featured products supplement: february 2016
DESCRIPTION
A monthly selection of the latest products from EEWebTRANSCRIPT
ZMDI ZSSC1750 System Basis Chip
A monthly selection of the latest products from EEWeb
FEATURED PRODUCTSFebruary 2016S U P P L E M E N T
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Unipolar 2-Phase Stepper Motor Driver ICThe SLA7070MPRT series, a Sanken product, are unipolar two-phase stepper motor driver integrated circuits (ICs). This device uses a clock input method as a control signal input method, enabling full control of the device operation using only a few signal lines, instead of the conventional phase input method that requires about 10 signal lines. This allows simplification of the circuit design and a reduced workload on the control microprocessor...Read More
800 A Feed-Through FiltersThe LCR056 is a feed-through filter with a rated current of up to 800 A. It provides high insertion loss over a broad band of frequencies from kHz to GHz frequency range. This feed-through filter is used in applications such as shielded facilities, base stations, and more...Read More
New XBee Wireless Connectivity KitDigi-Key Electronics and Digi-International annnounces the availability of the New XBee® Wireless Connectivity Kit from Digi International. The kit has two XBee Grove Development Boards, two XBee RF Modules and micro-USB cables. The Wireless Connectivity Kit helps developers gain an understanding of how to incorporate wireless connectivity into their solution, as well as create prototypes for testing proofs-of-concept...Read More
Digital Load Cell for CheckweighersThe FIT7A is a revolutionary digital load cell that is best suitable for checkweighers, sorting and packaging machines. This device drives the heartbeat of your dynamic weighing systems. It is more than a new sensor for your machine: you can use FIT7A as an “innovation motor”. By combining impressive technical properties at a competitive price - this could allow you to lower the prices of your checkweighing and packaging systems considerably, thereby potentially opening up entirely new market segments. FIT7A makes you fit – in hard global competition...Read More
FEATURED PRODUCTS SUPPLEMENT
5
New Radiation Hardened MultiplexersIntersil Corporation introduces the ISL71840SEH and ISL71841SEH. The devices are radiation hardened multiplexers that offer best-in-class electrostatic discharge (ESD) protection. The ISL71840SEH and ISL71841SEH are the industry’s highest signal chain accuracy and timing performance. The ISL71840SEH 30V 16-channel multiplexer is a drop-in replacement for Intersil’s widely adopted HS9-1840ARH, which has been aboard nearly every satellite and space exploration mission, including NASA’s recent Orion spacecraft flight test ...Read More
World of Sensors Design BoardThe World of Sensors (WoS) is a design board develop for products that may require several types of sensing solutions within the same design. It is a complete and easy to use development platform for Zilog’s series of Mini-Z™ stamp modules and provides customers with simple-to-use platform to develop prototypes and projects incorporating multiple sensors...Read More
20 A Smart 3-Phase Motor Drive HybridThe MSK 4323 is a 20 A, 100 V, MOSFET smart high temperature three-phase motor drive hybrid. The output switches of the device are power MOSFETs with intrinsic fast-recovery diodes for the free-wheeling currents of motor drives. This high temp smart power motor drive module is compatible with 5V CMOS or TTL logic levels. The internal circuitry prevents simultaneous turn-on of the in-line half bridge transistors with a built-in 2μS deadtime to prevent shoot-through...Read More
Cryogenic Temperature Resistant EpoxyThe EP29LPSP is a two-component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. It is serviceable from 275°F to 4K, the system for bonding, sealing, coating, potting and casting is NASA low outgassing approved...Read More
6
Multi-Crystalline Photovoltaic CellThe D6P is a silicon-based multi-crystalline photovoltaic cell featuring a very low temperature coefficient. The cell has an efficiency of up to 19% in a dynamic optimized setting system. The device measures 156 mm x 156 mm with a 180 μm to 200 μm wafer thickness...Read More
SMBus PWM Fan Speed ControllerThe TC665 is an SMBus PWM fan speed controller with fan fault detection intended for use with brushless DC motors. This device permits temperature proportional speed control and therefore accomplishes lower acoustic fan noise and longer fan life. The TC665 reads the voltage provided by an external ther-mistor (or voltage output temperature sensor) and adjust sa 30% to 100% PWM duty cycle output to the fan with respect to the input temperature voltage...Read More
Multiple Function Sensor Development ToolThe SENSOR-PUCK (634-SENSOR-PUCK) is a development tool developed by Silicon Labs featuring sensor demonstration application the runs from internal memory on the Gecko microcontroller. The product also offers Silicon Lab’s advantages on battery-powered applications, with all of its key components operating low power consumptions...Read More
Dual Unbuffered InverterThe 74HC2GU04 is a dual unbuffered inverter specifically designed to save up to 85% board space. The device is specified from -40 °C to +85 °C and -40 °C to +125 °C. This high-speed CMOS device is available in TSOP5 and TSSOP5 packages...Read More
FEATURED PRODUCTS SUPPLEMENT
7
DC-DC Telecom and Networking SolutionsON Semiconductor provides a wide range of DC-DC solutions for telecom and networking applications. Anyone charged with architecting their system power bussing should be aware of these solutions, and for more information refer to the TND347-D application note from ON Semiconductor...Read More
ATDR Class CC FuseThe STR4A100 series are off-line PWM controllers with integrated sensing MOSFET intended for switching power supplies. The device features rent-mode type PWM control, random switching function, slope compensation function and leading edge blanking function...Read More
Single-Stage LED Driver ICPower Integrations rolled out its LYTSwitch™-5 single-stage LED driver IC family. LYTSwitch-5 devices combine PFC and constant-current output, and support multiple common LED driver topologies.
