External Use

TM

Freescale Automotive Body MCU

Introduction

S e p t . 2 0 1 4

Jason Yang | Automotive BD

TM

External Use 1

Agenda

• Automotive Body Electronics Overview

• Freescale Body MCU Roadmap

• KEA Family for general purpose MCU

• MagniV for Distributed Nodes

• MPC574xG for BCM/Gateway

TM

External Use 2

Automotive Body Electronics Overview

TM

External Use 3

Body MCU Market Overview

0

200

400

600

800

1000

1200

1400

1600

2009 2010 2011 2012 2013 2014 2015 2016 2017

$M

Body SAM $M WINDOW LIFT

RAIN SENSITIVE WIPERS

POWER SEATS

POWER DOOR/TAILGATE/ROOF

PASSIVE KEYLESS ENTRY

MIRROR ADJUST

LIGHTING

KEYLESS ENTRY

IMMOBILISER

HVAC

HEATED SEATS

ELECTROCHROMIC MIRROR

ELEC. SUNROOF

BODY CONTROL MODULE

ALARM

SAM Overview

• Body control and HVAC systems dominate the SAM.

• OEM function optionalism driving growth in LIN connected

solutions.

• Growth in LED lighting

• 8/16-bit still very significant portion of the SAM in 2010

• 32-bit SAM growing

Body Control

HVAC

Lighting

Window Lift, Mirror

And Wiper

44%

29%

27% 8 bit

16 bit

32 bit

2010 SAM by bits

TM

External Use 5

Kinetis 32-Bit ARM MCU comes to automotive - KEA Series

Kinetis E Auto: 32-bit ARM Auto MCU • 32bit M0+ 48MHz high performance & low power

• 8K to 128K embedded flash, pin to pin compatible

• AECQ100 qualified, -40C to 125C, enhanced ESD (6kV)

• Automotive connectivity: CAN, LIN(SCI), SPI and IIC

• Automotive IPs: ADC, ACMP, Timers (FTM, PWM, PIT, PWT, RTC)

• Vdd = 2.7 - 5.5V, 3.3V or 5V convenience

Start your design easily today! • Most complete MCU + development environment

• 24 Hours to prototype level, 2 months to production grade

• Samples and Evaluation Boards (8K to 128KB)

• PPAP July 2014

TM

External Use 6

S12 MagniV: Integration Beyond the MCU

Our S12 MagniV portfolio simplifies system design with the integration on High-

Voltage (HV) analog features onto MCUs for automotive applications

S12ZVM

BLDC Motor Control

S12ZVC

Small CAN nodes

MM912/S12VR

Window Lift

S12ZVL

LIN Nodes

S12VR

MM912_S812 S12ZVL

Reduced PCB Space

Improved manufacturing efficiency

Reduced Bill of Material

Simplified development

MM912_S812

S12ZVC

TM

External Use 7

New

Integration,

Low Power,

Security &

Safety

Functional Safety and Security Security modules protect ECUs against various attack scenarios and Safety modules ensure robust operation per ISO 26262

Low Power Management New low-power modes, analog comparators, and pretended networking support help meet stringent next generation power budgets and ensure greener vehicles

Unprecedented Integration Single-chip solution offering multicore architecture and advanced networking protocols for next generation communication requirements while reducing the quantity of body control/gateway ECUs

TM

External Use 8

KEA Family Introduction

TM

External Use 9

KEA128 Block Diagram

Communications I/O System

6+2+2ch

16bit Flex

Timer(2)

2

I2C

2

SPI

3

SCI

(LIN)

2

KBI

16ch,

12bit ADC

w/8 FIFO

1

PWT

2

Analog

Comp-

arators

Peripheral Bus

SWD

Debugger

Debug

RAM

Up to

16KB

System

Peripheral

Bridge

Flash

UP To

128KB

1xWDT

1-Cycle GPIO

BME(1)

Applications:

• Automotive general purpose

Operating Characteristics:

• Voltage range: 2.7 to 5.5 V

• Temperature range: -40 to 125°C

Key Features:

• ARM Cortex M0+ core 48MHz

• Up to 128K embedded flash

• Up to 16K RAM

• External OSC and internal ICS for clock

• System functions: LVD, WDG, CRC, LP

modes

• Communication: SPI, SCI, IIC, CAN

• Timers: FTM, PWM, PIT, PWT, RTC

• 12bit ADC and ACMP

Packages:

•16TSSOP, 24QFN, 32/ 64 and 80LQFP

• Pin compatible within KEA family

PMC

2.7-5.5V

POR

Ext Osc

(1-20M, 32K)

FLL Clk Mult

Int R/C OSC

(~32KHz 2%)

Int LP Osc

(1KHz)

LVD

NV

IC

1-C

Y M

UL

ARM Cortex M0+

48MHz Core Freq

(1) Support bit operation in RAM

(2) Faster timer running 2 x core clock

1

MSCAN RTC

Open-

Drain IO,

KBI,

GPIO

1

PIT

EEPROM

256B

Option

TM

External Use 10

KEA products comparison table

Device

Features

Flash RAM EE

PROM Freq

MS

CAN SCI SPI ATD PWT

Flex-

Tim ACMP IIC GPIO

Packag

es

KEAZN8 8K 1K emulate 48MHz 0 1 1 12c12b 1 6c+2c

16b 2 1

Up to

22

16

TSSOP/

24 QFN

KEAZN16 16K 2K 256B 40MHz 0 3 2 16c12b NA 6c+2c+

2c 16b 2 2

Up to

57

32/64

LQFP

KEAZN32 32K 4K 256B 40MHz 0 3 2 16c12b NA 6c+2c+

2c 16b 2 2

Up to

57

32/64

LQFP

KEAZN64 64K 4K 256B 40MHz 0 3 2 16c12b NA 6c+2c+

2c 16b 2 2

Up to

57

32/64

LQFP

KEAZ64 64K 8K emulate 48MHz 1 3 2 16c12b 1 6c+2c+

2c 16b 2 2

Up to

71

64/80

LQFP

KEAZ128 128K 16K emulate 48MHz 1 3 2 16c12b 1 6c+2c+

2c 16b 2 2

Up to

71

64/80

LQFP

TM

External Use 11

Applications: • Seats/Sun Roof

• Windows/Doors

• Mirror/Wiper

• Fuel/Water Pump controller

• Body Control

• Park Assist

• DC/BLDC Motor control

• Ambient lighting

• Infotainment connection module

• GPS/Radio companion MCU

Reference Solutions: • BLDC motor control

• Vehicle Interior / Exterior LED Lighting

• Low Power LIN/CAN Node Networking

• Motorcycle Engine Control

Kinetis Auto: General Purpose 32 Bit ARM MCU

TM

External Use 12

Kinetis EA Series MCUs for Automotive Built on the ARM® Cortex® -M0+ Processor

Single-Cycle I/O Port •50% higher GPIO toggling

frequency than standard I/O

•Improves reaction time to

external events allowing bit-

banding and software

protocol emulation

•Save precious cycles, e.g.

set faster peripherals for

low-power access

•Access GPIO/peripherals

while processor fetches the

next instruction

Energy Efficiency •2-stage pipeline – reduced

cycles per instruction (CPI)

enabling faster branch

instruction and ISR entry

•Program memory access on

alternate cycles

Micro Trace Buffer •Powerful, lightweight trace

solution enabling fast debug

•Non-intrusive – trace

information stored in small

area of MCU SRAM (size

defined by programmer)

• Trace read over Serial Wire

/JTAG (CPU stopped)

Processing •Only 56 Instructions, mostly

coded on 16-bit. Option for

fast MUL 32x32 bit in 1 cycle

•Cortex-M0/3/4 compatible

•1.77CM/MHz

•Best-in-class code density –

reduced cost, power

consumption and pin-count

TM

External Use 13

24 Hours to Prototype: Typical Development Flow

Choose Your

Hardware

Install

Development Suite

Prototype with

Demo Code

1 2 3

• Demo boards

• Reference solutions

• Initialization / autocoding

• Compiler

• Debug

• Low-level drivers: CAN,

LIN, Flash

• Demo code: CAN

wakeup, LIN comms

• Peripheral enhancement

routines

TM

External Use 14

Kinetis EA Series MCUs for Automotive IDE Support

Freescale (CodeWarrior 10.1)

