european nanoelectronics...since 2009 the two well estab-lished events adtc (european...

Dresden (Germany), May 14 – 16, 2019www.edacentrum.de/edaworkshop

edaWorkshop 19

jointly organized

European Nanoelectronics Applications, Design & Technology Conference

On Tuesday evening enjoy a com-municative dinner in the Gallery Restaurant of Dorint Hotel while catching up on several EDA pro-jects within the poster exhibition.

Gallery Restaurant, Dorint Hotel (conference hotel), 1st floor

On Wednesday evening follow our invitation to a very special culinary evening on the edge of the river Elbe. A delightful dinner is waiting for you in the beautiful restaurant of the Lingner castle, the legacy of Karl August Lingner. Enjoy a spectacular view over Dresden and enjoy a communicative event.

LingnerterrassenBautzner Straße 132 01099 Dresden

Committees of edaWorkshop and ADTC

W. Nebel, OFFIS, edacentrum, DW. Rosenstiel, U Tübingen, edacentrum, D

A. Jerraya, CEATech, F G. Sicard, CEA-LETI, F U. Schlichtmann, TU München, D

Technical Program Chairs

General Chairs of edaWorkshop and ADTC

Steering Committee ADTC P. Blouet, ST, F M. Barnasconi, NXP, NL B. Candaele, Thales Group, F M. Coenen, EMC MCC, NL M. Coppola, ST, F M. Diaz-Nava, ST, F M. Dietrich, Dikuli, D T. Fleischmann, Bosch, D A. Fritsch, Thales Group, F A. Jerraya, CEATech, F

J. Haase, edacentrum, D J. Kadlec, CZ E. Macii, Polito, I P. Merkus, Philips, NL C. Musca , I (Marcello) F. Oppenheimer, OFFIS, D F. Petrot, TIMA, F P. Pype, NXP, NL H. Schmidt, Infineon, D F. Schenkel MunEDA, D P. Schneider, FHG, D G. Sicard, CEA-LETI, F A Vandenboch, IMEC B E. Vermessan, Sintef, N

E. Villar, U Cantabria, E

J. Haase, edacentrum, D R. Popp, edacentrum, D

Organization Committee

Th

ursd

ay, May 16, 2019 (ed

aWo

rksho

p)

Keyn

ote-S

ession

Moderator: U

lf Schlichtm

ann (TU M

ünchen, D)

9:00W

elcom

e

9:10O

n th

e Ro

ad to

Self-D

riving

IC D

esign

Too

ls and

Flows

Andrew

B. K

ahng (U C

alifornia, San D

iego, US

)

9:40Tu

torial: “H

ow to

bu

ild a ro

adm

ap”

Danilo D

emarchi (Polito Torino, IT)

10:10Q

&A

U

lf Schlichtm

an (TU M

ünchen, D)

10:20C

offee B

reak & Po

ster Exh

ibitio

n

Techn

ical Sessio

n 7: “A

uto

mated

Firmw

are Desig

n D

emo

nstrated

fo

r RIS

C-b

ased S

oC

s” M

oderator: Oliver B

ringmann (U

Tuebingen, D)

11:00R

ISC

-V b

ased M

ulti-C

ore V

irtual P

roto

type: A

n E

xtensib

le and

C

on

figu

rable P

latform

for M

od

eling

and

Verificatio

nV

ladimir H

erdt (U B

remen, D

)

11:25O

ptim

ization

and

Gen

eration

of th

e Hard

ware/S

oftw

are Interface

and

Firmw

are Drivers

Rafael S

tahl (TU M

uenchen, D)

11:50A

Form

al Ap

pro

ach to

verify Driver O

ptim

ization

s M

ichael Schw

arz (TU K

aiserslautern, D)

12:15Flexib

le Power O

ptim

ization

of P

rocesso

r Co

res – A R

ISC

-V C

ase S

tud

y D

ustin Peterson (U Tuebingen, D

)

12:40Q

&A

Oliver B

ringmann (U

Tuebingen, D)

12:55C

losin

g R

emarks W

. Rosenstiel, (edacentrum

, D)

13:00Lu

nch

14:00E

nd of 3rd day

Wed

nesd

ay, May 15, 2019 (A

DT

C &

edaW

orksh

op

)

Panel S

ession

Moderator: Jochen Langheim

(STMicroelectronics, F)

17:00Pan

el “New

Electro

nics Fu

nctio

ns in

Au

tom

otive – R

eliability,

Valid

ation

and

Imp

lemen

tation

of C

om

mo

n S

tand

ards – W

hat’s

Next?”

Andreas A

al (Volkswagen, D

)Laith A

ltimim

e (SE

MI, D

)S

anjay Huprikar (IP

C)

Stephan Lehm

ann (NX

P, D)

Markus S

onnemann (B

osch, D)

18:00B

reak

City To

ur by b

us an

d S

ocial E

vent

Dinner Location: “Lingnerterrassen”

18:30M

eeting Point at Hotel R

eception and Departure B

us Shuttle (C

ity Tour)

20:00W

elcome R

eception at “Lingnerterrassen”

20:15D

inn

er and

Aw

ard o

f “ED

A-M

edal 2019”

23:00S

huttle Back to the D

orint Hotel

23:30E

nd of 2nd day

Social Event Locations

We thank our sponsors Synopsys, Mentor QTronics and SparxSer-vices, who enable us to offer twoattractive social events during ADTC and edaWorkshop.