Solid-state lighting applications have highly variable driver requirements, and power engineers are often challenged to develop optimized designs quickly in response to requests from lighting designers ...Read More
R-78W RECOM RegulatorThis video provides a Digi-Key demonstration of how to use RECOM’s R-78w wire leaded regulator in LED lighting applications and also explains its features, benefits, and intended applications.
RECOM’s R-78w wire leaded DC regulator offers designers a way to quickly and easily source multiple voltages. R-78w is available in 32v input and 5, 9, and 12v output. It’s ability to power both a lighting and cooling source using only power source makes it a useful component for LED lighting applications...Video Link
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Qi-Certified Medium Power Receiver ReferenceROHM designs the world’s first Qi-certified medium power receiver reference design. The cutting-edge reference design allows ROHM to expand into the wireless charging segment. This BD57015GWL receiver, the first in the world certified to be compliant with the new Qi v1.2 standard for medium power, was showcased last week in the WPC booth during CES 2016...Read More
Digital TV Demodulator for ATSCMN88436 is demodulator LSI for terrestrial and cable broadcasts. It supports the broadcast specifications of North America, performing demodulation and error correction and outputting a transport stream (TS). Digital terrestrial broadcasts is compliant with ATSC (Advanced Televisions Systems Committee) specifications, and digital cable broadcasts is compliant with open cable specifications....Read More
SuperSpeed USB 3.0 Hub ControllersDemand for power-efficient, high-speed data transfer is driven by a host of personal electronics and enterprise applications, from notebooks, desktops, and servers to HDTVs, set top boxes, and gaming consoles as well as automotive infotainment. For these applications, USB 3.0 can be a good solution. Capable of transferring 5 Gbps over a 3-foot cable, it provides 10x data transfer compared to USB 2.0, and uses one-third the power that USB 2.0 would use to transfer the same amount of information ...Read More
Secure Low Power Wireless IPv6 ModuleThe ZWIR4512 enables secure low-power wireless IPv6 communication for sensors and small devices. ZMDI provides a user-programmable, royalty-free 6LoWPAN stack with mesh routing capability with the ZWIR4512. 6LoWPAN is an Internet Engineering Task Force (IETF) standard to build wireless, low-power IP-based sensor and device networks. These networks can easily be integrated into existing information technology infrastructure or can operate autonomously...Read More
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ZMDIZSSC1750System Basis Chip
“Using a shunt, this device is capable of measuring
charging and discharging battery current with a huge
dynamic range from milliamps to thousands of amps.”
In today’s EEWeb Tech Lab, we will be reviewing ZSSC1750 Data Acquisition System Basis Chip (SBC) from ZMDI (now IDT). A system basis chip is a system on a chip that integrates multiple ECU functions into a single die and the ZSSC1750 does this by integrating a high voltage circuit, sigma delta ADCs, analog input stage, digital filtering, and a LIN transceiver into one IC. It is designed for use with any microcontroller with an SPI interface.
FEATURED PRODUCTS SUPPLEMENT
11
ZMDIZSSC1750System Basis Chip
“Using a shunt, this device is capable of measuring
charging and discharging battery current with a huge
dynamic range from milliamps to thousands of amps.”
In today’s EEWeb Tech Lab, we will be reviewing ZSSC1750 Data Acquisition System Basis Chip (SBC) from ZMDI (now IDT). A system basis chip is a system on a chip that integrates multiple ECU functions into a single die and the ZSSC1750 does this by integrating a high voltage circuit, sigma delta ADCs, analog input stage, digital filtering, and a LIN transceiver into one IC. It is designed for use with any microcontroller with an SPI interface.