• Includes MQX Task Aware Debug plug-in option

• MCU v10.1 Complier Update for MQX3.7

• Includes Processor Expert

IAR (Embedded Workbench)

• Reliable, Powerful and Easy to Use

• The most widely used C/C++ tool chain for ARM MCUs

• Support for Kinetis 10/20/30/40/60, ColdFire+ and ColdFire

• Freescale MQX™ RTOS integration

• Ready-made project templates

• Professional technical support organization

Keil (MDK)

• Tailored to ARM Cortex-M devices

• Optimized Compiler, IDE, Debugger, Debug/Trace Adapters

• Support advanced Cortex-M and CoreSight technologies

TM

External Use 15

Kinetis EA Series MCUs for Automotive Motor Control Libraries

Wide group of algorithms • Basic mathematics, logic, controllers, modulations, transformations up to observers

• Tool for beginners as well as for professionals

• Libraries are optimized, tested and easy to use

• Implemented with C-callable function interface

Implemented Algorithms • Sine , Cosine , Tangent , Arcus Sine, Arcus Cosine, Arcus Tangent, Arcus Tangent, Shifted

Arcus Tangent, Square Root, Ramp, Limiter, Hysteresis, Signum, Look-up Table, PI Controller

• Clarke Transformation, Inverse Clarke Transformation, Park Transformation, Inverse Park Transformation, Space Vector Modulation, Vector Limiter, PMSM Decoupling, DC Bus Ripple Elimination

• IIR filter, Moving avg. filter

TM

External Use 16

Kinetis EA Series MCUs for Automotive MQX™ Lite RTOS - Overview

Very light MQX kernel for resource-limited MCUs • Targeted at the Kinetis L family initially

• Packaged as a Processor Expert component

I/O capability provided by Processor Expert • USB via FSL bare-metal stack, also a Processor Expert component

• No POSIX-like drivers or file access

Programming model allows upward code migration • A true subset of the full MQX RTOS

• Code built with MQX Lite will move to full MQX RTOS easily

• Same task templates, same API - some very minor differences

Available as a component within the Freescale s/ware offerings • Processor Expert software, MCU driver suite - Supports IAR, Keil, and GCC compilers /

build chains

• CodeWarrior Development Studio V10.3

TM

External Use 17

MagniV for Distributed Nodes

TM

External Use 18

A Technology Sweetspot for Sensor and Actuators

Digital Logic S12, PWMs, Timers,

SRAM, SPI, SCI, GPIO,

Watchdogs, etc.

High-Voltage

Analog Low Side & High

Side Drivers,

Voltage Regulator

LIN/CAN Phy. etc.

Non-Volatile

Memory Flash, EEPROM

Existing

Low Leakage 180nm CMOS+NVM 40V UHV Devices

TM

External Use 19

2015

15+ Years of System in Package (SiP) Experience

Troll - MUX3

• 8-bit HC05 Hyper-integrated Climate Stepper Driver

908E626

• HC08 + SMOS5 AFS Stepper Driver

908E630

• 8-bit HC08 (SOG) + SMOS8 Relay Driver

912F634

• 16-bit S12I32 + SMOS8 Relay & Switch Driver

S12VR64 (first part of

MagniV family

2009 2008 2007 2006 2005 2004 2003 2002 2001 2000 1999 1998 2010 1997

Start of SiP R&D

Mechatronics Package

HC05 Microcontroller with EEPROM (IDR60% -1.2um)

SiP Architecture

HC08 Microcontroller with flash (0.5um)

SMOS5 (0.8um)

54ld SOIC Package

SMOS8 (0.25um)

QFN Package

S12 Core (0.25um)

