engineering manual hf212 solder paste - farnell element14 · engineering manual ... • measured

Suitable for use with: Standard SAC Alloys

Engineering Manual LOCTITE GC 10 T3 Solder Paste

GC 10 – The Game Changer

January 26, 2016 Engineering Manual GC 10 Solder Paste 2

1. Performance Summary

2. Introduction: Properties, Features & Benefits

3. Operating Parameters

• Printing: Process Window

• Printing: Continuous and Abandon Time Testing

• Slump Testing

• Tack-Life Force

• Reflow Process Window

• Reflow Performance Testing

• Voiding Data

4. Reliability and Specification Testing

5. Operating Parameters: Storage

• Printing & Reflow Performance

6. Product Summary

Contents







• Slump Testing

• Tack-Life Force



• Voiding Data




6. Product Summary

Contents


GC 10: Performance Summary

Flux

• Halogen-free flux: passes IC with pretreatment IPC-TM-650

2.3.34/EN14582

• Halogen-free flux classification: ANSI/J-STD-004 Rev. B for

a type ROL0 classification

Paste

• Suitable for printing up to 125mm/s (5”/s)

• Optimized for long hot soak reflow profiles

• Excellent coalescence in air & nitrogen atmosphere

• Excellent humidity resistance

• Excellent solderability on challenging surface finishes,

including CuNiZn

• Colourless residues for easy post-reflow inspection

• Long 12 month shelf-life when stored below 25C







• Slump Testing

• Tack-Life Force



• Voiding Data




6. Product Summary

Contents

Introduction Basic Solder Paste Properties

Flux Description GC 10

Alloy SAC305

Henkel Powder Size Type 3

Powder Size range, m 45-25

Metal Content, % 88.5

Malcom Viscosity, 10rpm Pa.s 207

TI 0.50

IPC slump @182C (0.33mm x 2.03mm)

first space no bridge

0.15

IPC Solder Balling preferred



Introduction GC 10 Features & Benefits

Product Attribute Process Benefit

Halogen Free • No added halogen

• Measured <900ppm chlorine and bromine and <1,500ppm total by

oxygen (O2) bomb test

Halide Free • Flux classification ROL0 in accordance to J-STD-004B

Application

• Designed for printing and pin-in-paste

• Excellent wetting to a broad range of metallisations, even through

long hot soak profiles in an air atmosphere

• Compatible with existing halogen free solutions

• Suitable for medium to large board assemblies

• Designed for long 12 month shelf-life stability without impact to

printing or reflow


Introduction GC 10 Features & Benefits

Product Attribute Process Benefit

Technology Printing

Advantages

• Wide process window for printing and minimal slump

• Abandon time of up to 2 hours; work life > 16 hours

• Excellent print capability and reduction in print related defects

• Suited for high throughput production, where yield consistency on print

deposits is key

• Improved paste transfer efficiency

• Allows on line paste utilisation protocols to be re-written

Technology Reflow

Advantages

• Optimised for long hot soak reflow processes

• Very shiny Pb-free solder joints over wide range of reflow

• Excellent coalescence


• Excellent solderability on challenging surface finishes (ENIG, Copper OSP,

CuNiZn and Imm Ag)

Low Voiding

• Low void levels increases solder joint reliability

• New chemistries allow pursuit of class 3 void levels in accordance to IPC7095B

on industry surface finishes: ENIG, Copper OSP, CuNiZn and Imm Ag

• Low voiding in CSP/BGA

Residues

• Clear, transparent and colourless

• Pin testable after 4x reflows







• Slump Testing

• Tack-Life Force



• Voiding Data




6. Product Summary

Contents

January 26, 2016 Engineering Manual GC10 Solder Paste 10

Operating Parameters Print Process Window (LOCTITE GC 10 SAC305 T3 885V)

• Excellent printing in the range 30 –

120mm/s, 0.4mm to 0.27mm round

apertures

0.8mm, 0.5mm & 0.4mm pitch round apertures, (120µm stencil)

Speed mm/s

Pre

ssu

re

kg

/m

m

120100806040

0.04

0.03

0.02

>

–

–

< 1.33

1.33 1.67

1.67 2.00

2.00

0.8BGA Cpk

Speed mm/s

Pre

ssu

re

kg

/m

m

120100806040

0.04

0.03

0.02

>

–

–

< 1.33

1.33 1.67

1.67 2.00

2.00

0.5CSPCpk

Speed mm/s

Pre

ssu

re

kg

/m

m

120100806040

0.04

0.03

0.02

>

–

–

< 1.33

1.33 1.67

1.67 2.00

2.00

diam Cpk0.30mm

Speed mm/s

Pre

ssu

re

kg

/m

m120100806040

0.04

0.03

0.02

>

–

–

< 1.33

1.33 1.67

1.67 2.00

2.00

0.5BGA Cpk

Contour Plot of 0.8mm BGA (0.4mm aperture) Cpk Contour Plot of 0.5mm CSP (0.31mm aperture) Cpk