CLICKzmdi.com
12
With the ADCs, the ZSSC1750 can measure
lead-acid battery voltage and current at a
rate of 1 kHz or more, as well as resolution
of up to 18 bits with no missing codes while
concurrently measuring temperature.
Simultaneous measurement of voltage
and current allows for inner resistance
calculations often used for battery state
of health estimation. Using a shunt, this
device is capable of measuring charging
and discharging battery current with a huge
dynamic range from milliamps to thousands of
amps. Accumulator registers allow accurately
calculating state of charge even in operating
modes when the microcontroller is asleep.
Click the image below to watch a video
demonstration of the ZSSC1750 evaluation kit:
KEY BENEFITS
» On-chip voltage reference
» Robust power-on-reset for harsh automotive environments
» On-chip low-power oscillator
» AEC-Q100 qualified solution
» Industry’s smallest footprint
The ZSSC1750 is an extremely small form factor, ultra-low power consumption IC that will help in any situation, automotive, medical, or industrial, that requires real time monitoring and control of battery systems. To learn more about the ZSSC1750 go to ZMDI.com.
“Using the ZSSC1750, you can do a large amount of the testing in your lab—
you can get a very good review of exactly how this IC is going to work inside of your system.”
– Josh Bishop, EEWeb Tech Lab
FEATURED PRODUCTS SUPPLEMENT
13
With the ADCs, the ZSSC1750 can measure
lead-acid battery voltage and current at a
rate of 1 kHz or more, as well as resolution
of up to 18 bits with no missing codes while
concurrently measuring temperature.
Simultaneous measurement of voltage
and current allows for inner resistance
calculations often used for battery state
of health estimation. Using a shunt, this
device is capable of measuring charging
and discharging battery current with a huge
dynamic range from milliamps to thousands of
amps. Accumulator registers allow accurately
calculating state of charge even in operating
modes when the microcontroller is asleep.
Click the image below to watch a video
demonstration of the ZSSC1750 evaluation kit:
KEY BENEFITS
» On-chip voltage reference
» Robust power-on-reset for harsh automotive environments
» On-chip low-power oscillator
» AEC-Q100 qualified solution
» Industry’s smallest footprint
The ZSSC1750 is an extremely small form factor, ultra-low power consumption IC that will help in any situation, automotive, medical, or industrial, that requires real time monitoring and control of battery systems. To learn more about the ZSSC1750 go to ZMDI.com.
“Using the ZSSC1750, you can do a large amount of the testing in your lab—
you can get a very good review of exactly how this IC is going to work inside of your system.”
– Josh Bishop, EEWeb Tech Lab
14
BD9G341AEFJ DC-DC Converter
This EEWeb Tech Lab looks at ROHM’s BD9G341AEFJ, a single-channel buck converter with an integrated FET, a wide input voltage range, and output voltage that is variable from 1V to Vcc at 3A.
The BD9G341AEFJ implements current mode architecture, providing fast transient response and simple phase compensation setup. Design is further simplified by integrating an 80V, 3.5A, 150 mΩ N-channel MOSFET. The input range of 12V to 76V allows the device to be used in distributed power applications and eliminates intermediate conversions and the associated loss in total conversion efficiency. In addition, a standby current of 0 µA makes it well-suited for battery powered applications, while a switching frequency of up to 750 kHz supports smaller inductors and provides high efficiency variable output voltage (from 1V to Vcc) at 3A.
The device comes with an evaluation kit to see how simple the implementation actually is. The board contains the converter, the output diode, and the output inductor. There is also a 47kΩ resistor that sets the clock to 200
From
ROHM’s BD9G341AEFJ DC-DC Converter
reduces design effort due to its integrated
FET and current-mode architecture.
kHz. If you decrease this resistor, you increase the clock frequency, which allows you to reduce this inductor, which ultimately allows you to reduce the size of your implementation.
ROHM’s BD9G341AEFJ DC-DC Converter reduces design effort due to its integrated FET and current-mode architecture. To watch a video demonstration of the BD9G341AEFJ, click the image below.
For more information, visit ROHM.com.
CLICK
rohm.com
FEATURED PRODUCTS SUPPLEMENT
15
BD9G341AEFJ DC-DC Converter
This EEWeb Tech Lab looks at ROHM’s BD9G341AEFJ, a single-channel buck converter with an integrated FET, a wide input voltage range, and output voltage that is variable from 1V to Vcc at 3A.