Architecture Repartitioning

Monolithic Architecture

1st Gen 2nd Gen 3rd Gen

2011 2012 2013 2014

4th Gen

HC05PV8

• 8-bit HC05 Hyper-integrated Relay Driver

908E624

• 8-bit HC08 + SMOS5 Relay Driver

908E622/1

• 8-bit HC08 + SMOS5 Mirror Driver

LL18UHV technology

Monolithic SiP

Pro

ducts

Technolo

gie

s

S12ZVM S12ZVH

S12ZVL

S12ZVC

S12Z Core

TM

External Use 20

S12 MagniV Roadmap

< 2012 2013 2014 2015 2016 2017

Motor

Control

Instrument

Cluster

LCD Displays

General

Purpose

Production

First

Sample Date

(left edge)

Product

Qualification

(right edge)

Proposal

Planning

Execution

S12ZVH

S12ZVL32

S12ZVFP

S12ZVC

High temp

(AEC Grade 0)

PWM command

S12VR64/48

LIN applications

CAN applications

S12ZVML

32-128kB, 64pin.6ch GDU, 50MHz

64-128kB, LCD, 4 stepper drivers

64kB, LCD

64-192kB; 48-64pin; 32MHz

8-32kB; 32-48pin, 32MHz

S12ZVMC (no CAN phy)

S12ZVHL

32-64kB, LCD, 2 stepper drivers

16-32kB; 6ch GDU

32pin only, 16-32kB

Small CAN

Nodes

LIN Nodes

S12ZVM

DC Motors

BLDC

Motors

Relay-driven window lift/sunroof

32-48pin; 25MHz

MM912H/G634

S12ZVHY (no LIN phy)

Last Updated 06JUN14

S12VR32/16

S12ZVL128

64-128kB; CAN/LIN gateway

(no CAN PHY)

TM

External Use 21

S12 MagniV Benefits S12 MagniV solutions deliver optimal system cost and

physical footprint for sensor and actuator applications.

Reduced PCB Space Up to 30%

Improved manufacturing efficiency Replacing typically 3 IC by 1 MagniV reduces assembly and test cost while quality improves

Reduced Bill Of Material (BOM) Fewer components to purchase, handle, store and qualify

Simplified motor control that speeds up time-to-market Save up to 6 months on development, validation and ISO26262 implementation • Abstract the complexity of 3-phase motor control software development • Production ready Automotive quality SW and Tools • SafeAssure program

TM

External Use 22

Motor Control Solutions

Production Proposal Planning Execution

Re

lay-d

rive

n

DC

-mo

tors

H-B

rid

ge

drive

n

DC

-mo

tors

Bru

sh

less D

C

Mo

tors

S12VR 48K-64KB; 32/48pin

LIN with PHY; LS drivers

S12ZVML 32-128KB; 64pin

LIN with PHY, 100nC

S12ZVMC 64-128KB; 64pin

2nd 5V VREG for ext CAN, 100nC

S12ZVM 16/32KB; 64pin; 50nC

S12ZVML 32-128KB; 64pin

LIN with PHY, 100nC

S12ZVMC 64-128KB; 64pin

2nd 5V VREG for ext CAN, 100nC

LIN applications

CAN applications

PWM controlled apps

< 200W Motors > 200W Motors

High temp option (AEC Grade 0)

Switch panel interface

S12VR 32/16kB, 32pin

LIN with PHY; LS-driver

TM

External Use 23

S12

Vreg

Temp

Sense

PLL

BDM

HVI

LIN

PHY

High

Side

Flash

EEPROM RAM

ADC

10bit

TIM

KWU

RTI

COP SPI

SCI0

SCI1

Ext. Osc

IRC

PWM

8ch

Low

Side

Relay

Driver

EVDD

Hallout

LIN

LG

ND

LIN

VS

EN

SE

Window Lift with S12VR

Pinout representing functionality,

Physical pins location is not correct

VS

UP

LS1

LSGND

LS0 M M

Vbat

Hall

Sensor IOC

IOC

Switches HVI0

HS1

HVI1

HVI2

HVI3

HS0

Indicator

LED

Debug &

Programming

Connector

Altern.

