freescale powerpoint template offered for 2g, 3g and 4g standards including gsm, cdma, wcdma, ......
TRANSCRIPT
TM
Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.
FTF-NET-F0346
RF Division General Introduction and New Products Update
August 27, 2009
Suhail AgwaniPortfolio Manager, RF Division
TM
2Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.
Agenda
RF Power Transistor Products and Markets
• Introduction
• Market Trends
Product Portfolio
• Next gen HV8 products
• Packaging solutions
Design and Logistics Support
TM
3Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.
RF Power Transistors Products and Markets :Introduction
TM
4Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.
Introduction to Freescale’s RF Power Transistors
*Sources: ABI, 2009
Product:RF Power Transistors are the key component of RF power amplifiers employed in cellular infrastructure to broadcast cellular signals over a large area.
Markets Served:Cellular, Industrial, BroadcastFreescale’s RF Cellular portfolio covers all major bands from 700MHz
– 3500MHz. Products offered for 2G, 3G and 4G standards including GSM, CDMA, WCDMA, CDMA2000, TD-SCDMA, and LTE.
Freescale’s Leadership:Market leader in wireless infrastructure power transistors with a market share of 62%*.
Freescale’s Vision:To provide leadership products, with the lowest cost and highestperformance, to enable substantial system level cost reductions.
TM
5Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.
Market share position: #1
Dedicated, performance-optimized portfolio for all popular frequency bands
Leader in reliability, performance and consistency
Most advanced multi-stage IC portfolio
Only vendor offering high-power, cost-effective over-molded plastic packaging
Leveraging history of leadership and experience to deliver innovative products to new markets
Freescale’s Strengths
Cellular Infrastructure
Broadcast
Industrial, Scientific & Medical
*Sources: Gartner Dataquest, Strategy Analytics
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6Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.
RFD Worldwide Organization
Freescale TempeDesign, Packaging,
Semiconductor Technology, Engineering, Reliability
Marketing, Modeling Application, System
Freescale TempeDesign, Packaging,
Semiconductor Technology, Engineering, Reliability
Marketing, Modeling Application, System
Freescale Toulouse Design, Engineering Marketing, Modeling Applications, System
Freescale Toulouse Design, Engineering Marketing, Modeling Applications, System
Freescale KualaLumpur Final Mfg-
Kuala Lumpur, Malaysia
Freescale KualaLumpur Final Mfg-
Kuala Lumpur, Malaysia
Freescale Tianjin Final Mfg
Tianjin, China
Freescale Tianjin Final Mfg
Tianjin, China
Freescale Shanghai Marketing,
Applications
Freescale Shanghai Marketing,
Applications
Freescale TokyoMarketing, Application
Freescale TokyoMarketing, Application
Freescale Chengdu Design Center
Freescale Chengdu Design Center
Freescale Oak Hill Fab – 8”
Austin, Texas
Freescale Oak Hill Fab – 8”
Austin, Texas
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7Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.
Cellular Subscriber Facts
Over 1Million new cellular connections added every day
It took 12 years for Subscriber count to reach 1 billion connections and 30 months to get to 2 billion
Today there are almost 4 billion Subscribers across 1050 networks in 222 Countries
Global Technology Market Share : 2009
GSM, 80.4%
CDMA, 10.3%
W-CDMA, 6.7%
iDEN, 0.5% PDC, 0.2%WCDMA HSPA,
1.9%
640 Million Subscribers : 2000
Eastern Europe, 4.0% Asia pacific,
31.0%
Americas, 8.0%
Africa, 2.0%Middle East, 4.0%
Western Europe, 33.0%
North America, 18.0%
4000 Million Subscribers : end 2008
US/Canada, 7.0%
Western Europe, 13.0%
Middle East, 6.0%
Africa, 9.0%Americas, 11.0%
Asia pacific, 43.0%
Eastern Europe, 11.0%
Source: wirelessintelligence.com
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8Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.
Cellular Communications – Industry Trends
OperatorOperator’’s Needss Needs
New frequency bands / spectrum re-use / legacy network support
• Data services driving 3.5G / 4G
• Low ARPU voice services
Rapid network deployment
OPEX reduction• “Green” networks
CAPEX reduction
Impact to RF Amplifier DesignImpact to RF Amplifier DesignPortfolio Expansion to support new Frequency bandsSupport for high speed data services
Multi Carrier / Multi Mode PA’sHigh Peak to Average ratio signalsWider Signal bandwidth (20+ MHz)More stringent Linearity
Faster time to MarketHigh volume manufacturing capability
Lower Power ConsumptionLDMOS Doherty delivers best performance / price ratio
BOM Cost reductionSmaller footprints / Compact PAsImproved reliability and ruggedness
TM
9Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.
Product Portfolio :Introduction to Freescale’s 8th Gen LDMOS
TM
10Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.