Sponsors

Keyn

ote-S

ession

M

oderator: Wolfgang R

osenstiel (edacentrum, D

)

8:40W

elcom

e

8:45C

on

nected

Sm

art Sen

sor S

ystems – E

nab

ling

Techn

olo

gy fo

r the Io

T

Markus S

onnemann (B

osch, D)

Techn

ical Sessio

n 4: “S

ystem In

tegratio

n an

d Packag

ing

- S

olu

tion

s for th

e Ch

allenges o

f Min

iaturizatio

n”M

oderator: Manfred D

ietrich (TU D

resden, D)

9:15O

ptim

ize Pro

du

ct Co

st and

Perform

ance w

ith S

ystem-Level

Co

-Desig

n

Iyad Rayane (Zuken, F)

9:40M

ICR

OP

RIN

CE

– Op

en-A

ccess Pilo

t Line fo

r Micro

-Transfer-

Prin

ting

of fu

nctio

nal co

mp

on

ents o

n W

afer Level S

ebastian Wicht (X

-FAB

, D)

10:05Q

&A

M

anfred Dietrich (TU

Dresden, D

)

10:10In

trod

uctio

n Po

ster Sessio

nR

alf Popp (edacentrum, D

)

10:15 C

offee B

reak and

Poster E

xhib

ition

Techn

ical Sessio

n 5: “V

irtual P

latform

s in A

uto

mo

tive”M

oderator: Christoph H

eer (Intel, D)

10:45S

hiftin

g Left To

gether - V

irtual P

latform

s for A

uto

mo

tive Jakob E

ngblom (Intel, S

E)

11:15V

irtual D

evelop

men

t in A

uto

mo

tive – Co

ncep

ts and

Visio

ns o

f th

e ED

A In

du

stry

Sh

ift left – drivin

g in

novatio

n fro

m th

e insid

e ou

t A

ndreas Hoffm

ann (Synopsys, D)

Dig

italization

of th

e Au

tom

otive In

du

stry(S

eamless system

for E

CU

develo

pm

ent an

d verificatio

n)

Shaun B

ridges (Mentor, U

K)

Desig

n C

hain

En

ablem

ent fo

r Au

tom

otive A

pp

lication

sR

obert Schw

eiger (Cadence, D

)

12:25V

irtual E

CU

s for E

mb

edd

ed S

oftw

are Develo

pm

ent - A

Su

rvey of

Au

tom

otive A

pp

lication

s Jakob M

auss (QTronic, D

)

12:45Lu

nch

and

Poster E

xhib

ition

Techn

ical Sessio

n 6: “C

on

sum

er Electro

nics in

Au

tom

otive”

Moderator: A

ndreas Krauss (B

osch, D)

14:45T

RA

CE

- Techn

olo

gy Read

iness P

rocess fo

r Co

nsu

mer E

lectron

ics in

Au

tom

otive an

d In

du

strialA

ndreas Krauss (B

osch, D)

15:00T

he Tech

no

logy R

eadin

ess Pro

cess – a Cen

tral En

abler to

Han

dle

Co

mp

lex Electro

nic D

esign

s in a N

ew E

co S

ystemA

ndreas Aal (Volksw

agen, D)

15:25E

mb

edd

ed B

ayesian S

enso

r Fusio

n: A

n A

pp

lication

in T

RA

CE

Aurélien Fresneau, Tiana R

akotovao (CE

A-LETI, F)

15:50

(CE

-)Package Reliab

ility Co

ncern

s and

Imp

rovemen

ts Derived

in

TR

AC

ESven R

zepka (Fraunhofer-EN

AS, D

), Klas B

rinkfeldt (RIS

E, S

E), H

osea Busse

(GÖ

PE

L, D), R

ainer Dudek (Fraunhofer E

NA

S, D), R

einhold-Wilhem

Ortm

ann (C

ontinental Autom

otive, F)

16:15Q

&A

Andreas K

rauss (Bosch, D

)

16:30C

offee B

reak & Po

ster Exh

ibitio

n

Welco

me / O

pen

ing

Keyn

ote

Moderator: W

olfgang Rosenstiel (edacentrum

, D)

10:15W

elcom

eW


, D)

10:30C

yber P

hysical System

s, a Ch

ance fo

r Eu

rop

ean Fu

ture

Fabien Clerm

idy (CE

A Tech, F)

Techn

ical Sessio

n 1: “S

ensin

g fo

r Cyb

er Physical S

ystems”

Moderator: G

illes Sicard (C

EA

-LETI, F)

11:00S

enso

r Fusio

n fo

r Enviro

nm

ent Percep

tion

Ap

plied

to C

PS

Aurélien Fresneau, S

uzanne Lesecq, Diego Puschini,

Tiana Rakotovao (C

EA

-LETI, F)

11:25A

3D S

tacked S

mart V

ision

Ch

ip fo

r Low Laten

cy Image

Pro

cessing

Stéphane C

hevobbe (CE

A-LIST, F)

11:50Q

&A

Gilles S

icard (CE

A-LETI, F)