SPI&UART

based Test

Connector

VD

DX

VD

DA

KWU

EVDD

High-Voltage

Components

Digital

Components

5V Analogue

Components

MCU Core

and Memories

TM

External Use 24

S12VR Development Tools and Enablement

HARDWARE:

• S12VR64EVB: S12VR Evaluation Board ($149,-)

• USBMULTILINKBDM: In-Circuit Debugger/Programmer

COMPILER, DEBUGGER:

• CW_V5.1HCS12_VR64SP: CodeWarrior for HCS12(X) v5.1 VR64 Service Pack

• ZAP 6812 ICD: Cosmic ZAP HCS12 BDM Debugger.

APPLICATION NOTE, REFERENCE DESIGN, MIDDLEWARE:

• AN4540 Comparison Between the MC9S12VR and MM912_634

• AN4650 Functional Differences between Tomar 2.1 (2N05E) & Tomar 3 (0N59H)

• Anti-Pinch Window Lift Reference Design

http://www.freescale.com/webapp/sps/site/prod_summary.jsp?code=RDS12VR

• FSL_LIN_2.1_DRIVER: LIN 2.1 / J2602 Driver

TRAINING:

• AN4448: MC9S12VR Family Demonstration Lab Training

• S12 MagniV Mixed-Signal Microcontroller Introduction: Overview on S12-MagniV family, including S12VR64 introduction

• http://www.youtube.com/watch?v=dCnc7X9mptc&feature=player_embedded

Not needed

with EVB

TM

External Use 25

S12ZVL – Key Features High-Voltage

Components

Digital

Components

5V Analogue

Components

MCU Core

and Memories

SPI

TIM 16b

6+2ch 128B

EEPROM

(ECC)

8-32KB

Flash (ECC)

S12Z 32MHz Bus IIC

LIN-PHY 10-Bit

ADC

Temp

Sense

1kB

RAM

(ECC)

PLL RCosc.

+/-1.3%

Pierce

Osc.

HV Input 1#

E-Vdd

1-3#

NGPIO

SCI 1 SCI 0

G

P

I

O

Vreg

70, or up to 170mA

with ext. Ballast

PWM 8ch 8b

or 4ch 16b

Vsup

sense

BDM

BDC KWU

Win Wdog

High Voltage

Input 12V Input for

Switch Monitoring

Routable to ADC

Vsup sense Monitoring supply voltage

(sense after protection

diode)

Packaging Options 32-LQFP and 48-LQFP

32-QFN 5x5mm

Voltage Regulator 5V/70mA total supply or

170mA with external ballast

for more current and lower

power dissipation

NGPIO 1-3# 5V / 25mA sink

Eg. for RGB-LED

SPI, IIC Serial link to other Ics,

e.g sensors,…

LIN Physical

Layer LIN2.2 and SAE

J2602 compliant

+/- 8kV ESD

capability

External Supply 5V / 20mA switchable for

local (same PCB), over

current protected

TM

External Use 26

S12ZVL

Product Name S12ZVL S12ZVLS

Package 48-LQFP 32-LQFP 32-QFN

Flash memory (ECC) 32 / 16 / 8 kB 32 / 16 kB

EEPROM (ECC) 128B

RAM (ECC) 1kB

SCI / SPI / IIC 2 / 1 / 1

LIN-PHY 1

HVI 1

V reg 12V/70mA; extendable to 170mA with ext. Ballast

Timer 6ch + 2ch (16 Bit)

PWM 8ch 8 Bit (or 4ch 16Bit)

ADC 10ch 10Bit 6ch 10Bit

eVdd (5V/20mA) 1ch (source)

N-GPIOs (5V / 25mA) 3ch (sink) 1ch (sink) 3ch (sink)

Temperature options C / V / M

TM

External Use 27

Target Applications

LIN-Sensors LIN-switchpanels LIN-Actuator

Product Function

• Hooking up sensors into

automotive LIN-Network

(with signal pre-

conditioning

Market Requirements

• LIN-PHY, 12V-Vreg, MCU

• Small formfactor (QFN)

• ADC, SPI

Product Function

• Reading multiple switch-

positions and feeding into

LIN-network

Market Requirements

• LIN-PHY, 12V-Vreg, MCU

• Multiple GPIOs

• ADC

Product Function

• Converting LIN-

command into an activity

(eg driving LEDs)