2009 RF Cellular Standard Products Portfolio220 active part numbers220 active part numbers for RF Cellular applications addressing the full spectrum of frequencies and modulation schemes
Band
Modulation
0.4 0.7 0.8 0.9 1.5 1.6
SC/MC-GSM
CDMA
TD-SCDMA
W-CDMA
LTE
TD-LTE
WiMAX
1.8 1.9 2.0 2.1 2.3 2.6 2.7 3.5
35 new products35 new products in active developmentin active development New product Development
Significant Investment
TM
11Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.
Next Gen is more than just a die evolution - Freescale delivers a complete package solution that optimizes performance at the system level
Die TechnoDie Techno
MatchingMatching&&
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TM
12Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.
Challenges associated with Transistor Optimization for Doherty + DPD
5.6pF
10nF
1.0
kΩ
1.2pF
330Ω
330Ω
1.2pF
4.7µ
F
10nF
1.0
kΩ
4.7µ
F
5.6pF
5.6pF
3.3pF
3.3pF
MR
F7S21125HM
RF7S21145H
5.6pF 10µF / 50V
10µF / 50V
10µF / 50V
10µF / 50V
Doherty PCB
Bare LDMOS Die Packaged LDMOS Transistor
• Intrinsic RF Performance
•Thermal Performance of die
•Circuit Design Approach :
Doherty circuit optimization
• Extrinsic RF Performance : Impedance optimization and matching
•Thermal performance of package
Coupled Effects – All elements must be optimized together.together.
Package
TM
13Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.
Freescale’s 8th Gen RF Power LDMOS (HV8)
HV8 is Freescale’s latest generation of LDMOS technology, achieving Best in Class RF performance in 2G, 3G, and 4G base station power amplifiers.
Internal Use Only
Delivering PerformanceDelivering Performance
Cellular Operators demand “greener” solutions for future
networks
•Best LDMOS Efficiency for Class AB and Doherty applications: up to 46% Doherty efficiency in multi-carrier 2.1 GHz W-CDMA test conditions
•New standards such as LTE and WiMAX create additional challenges: HV8 is specifically optimized to deliver excellent linearity under the most stringent signal conditions.
•High Gain Final stages•High peak power in compact packaging solutions
Tailored SolutionsTailored Solutions
Timely introduction to meet the needs of Multi-carrier GSM, W-
CDMA and LTE applications
•Freescale provides complete reference designs and performance data, including information with Digital Pre-Distortion (DPD)
•Band specific HV8 solutions in development at 700 MHz, 900 MHz, 1.8 GHz, 2.1 GHz and 2.6 GHz.
•Broad portfolio of LDMOS discrete transistors and IC’s in air cavity and over-molded plastic packages•GaAs GPA’s for low power stages.
Cost & ReliabilityCost & Reliability
Reducing costs while improving performance and reliability
•Higher PA efficiency enables significant system level savings (cooling, battery back-up, smaller housing) .
•HV8 product portfolios benefit from innovation in cost effective over-molded plastic packaging
•Outstanding ruggedness•Excellent MTBF figures.
TM
14Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.
HV8 Product Portfolio - 1 GHz
Product Options
Part Number Rated Power (W) Package
100 NI-780
OM-780
OM-780
NI-880
NI-1230
170
200
260
300
MRF8S9100H/S
MRF8S9170N
MRF8S9200N
MRF8S9260H/S
MRF8S9300H
DEVICE PACKAGING
NI-780H OM-780 NI-1230H NI-1230HSNI-880HNI-780HS
TM
15Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.
HV8 Performance at 900MHz
TYPICAL PERFORMANCE (1) 1 Carrier WCDMA, 6.5 dB signal PAR, (2 Device Symmetric Doherty), 920-960MHz
Characteristic MRF8S9170N MRF8S9200N MRF8S9260H Unit
Peak Power
Average Power 60 70 90 W
Power Gain (2)
Drain Efficiency (2)
Adjacent Channel Power Ratio (2)
(DPD Corrected)
45 44 43 %
-60 -60 -60 dBc
(1) In Freescale RF test fixture, 50 Ohm system. VDD = 28 V.(2) Measured at Average Power
55.8 56.4 57.6 dBm
17 17 16.5 dB
Doherty reference designs available for all products in family
Peak power level range of 55 – 58 dBm to cover multiple 4 and 6 carrier applications.
Excellent gain and efficiency Video Bandwidth optimization ensures
excellent Linearity in Digital Pre-Distortion (DPD) systems
Cost effective over-molded plastic package (MRF8S9170N, MRF8S9200N)
High device power capability in compact footprint
All devices internally input and output matched, to achieve high terminal impedances
Outstanding device ruggedness and mean time to failure
TM
16Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.