12:30Lu

nch

Techn

ical Sessio

n 2: “T

he In

ternet o

f Secu

re Th

ing

s: How

to

Ad

dress S

ecurity in

IOT

” M

oderator: Marcello C

oppola (STMicroelectronics, F)

13:30A

Meth

od

olo

gy of D

esign

ing

Safety-C

om

plian

t Secu

re C

om

mu

nicatio

n fo

r Au

ton

om

ou

s Veh

iclesD

aniela Cancila (C

EA

-LIST, F)

13:50S

afe and

Secu

re Mo

du

lar Up

dates fo

r Ind

ustry 4.0

Thomas S

trathmann (O

FFIS, D)

14:10S

ecure Test A

rchitectu

res in Io

TPaolo M

aistri (U G

renoble Alpes, F)

14:30C

yber S

ecurity M

od

eling

as a Majo

r Step

into

Secu

re IoT

Peter Lieber (Sparx S

ervices, A)

14:50Q

&A

Marcello C


15:00C

offee B

reak

Techn

ical Sessio

n 3: “M

edical D

evices”M

oderator: Arm

and Castillejo (STM

icroelectronics, F)

15:30M

edical D

evices Cyb

ersecurity: In

tegrity C

on

trol by D

esign

Moham

med A

it-Bendaoud, Florian Pebay-Peyroula, C

laire Rhue, C

hristophe Villem

azet (CE

A-LETI, F)

15:55D

igitizatio

n fo

r Health

care: a Hard

ware Persp

ectiveS

otir Ouzounov (P

hilips Research, N

L), Phil van Liere (P

hilips Healthcare, N

L)

16:20A

Tele-Visit S

ystem fo

r AC

TIV

AG

E P

roject

Andrea C

arboni (ISTI-CN

R, IT)

16:45Q

&A

Arm

and Castillejo (STM

icroelectronics, F)

17:00B

reak

Sp

ecial Sessio

n: “E

CS

in E

uro

pe: S

trategic R

esearch A

gend

a and

th

e Eu

rop

ean Fu

nd

ing

Land

scape”

Moderator: A

hmed Jerraya (C

EA

Tech)

17:30“E

CS

in E

uro

pe: S

trategic R

esearch A

gend

a and

the E

uro

pean

Fu

nd

ing

Land

scape”

Patrick Cogez (A

EN

EA

S, F)Y

ves Gigase (E

CS

EL, B

E)

19:00B

reak

Co

nferen

ce Din

ner (Location: G

allery at Dorint H

otel)

19:30C

ome Together including Poster E

xhibition

20:00D

inn

er and

Poster E

xhib

ition

22:00E

nd of 1st day

Tuesd

ay, May 14, 2019 (A

DT

C)

Ah

med

Jerraya (CE

A Tech, F)

Gilles S

icard (C

EA

-LETI, F)

AD

TC

Pro

gram

Ch

airs

About edaWorkshop and European Nanoelectronics Applications, Design & Technology Conference (ADTC)

Since 2009 the two well estab-lished events ADTC (European Nanoelectronics Applications, Design & Technology Conference, until 2015 known as CATRENE DTC) and edaWorkshop (premier German event for the discussion of electronics design and applications (EDA)) are co-located and share a common day every two years in Dresden and provide an efficient and thrilling platform for collabo-ration and technical discussions among R&D projects and leading experts from all over Europe.

Mission: The mission of ADTC & edaWorkshop is to support the transfer from new nanoelectronics

technologies into applications with high economical value and valuable impact on societal challenges by the means of innovations in design technologies. This explic-

itly includes close collaboration of R&D experts along the whole value chains of the industries. The event has a clear focus on deep technical discussions between the leading European experts in the addressed fields, independent from

the research programs where the in-dividual projects have been started. CATRENE, PENTA, ECSEL, Horizon 2020, national research programs – ADTC and edaWorkshop bring together all of them at one common technical workshop. This perfectly complements the European Forum for Electronic Components & Sys-tems, where strategic and political discussions have their home.

The three day event is a balanced combination of information and communication. It offers a wide range of discussions on specialized subjects and EDA research projects, and provides plenty of networking opportunities. This is supported by a

edaWorkshop 19edaWorkshop 19

comprehensive poster exhibition, where also demonstrations and prototypes will be presented.

With a mix of representatives from industry and academic research the event creates ideal opportunities for a professional exchange of ideas and results on a scientific basis. The dialog can pave the way for industry to ben-efit from research results.

Looking forward to seeing you in Dresden!

Prof. Dr. W. Rosenstiel Prof. Dr. W. Nebel General Chairs

Wed

nesd

ay, May 15, 2019 (A

DT

C &

edaW

orksh

op

)

Ulf S

chlich

tman

n (TU

München)

edaW

orksh

op

Pro

gram

Ch

airs

edacentrum

The design of integrated circuits and systems places enormous de-mands on R&D engineers and de-sign methods and tools that they use. It requires the efficient and manufacturing-aware development of safe, economical, robust and reliable systems of high complex-ity with very small structures and the design of analog and mixed-signal circuits.

In addition, most integrated circuits today contain not only a ‘system on chip’ (SoC), they also comprise large systems which are essential parts of applications. A new (product) design concept along the entire value chain with close interaction between elec-

tronics, design and applications (EDA) is necessary to speed-up innovation. This requires the integration of application domain knowledge into the design pro-cess, including design method-ologies and tools. It comprises management of requirements, design along all levels of abstrac-tion and the consideration of extra-functional properties.

