fy 2017 ending dec. 2017 second quarter financial results · ・ increased by 10% yoy. ・...

1 (C) Copyright DAI-ICHI SEIKO Co., Ltd. All rights reserved.

Security code: 6640

FY 2017 ending Dec. 2017 Second Quarter Financial Results

August 17, 2017 Dai-ichi Seiko Co., Ltd.


Trade Name Dai-ichi Seiko Co., Ltd.

Founded July 10, 1963 （Fiscal year end in December ）

Stock Exchange Listings The Tokyo Stock Exchange First section, stock code: 6640

Paid-in-capital 8,522 million yen

Issued Share 16,722,800 shares

Business Ⅰ. Connectors & Electronics Components Business Ⅱ. Automotive Electronics & Associated Components Business Ⅲ. Semiconductor Mfg. Equipment and Other Business

Board President: KONISHI Hideki, 8 Other Directors （1 External Director）, 3 Audit and Supervisory Committee Member (3 External Statutory Auditors)

Stockholders Holding Company: 43.05%, Employee Holding Association: 4.19%, The Master Trust Bank of Japan, Ltd.: 4.11%, KONISHI Hideki: 2.97%, Japan Trustee Services Bank, Ltd.: 2.05% (As of Jun. 30, 2017)

Head Office Kyoto-City, JAPAN

Plants in Japan 6 places （3 in Fukuoka, 1 in Yamanashi, 1 in Kyoto , 1 in Shimane）

Overseas Plants 11 places （2 in Singapore, 1 in Indonesia, 2 in Malaysia, 1 in Philippines, 1 in Thailand, 2 in China, 1 in Vietnam and 1 in U.S.A.）

Subsidiaries Matsue Dai-ichi Seiko Co., Ltd. （100% share）, DJ Precision Co., Ltd. （70% share, 30% shared by JAE Co., Ltd.）, 17 overseas companies （100% share）,

No. of Employees 6,065 (2,055 in Japan and 4,010 in Overseas) Compared with Mar. 31, 2017, our employees increased 125 in Japan and 114 in overseas.

■ Corporate Overview as of Jun. 2017


■ FY2017 1H Topics

✔ Record-high sales in the automotive components business

✔ Actions for more growth

✔ 1H results were favorable! Large growth in operating income

(Hundred million yen) Plan Actual Change Sales 234.0 244.4 4.4% Operating income 3.5 8.4 2.4 times ・Connectors for PCs with high transmission speed and automotive connectors

were the growth drivers. ・Demands for capital expenditures increased due to the favorable

semiconductor market.

・Entire business: 105.8％ YoY 9.48 billion yen ・Own brand: 1.6 times YoY 1.44 billion yen

・ESTORQ-equipped robots were launched in this 1H.


Million yen FY2016 1H （Jan.-Jun.）

FY2017 1H （Jan.-Jun.） Change Percentage

Change

Sales 22,083 24,440 2,357 10.7%

Gross Profit 5,605 7,055 1,450 25.9%

Operating Income (410) 841 1,251 - Ordinary Income (1,246) 684 1,930 -

Net Income Attributable to Owners of Parent (1,393) 267 1,660 -

✔ Sales in all business remained firm from 1Q.

✔ All income items grew.

◆ Connector business: sales steadily grew due to an upturn in the global IT market. Especially, sales of micro-coax connectors and newly developed full shield connectors with noise countermeasure function steadily grew.

◆ Automotive business: in addition to continued high market acceptance of automobiles, development of automotive electronics contributed to a steady growth in sensor sales, and more adoption by different types of vehicles contributed to a continued growth in automobile connectors.

◆ Semiconductor equipment business: higher demand for memories for mobile and other devices, combined with capacity enlargement, increased semiconductor manufacturers’ appetite for capital expenditures for manufacturing semiconductors for smartphones and automobiles. Therefore, sales of molding machines and molds grew.

◆ Gross profit significantly increased due to higher sales, and income items at levels below the operating income also significantly increased.