Market Requirements

• LIN-PHY, 12V-Vreg, MCU

• Drivers (3x25mA drive

strength in case of RGB-

LED)

• ADC

TM

External Use 28

Switch Panel with S12ZVL High-Voltage

Components

Digital

Components

5V Analogue

Components

MCU Core

and Memories

On-board

Switches

LED

Backlight

Dials

Off-board

Switches

Battery

Voltage

LIN Bus

SPI

TIM 16b

6+2ch 128B

EEPROM

(ECC)

8-32KB

Flash (ECC)

S12Z 32MHz Bus IIC

LIN-PHY 10-Bit

ADC

Temp

Sense

1kB

RAM

(ECC)

PLL RCosc.

+/-1.3%

Pierce

Osc.

HV Input 1#

E-Vdd

1-3#

NGPIO

SCI 1 SCI 0

G

P

I

O

Vreg

70, or up to 170mA

with ext. Ballast

PWM 8ch 8b

or 4ch 16b

Vsup

sense

BDM

BDC KWU

Win Wdog

Wakeup

TM

External Use 29

Intelligent Sensor Application

http://www.bmw.com/com/en/insights/technology

/technology_guide/articles/rain_sensor.html 5V Supply

High-Voltage

Components

Digital

Components

5V Analogue

Components

MCU Core

and Memories

SPI

TIM 16b

6+2ch 128B

EEPROM

(ECC)

8-32KB

Flash (ECC)

S12Z 32MHz Bus IIC

LIN-PHY 10-Bit

ADC

Temp

Sense

1kB

RAM

(ECC)

PLL RCosc.

+/-1.3%

Pierce

Osc.

HV Input 1#

E-Vdd

1-3#

NGPIO

SCI 1 SCI 0

G

P

I

O

Vreg

70, or up to 170mA

with ext. Ballast

PWM 8ch 8b

or 4ch 16b

Vsup

sense

BDM

BDC KWU

Win Wdog

Rain /

Light

Sensor

ASIC

Automotive Voltage

LIN Bus

TM

External Use 30

S12Z

Vreg

Temp

Sense

PLL

BDM

LIN

PHY

Flash

EEPROM RAM

ADC

10bit

RTI COP

SCI0

Ext. Osc

IRC

VDDX

LIN_In

VD

DS

VD

DX

LIN RGB application draft

GPIO

LIN Master

VSUP

PWM

3x16bit

Verpolschutz BC

TL

3x20mA

RGB LED

S12ZVL16/32

High-Voltage

Components

Digital

Components

5V Analogue

Components

MCU Core

and Memories

TM

External Use 31

S12ZVL Development Tools and Enablement

HARDWARE:

• X-TWR-S12ZVL32 & X-TRK-S12ZVL

(both available now, TRK will replace TWR, $99 each)

• TRK-S12ZVL : OOBE EVB (available for launch, $99)

• USBMULTILINKBDM: In-Circuit Debugger/Programmer (available now)

COMPILER, DEBUGGER:

• CW_V10.x: CodeWarrior for S12ZVL

• ZAP 6812 ICD: Cosmic ZAP HCS12 BDM Debugger.

APPLICATION NOTE, REFERENCE DESIGN, MIDDLEWARE:

• Reference Designs / Demos:

- Ultrasonic distance measurement (available for launch)

- LIN-RGB (LED) (available for launch)

• FSL_LIN_2.1_DRIVER: LIN 2.1 / J2602 Driver (available now)

Not needed

with EVB

TM

External Use 32

MPC574xG for High-end Gateway

TM

External Use 33

Multiplex Architecture for modern cars

Ethernet

Flexray

LIN

MOST

Bo

dy C

AN

Co

mfo

rt CA

N

Dia

gn

ostic

CA

N

Po

we

rtrain

CA

N

... Up to 6 x CAN

Central or

Integrated

Gateway

Potentially

other

interfaces

Potentially

active star

Switch

or

PHY

TM

External Use 34

32-bit Body Electronics MCU Roadmap

Single Core

Dual Core

En

try B

CM

Past 2012 2014 2016

Mid

-Hig

h B

CM

In

teg

rate

d

Gate

ways

2013 2015

Triple Core

First Sample

Date (left edge)