Within the scope of its funding programme for information and communication technologies (ICT 2020) the BMBF (Federal Ministry of Education and Research, Ger-many) supports research activities in the area of “Electronics, Design and Applications”. Currently fun-

ded projects predominantly aim at developing application-specific design platforms for complex systems and circuits. The EDA-industry forms an important link between semiconductor manufac-turers and OEMs, and EDA-related research projects within ICT 2020 foster collaboration along the value chain. ICT 2020 focuses on fields of application that play a de-cisive role for the future strength of the German economy, such as automotive/mobility, automation and medical technology. Some projects within ICT 2020 are part of European collaborations, for example within the programme EUREKA-CATRENE or PENTA.

The edaWorkshop and ADTC – Catalyst of EDA Research

This event is a central platform for exchanging information concern-ing the approaches and results of projects from ICT 2020 and CATRENE, PENTA, ECSEL or Horizon 2020 as well.

Experts involved in the projects will be invited to present their results by means of talks and posters. At the heart of these presentations on electronics, design and applications will be the relevance of the applications to topics affecting society. As a second essential part of the event, project presentations will be supplemented by a selection of peer-reviewed scientific presenta-tions on R&D results.

eneasAssociation for European NanoElectronics ActivitieS

Abstract:Cyber-Physical Systems (CPS) can be defined as Systems being able to interact with their environ-ments thanks to sensors and ac-tuators. Their promise is huge, as they will probably be a revolution in the way we communicate with the increasing number of “things” in our today life while becoming closer to natural behavior.

As such, CPS will impact the whole European industry: new transport capacities thanks to autonomous driving will change our habits while robots or cobots will enter in our day-to-day life as well as in idustry4.0. Even so-called traditional industries such as avionics, aerospace or defense will deeply change with the mas-

sive arrival of CPS.

But CPS will come with many challenges in their computing requirements: while demanding more performance in real-time for fast events reaction, it will embed Artificial Intelligence for delivering more services but at low-power consumption for increased autonomy while keeping the full system at low-cost. Moreover, the challenges of reliability and security must be addressed for its massive adoption. However, these characteristics are mostly the same than previously aimed for embedded systems in transport and Internet-of-Things, two domains where Europe has always shown its excellence in research and industry.

In this talk, I will show how Europe can use its assets to be-come a worldwide leader in CPS and what are the challenges we must face together for achieving this goal. Of course, the way is still long, but if we set-up good collabora-tions, there are many reasons that CPS will be a chance for European future.

Curriculum Vitae: Fabien Clermidy leads the micro-electronic digital architecture and design activities at the research technology division of CEA.

In this position, he develops the computing strategy for High-Performance Computing, Artificial Intelligence, cybersecurity and

Cyber-Physical-Sys-tems in relation with system developments in automotive, factory of future, avionics or defense and new nanotechnologies such as 3D stacking, new embedded Non-Volatile-Memories or photonic.

Fabien Clermidy has been work-ing in CEA since 2000, holding different positions as project leader and manager of different teams. He is also a senior expert with a Ph’D supervisor degree and has published more than 80 papers in the greatest confer-ences such as ISSCC or DAC.

Tuesday Keynote: Fabien Clermidy: “Cyber Physical Systems, a Chance for European Future”

Abstract:Digital transformation is changing our way of living fundamentally: smart sensors collect data and connectivity solutions upload the data to a cloud, where intelligent algorithms enable services that make our life safer, simpler or more enjoyable.

However, making devices able to sense and being connected is simply not enough to realize the grand promise of the Internet-of-Things (IoT). The fact remains, that IoT will only be successful if it follows a user-centric approach, i.e. by solving real-life everyday challenges. Furthermore, ubiqui-tous sensing of everything on all kind of devices in an ever-increas-ing number of complex environ-

ments poses definite and growing challenges for sensor providers.

On ASIC and MEMS development level, the discussed challenges do translate into a significant spread of requirements. We will indicate the move from classical key performance indicators aim-ing on signal quality or ultra-low power consumption towards new architectures for smart sensor signal fusion or connectivity in arbitrary applications. The demand for innovation and short Time-To-Market together with the continu-ing rise of complexity leads to an even stronger need for “first time right” design methodologies in general, and more powerful and effective verification methodolo-gies in particular.

In this keynote, these challenges as well as possible solutions from a sensor vendor’s perspective will explored.

Curriculum Vitae: Dr. Markus Sonnemann is Vice President Engineering MEMS at Bosch Automotive Electronics and is responsible for Innovation and New Business with MEMS providing business ideas as well as advanced sensor concepts for automotive, consumer and multi-market applications.

Dr. Sonnemann studied physics at the University of Würzburg and at Northeastern University in Boston (USA) focusing on semiconduc-tor technologies and quantum electronics.

He started his pro-fessional career at Bosch in the MEMS development focusing on inertial sensors and held various manage-ment positions in Bosch electronics R&D as well as in business strategy. Today he is focusing on break-through innova-tion and the successful transfer of new technologies from research to volume production.s.