The BD9G341AEFJ implements current mode architecture, providing fast transient response and simple phase compensation setup. Design is further simplified by integrating an 80V, 3.5A, 150 mΩ N-channel MOSFET. The input range of 12V to 76V allows the device to be used in distributed power applications and eliminates intermediate conversions and the associated loss in total conversion efficiency. In addition, a standby current of 0 µA makes it well-suited for battery powered applications, while a switching frequency of up to 750 kHz supports smaller inductors and provides high efficiency variable output voltage (from 1V to Vcc) at 3A.
The device comes with an evaluation kit to see how simple the implementation actually is. The board contains the converter, the output diode, and the output inductor. There is also a 47kΩ resistor that sets the clock to 200
From
ROHM’s BD9G341AEFJ DC-DC Converter
reduces design effort due to its integrated
FET and current-mode architecture.
kHz. If you decrease this resistor, you increase the clock frequency, which allows you to reduce this inductor, which ultimately allows you to reduce the size of your implementation.
ROHM’s BD9G341AEFJ DC-DC Converter reduces design effort due to its integrated FET and current-mode architecture. To watch a video demonstration of the BD9G341AEFJ, click the image below.
For more information, visit ROHM.com.
16
For this Arrow New Product Insights, we will discuss three DC-to-DC step-down converters from OnSemi, muRata, and Linear Technology. We will also take a look at three JFET based products—two from Infineon and one from GeneSic.
OnSemi’s NCP1529 is an adjustable voltage step-down DC-to-DC converter, using a constant frequency, current mode step-down architecture. Using external resistors to set the output voltage, this IC can output a voltage range between point nine and three point nine volts and can source at least one amp. For greater efficiency, the NCP1529 employs two modes of operation, pulse width modulation for high efficiency with greater current and pulse frequency modulation for higher efficiency with lighter current loads. It also includes features such as soft-start, undervoltage protection, thermal shutdown protection, and current overload protection.
muRata’s LXDC3EP33A-107 is a step-down DC to DC converter with a small 3.5 by 3.2 millimeter footprint due to its inductor embedded ferrite substrate. Using synchronous rectifier technology and an automatic pulse width or pulse frequency modulation selection, this IC achieves up to ninety four percent efficiency. Accepting anywhere from two point five to five point five volts with an output between one and three point three volts, this also has been specially designed for reduced EMI.
Linear Technology’s LTC3251 DC-to-DC step-down converter uses a dual phase switched capacitor charge pump in order to drop the input voltage. The voltage is regulated by detecting the output voltage through an external resistor network and adjusting the output current based off of those readings. Linear Technology has also implemented its Spread Spectrum Operation technology, smoothing peaks in the frequency domain and decreasing overall EMI.
Infineon’s 1EDI30J12C family is a single-driver IC for a normally-on JFET. Using a JFET in conjunction with a low voltage P-channel MOSFET, switching losses are minimized while allowing a high voltage capability of up to 17.5V. This IC provides the Direct Drive JFET Topology, an optimized cascode operation that keeps the JFET in a safe off-state during the startup of the application. When the supply voltage reaches an acceptable level, the MOSFET is permanently turned on and the JFET is driven directly by the input signal.
I N S I G H T SPR DUCT
Linear Technology has implemented its Spread Spectrum Operation technology, smoothing peaks in the frequency domain and decreasing overall EMI.
This IC provides the Direct Drive JFET Topology, an
optimized cascode operation that keeps the JFET in a
safe off-state during the startup of the application.
∨
∨
FEATURED PRODUCTS SUPPLEMENT
17
For this Arrow New Product Insights, we will discuss three DC-to-DC step-down converters from OnSemi, muRata, and Linear Technology. We will also take a look at three JFET based products—two from Infineon and one from GeneSic.
OnSemi’s NCP1529 is an adjustable voltage step-down DC-to-DC converter, using a constant frequency, current mode step-down architecture. Using external resistors to set the output voltage, this IC can output a voltage range between point nine and three point nine volts and can source at least one amp. For greater efficiency, the NCP1529 employs two modes of operation, pulse width modulation for high efficiency with greater current and pulse frequency modulation for higher efficiency with lighter current loads. It also includes features such as soft-start, undervoltage protection, thermal shutdown protection, and current overload protection.
muRata’s LXDC3EP33A-107 is a step-down DC to DC converter with a small 3.5 by 3.2 millimeter footprint due to its inductor embedded ferrite substrate. Using synchronous rectifier technology and an automatic pulse width or pulse frequency modulation selection, this IC achieves up to ninety four percent efficiency. Accepting anywhere from two point five to five point five volts with an output between one and three point three volts, this also has been specially designed for reduced EMI.
