finfet thermal and reliability signoff - simutech group€¦ · design for reliability is a must...
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1 © 2018 ANSYS, Inc. June 1, 2018 ANSYS Confidential
FinFET Thermal and Reliability Signoff
2 © 2018 ANSYS, Inc. June 1, 2018 ANSYS Confidential
Design For Reliability is a MUST have in FinFET era
Advanced FinFET Technology Reliability Challenges
Problem
Chip FailureImpact
Relia
bilit
y Le
vel
Stand-alone Device
INCONVENIENT
Connected Device
ANNOYING
Always-on
DANGEROUS
Cooperative Systems
On-demand
LETHAL
Collaborative Systems
Autonomous
Evolving Reliability Needs for Semiconductors
Consumer/Mobile Cloud Era Auto/IoT
Source: NEW CONCEPT ON SECURITY AND QUALITY- NXP, ISS Europe, Munich, March 6, 2017New application trends push requirements in system reliability Source: Aging Assessment and Reliability Aware Computing Platforms
- Yao Wang, Msc. Thesis, National university of Defense Technology, China
Wear-out Failures increase due to
• FinFET Aging/Stress(NBTI/PBTI/TDDB)
• Increased interconnect EM/Self-Heat
• Thermal reliability
Reliability challenges in FinFET Nodes
3 © 2018 ANSYS, Inc. June 1, 2018 ANSYS Confidential
ANSYS Reliability Platforms
Solution
Totem
AnalogIP
FoundationIP
InterfaceIP
IcePak/SiWave
✓ HBM CDM checks✓ Adv. dynamic ESD checks
ESD
Metal/via bottlenecks
Current crowding on diode fingers
EMC
✓ CECM modeling✓ Chip-aware EMI analysis
Thermal
✓ Self-heat/CTA analysis✓ Post thermal EM/FIT
Electromigration
✓ Power EM/Signal EM✓ Multistate multimode
RedHawk
IP Chip/Package System Level
4 © 2018 ANSYS, Inc. June 1, 2018 ANSYS Confidential
Integrated Thermal & Statistical EM Analysis
Integrated Power/Signal flow
Dev. ModelExtractionSimulation
Device/WireDelta T Interconnect
EM violations Failure in Time (FIT) Violations
ΔT> 20C
EM hotspot
BEOL Fail Rate
LayoutAM
PPC
VCO
Netlist Currents/Power
Device ΔT
IP Results
➢ Integrated Power/Signal analysis
➢ Multivector analysis and sign-off
➢ Adv. Reliability (post-thermal EM , FIT)
➢ Validated by multiple foundries
Totem-CTA AMS/IP level Reliability Analysis
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5 © 2018 ANSYS, Inc. June 1, 2018 ANSYS Confidential
PMIC Analyses Using Totem
Features:
✓ Simpler to setup
✓ High capacity
✓ Multithreaded
Tech/GDS map
GDS Pad locations
GDS translation
R-Extraction
RDS-ON Calculation
Device name +Device RON(per micron)
Detailed RDS-on Report
Tote
m/P
ath
Fin
der
Current/Voltage Maps
collateral
Design specific
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Current Density Map (per-layer)
6 © 2018 ANSYS, Inc. June 1, 2018 ANSYS Confidential
Vectored thermal-aware EM analysis Totem
Features:
✓ A comprehensive slew/load/frequency sweep for all timing arcs
✓ Multithreaded with distributed computing support
✓ Support for thermal aware EM sign-off
✓ Enables EM limited Max-cap tables for SOC level PnR environment
Automated Vector-based Logic Library Reliability Flow
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Includes SPICE simulation
7 © 2018 ANSYS, Inc. June 1, 2018 ANSYS Confidential
Totem GUI-driven flow setup
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Analysis wizard for designers
Wizard for CAD setup
Early to sign-off analysis flows
✓ Early analysis (P2P, layout only)
✓ Static and dynamic IR
✓ Signal EM
✓ ESD analysis w/ PathFinder
Fully customizable wizard
✓ Customer-specific flows
✓ Re-configure workflows
✓ Add addition pre-post processing
Advanced usage model support
✓ CCI flows
✓ Self-heat analysis
8 © 2018 ANSYS, Inc. June 1, 2018 ANSYS Confidential
Totem LVS Flow Using Calibre CCI Database
• Leverages LVS database for complex device recognition/net tracing
• Does not require a detailed RC netlist for signal EM analysis
• Validated by TSMC for N16, N10, N7
Technology collateralsU
sab
ility
En
ha
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men
tsFlow Status
Static Analysis Yes
Dynamic Analysis Yes
Power/Signal EM Yes
CMM Generation(cell, mmx, post-sim) Yes
GUI wizard/Virtuoso Integration Yes
ESD analysis No
Substrate noise analysis No
9 © 2018 ANSYS, Inc. June 1, 2018 ANSYS Confidential
Totem supports AFS simulator for data modeling
✓ Supports FSDB generated by Mentor-AFS for generating current and capacitance models
✓ Supports results from Mentor-AFS simulation w/ SPICE/spectre netlist based setup
✓ Supports device self-heat info generated by Mentor-AFS for Totem-self-heat analysis
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DSPF Netlist/Calibre-CI
Totem
GDS processing
Extraction
EMIR Transient simulation
Self-heat analysis
Tech Collaterals
Mentor-AFS
SPICE/SpectreModels
Sim Netlist/Test bench
Fsdb w/ device currents
Layout
EMIR Results
TotemAPLMMX**
Electrical Model(device current &
Decap model)
** Totem can invoke Mentor-AFS for decap modelingNote: Totem also supports other industry standard SPICE, spectre and fast SPICE simulators
10 © 2018 ANSYS, Inc. June 1, 2018 ANSYS Confidential
ANSYS RedHawk and ANSYS Totem Foundry Readiness
TSMC Samsung Intel GF ST UMC SMIC
N180 ● ●
N130 ● ● ●
N65/N55 ● ● ● ●
N40 ● ● ● ●
N32/28 ● ● ● ● ●
N22/20 ● ● ● ●
N14 ● ● ● V0.5 ● V0.5 ●
N16FF+ V1.0 ●
N16FFC V1.1 ●
N12 V1.0 ●
N10 V1.0 ● V1.0 ● ●
N7 V1.0 ● V0.5 ● V0.5 ●
N5 V0.1 ●
● Available
> RedHawk and Totem are certified and used by all major foundries> Innovative technology collaboration – 3DIC, InFO, ESD and Thermal> Collaboration across other leading foundries