Wednesday Keynote: Markus Sonnemann: “Connected Smart Sensor Systems – Enabling Technology for the IoT”

Abstract: At today’s leading edge, critical scaling levers for semiconduc-tor product companies include design cost, quality and schedule. To reduce time and effort in IC implementation, fundamental chal-lenges must be solved. First, the need for (expensive) humans must be removed wherever possible. Humans are skilled at predicting downstream flow failures, evaluat-ing key early decisions such as RTL floorplanning, and deciding tool/flow options to apply to a given design. Achieving human-quality prediction, evaluation and decision-making will require new machine learning- (ML)-centric models of both tools and designs. Second, to reduce design schedule, focus must return to the long-held dream

Thursday Keynote: Andrew B. Kahng: “On the Road to Self-Driving IC Design Tools and Flows”

of single-pass design. Future design tools and flows that never require iteration and never fail (but, without undue conservatism) demand new paradigms and core algorithms for parallel search in design automation. Third, learning-based models of tools and flows must continually improve with additional design experiences. Therefore, the EDA and design ecosystem must deploy new infra-structure for ML model develop-ment and sharing.

At UCSD, a recently launched U.S. DARPA project, OpenROAD (“Foundations and Realization of Open, Accessible Design”), seeks to develop electronic chip design automation tools for 24-hour, “no-human-in-the-loop” hardware

layout generation. The project aims to combine several new approaches in chip design — ML, parallel optimization and “extreme partitioning” of the design problem — to develop a fast, autonomous design process. Today’s talk will sketch a few waypoints “on the road to self-driving IC design tools and flows”, framed as opportunities for collaborations that span ML, IC design, EDA and academia.

Curriculum Vitae:Andrew B. Kahng is Professor of CSE and ECE and holder of the endowed chair in HPC, at UC San Diego. He was visiting scien-tist at Cadence (1995-97) and founder/CTO at Blaze DFM (2004-06). He is coauthor of 3 books

and over 400 journal and conference pa-pers, holds 34 issued U.S. patents, and is a fellow of ACM and IEEE. He served as general chair of DAC, ISPD and other conferences, and from 2000-2016 as international chair/co-chair of the ITRS Design and System Drivers working groups. He is currently PI of “OpenROAD”, an $11.3M U.S. DARPA project targeting open-source, autonomous (“no humans”) tools for IC implemen-tation.

Keyn

ote-S

ession

M

oderator: Wolfgang R

osenstiel (edacentrum, D

)

8:40W

elcom

e

8:45C

on

nected

Sm

art Sen

sor S

ystems – E

nab

ling

Techn

olo

gy fo

r the Io

T

Markus S

onnemann (B

osch, D)

Techn

ical Sessio

n 4: “S

ystem In

tegratio

n an

d Packag

ing

- S

olu

tion

s for th

e Ch

allenges o

f Min

iaturizatio

n”M

oderator: Manfred D

ietrich (TU D

resden, D)

9:15O

ptim

ize Pro

du

ct Co

st and

Perform

ance w

ith S

ystem-Level

Co

-Desig

n

Iyad Rayane (Zuken, F)

9:40M

ICR

OP

RIN

CE

– Op

en-A

ccess Pilo

t Line fo

r Micro

-Transfer-

Prin

ting

of fu

nctio

nal co

mp

on

ents o

n W

afer Level S

ebastian Wicht (X

-FAB

, D)

10:05Q

&A

M

anfred Dietrich (TU

Dresden, D

)

10:10In

trod

uctio

n Po

ster Sessio

nR

alf Popp (edacentrum, D

)

10:15 C

offee B

reak and

Poster E

xhib

ition

Techn

ical Sessio

n 5: “V

irtual P

latform

s in A

uto

mo

tive”M

oderator: Christoph H

eer (Intel, D)

10:45S

hiftin

g Left To

gether - V

irtual P

latform

s for A

uto

mo

tive Jakob E

ngblom (Intel, S

E)

11:15V

irtual D

evelop

men

t in A

uto

mo

tive – Co

ncep

ts and

Visio

ns o

f th

e ED

A In

du

stry

Sh

ift left – drivin

g in

novatio

n fro

m th

e insid

e ou

t A

ndreas Hoffm

ann (Synopsys, D)

Dig

italization

of th

e Au

tom

otive In

du

stry(S

eamless system

for E

CU

develo

pm

ent an

d verificatio

n)

Shaun B

ridges (Mentor, U

K)

Desig

n C

hain

En

ablem

ent fo

r Au

tom

otive A

pp

lication

sR

obert Schw

eiger (Cadence, D

)

12:25V

irtual E

CU

s for E

mb

edd

ed S

oftw

are Develo

pm

ent - A

Su

rvey of

Au

tom

otive A

pp

lication

s Jakob M

auss (QTronic, D

)

12:45Lu

nch

and

Poster E

xhib

ition

Techn

ical Sessio

n 6: “C

on

sum

er Electro

nics in

Au

tom

otive”

Moderator: A

ndreas Krauss (B

osch, D)

14:45T

RA

CE

- Techn

olo

gy Read

iness P

rocess fo

r Co

nsu

mer E

lectron

ics in

Au

tom

otive an

d In

du

strialA

ndreas Krauss (B

osch, D)