Contour Plot of 0.30mm diam circles Cpk Contour Plot of 0.5mm BGA (0.27mm aperture) Cpk


Operating Parameters Print Process Window (LOCTITE GC 10 SAC305 T3 885V)

• Excellent printing in

the range 30 –

120mm/s, 0.28-

0.22mm round

apertures

• Limited process

window with

0.20mm apertures.

GC 10 T4 may be

required

0.28mm – 0.20mm round apertures, (120µm stencil)

Speed mm/s

Pre

ssu

re

kg

/m

m

120100806040

0.04

0.03

0.02

>

–

–

< 1.33

1.33 1.67

1.67 2.00

2.00

diam Cpk

0.28mm

Speed mm/s

Pre

ssu

re

kg

/m

m

120100806040

0.04

0.03

0.02

>

–

–

< 1.33

1.33 1.67

1.67 2.00

2.00

diam Cpk

0.25mm

Speed mm/s

Pre

ssu

re

kg

/m

m

120100806040

0.04

0.03

0.02

>

–

–

< 1.33

1.33 1.67

1.67 2.00

2.00

diam Cpk0.22mm

Speed mm/s

Pre

ssu

re

kg

/m

m

120100806040

0.04

0.03

0.02

>

–

–

< 1.33

1.33 1.67

1.67 2.00

2.00

diam Cpk0.20mm

Contour Plot of 0.28mm diam circles Cpk Contour Plot of 0.25mm diam circles Cpk

Contour Plot of 0.22mm diam circles Cpk Contour Plot of 0.20mm diam circles Cpk


Operating Parameters – Separation Speed Print Process Window (LOCTITE GC 10 SAC305 T3 885V) • Excellent printing in the

range down to 0.22mm round apertures.

• Fast separation speed is preferable.

0.8mm BGA – 0.18mm round apertures, 120m stencil thickness, 60mm/s,10kg

0.18

mm

dia circ

les

0.20

mm d

ia cir

cles

0.22

mm

dia circ

les

0.25

mm d

ia cir

cles

0.28

mm

dia circ

les

0.5m

m BGA

(0.2

7mm ap)

0.5m

m CSP

(0.3

1mm a

p)

0.5m

m uBG

A (0

.35m

m ap)

0.8m

m BGA

(0.4

mm a

p)

5

4

3

2

1

0

Cp

k1.33 ref1.67 ref

Fast

Medium

Slow

Variable

Separation speed. Cpk Loctite GC 10 SAC305 T3 885V

Operating Parameters Continuous Print and Abandon Stability Assessment

Paste

added to stencil

Paste

kneaded

Dry under

stencil wipe

1hr pause Print 5 PCBs Print 5 PCBs

• Printing

• DEK Europa

• Stainless steel, laser cut

• 120m thickness

• Vacuum tooling

• 250mm, 60 squeegee

• 60mm/s squeegee speed

• Fast separation speed

• Conditions typical, 22C, 40% RH

• Koh Young KY-8020T volume measurement

Print 15 PCBs,

dry wipe every 5

2hr pause

Volumes

Measured

Blank stencil

1000 or 2000

cycles

Print 15 PCBs,

dry wipe every 5

Volumes

Measured


Henkel Board 0.8mm BGA to 0.18mm diameter circles Process flow for Henkel print test as shown below


Operating Parameters – Abandon Stability 22C/40%RH Print Process Window (LOCTITE GC 10 SAC305 T3 885V)

• Print Capabilities

• Excellent printing in the

range down to 0.22mm round apertures

• Single knead cycle required after 2hr abandon at 0.20mm round apertures

0.8mm BGA – 0.15mm round apertures

120m stencil thickness, 60mm/s, fast separation, 250mm squeegee, 10kg

0.18

mm dia circ

les

0.20

mm dia circ

les

0.22

mm dia circ

les

0.25

mm dia circ

les

0.28

mm dia circ

les

0.5m

m BGA

(0.27

mm ap)

0.5m

m CSP

(0.31

mm ap)

0.5m

m µBG

A (0

.35m

m ap)

0.8m

m BGA

(0.4m

m ap)

5

4

3

2

1

0

Cp

k

1.33 ref1.67 ref

Initial

1hr

2hr

2hr + knead

Variable

Abandon time 1hr, 2hr, 2hr + 1 knead Loctite GC 10 SAC305 T3 885V



• Transfer Efficiencies

• Excellent printing in the range 0.40mm down to 0.27mm round apertures

0.8mm BGA – 0.5mm BGA round apertures


252321191715131197531

160

120

80

40

0

Print No.