Linear Technology’s LTC3251 DC-to-DC step-down converter uses a dual phase switched capacitor charge pump in order to drop the input voltage. The voltage is regulated by detecting the output voltage through an external resistor network and adjusting the output current based off of those readings. Linear Technology has also implemented its Spread Spectrum Operation technology, smoothing peaks in the frequency domain and decreasing overall EMI.
Infineon’s 1EDI30J12C family is a single-driver IC for a normally-on JFET. Using a JFET in conjunction with a low voltage P-channel MOSFET, switching losses are minimized while allowing a high voltage capability of up to 17.5V. This IC provides the Direct Drive JFET Topology, an optimized cascode operation that keeps the JFET in a safe off-state during the startup of the application. When the supply voltage reaches an acceptable level, the MOSFET is permanently turned on and the JFET is driven directly by the input signal.
I N S I G H T SPR DUCT
Linear Technology has implemented its Spread Spectrum Operation technology, smoothing peaks in the frequency domain and decreasing overall EMI.
This IC provides the Direct Drive JFET Topology, an
optimized cascode operation that keeps the JFET in a
safe off-state during the startup of the application.
∨
∨
Arrow.com
18
Infineon’s IJW120R070T1 JFET combines the material properties of silicon carbide with the normally-on JFET concept, allowing for higher performance and ruggedness. To reduce switching losses compared to other conventional cascodes, the JFET is directly switched on and off by applying a negative gate voltage and 0V respectively, with the MOSFET always in an ON state except during start-up and power loss. Both the 1EDI30J12C and IJW120R070T1 are on an Infineon evaluation board, the Eval 1200V CoolSIC for easy prototyping.
GeneSiC’s GA05JT12 is a normally off Silicon Carbide JFET that is compatible with existing silicon gate-drivers. With a max operating temperature of 175 degrees Celsius, high efficiency, and the ability to withstand short circuits, this JFET is ready for usage in applications ranging from uninterruptible power supplies to down hole oil drilling.
For more info on the latest products, join us for the next Arrow New Product Insights, or look to Arrow.com.
Infineon’s IJW120R070T1 JFET combines the material properties of silicon carbide with the normally-on JFET concept, allowing for higher performance and ruggedness.
∨
Schematics.com
FEATURED PRODUCTS SUPPLEMENT
19
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ARISO
Inside the Lab is a webseries sponsored by Arrow Electronics dedicated to exploring the latest in technology and electronics. In this episode we’ll introduce you to TE Conncetivity’s ARISO Contactless Connectivity Platform, a system delivering contactless power and data that simplifies complex connections and enables completely new applications.
The ARISO Platform is capable of transmitting up to 12 watts and eight channels of data over a 7mm air gap. TE provides a demonstration kit that includes a transmitter, which transmits power to the receive side, which will turn on the light. As the user closes the gap in the 7mm window, the light will turn off. ARISO can tolerate up to 30 degrees of tilt and up to 5mm of misalignment before the connection breaks.
The contactless nature of ARISO brings certain benefits to the table. Because it is contactless, it has unlimited mating cycles, whereas a traditional connector will eventually wear out and need to be replaced, causing downtime and maintenance costs. The platform also allows for on-the-fly connections. In a manufacturing environment, for example, if a device is passed down a manufacturing line, the user can power them and exchange data with them, whether that is a program or calibration data.
Another one of the benefits of ARISO is rotation. The transmitter can be rotated and it will remain working, even at high RPMs. If you have a
Sponsored by Arrow Electronics
CNC or a lathe, ARISO will continue to provide power and data to them as they rotate. This is a great replacement for slip rings, which also have problems in harsh environments, and is something that ARISO is designed to work in.
TE’s ARISO Contactless Connectivity platform is a truly innovative system for transferring data and power. ARISO provides tremendous benefits in the form of unlimited mating cycles, reliable operation in harsh environments, and the ability to replace complex connection systems. For more information, visit Arrow.com.
Click the image below to watch a video demonstration of the ARISO Platform.
Contactless Connectivity Platform
ARISO PROVIDES TREMENDOUS BENEFITS IN THE FORM OF UNLIMITED MATING CYCLES, RELIABLE OPERATION IN HARSH ENVIRONMENTS, AND THE ABILITY TO REPLACE COMPLEX CONNECTION SYSTEMS.