15:00T

he Tech

no

logy R

eadin

ess Pro

cess – a Cen

tral En

abler to

Han

dle

Co

mp

lex Electro

nic D

esign

s in a N

ew E

co S

ystemA

ndreas Aal (Volksw

agen, D)

15:25E

mb

edd

ed B

ayesian S

enso

r Fusio

n: A

n A

pp

lication

in T

RA

CE

Aurélien Fresneau, Tiana R

akotovao (CE

A-LETI, F)

15:50

(CE

-)Package Reliab

ility Co

ncern

s and

Imp

rovemen

ts Derived

in

TR

AC

ESven R

zepka (Fraunhofer-EN

AS, D

), Klas B

rinkfeldt (RIS

E, S

E), H

osea Busse

(GÖ

PE

L, D), R

ainer Dudek (Fraunhofer E

NA

S, D), R

einhold-Wilhem

Ortm

ann (C

ontinental Autom

otive, F)

16:15Q

&A

Andreas K

rauss (Bosch, D

)

16:30C

offee B

reak & Po

ster Exh

ibitio

n

Welco

me / O

pen

ing

Keyn

ote

Moderator: W


, D)

10:15W

elcom

eW


, D)

10:30C

yber P

hysical System

s, a Ch

ance fo

r Eu

rop

ean Fu

ture

Fabien Clerm

idy (CE

A Tech, F)

Techn

ical Sessio

n 1: “S

ensin

g fo

r Cyb

er Physical S

ystems”

Moderator: G

illes Sicard (C

EA

-LETI, F)

11:00S

enso

r Fusio

n fo

r Enviro

nm

ent Percep

tion

Ap

plied

to C

PS

Aurélien Fresneau, S

uzanne Lesecq, Diego Puschini,

Tiana Rakotovao (C

EA

-LETI, F)

11:25A

3D S

tacked S

mart V

ision

Ch

ip fo

r Low Laten

cy Image

Pro

cessing

Stéphane C

hevobbe (CE

A-LIST, F)

11:50Q

&A

Gilles S

icard (CE

A-LETI, F)

12:30Lu

nch

Techn

ical Sessio

n 2: “T

he In

ternet o

f Secu

re Th

ing

s: How

to

Ad

dress S

ecurity in

IOT

” M

oderator: Marcello C


13:30A

Meth

od

olo

gy of D

esign

ing

Safety-C

om

plian

t Secu

re C

om

mu

nicatio

n fo

r Au

ton

om

ou

s Veh

iclesD

aniela Cancila (C

EA

-LIST, F)

13:50S

afe and

Secu

re Mo

du

lar Up

dates fo

r Ind

ustry 4.0

Thomas S

trathmann (O

FFIS, D)

14:10S

ecure Test A

rchitectu

res in Io

TPaolo M

aistri (U G

renoble Alpes, F)

14:30C

yber S

ecurity M

od

eling

as a Majo

r Step

into

Secu

re IoT

Peter Lieber (Sparx S

ervices, A)

14:50Q

&A

Marcello C


15:00C

offee B

reak

Techn

ical Sessio

n 3: “M

edical D

evices”M

oderator: Arm

and Castillejo (STM

icroelectronics, F)

15:30M

edical D

evices Cyb

ersecurity: In

tegrity C

on

trol by D

esign

Moham

med A

it-Bendaoud, Florian Pebay-Peyroula, C

laire Rhue, C

hristophe Villem

azet (CE

A-LETI, F)

15:55D

igitizatio

n fo

r Health

care: a Hard

ware Persp

ectiveS

otir Ouzounov (P

hilips Research, N

L), Phil van Liere (P

hilips Healthcare, N

L)

16:20A

Tele-Visit S

ystem fo

r AC

TIV

AG

E P

roject

Andrea C

arboni (ISTI-CN

R, IT)

16:45Q

&A

Arm

and Castillejo (STM

icroelectronics, F)

17:00B

reak

Sp

ecial Sessio

n: “E

CS

in E

uro

pe: S

trategic R

esearch A

gend

a and

th

e Eu

rop

ean Fu

nd

ing

Land

scape”

Moderator: A

hmed Jerraya (C

EA

Tech)

17:30“E

CS

in E

uro

pe: S

trategic R

esearch A

gend

a and

the E

uro

pean

Fu

nd

ing

Land

scape”

Patrick Cogez (A

EN

EA

S, F)Y

ves Gigase (E

CS

EL, B

E)

19:00B

reak

Co

nferen

ce Din

ner (Location: G

allery at Dorint H

otel)

19:30C

ome Together including Poster E

xhibition

20:00D

inn

er and

Poster E

xhib

ition

22:00E

nd of 1st day

Tuesd

ay, May 14, 2019 (A

DT

C)

Ah

med

Jerraya (CE

A Tech, F)

Gilles S

icard (C

EA

-LETI, F)

AD

TC

Pro

gram

Ch

airs

About edaWorkshop and European Nanoelectronics Applications, Design & Technology Conference (ADTC)

Since 2009 the two well estab-lished events ADTC (European Nanoelectronics Applications, Design & Technology Conference, until 2015 known as CATRENE DTC) and edaWorkshop (premier German event for the discussion of electronics design and applications (EDA)) are co-located and share a common day every two years in Dresden and provide an efficient and thrilling platform for collabo-ration and technical discussions among R&D projects and leading experts from all over Europe.