Execution

Proposal

Planning

Production

Product

Qualification

(right edge)

1H 1H 1H 1H 2H 2H 2H 2H

90nm Body Products 55nm Body Products

Security

MPC5668G/E z6+z0, 116MHz,

Up to 2M Flash, 592k RAM

Flex, Ether, MLB, CAN, LIN MPC5646/5/4C z4+z0, 120MHz,

Up to 3M Flash, 256k RAM

Flex, Ether, Security,

CAN, LIN

MPC5646/5/4B z4, 120MHz,

Up to 3M Flash, 192k RAM

Flex, Security,

CAN, LIN

MPC5607/6/5/B z0, 64MHz,

Up to 1.5M Flash, 96k RAM

CAN, LIN

MPC5604/3/2/B/C z0, 64MHz,

Up to 512k Flash, 48k RAM

CAN, LIN

MPC5602/1D z0, 48MHz,

Up to 256k Flash, 16k RAM

CAN, LIN

MPC5748/7/6G z4+z4+z2, 160MHz,

3M-6M Flash,

Flex, Ether, Security,

MLB, USB, CAN, LIN

MPC5748/7C z4+z2, 160MHz,

4M-6M Flash,

Flex, Ether, Security,

CAN, LIN

MPC5746/5C z4+z2, 160MHz,

2M to 3M Flash,

Flex, Ether, Security,

CAN, LIN

MPC5746/5B z4, 160MHz,

2M to 3M Flash,

Flex, Security,

CAN, LIN

TM

External Use 35

256k

SRAM

(with ECC)

256k

SRAM

(with ECC)

MPC5748C/G - Development Device and High End Gateway/BCM Solution

Communications I/O System

48ch*

ATD

10bit

eMIOS

96ch

4

I2C,

3 SAI

4

DSPI

6

SPIs

8

CAN

18

LIN

Flex

32ch*

ATD

12bit

CTU

3

Analog

Comp-

arators

CROSSBAR SWITCH

Memory Protection Unit (MPU)

Crossbar Masters

3x Nexus

Class 3+

JTAG

Debug System

Peripheral

Bridge

HSM

256k

SRAM

(with ECC)

Flash controller

SIUL

16xPIT+RTI

3xSWT

3xSTM

SSCM

STCU (MBIST/LBIST)

FCCU

BAF/BAR

16xSemaphore

DMA MUX

6M

Flash

incl EE emulation

(with ECC)

Applications:

•High end Gateway and Body Modules

Key Characteristics:

•2x e200z4 + 1x z2 cores, FPU on z4 cores

•160 MHz max for z4s and 80 MHz on z2

•HSM Security Module option supports both SHE

and EVITA low/medium standard

•Media Local Bus supports MOST communication

•2 x USB 2.0 (1 OTG and 1 Host module) support

interfacing to 3G modem and infotainment domain

•2x Ethernet 10/100 Mbps RMII, MII, +1588, AVB

•Ethernet switch

•CAN module optionally supports CAN FD

•SDHC provides standard SDIO interface

•Low Power Unit provides reduced CAN, LIN, SPI,

ADC functionality in low power mode

•Designed to ISO26262 process for use in ASIL B

•-40 to +125C (ambient)

•3.0V to 5.5V

Packages:

•176 LQFP, 256 BGA, 324 BGA

VReg

RTC/API

8-40MHz Osc

FMPLL

32KHz Osc

16MHz IRC

128KHz IRC

ML

B

SD

HC

Fle

xR

ay

2x U

SB

2.0

Eth

ern

et

e200z2

Core

e200z4

Core

e200z4

Core

*Mixture of internal and external channels

Features available depend on package and device version

1

CRC

5747C 5748C 5747G 5748G

Cores 2 2 3 3

Flash 4M 6M 4M 6M

RAM 512k 768k 768k 768k

MLB N N Y Y

USB N N Y Y

Low

Power

Unit

Interface

32

ch

eD

MA

Eth

ern

et

X

Cut 2 Features Represented Below

TM

© 2014 Freescale Semiconductor, Inc. | External Use

www.Freescale.com