HV8 Product Portfolio – 2.1 GHz
Product Options
Part Number Rated Power (W) Package
100 NI-780
NI-780
NI-780
NI-780
NI-1230
NI-1230
120
140
170
200
240
MRF8S21100H/S
MRF8S21120H/S
MRF8S21140H/S
MRF8S21170H/S
MRF8S21200H/S
MRF8S21240H/S
DEVICE PACKAGING
NI-780H NI-780HS NI-1230H NI-1230HS
TM
17Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.
Performance Comparison - HV7 vs. HV8 at 2.1 GHz
2.1 GHz Doherty + DPD Technology ComparisonDPD Corrected Linearity vs. Efficiency
2 Carrier WCDMA
-65
-60
-55
-50
-45
-40
-35
-30
30 35 40 45 50 55
Drain Efficiency (%)
Cor
rect
ed L
inea
rity
(IM3
dBc)
6% Improvementat -55 dBc
HV8 Doherty
HV7 Doherty
Highly efficient, the HV8 product family delivers a 4 to 6 percentage point drain efficiency improvement in Doherty applications at a fixed corrected linearity point when compared to previous Freescale technology generations, such as HV7.
HV8 demonstrates excellent correction over a large dynamic range of output power, resulting in performance benefit for any signal Peak to Average Ratio (PAR).
Improved correction allows for reduction in device rated power required for PA designs
2 Carrier WCDMA, 6.5 dB signal PAR, 101 Configuration
TM
18Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.
HV8 Performance at 2.1 GHz
MRF8S21100HS TYPICAL PERFORMANCE (1)
2 Carrier WCDMA, 6.5 dB signal PAR, 101 Configuration(2 Device Symmetric Doherty)
Characteristic Pout (dBm)
Peak Power
Power Gain
Drain Efficiency
Intermodulation Distortion (DPD Corrected)
45.8 -56.9 (L)-55.6 (U)
-57.1 (L)-56.0 (U)
-55.8 (L)-54.8 (U) dBc
Adjacent Channel Power Ratio (DPD Corrected)
2110 MHz
2140 MHz
2170 MHz Unit
45.8 46.2 46.1 45.8 %
45.8 -55.0 (L)-54.5 (U)
-54.3 (L)-53.8 (U)
-52.7 (L)-52.3 (U) dBc
(1) In Freescale RF test fixture, 50 Ohm system. VDD = 28 V.ACPR measured in 3.84 MHz bandwidth at 5 MHz offset from each carrier.IMD3 measured in 3.84 MHz bandwidth at 10 MHz offset from each carrier.
- - - 53.8 53.8 53.7 dBm
45.8 15.5 15.8 15.9 dB
HV8’s exceptional broadband behavior, typically covering more than 120 MHz or 2X the target downlink transmit band, in conjunction with optimization for low memory effects, is ideal for multi-carrier or wide signal bandwidth applications.
HV8 increases in gain, typically on the order of 0.5 to 1 dB in a Doherty architecture, also aids in system level efficiency. Driver and predriver stage power transistor power levels can be scaled down accordingly.
TM
19Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.
Industry Leader in RF Power Packaging
Most comprehensive portfolio of over-molded plastic and air-cavity packages
Industry leader in RF power over-molded plastic packaging
Automated assembly manufacturing for consistency
Dedicated packaging design center for system level application support
Multiple assembly locations for secure supply
Compatibility with high temperature re-flow Pb-free solders
Advanced Packaging Solutions
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20Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.
Freescale’s Over-molded Plastic Family
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21Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.
Ceramic (Air Cavity) Packaging
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22Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.
Support & Beyond
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23Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.
Freescale’s Value Proposition
Performance and Cost• Best in class 8th generation Silicon LDMOS portfolio for all major
cellular bands• Air cavity ceramic and Plastic over molded package options• Surface mount IC options
Applications Support / Time to Market• Doherty reference designs for rapid evaluation and implementation• Transistor models• Advanced load pull capabilities • Thermal analysis• Customer specific optimization and characterization• Worldwide network of Applications Engineers
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24Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.
Freescale’s Value Proposition
Supply chain and Manufacturing capacity• Largest manufacturing capacity in the industry • Competitive, and stable lead times in any market environment• Capable of supporting sudden and unexpected customer demand• In-house 8” state of the art Wafer fabrication facility• In-house test and assembly facility – site has flexible, reconfigurable test capacity
Quality and Reliability• Freescale products adhere to the highest industry standards for quality and reliability. • Products typically demonstrate greater than 100 years mean time to failure.
Simplified Supply Chain• Freescale offers the broadest and deepest portfolio of RF power transistors for cellular
infrastructure of any vendor on the market. • Product portfolios include GPA predrivers, two stage RFIC drivers, and final stage
products at an array of power levels for all cellular bands.
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25Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.
Summary: What Freescale is striving to provide
PPERFORMANCE
AAVAILABILITY
RRELIABILITY
CCOST
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