■ FY2017 1H Consolidated Financial Highlights


Million yen FY2016 1H (Jan.-Jun.) Ratio FY2017 1H

(Jan.-Jun.) Ratio Change (%)

Sales 22,083 100.0% 24,440 100.0% 10.7%

Cost of Sales 16,478 74.6% 17,384 71.1% 5.5%

Gross Profit 5,605 25.4% 7,055 28.9% 25.9% Selling

Administration Exps

6,016 27.2% 6,213 25.4%

Operating Income (410) (1.9) % 841 3.4% -

Non-operating Income 297 1.3% 268 1.1%

Non-operating Expense 1,133 5.1% 426 1.7%

Ordinary Income (1,246) (5.6) % 684 2.8% -

Extraordinary Income - - - -

Extraordinary Expense - - 121 0.5%

Net Income before Tax (1,246) (5.6) % 562 2.3% -

Taxation 142 0.6% 301 1.2%

Net Income Attributable to Non-controlling Interests

4 0.0% (6) (0.0)%

Net Income Attributable to

Owners of Parent (1,393) (6.3) % 267 1.1% -

No. of Employees 5,878 6,065

FY2016 1H (Jan. - Jun.)

Actual

FY2017 1H (Jan. - Jun.)

Actual

FY2016 (Jan. - Dec.)

Actual

FY2017 (Jan. - Dec.) Revised Plan

2,436 2,559 5,477 5,600

Gross Margin Ratio: 28.9%

✔ Higher sales in all business significantly improved gross margin ratio and pushed up all income items.

✔ Especially, continued steady sales of micro-coax connectors and newly developed full shield connectors made a large contribution to improving gross profit.

✔ Overall gross margin ratio significantly improved by 3.5 points to 28.9% YoY.

Sales in all business steadily grew.

✔ Operating income significantly increased due to higher gross profit, although SG&A expenses increased YoY due to increased labor costs, etc.

✔ Ordinary income significantly improved YoY, although foreign exchange losses of 386 million yen were incurred.

✔ Net income significantly improved YoY, although corporate income tax increased.

■ FY2017 1H Consolidated Statements of Income

＜ Depreciation ＞（ Million yen ）

Operating Income: 841 million yen


324 344 668 557 693 1,250 4,714 4,248

8,962

4,733 4,751

9,484 5,897 6,556

12,453

6,582 7,124

13,706

1Q 2Q 1H 1Q 2Ｑ 1H

Semicon Equip. and others Automotive ComponentsConnectors and Electronics Components

22,083

FY2016

（Million yen）

11,872 12,568

24,440

10,935 11,148

Up 10% YoY

FY2017

【Connector & Electronics】・ Increased by 10% YoY. ・ Connectors for PCs and

panels were strong. Full-shield Board-to-Board connectors also experienced favorable growth.

【Automotive Components】・ Increased by 5% YoY. ・ Sensors remained firm. Own

brand connectors grew due to more adoption by different types of vehicles.

【Semiconductor Equipment & Others】・ Increased by 87% YoY. ・ Orders for molding machines

showed rapid recovery due to an upturn in the market.

■ FY2017 1H Sales per Segment


26.9% 26.4%

29.4% 31.1% 32.2% 33.0%

24.3% 24.1%

24.3% 24.3% 24.6% 24.2%

25.5% 25.3% 26.9%

27.9% 28.6% 29.1%

1Q 2Q 3Q 4Q 1Q 2Q

Connectors and Electronics Components Automotive Components Total

Million yen FY2016

(Jan.-Jun.) FY2017

(Jan.-Jun.) Change Amount Ratio Amount Ratio

Connectors & Electronics

3,322 26.7% 4,473 32.6% 1,151

Automotive Components

2,170 24.2% 2,312 24.4% 142

Semicon Equip. & others

113 16.9% 270 21.6% 157

Total 5,605 25.4% 7,055 28.9% 1,450

Connectors and Electronics Components

Automotive Components

Gross Margin Ratio / Two Main Businesses and Company Total

FY2016 FY2017

Gross margin ratio has significantly recovered as the factory utilization rate remained high due to increase in sales from March to June.

Sales were steady due to strong automobile sales. Gross margin ratio was stable as higher fixed and other costs were absorbed by higher sales.

