spirit Circuits sign value added reseller agreementFollowing the recent launch of it’s Nanotherm™ MBPCB (Metal-Backed Printed Circuit Board) product, Cambridge Nanotherm has announced the signing of an agreement between itself and Spirit Circuits who will now act as its Value Added Reseller. (VAR). Cambridge Nanotherm has developed a unique process for converting aluminium into alumina (aluminium oxide [Al2O3]). The process allows the surface of an aluminium plate to be converted into a layer of alumina, which acts as a dielectric. ð www.globalsmtuk.net

ISA announces New Charter, name changed to India Electronics and Semiconductor Association (IESA)

The India Semiconductor Association (ISA), the premier trade body, repre-senting the Indian Electronic System Design and Manufacturing (ESDM) and Semiconductor industry unveiled their new charter at the inauguration of the 8th IESA Vision Summit 2013 in Bangalore.ð www.globalsmtseasia.com

ViTrox Technologies Reconocido por los Premios de Tecnología Global por sus Capacidades de Inspección de Rayos-XViTrox Technologies, un proveedor de soluciones de equipo y sistemas de inspec-ción de visión automatizados, efectivos-en-costo, avanzados e inovadores para las industrias de empaquetado electrónico y semiconductores, anuncia que ha sido galardonado con un Premio de Tecnología Global 2012 en la categoría de Equipo de Inspección – rayos-X por su Sistema de Inspección de Rayos-X Automatizado de 3D En-Línea V810 (AXI). El premio fué presentado a la compañía durante una ceremonia que tuvo lugar el martes 16 de octubre en el Walt Disney World Dolphin Hotel en Orlando, FL durante la SMTA International 2012.

El Sistema de Inspección de Rayos-X V810 es el sistema AXI mas rápido y de mayor cobertura en el mundo. La avanzada máquina de rayos-X es la última revolución en tecnología de rayos-X que inspecciona paneles de doble-lado con alto cubrimiento de defectos, alta velocidad de inspección y un excelente índice de llamadas. ð www.globalsmtlamerica.net

권태영 AMD 코리아 대표이사, AMD 아시아태평양 및 일본 지역(APJ) 총괄 사장으로 선임AMD는 AMD 코리아의 권태영(David Kwon) 대표이사가 AMD 아시아태평양 및 일본 지역 총괄 사장으로 선임되었다고 밝혔다. 이에 따라, 권태영 대표이사는 기존에 담당하던 AMD의 삼성 및 도시바 글로벌 비즈니스는 물론, 한국, 일본, 인도, 호주, 동남아 등을 포함한 전 아시아태평양 지역의 비즈니스를 총괄하게 된다. 이번 선임은 권태영 대표이사가 2010년 삼성 글로벌 전략 영업 본부 수장으로 AMD 에 합류한 후 약 2년만에 이루어 진 것으로, 뛰어난 리더십으로 짧은 시간에 괄목할만한 비즈니스 성과를 이뤄낸 능력을 AMD 본사로부터 인정받아 전격적으로 이루어졌다.

ð www.globalsmtkorea.net

SOUTHEAST ASIA

CHINA

BRAZIL

UK/IRELAND

LATIN AMERICA

KOREA


international diary

international diary13-14 March 2013Smart Systems IntegrationAmsterdam, Netherlandssmartsystemsintegration.com

18-22 March 2013DATE—Design, Automation & TestGrenoble, Francedate-conference.com

19-21 March 2013Productronica ChinaShanghai, Chinae-p-china.com

19-21 March 2013SEMICON ChinaShanghai, Chinasemiconchina.com

1-5 April 2013electronicAmericasSao Paulo, Brazilelectronicamericas.com

10-12 April 2013Expo ElectronicaMoscow, Russiaexpoexlectronica.primexpo.com

23-25 April 2013NEPCON ChinaShanghai, Chinanepconchina.com

7-9 May 2013SEMICON SingaporeSingaporesemiconsingapore.org

16-18 May 2013SMT/Hybrid/PackagingNuremberg, Germanysmt-exhibition.com

10-12 June 2013NEPCON MalaysiaPenang, Malaysianepcon.com.my

11-13 June 2013LOPE-CMunich, Germanylope-c.com

20-23 June 2013NEPCON ThailandBangkok, Thailandnepconthailand.com

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www.nepconchina.com For exhibitor Mr. Tim Wang, 86 21 2231 7016 [email protected] For visitor Ms. Linda Gao, 86 10 5763 1818 [email protected]

Shanghai World Expo Convention & Exhibition Center April 23~25, 2013

One of the most effective trade and sourcing platform in China's electronics manufacturing and automation industrie

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NEPCON China 2013

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www.nepconchina.com For exhibitor Mr. Tim Wang, 86 21 2231 7016 [email protected] For visitor Ms. Linda Gao, 86 10 5763 1818 [email protected]

Shanghai World Expo Convention & Exhibition Center April 23~25, 2013

One of the most effective trade and sourcing platform in China's electronics manufacturing and automation industrie

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NEPCON China 2013

Hit your target! The most effective trade and sourcing platform in China’s electronics manufacturing and automation industry.

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2013 Global Technology Awards

For complete rules & to enter, visit awards.globalsmt.netDeadline for entries: July 5, 2013

• Adhesives/Coatings/Encapsulants• Assembly Tools• Bonding Equipment• Cleaning Equipment• Cleaning Materials• Contract Services < $25 million• Contract Services $25 - $100 mil-

lion• Contract Services > $100 million• Dispensing Equipment• Flux• Hand Soldering

• Inspection—AOI Systems• Inspection—SPI Systems• Inspection—X-Ray Systems• LED Production Equipment• Placement Equipment—Low to

Medium Volume• Placement Equipment—High Volume• Printing Equipment• Programming• Rework & Repair• Software—Process Control• Software—Production

• Solder—Bar and Cored Wire• Solder Paste• Soldering Equipment—Reflow• Soldering Equipment—Selective• Soldering Equipment—Wave• Soldering Equipment—Other• Stencils• Storage Systems• Test Equipment• Test Services

Plus:• Best Product—Asia• Best Product—Europe• Best Product—North America• Best Distributor—Asia• Best Distributor—Europe• Best Distributor—North America• Best Environmentally Friendly

Product

GET RECOGNITION FOR THE THINGS YOUR COMPANY DOES BEST

The Global Technology Awards have been recognizing the very best new innovations in the printed circuit assembly and packaging industries since 2005. Each year, the field of entries is scored by an independent, international panel of judges on six different criteria—innovation, speed/throughput improvements, quality contribution, cost benefits, environmental consideration, ease of use/implementation, and maintanability/repairabil-ity—to determine the best new technologies and services introduced in the previous year.

Entries for the 9th annual Global Technology Awards are invited from equip-ment, materials and EMS companies of all sizes. The deadline is July 5, 2013. All products and services introduced between August 1, 2012 and July 31, 2013 are eligible. This year’s ceremony will take place in November at the Productronica show in Munich. For more information, visit awards.globalsmt.net.

www.globalsmt.net

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