20
ARISO
Inside the Lab is a webseries sponsored by Arrow Electronics dedicated to exploring the latest in technology and electronics. In this episode we’ll introduce you to TE Conncetivity’s ARISO Contactless Connectivity Platform, a system delivering contactless power and data that simplifies complex connections and enables completely new applications.
The ARISO Platform is capable of transmitting up to 12 watts and eight channels of data over a 7mm air gap. TE provides a demonstration kit that includes a transmitter, which transmits power to the receive side, which will turn on the light. As the user closes the gap in the 7mm window, the light will turn off. ARISO can tolerate up to 30 degrees of tilt and up to 5mm of misalignment before the connection breaks.
The contactless nature of ARISO brings certain benefits to the table. Because it is contactless, it has unlimited mating cycles, whereas a traditional connector will eventually wear out and need to be replaced, causing downtime and maintenance costs. The platform also allows for on-the-fly connections. In a manufacturing environment, for example, if a device is passed down a manufacturing line, the user can power them and exchange data with them, whether that is a program or calibration data.
Another one of the benefits of ARISO is rotation. The transmitter can be rotated and it will remain working, even at high RPMs. If you have a
Sponsored by Arrow Electronics
CNC or a lathe, ARISO will continue to provide power and data to them as they rotate. This is a great replacement for slip rings, which also have problems in harsh environments, and is something that ARISO is designed to work in.
TE’s ARISO Contactless Connectivity platform is a truly innovative system for transferring data and power. ARISO provides tremendous benefits in the form of unlimited mating cycles, reliable operation in harsh environments, and the ability to replace complex connection systems. For more information, visit Arrow.com.
Click the image below to watch a video demonstration of the ARISO Platform.
Contactless Connectivity Platform
ARISO PROVIDES TREMENDOUS BENEFITS IN THE FORM OF UNLIMITED MATING CYCLES, RELIABLE OPERATION IN HARSH ENVIRONMENTS, AND THE ABILITY TO REPLACE COMPLEX CONNECTION SYSTEMS.
CLICK
ARROW.COM
ARISO
Inside the Lab is a webseries sponsored by Arrow Electronics dedicated to exploring the latest in technology and electronics. In this episode we’ll introduce you to TE Conncetivity’s ARISO Contactless Connectivity Platform, a system delivering contactless power and data that simplifies complex connections and enables completely new applications.
The ARISO Platform is capable of transmitting up to 12 watts and eight channels of data over a 7mm air gap. TE provides a demonstration kit that includes a transmitter, which transmits power to the receive side, which will turn on the light. As the user closes the gap in the 7mm window, the light will turn off. ARISO can tolerate up to 30 degrees of tilt and up to 5mm of misalignment before the connection breaks.
The contactless nature of ARISO brings certain benefits to the table. Because it is contactless, it has unlimited mating cycles, whereas a traditional connector will eventually wear out and need to be replaced, causing downtime and maintenance costs. The platform also allows for on-the-fly connections. In a manufacturing environment, for example, if a device is passed down a manufacturing line, the user can power them and exchange data with them, whether that is a program or calibration data.
Another one of the benefits of ARISO is rotation. The transmitter can be rotated and it will remain working, even at high RPMs. If you have a
Sponsored by Arrow Electronics
CNC or a lathe, ARISO will continue to provide power and data to them as they rotate. This is a great replacement for slip rings, which also have problems in harsh environments, and is something that ARISO is designed to work in.
TE’s ARISO Contactless Connectivity platform is a truly innovative system for transferring data and power. ARISO provides tremendous benefits in the form of unlimited mating cycles, reliable operation in harsh environments, and the ability to replace complex connection systems. For more information, visit Arrow.com.
Click the image below to watch a video demonstration of the ARISO Platform.
Contactless Connectivity Platform
ARISO PROVIDES TREMENDOUS BENEFITS IN THE FORM OF UNLIMITED MATING CYCLES, RELIABLE OPERATION IN HARSH ENVIRONMENTS, AND THE ABILITY TO REPLACE COMPLEX CONNECTION SYSTEMS.
FEATURED PRODUCTS SUPPLEMENT
21
ARISO
Inside the Lab is a webseries sponsored by Arrow Electronics dedicated to exploring the latest in technology and electronics. In this episode we’ll introduce you to TE Conncetivity’s ARISO Contactless Connectivity Platform, a system delivering contactless power and data that simplifies complex connections and enables completely new applications.
The ARISO Platform is capable of transmitting up to 12 watts and eight channels of data over a 7mm air gap. TE provides a demonstration kit that includes a transmitter, which transmits power to the receive side, which will turn on the light. As the user closes the gap in the 7mm window, the light will turn off. ARISO can tolerate up to 30 degrees of tilt and up to 5mm of misalignment before the connection breaks.