■ FY2017 1H Gross Profit per Segment


Million yen FY2016 4Q

FY2017 2Q Change

Current Assets 31,094 31,194 100

Cash & Deposit 11,111 11,139 28

Notes & Accounts Receivable 10,665 10,144 (521)

Inventories 8,131 8,660 529 Fixed Assets 28,081 29,460 1,379

Tangible Fixed Assets 26,710 28,085 1,375

Intangible Fixed Assets 378 393 15

Investments and Other Assets 992 982 (10)

Total Assets 59,175 60,654 1,479

Million yen FY2016 4Q

FY2017 2Q Change

Current Liabilities 9,112 9,958 846 Notes & Accounts

Payable 2,378 2,530 152

Short-term Debt 3,250 2,901 (349)

Fixed Liabilities 5,381 6,043 662

Long-term Debt 3,033 3,376 343

Total Liabilities 14,494 16,001 1,507

Shareholders’ Equity 44,199 44,300 101

Total Net Assets 44,681 44,652 (29) Total Liabilities &

Net Assets 59,175 60,654 1,479

Turnover Period

(Unit：month)

FY2016 4Q

FY2017 2Q Change

Accounts Receivable 2.29 2.49 0.20

Inventories 2.88 2.99 0.11

■ FY2017 1H Consolidated Balance Sheet

Favorable turnover periods of accounts receivable and inventories have been continuously maintained.

【 Assets 】

Acquisition of fixed assets: 4,251 million yen

Our interest-bearing debt & bonds decreased by 6 million yen versus FY2016 as planned. Equity Ratio: 75.3% (FY2016) ⇒ 73.5%

Extremely healthy condition with over 70% equity ratio has been maintained!

【 Total Liabilities & Net Assets 】


Million yen

FY2016 FY2017

Full-year Actual Ratio 1H

Actual

2H Revised

Plan

Full-year Revised

Plan Ratio

Vs. Initial Plan

Vs. Full-year

Actual

Sales 45,834 100.0 24,440 26,560 51,000 100.0 2.0% 11.3%

Connectors & Electronics Components

26,237 57.2 13,706 15,294 29,000 56.9 0.7％ 10.5％

Automotive Components 17,974 39.2 9,484 9,916 19,400 38.0 2.6％ 7.9％

Semiconductor Mfg equipment & Others

1,623 3.5 1,250 1,350 2,600 5.1 13.0％ 1.6 times

Gross Profit 12,116 26.4 7,055 7,977 15,032 29.5 5.2% 24.1%

Overhead Expenses 11,715 25.6 6,213 6,318 12,532 24.6 1.9% 7.0%

Operating Income 401 0.9 841 1,659 2,500 4.9 25.0% 6.2 times

Ordinary Income 800 1.7 684 1,716 2,400 4.7 9.1% 3.0 times

Net Income Attributable to Owners of Parent

157 0.3 267 1,333 1,600 3.1 6.7% 10.2 times

Dividends per Share 15 ５ 10 15

■ FY2017 Plan Brief Overview of Consolidated Business Budget for FY2017


■ Segment Information

Segment Information


【1H Sales】

314 402 716 263 341 604 1,007 991

1,998 1,126 1,113

2,239 620 846

1,466

1,283 1,389

2,672

1,590 1,769

3,359

1,695 1,746

3,441

2,366 2,548

4,914

2,215 2,535

4,750

1Q 2Q 上期１Q ２Q 上期

その他 HDD関連 FPC/FFC/Board to Board 細線同軸 RF同軸

Up 11% YoY

13,706

FY2016 FY2017

6,556 5,897

12,453

6,582 7,124

Up 8％ YoY

（Million yen）

(by products)

Million yen FY2016

1H FY2017

1H Change

(%)

RF Coax Connectors

4,914 4,750 (3.3)%

Micro-Coax Connectors 3,359 3,441 2.4%

FPC/FFC Board to

Board 1,466 2,672 82.3%

HDD Components

1,998 2,239 12.1%

Other 716 604 (15.6)%

Total 12,453 13,706 10.1%

Increased by 10% YoY.

✔ FPC/Board to Board connector sales were 1.8 times. Full shield connector sales grew.

✔ Micro-coax connector sales for laptop PCs were firm.

■ FY2017 1H Connectors & Electronics Components

1H 1H


221 303 524 263 341 604 1,007 991 1,998

1,126 1,113 2,239 728 1,007

1,735

874 1,029

1,903 1,575 1,707

3,282

2,104 2,106

4,210

2,366 2,548

4,914

2,215 2,535

4,750

1Q 2Q 上期 1Q 2Q 上期

その他 HDD関連 DA&スマホ PC ﾜｲﾔﾚｽﾈｯﾄﾜｰｸ

FY2016 FY2017

13,706

6,556 5,897

12,453

6,582 7,124 Million yen

FY2016 1H

FY2017 1H

Change (%)