Tra

nsfe

r Eff

icie

ncy %

0.5 Vnom

1.5 Vnom

_X=98.5

_X=97.7

_X=94.4

Initial 1 hr ab 2 hr ab

252321191715131197531

160

120

80

40

0

Print No.

Tra

nsfe

r E

ffic

ien

cy %

1.5 Vnom

0.5Vnom

_X=88.8

_X=85.6


_X=86.9

252321191715131197531

160

120

80

40

0

Print No.

Tra

nsfe

r Eff

icie

ncy %

0.5V nom

1.5 Vnom

_X=84.7 _

X=84.9_X=83.2


252321191715131197531

160

120

80

40

0

Print no.

Tra

nsfe

r Eff

icie

ncy %

0.5 Vnom

1.5 Vnom

_X=84.7

_X=83.5

_X=82.4


0.8mm BGA (0 .4mm ap) 0 .5mm BGA (0 .34mm ap)

0 .5mm CSP (0 .31mm ap) 0 .5mm BGA (0 .27mm dia ap)



• Transfer Efficiencies

• Excellent printing in the

range down to 0.22mm round apertures

• Single knead cycle for best results after 2hr abandon at 0.20mm round apertures and below

0.28mm – 0.20mm round apertures


252321191715131197531

160

120

80

40

0

Print No.

Tra

nsfe

r Eff

icie

ncy %

1.5 Vnom

0.5 Vnom

_X=92.0

_X=92.1

_X=90.6


252321191715131197531

160

120

80

40

0

Print No.

Tra

nsfe

r Eff

icie

ncy %

0.5 Vnom

1.5 Vnom

_X=96.3

_X=96.1


_X=95.0

252321191715131197531

160

120

80

40

0

Print No.

Tra

nsfe

r Eff

icie

ncy %

0.5 Vnom

1.5 Vnom

_X=99.6

_X=99.4

_X=95.7


252321191715131197531

160

120

80

40

0

Print No.

Tra

nsfe

r Eff

icie

ncy %

0.5 Vnom

1.5 Vnom

_X=95.1

_X=94.6 _

X=88.3


0.25mm dia round apertures 0 .22mm dia round apertures

0 .20mm dia round apertures 0 .18mm dia round apertures


Operating Parameters – Continuous Print Stability Print Process Window (LOCTITE GC 10 SAC305 T3 885V) • Print Capabilities

• No impact on print

performance after 8 hours (1000 cycles) and 16 hours (2000 cycles) printing

0.8mm BGA – 0.18mm round apertures, 120m stencil thickness,

60mm/s, Fast separation, 250mm squeegee, 10kg

0.18

mm dia circ

les

0.20

mm dia circ

les

0.22

mm dia circ

les

0.25

mm dia circ

les

0.28

mm dia circ

les

0.5m

m BGA

(0.27

mm ap)

0.5m

m C

SP (0.31

mm ap)

0.5m

m µBG

A (0.35m

m ap)

0.8m

m BGA

(0.4m

m ap)

5

4

3

2

1

0

Cp

k

1.33 ref1.67 ref

Initial

1,000 cycles

2,000 cycles

Variable

Continuous Print Stability 1000 cycles, 2000 cycles

Loctite GC 10 SAC305 T3 885V


Operating Parameters – Continuous Print Stability Print Process Window (LOCTITE GC 10 SAC305 T3 885V) • Transfer Efficiencies

• No impact on print

performance after 8 hours (1000 cycles) and 16 hours (2000 cycles) printing

0.8mm BGA – 0.5mm BGA round apertures, 120m stencil thickness,


454137332925211713951

160

120

80

40

0

Print No.

Tra

nsfe

r Eff

iency %

1.5 V nom

0.5 Vnom

_X=98.5

_X=96.5

_X=94.1

Initial 1000 prints 2000 prints

454137332925211713951

160

120

80

40

0

Print No.

Tra

nsfe

r Eff

icie

ny %

0.5 Vnom

1.5 Vnom

_X=88.8

_X=87.2

_X=83.8


454137332925211713951

160

120

80

40

0

Print No.