Mission: The mission of ADTC & edaWorkshop is to support the transfer from new nanoelectronics

technologies into applications with high economical value and valuable impact on societal challenges by the means of innovations in design technologies. This explic-

itly includes close collaboration of R&D experts along the whole value chains of the industries. The event has a clear focus on deep technical discussions between the leading European experts in the addressed fields, independent from

the research programs where the in-dividual projects have been started. CATRENE, PENTA, ECSEL, Horizon 2020, national research programs – ADTC and edaWorkshop bring together all of them at one common technical workshop. This perfectly complements the European Forum for Electronic Components & Sys-tems, where strategic and political discussions have their home.

The three day event is a balanced combination of information and communication. It offers a wide range of discussions on specialized subjects and EDA research projects, and provides plenty of networking opportunities. This is supported by a

edaWorkshop 19edaWorkshop 19

comprehensive poster exhibition, where also demonstrations and prototypes will be presented.

With a mix of representatives from industry and academic research the event creates ideal opportunities for a professional exchange of ideas and results on a scientific basis. The dialog can pave the way for industry to ben-efit from research results.

Looking forward to seeing you in Dresden!

Prof. Dr. W. Rosenstiel Prof. Dr. W. Nebel General Chairs

Wed

nesd

ay, May 15, 2019 (A

DT

C &

edaW

orksh

op

)

Ulf S

chlich

tman

n (TU

München)

edaW

orksh

op

Pro

gram

Ch

airs

Program


edaWorkshop 19

jointly organized


On Tuesday evening enjoy a com-municative dinner in the Gallery Restaurant of Dorint Hotel while catching up on several EDA pro-jects within the poster exhibition. Gallery Restaurant, Dorint Hotel (conference hotel), 1st floor

On Wednesday evening follow our invitation to a very special culinary evening on the edge of the river Elbe. A delightful dinner is waiting for you in the beautiful restaurant of the Lingner castle, the legacy of Karl August Lingner. Enjoy a spectacular view over Dresden and enjoy a communicative event. Lingnerterrassen Bautzner Straße 132 01099 Dresden


W. Nebel, OFFIS, edacentrum, D W. Rosenstiel, U Tübingen, edacentrum, D




Steering Committee ADTC P. Blouet, ST, F M. Barnasconi, NXP, NL B. Candaele, Thales Group, F M. Coenen, EMC MCC, NL M. Coppola, ST, F M. Diaz-Nava, ST, F M. Dietrich, Dikuli, D T. Fleischmann, Bosch, D A. Fritsch, Thales Group, F A. Jerraya, CEATech, F J. Haase, edacentrum, D J. Kadlec, CZ E. Macii, Polito, I P. Merkus, Philips, NL C. Musca , I (Marcello) F. Oppenheimer, OFFIS, D F. Petrot, TIMA, F P. Pype, NXP, NL H. Schmidt, Infineon, D F. Schenkel MunEDA, D P. Schneider, FHG, D G. Sicard, CEA-LETI, F A Vandenboch, IMEC B E. Vermessan, Sintef, N



Organization Committee

Th

ursd

ay, May 16, 2019 (ed

aWo

rksho

p)

Keyn

ote-S

ession

Moderator: U

lf Schlichtm

ann (TU M

ünchen, D)

9:00W

elcom

e

9:10O

n th

e Ro

ad to

Self-D

riving

IC D

esign

Too

ls and

Flows

Andrew

B. K

ahng (U C

alifornia, San D

iego, US

)

9:40Tu

torial: “H

ow to

bu

ild a ro

adm

ap”

Danilo D


10:10Q

&A

U

lf Schlichtm

an (TU M

ünchen, D)

10:20C

offee B

reak & Po

ster Exh

ibitio

n

Techn

ical Sessio

n 7: “A

uto

mated

Firmw

are Desig

n D

emo

nstrated

fo

r RIS

C-b

ased S

oC

s” M

oderator: Oliver B

ringmann (U

Tuebingen, D)

11:00R

ISC

-V b

ased M

ulti-C

ore V

irtual P

roto

type: A

n E

xtensib

le and

C

on

figu

rable P

latform

for M

od

eling

and

Verificatio

nV

ladimir H

erdt (U B

remen, D

)

11:25O

ptim

ization

and

Gen

eration

of th

e Hard

ware/S

oftw

are Interface

and

Firmw

are Drivers

Rafael S

tahl (TU M

uenchen, D)

11:50A

Form

al Ap

pro

ach to

verify Driver O

ptim

ization

s M

ichael Schw

arz (TU K

aiserslautern, D)

12:15Flexib

le Power O

ptim

ization

of P

rocesso

r Co

res – A R

ISC

-V C

ase S

tud

y D


)

12:40Q

&A

Oliver B

ringmann (U

Tuebingen, D)

12:55C

losin

g R

emarks W


, D)

13:00Lu

nch

14:00E

nd of 3rd day

Wed

nesd

ay, May 15, 2019 (A

DT

C &

edaW

orksh

op

)

Panel S

ession



17:00Pan

el “New

Electro

nics Fu

nctio

ns in

Au

tom

otive – R

eliability,

Valid

ation

and

Imp

lemen

tation

of C

om

mo

n S

tand

ards – W

hat’s

Next?”