WL 4,914 4,750 (3.3)%

PC 3,282 4,210 28.3%

DA, Smart Phone

1,735 1,903 9.7%

HDD 1,998 2,239 12.1%

Others 524 604 15.3%

Total 12,453 13,706 10.1%

35%

31%

14%

16%

4%

40%

26%

14%

16%

4%

【1H Sales】

■ FY2017 1H Connectors & Electronics Components

（Million yen）

【 Component Ratio 】

W/less Network

PC

HDD

DA & Smartphone

FY2016 1H FY2017 1H

1H 1H

(by applications)


【Full-year Plan】

29,000

その他 HDD関連 FPC/FFC等細線同軸 RF同軸

1,313 604 796 1,400

3,9402,239 1,861

4,100

4,019

2,672 3,328

6,000

6,913

3,441 3,659

7,100

10,052

4,7505,650

10,400

通期実績上期実績下期計画通期計画

（Million yen）

26,237

13,706

(Revised plan)

FY2016 FY2017

15,294 (Revised plan)

Up 11％ from 1H

(by products)

【Board to Board】

RF Coax Connectors

FPC/FFC/Board to Board

✔ 1.5 times YoY Expand the use of high frequency noise control connectors for USB3.1Type C in PCs.

Micro-Coax Connectors

・Maintain favorable sales of connectors for PCs and panels.

・Expand sales of full shield connectors.

【Micro-Coax Connectors】

NOVASTACK®35-HDP

CABLINE®-CAⅡ

■ FY2017 Plan Connectors & Electronics Components

・ Use in new smartphone models made in Korea and China.

・ Target new applications involving IoT.

Full-year Actual

Full-year Plan

1H Actual

2H Plan

Increase by 10% YoY.


1,121 604 796 1,400

3,940 2,239 1,861

4,100

3,729

1,903 2,097

4,000

7,395

4,210 4,890

9,100

10,052

4,750 5,650

10,400


37%

32%

14%

12%

5%

35%

31%

14%

16%

4%26,237

15,294 13,706

29,000

Million yen FY2017 1H Actual

FY2017 2H Plan

Change (%)

WL 4,750 5,650 18.9%

ＰＣ 4,210 4,890 16.2％

DA, Smart Phone

1,903 2,097 10.2％

HDD 2,239 1,861 (16.9)%

Others 604 796 31.8％

Total 13,706 15,294 11.6%

■ FY2017 Plan Connectors & Electronics Components

【Full-year Plan】【 Component Ratio 】

FY2017 1H FY2017 2H

(Revised plan)

Up 11％ from 1H

(Revised plan)

FY2016 FY2017

Full-year Actual

Full-year Plan

1H Actual

2H Plan

（Million yen）

(by applications)

W/less Network

PC

HDD

DA & Smartphone


606 555 1,161 452 458 910

820 895

1,715

1,278 1,353

2,631

3,288 2,798

6,086

3,003 2,940

5,943

1Q 2Ｑ上期 1Q 2Ｑ上期

関連部品コネクタ及び電装部品車載用センサ

8,962 （Million yen）

9,484

4,248 4,714 4,733 4,751

Up 0.4％ YoY

Up 11% YoY

Record-high

FY2016 FY2017

【1H Sales】

Million yen FY2016

1H FY2017

1H Change

(%)

Sensors 6,086 5,943 (2.3) %

Electronics Parts 1,715 2,631 53.4%

Associated Components 1,161 910 (21.6)%

Total 8,962 9,484 5.8%

✔ Sales of connectors and electronics parts steadily increased to 1.5 times YoY.

✔ Sensor production remained at high level.

■ FY2017 1H Automotive Components

1H 1H

Increased by 5% YoY.


1,994910 890 1,800

3,905

2,631 2,869

5,500

12,075

5,943 6,157

12,100


Urgent need to increase our capabilities!

・ Increase ability to produce equipment ・ Boost production capacity

19,400 17,974

9,484 9,916

Increase by 7% YoY. (Revised plan)

■ FY2017 Plan Automotive Components


Up 4％ from 1H

(Million yen）

Automotive Sensors

Electronics

【SMT Connector】

【Angle Sensor】【Pressure Sensor】

✔ Orders were received for all next-model products!

Existing products are being produced at full capacity.