The contactless nature of ARISO brings certain benefits to the table. Because it is contactless, it has unlimited mating cycles, whereas a traditional connector will eventually wear out and need to be replaced, causing downtime and maintenance costs. The platform also allows for on-the-fly connections. In a manufacturing environment, for example, if a device is passed down a manufacturing line, the user can power them and exchange data with them, whether that is a program or calibration data.
Another one of the benefits of ARISO is rotation. The transmitter can be rotated and it will remain working, even at high RPMs. If you have a
Sponsored by Arrow Electronics
CNC or a lathe, ARISO will continue to provide power and data to them as they rotate. This is a great replacement for slip rings, which also have problems in harsh environments, and is something that ARISO is designed to work in.
TE’s ARISO Contactless Connectivity platform is a truly innovative system for transferring data and power. ARISO provides tremendous benefits in the form of unlimited mating cycles, reliable operation in harsh environments, and the ability to replace complex connection systems. For more information, visit Arrow.com.
Click the image below to watch a video demonstration of the ARISO Platform.
Contactless Connectivity Platform
ARISO PROVIDES TREMENDOUS BENEFITS IN THE FORM OF UNLIMITED MATING CYCLES, RELIABLE OPERATION IN HARSH ENVIRONMENTS, AND THE ABILITY TO REPLACE COMPLEX CONNECTION SYSTEMS.
LINK HEREzQSFP+ Interconnects
As data usage continues to rise, designers need interconnect solutions that can provide increased data rates while maintaining a consistent level of reliable performance. TE Connectivity’s comprehensive zQSFP+ interconnect portfolio helps to meet this need by offering 2.5 times more throughput than existing interconnect solutions while offering backwards compatibility with QSFP products. These features provide a flexible upgrade path to increase data rates from 10 Gbps to 25 Gbps, providing four channels with data rates of 25 GB/s, the zQSFP+ interconnect supports 100 Gbps Ethernet and 100 Gbps InfiniBand enhanced data rate requirements for high-speed designs.from TE Connectivity
LINK HERELINK HERE
22
zQSFP+ Interconnects
As data usage continues to rise, designers need interconnect solutions that can provide increased data rates while maintaining a consistent level of reliable performance. TE Connectivity’s comprehensive zQSFP+ interconnect portfolio helps to meet this need by offering 2.5 times more throughput than existing interconnect solutions while offering backwards compatibility with QSFP products. These features provide a flexible upgrade path to increase data rates from 10 Gbps to 25 Gbps, providing four channels with data rates of 25 GB/s, the zQSFP+ interconnect supports 100 Gbps Ethernet and 100 Gbps InfiniBand enhanced data rate requirements for high-speed designs.from TE Connectivity
zQSFP+ Interconnects
As data usage continues to rise, designers need interconnect solutions that can provide increased data rates while maintaining a consistent level of reliable performance. TE Connectivity’s comprehensive zQSFP+ interconnect portfolio helps to meet this need by offering 2.5 times more throughput than existing interconnect solutions while offering backwards compatibility with QSFP products. These features provide a flexible upgrade path to increase data rates from 10 Gbps to 25 Gbps, providing four channels with data rates of 25 GB/s, the zQSFP+ interconnect supports 100 Gbps Ethernet and 100 Gbps InfiniBand enhanced data rate requirements for high-speed designs.from TE Connectivity
FEATURED PRODUCTS SUPPLEMENT
23
zQSFP+ Interconnects
As data usage continues to rise, designers need interconnect solutions that can provide increased data rates while maintaining a consistent level of reliable performance. TE Connectivity’s comprehensive zQSFP+ interconnect portfolio helps to meet this need by offering 2.5 times more throughput than existing interconnect solutions while offering backwards compatibility with QSFP products. These features provide a flexible upgrade path to increase data rates from 10 Gbps to 25 Gbps, providing four channels with data rates of 25 GB/s, the zQSFP+ interconnect supports 100 Gbps Ethernet and 100 Gbps InfiniBand enhanced data rate requirements for high-speed designs.from TE Connectivity
24
TE’s zQSFP+ interconnects help optical, module, and cable assemblies reach new levels, increasing data transfer rates by 2.5-times more than existing solutions. Since increased data rates can make EMI protection more challenging, the ZQSFP+ interconnect product portfolio is designed to enable improved EMI protection through 25 Gbps. Design flexibility for thermal management is crucial for customers. As such, TE’s single-row cages have
been designed to be belly-to-belly compatible so that in higher-load thermal applications, customers can separate ports for improved thermal transfer.
