extending probe card life for fine pitch probe cards › swtw_library › 2002proc › pdf ›...
TRANSCRIPT
![Page 1: Extending Probe Card Life for Fine Pitch Probe Cards › swtw_library › 2002proc › PDF › S02_03.pdf · Fine Pitch Probe Cards Gene Humphrey International Test Solutions, Inc](https://reader034.vdocuments.mx/reader034/viewer/2022050715/5f2177c37176ed15dd311510/html5/thumbnails/1.jpg)
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Extending Probe Card Life for Fine Pitch Probe Cards
Gene HumphreyInternational Test Solutions, Inc.
June 10, 2002
Southwest Test Workshop
9-12 June 2002
Long Beach, CA USA
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Material Considerations
• Relative Accumulation– Comparison of 5 Common Probe
Materials– Effects of Probe Tip Roughness
• Effect of Cleaning Materials– Comparison of 4 Common Probe
Materials– Comparison of 5 Common Cleaning
Materials
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Accumulation Study
• 5 Probe Cards– One each of ReW, W, BeCu, P, NTK– Each Card with 10 Probes of the Same Material– Same Build Configuration– Study Conducted in Production Environment
• No Electrical Testing• One Touch per die• 3 mil Overdrive
– Same Test Condition for All Cards– No Cleaning
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Probe 1 Comparison
ReW – Baseline ReW – 10TD ReW- 50TD ReW – 100TD
W – Baseline W – 10TD W- 50TD W – 100TD
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Comparison Probe 1
BeCu – Baseline BeCu – 10TD BeCu- 50TD BeCu – 100TD
NTK – Baseline NTK – 10TD NTK- 50TD NTK – 100TD
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Probe 1 Comparison
P – Baseline P – 10TD P- 50TD P – 100TD
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Probe 2 Comparison
ReW – 100TDReW– Baseline ReW – 10TD ReW- 50TD
W – 100TDW– Baseline W – 10TD W- 50TD
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Probe 2 Comparison
BeCu – 100TDBeCu– Baseline BeCu – 10TD BeCu- 50TD
NTK – 100TDNTK– Baseline NTK – 10TD NTK- 50TD
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Probe 2 Comparison
P – 100TDP– Baseline P – 10TD P- 50TD
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Probe 3 Comparison
ReW– Baseline ReW – 10TD ReW- 50TD ReW – 100TD
W– Baseline W – 10TD W- 50TD W – 100TD
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Probe 3 Comparison
BeCu– Baseline BeCu – 10TD BeCu- 50TD BeCu – 100TD
NTK – Baseline NTK – 10TD NTK- 50TD NTK – 100TD
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Probe 3 Comparison
P– Baseline P – 10TD P- 50TD P – 100TD
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Accumulation Conclusions
• Relative Accumulation– ReW and W Accumulate at nearly the
same rate– BeCu and NTK Accumulate at nearly
the same rate– P Accumulation Rate Least of All
Materials Studied– Substantial Difference in the
Accumulation on ReW and P
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Effect of Roughness
• Does the Probe Roughness Effect Accumulation Rates?– One ReW Probe Card
• 100 Touchdowns After Sanding Flat with 3µm Lapping Film
• 100 Touchdowns After Sanding Flat with 0.5µm Lapping Film
• No Electrical Testing
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ReW Probes, same probes, same OD
Probes sanded with 0.5µm AlO2 lapping film, 100TD
Probes sanded with 3µm AlO2 lapping film, 100TD
0.5 µm vs 3 µm
Probe 1
Probe 1
Probe 2
Probe 2
Probe 3
Probe 3
Probe 4
Probe 4
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Roughness Conclusion
• Appears That Roughness Does Effect the Rate of Accumulation of Material on the Probe Tips
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Durability Comparison
• “An Extremely Abrasive Analysis” Troy Harnish and Bill Wenholz, SWTW 2001
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The Evaluation Basics
• Identical and simple probe cards– One probe card designated for each cleaning material– Cantilever design (epoxy ring)– Probe metallurgy and target size (flat)
• Tungsten (25um)• Rhenium Tungsten (25um)• Beryllium Copper (25um)• Palladium (25um)
• Cleaning products in wafer format• Common probe card metrology analysis• Z only cleaning motion with indexing & OD extremes
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3µm-LF SEM Comparison
ReW
P
BeCu
W
Baseline 100k Touchdowns
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0.5µm Cushion Lapping Film
100k TouchdownsBaseline
W
BeCu
P
ReW
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Sanding Debris
Tungsten - 75µ l Rhenium Tungsten - 80µ l
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Tungsten CarbideSEM Comparison
Baseline 500k Touchdowns
W
BeCu
P
ReW
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Tungsten Carbide Photos
Tungsten Beryllium Copper
Mushroom effect
Mushroom Effect
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Custom Ceramic SEM Comparison
Baseline 500k Touchdowns
W
BeCu
P
ReW
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Custom Ceramic Photos
Mushroom Effect
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Probe Polish 99 SEM Comparison
Baseline 1 Million Touchdowns
W
BeCu
P
ReW
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Durability Conclusions
• ReW and W Most Durable• P and BeCu Much Less Durable• Tungsten Carbide and Ceramic Less
Destructive Than Any Lapping Film• Probe Polish Least Destructive
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Reshaping Tests
• On Going Research• Goals
– Reshaping Materials for Each Common Probe Materials
– Control the Shape– Cost Effective Option to Extend Probe
Card Life
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BEFORE/AFTER
W Probe, 6000 Touchdowns
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“X” DIAMETER CHANGE
TUNGSTEN PROBE RESHAPE
0
10
20
30
40
50
1 2 3 4 5 6 7 8 9 10 11 12
PROBE #
MIC
RO
NS
BEFORE
AFTER
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“Y” DIAMETER CHANGE
TUNGSTEN PROBE RESHAPE
0
10
20
30
40
50
60
1 2 3 4 5 6 7 8 9 10 11 12
PROBE #
MIC
RO
NS
BEFORE
AFTER
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Reshaping Recipe
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Reshaping Plate
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Tip Cleaning Window
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Conclusion
• The Cleaning Recipe Must be an Integral Part of the Overall Test Program
• Different Probe Materials Accumulate Debris at Different Rates
• Surface Roughness Effects Debris Accumulation
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Conclusion
• Material Used in Cleaning Dramatically Effects Probe Card Life
• Reshaping Probes can Extend Probe Card Life