✔ Target 40% YoY increase! Increase sales of our own brand connectors

(¥1.8 billion → ¥3 billion Up 60%)

FY2016 FY2017

Full-year Actual

Full-year Plan

1H Actual

2H Plan

(Revised plan)


・Site area： 43,526㎡・Total floor space： 20,924㎡・Production items： Automotive

components, Electronics components ・Commercial operation: Scheduled to

start in October 2018

Current Malaysia Plant

Current Singapore Plant New Malaysia Plant

■ Capability Increase Plan New Malaysia Plant

New Malaysia Plant Extended to become a major

production base in South Asia

*Expected completion image

About 30-minute drive


668

1,623

1,250

2,600

上期通期上期通期

✔ Expand sales of new concept encapsulation machinery for ultra-thin packages.

【GP-PRO SP170】

【TS-PRO】

Semiconductor Molding Machine

Up 60% YoY

FY2016 FY2017

Sharp recovery in demand due to the

favorable semiconductor market

■ FY 2017 Plan Semiconductor Mfg. Equipment & Others


(Million yen)

1H 1H Full-year Full-year Auto Taping System for MAP-QFN

(Revised plan)

Other Related Equipment

✔ Expand sales by leveraging strengths as the market leader. Automatic taping machines for specialty packages.

✔ Reinforce sales activities in Asia.

Conduct sales activities closely linked with each region and build stronger ties with agents.

For large densely molded frame Semiconductor Molding Machine


Used in “HC10”, a robot made by YASUKAWA Electric Corporation.

Full-scale production has started in 2Q FY2017!

Launched in June 2017

【HC10】

■ New Business Torque sensors

ESTORQ is installed in all robot joints.

・Working with people without safety fences. ・Designed for “Direct Teaching”, teaching

operations by holding the robot in hand.

Stop safely and automatically even when people touch the robot.


MEMS Chip

Seismic and other motion sensors

Acceleration sensor for automobile crash test

Laser scanner for self-driving vehicles

Can be deployed in various applications by using our unique film formation technologies

■ New Business MEMS Device *Image

Acceleration sensors


(1,234)

1,246 2,355

157 1,600

5,208

4,944 5,119

5,477

5,600

6,382 5,017

8,826

6,914

9,000

FY2013 FY2014 FY2015 FY2016 FY2017

(Revised Plan) 13/12期 14/12期 15/12期 16/12期 17/12期

Hundred million yen FY2013 FY2014 FY2015 FY2016 FY2017

Production M/C 60 43 62 56 60

Expansion of Plants － 4 10 2 8

Plant site －－－－ 10

New Businesses for MEMS, etc.

－－ 10 6 3

R & D 2 ２ 2 2 2

Others 1 １ 4 3 7

■ 2017 Plan Capital Expenditures Continue aggressive capital expenditures in new businesses, etc.

to build a powerful foundation for sustained growth. (Million yen)

Capital Expenditures

Depreciation

Net Income

FY2013 FY2015 FY2014 FY2016 FY2017


Reference


(Sales Ratio 56.1%) Connectors & Electronics Components

GP-PRO SP170 TS-PRO GP-PRO sf40

(Sales Ratio 38.8%) Automotive Electronics & Associated Components

■Reference Main Products

MHF® MINIFLEX175-ST CABLINE®-CAⅡ NOVASTACK®35-HDP

Note: sales ratios are based on financial results for 1H of FY2017.

RAMP

【RF Coax Connectors】【Micro-Coax Connectors】【Board to Board Connectors】【FPC/FFC Connectors】【HDD Components】

【Sensor】【 Connector for Automobile】【Electronics】【Associated Components】

Angle Sensor Pressure Sensor SMT Connector PCB Connector Control Unit Smart Entry Key Ignition Coil

（Sales Ratio 5.1%) Semiconductor Mfg. Equipment and Others 【Semiconductor Molding Machine】【Other Related Equipment】【Peripheral Device for Injection Molding】

Gate Cut Robot


3,151 1,634 2,057 1,776 1,952 2,201 1,623 2,600

12,523 8,911

13,559 14,920 15,874 17,370 17,974

19,400

31,133

21,175

25,558 24,705 28,715

29,178 26,237 29,000 6,716

3,247

1,042 1,328

3,098 2,344

800

2,400

0

1,000

2,000

3,000

4,000

5,000

6,000

7,000

8,000

9,000

10,000

0

10,000

20,000

30,000

40,000

50,000

60,000

FY3/11 FY2011 FY2012 FY2013 FY2014 FY2015 FY2016 FY2017

Semicon Equip. and others Automotive Components

Connectors and Electronics components Ordinary Income

＜for 9 months＞

51,000 46,807

31,720

41,174 41,401

46,541 48,749

45,834

(Revised Plan)

（Million yen）

■Reference Transition of Business Performance


■ Reference Business Model ① -No overlap in business process-

● 2004 business integration with I-PEX ● 2006 listed on the JASDAQ securities exchange ● 2011 listed on the first section of the Tokyo Stock Exchange ● 2012 started new connector business

organization ● 2012 set up our own automotive

connector brand “I-PEX AUTOMOTIVE” ● 2014 started sensor business

Detect and control motions of human-like robots and auto-assembling machines, etc.