With a comprehensive portfolio, including behind and thru bezel cages with various light pipe and heatsink options, designers achieve ultimate flexibility in function and performance. In response to the significant market demand for technology and data center
applications, TE offers a comprehensive zQSFP+ interconnect product portfolio, providing customers with one of the widest product selections in the market.
Enable faster speeds in today’s designs with TE’s comprehensive zQSFP+ interconnect portfolio, providing a scalable interface to easily move from 10 gigabits-per-second to 25 gigabits-per-second data rates. To learn more, contact your TE representative or distributor today.
FEATURED PRODUCTS SUPPLEMENT
25
TE’s zQSFP+ interconnects help optical, module, and cable assemblies reach new levels, increasing data transfer rates by 2.5-times more than existing solutions. Since increased data rates can make EMI protection more challenging, the ZQSFP+ interconnect product portfolio is designed to enable improved EMI protection through 25 Gbps. Design flexibility for thermal management is crucial for customers. As such, TE’s single-row cages have
been designed to be belly-to-belly compatible so that in higher-load thermal applications, customers can separate ports for improved thermal transfer.
With a comprehensive portfolio, including behind and thru bezel cages with various light pipe and heatsink options, designers achieve ultimate flexibility in function and performance. In response to the significant market demand for technology and data center
applications, TE offers a comprehensive zQSFP+ interconnect product portfolio, providing customers with one of the widest product selections in the market.
Enable faster speeds in today’s designs with TE’s comprehensive zQSFP+ interconnect portfolio, providing a scalable interface to easily move from 10 gigabits-per-second to 25 gigabits-per-second data rates. To learn more, contact your TE representative or distributor today.
26
Innovative ASSEMBLY Services from Ohmite
Ohmite’s decades of experience in building electro-mechanical assemblies has led to a broad set of capabilities and extensive expertise. Ohmite’s own power resistor and rheostat applications involve assembling multiple components in series or parallel, combined with fans and heat sinks to achieve power ratings exceeding 5000 watts. The company’s recent acquisition of ARCOL adds to the product base available in these assemblies, particularly ARCOL’s robust aluminum housed resistors. ARCOL is located in the UK and improves Ohmite’s worldwide reach.
Ohmite’s 75,000 square- foot facility includes product assembly and manufacture
FEATURED PRODUCTS SUPPLEMENT
27
Innovative ASSEMBLY Services from Ohmite
Ohmite’s decades of experience in building electro-mechanical assemblies has led to a broad set of capabilities and extensive expertise. Ohmite’s own power resistor and rheostat applications involve assembling multiple components in series or parallel, combined with fans and heat sinks to achieve power ratings exceeding 5000 watts. The company’s recent acquisition of ARCOL adds to the product base available in these assemblies, particularly ARCOL’s robust aluminum housed resistors. ARCOL is located in the UK and improves Ohmite’s worldwide reach.
Ohmite’s 75,000 square- foot facility includes product assembly and manufacture
ohmite.com
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Ohmite’s 75,000-square-foot facility includes metal fabrication, epoxy-molding, connector fabrication, wire winding, and welding capabilities to manufacture and assemble nearly any product.
Ohmite also provides custom thick-film solutions, including double-sided, multilayer, and via capabilities in a QS9000-approved facility. Substrates include ceramic, FR4, insulated metal alloys, aluminum nitride, and plastic, with sizes up to 6-inches x 5-inches. A variety of conductors and dielectric materials are available with line width and spacing from 4- to 8-mils and sheet resistance from 0.10 to 1000 MΩ/square and tolerance as low as 0.25%. Ohmite offers automated laser trimming for tight tolerance thick film parts. For high-energy thick film applications, Ohmite provides scan cut laser trimming to provide better pulse handling capabilities.
Ohmite’s PCB assembly service supports high-mix, low- to mid-volume assembly of PCBs with SMD, through-hole, or mixed components in an ISO 9001-2008 approved facility. Ohmite can offer inventory management services for all subcomponents. Beyond assembly, Ohmite provides design engineering support to help the customer transition from prototype to production volumes as well as cost reduction through component sourcing and designing for manufacturability.
For more information on Ohmite’s extensive assembly service portfolio, visit Ohmite.com.
Substrates include ceramic, FR4, insulated metal alloys, aluminum nitride, and plastic,
with sizes up to 6-inches x 5-inches.
Your Guide to Embedded MCUs and Development Tools.
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Everything you’re looking for in one place.
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Your Guide to Embedded MCUs and Development Tools.
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