Andreas A

al (Volkswagen, D

)Laith A

ltimim

e (SE

MI, D

)S

anjay Huprikar (IP

C)

Stephan Lehm

ann (NX

P, D)

Markus S

onnemann (B

osch, D)

18:00B

reak

City To

ur by b

us an

d S

ocial E

vent


18:30M



us Shuttle (C

ity Tour)

20:00W

elcome R


20:15D

inn

er and

Aw

ard o

f “ED

A-M

edal 2019”

23:00S


orint Hotel

23:30E

nd of 2nd day


We thank our sponsors Synopsys, Mentor QTronics and SparxSer-vices, who enable us to offer two attractive social events during ADTC and edaWorkshop.

Sponsors

Program


edaWorkshop 19

jointly organized


On Tuesday evening enjoy a com-municative dinner in the Gallery Restaurant of Dorint Hotel while catching up on several EDA pro-jects within the poster exhibition. Gallery Restaurant, Dorint Hotel (conference hotel), 1st floor

On Wednesday evening follow our invitation to a very special culinary evening on the edge of the river Elbe. A delightful dinner is waiting for you in the beautiful restaurant of the Lingner castle, the legacy of Karl August Lingner. Enjoy a spectacular view over Dresden and enjoy a communicative event. Lingnerterrassen Bautzner Straße 132 01099 Dresden


W. Nebel, OFFIS, edacentrum, D W. Rosenstiel, U Tübingen, edacentrum, D




Steering Committee ADTC P. Blouet, ST, F M. Barnasconi, NXP, NL B. Candaele, Thales Group, F M. Coenen, EMC MCC, NL M. Coppola, ST, F M. Diaz-Nava, ST, F M. Dietrich, Dikuli, D T. Fleischmann, Bosch, D A. Fritsch, Thales Group, F A. Jerraya, CEATech, F J. Haase, edacentrum, D J. Kadlec, CZ E. Macii, Polito, I P. Merkus, Philips, NL C. Musca , I (Marcello) F. Oppenheimer, OFFIS, D F. Petrot, TIMA, F P. Pype, NXP, NL H. Schmidt, Infineon, D F. Schenkel MunEDA, D P. Schneider, FHG, D G. Sicard, CEA-LETI, F A Vandenboch, IMEC B E. Vermessan, Sintef, N



Organization CommitteeT

hu

rsday, M

ay 16, 2019 (edaW

orksh

op

)

Keyn

ote-S

ession

Moderator: U

lf Schlichtm

ann (TU M

ünchen, D)

9:00W

elcom

e

9:10O

n th

e Ro

ad to

Self-D

riving

IC D

esign

Too

ls and

Flows

Andrew

B. K

ahng (U C

alifornia, San D

iego, US

)

9:40Tu

torial: “H

ow to

bu

ild a ro

adm

ap”

Danilo D


10:10Q

&A

U

lf Schlichtm

an (TU M

ünchen, D)

10:20C

offee B

reak & Po

ster Exh

ibitio

n

Techn

ical Sessio

n 7: “A

uto

mated

Firmw

are Desig

n D

emo

nstrated

fo

r RIS

C-b

ased S

oC

s” M

oderator: Oliver B

ringmann (U

Tuebingen, D)

11:00R

ISC

-V b

ased M

ulti-C

ore V

irtual P

roto

type: A

n E

xtensib

le and

C

on

figu

rable P

latform

for M

od

eling

and

Verificatio

nV

ladimir H

erdt (U B

remen, D

)

11:25O

ptim

ization

and

Gen

eration

of th

e Hard

ware/S

oftw

are Interface

and

Firmw

are Drivers

Rafael S

tahl (TU M

uenchen, D)

11:50A

Form

al Ap

pro

ach to

verify Driver O

ptim

ization

s M

ichael Schw

arz (TU K

aiserslautern, D)

12:15Flexib

le Power O

ptim

ization

of P

rocesso

r Co

res – A R

ISC

-V C

ase S

tud

y D


)

12:40Q

&A

Oliver B

ringmann (U

Tuebingen, D)

12:55C

losin

g R

emarks W


, D)

13:00Lu

nch

14:00E

nd of 3rd day

Wed

nesd

ay, May 15, 2019 (A

DT

C &

edaW

orksh

op

)

Panel S

ession



17:00Pan

el “New

Electro

nics Fu

nctio

ns in

Au

tom

otive – R

eliability,

Valid

ation

and

Imp

lemen

tation

of C

om

mo

n S

tand

ards – W

hat’s

Next?”

Andreas A

al (Volkswagen, D

)Laith A

ltimim

e (SE

MI, D

)S

anjay Huprikar (IP

C)

Stephan Lehm

ann (NX

P, D)

Markus S

onnemann (B

osch, D)

18:00B

reak

City To

ur by b

us an

d S

ocial E

vent


18:30M



us Shuttle (C

ity Tour)

20:00W

elcome R


20:15D

inn

er and

Aw

ard o

f “ED

A-M

edal 2019”

23:00S


orint Hotel

23:30E

nd of 2nd day


We thank our sponsors Synopsys, Mentor QTronics and SparxSer-vices, who enable us to offer two attractive social events during ADTC and edaWorkshop.

Sponsors

european nanoelectronics...since 2009 the two well estab-lished events adtc (european...

Documents