Corporate history

● 1963 started as a precision tooling company

● 1976 started precision plastic molding ● 1979 started overseas operation ● 1980 started semicon mfg. equipment business ● 1982 started integrated production strategy ● 1994 started business with I-PEX ● 2000 started automotive business

Provides mold tooling & assembly system technology

OEM Subcontractor

Fabless Design & Sales

OEM R&D plus Production

No overlap in business process

Fabless connector maker

＜2004 ～Business integration with I-PEX Co., Ltd. ＞

New connector maker with a strong mold engineering origin.


■ Reference Business Model ② -Integrated production system-

(In-house tooling and machinery） (Production of connectors）

(1)Fast R&D capability

(2)Production system design + tooling ability (3)Integrated Production Sites

(Design & development of connectors）

R&D to create the world’s first products

Fast product design

Stamping Mold Injection Mold

Machines for Injection, Assy., Inspection and Packing

Molding Raw material

Injection Molding M/C

Mold for plastic parts

Stamping ＆ Plating

Stamping Mold

Stamping Plant Plating Plant

Stamped metal terminals

Plated metal terminals

Molding Plant Plastic Parts Assembly FAM for Assy.

Completion

Integrated in one company


■ Reference Business Model ③ -Source of competitive edge: precision mold-

1.0mm

Super precise mold

Comparison with razor edge

Enlarged

0.25 mm thick

0.25 mm thick

0.3 mm or less fine process

1/1,000 mm precision

Connector mold

Around 200 parts assembled

１．DAI-ICHI SEIKO: ONE and ONLY connector company born as a Mold Origin company.

(1) Final product R&D capability ＋ (2) Production system design and Tooling capability ＋ (3) Integrated production sites in Multiple countries

【 Differentiates Dai-ichi Seiko from its competitors 】 ● Speedy product supply on the market with our internally-developed products and production facilities.

２．Production Technology company born as a Mold Origin company.

(1) Production system design and Tooling capability ＋ (2) Integrated production sites in multiple countries ＝ Spreads widely across other industries

【 Providing various precision parts and devices targeting customers’ needs 】 ● Produce precise molds for various industries by focusing our resources on high value-added products. Diversified products of parts for automobile and hard disk drive, and equipments for semiconductors.


■ Reference Dai-ichi Seiko and its Group Companies

Production 19 Sales 12

YAMANASHI PLANT

FUKUOKA OFFICE Ogori Plant DJ Precision

FUKUOKA OFFICE Onojo Plant

FUKUOKA OFFICE Tachiarai Plant

TOKYO SHINAGAWA OFFICE

OSAKA BRANCH

HEAD OFFICE KYOTO PLANT

SHIZUOKA OFFICE

Matsue Dai-ichi Seiko

TOKYO MACHIDA OFFICE

U.S.A. Alabama Plant

U.S.A. Texas

U.S.A. San Jose U.S.A. Detroit

Philippines Laguna Plant

China Shanghai Plant 2

China Shanghai Plant １

FRANCE

China Dong Guan Plant

Thai Plant

Vietnam Plant

KOREA

TAIWAN

SHANGHAI

SINGAPORE

HONG KONG

Singapore Yishun Plant

Indonesia Bintan Plant

Singapore Woodlands Plant

Malaysia Plant

http://www.i-pex.com/ja/


Corporate Planning

Phone： + 81.942.75.5264

E-mail： [email protected]

Web： http://www.daiichi-seiko.co.jp

Contact

--- NOTE ---

This is a document for corporate presentation purposes only and not for solicitation of investment.

Terms and conditions may change without prior notice.

mailto:[email protected]

http://www.daiichi-seiko.co.jp/

fy 2017 ending dec. 2017 second quarter financial results · ・ increased by 10% yoy. ・...

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