Tra

nsfe

r Eff

icie

ncy %

0.5 Vnom

1.5 Vnom

_X=84.7

_X=84.0

_X=80.8


454137332925211713951

160

120

80

40

0

Print no.

Tra

nsfe

r Eff

icie

ncy % _

X=84.7 _X=80.9


0.5 Vnom

1.5 Vnom

_X=83.5

0.8mm BGA (0 .4mm ap) 0 .5mm BGA (0 .34mm ap)

0 .5mm CSP (0 .31mm ap) 0 .5mm BGA (0 .27mm ap)


Operating Parameters – Continuous Print Stability Print Process Window (LOCTITE GC 10 SAC305 T3 885V) • Transfer Efficiencies

• No impact on print performance after 8 hours (1000 cycles) and 16 hours (2000 cycles) printing

0.28mm– 0.20mm round apertures, 120m stencil thickness,


454137332925211713951

160

120

80

40

0

Print No.

Tra

nsfe

r Eff

icie

ncy %

1.5 Vnom

0.5 Vnom

_X=92.0

_X=89.0

_X=85.5


454137332925211713951

160

120

80

40

0

Print No.

Tra

nsfe

r Eff

icie

ncy %

0.5 Vnom

1.5 Vnom

_X=96.3

_X=93.9

_X=89.6


454137332925211713951

160

120

80

40

0

Print No.

Tra

nsfe

r Eff

icie

ncy %

0.5 Vnom

1.5 Vnom

_X=99.6

_X=96.9


_X=91.9

454137332925211713951

160

120

80

40

0

Print no.

Tra

nsfe

r E

ffic

ien

cy %

0.5 Vnom

1.5 Vnom

_X=95.1

_X=92.7

_X=87.2


0.25mm dia round apertures 0 .22mm dia round apertures

0 .20mm dia round apertures 0 .18mm dia round apertures

6543210

300

250

200

150

100

50

0

Time (min)

Te

mp

era

ture

(°C

) 217°C

Profile 2

• No change to reflow performance after 16hours

printing (2000 print cycles)


Operating Parameters (Reflow) Paste Properties After Continuous Printing

Initial

1,000 cycles

(8 hours)

22°C, 40%RH

2,000 cycles

(16 hours)

22°C, 40%RH

0.5

mm

CS

P

6.5

mm

Overp

rint


Operating Parameters Slump

• Slump evaluation was performed in accordance with J-STD-005A, IPC-TM-650 2.4.35

• First spacing with no bridge recorded after 10 minutes at 182C (35C below melting point 217C)

Stencil

Design/

thickness

A 21

200m

A 20

100m

Aperture

0.63 x

2.03mm

0.33 x

2.03mm

0.33 x

2.03mm

0.20 x

2.03mm

Pass

mark 0.63mm 0.30mm 0.30mm 0.25mm

GC 10

25C 0.33mm 0.10mm 0.08mm 0.075mm

GC 10

182C 0.33mm 0.15mm 0.15mm 0.125mm

A21

200m

A20

100m

Operating Parameters Tack Force

Preload 300g

Preload time 5 secs

Retraction Speed 2.5mm/sec

Deposit diameter 5.1mm

Deposit height 0.25mm

Malcom TK1 Tackiness Tester


• Tackiness evaluation was performed in accordance with J-STD-005A,

IPC-TM-650 2.4.44

• GC10 tack-life >48hours

0

10

20

30

40

50

60

70

80

90

100

0 6 16 24 48

Tack

Fo

rce

gF

Time hours

IPC Tack force gF

Tack force gF 80% Peak Tack Force


Operating Parameters Solder Balling

Initial

Preferred Pass

• Solder balling performance as been assessed in accordance with

an extended version of IPC-TM-650 2.4.4.3

• Clear and colourless residues observed post-reflow

24hrs 25C 50% RH

Preferred Pass


Operating Parameters Reflow Process Window (Air)

• LOCTITE GC 10 solder paste offers halogen containing reflow performance in a

truly halogen free formulation

• GC 10 shows excellent coalescence onto a range of PCB and component finishes

especially during long-hot profiles

• There is no single profile that works for all applications and each process should be

assessed individually, under laboratory conditions the following profiles have been

found to give good results

• These process window guidelines are suitable for Type 3 SAC powder

Profile 1 2 3 4

Peak Temp (°C) 244 254 260 255

Time to Peak (min) 3.3 4.5 5.1 6.0

Soak Time (150-200°C) (min)

(No

Soak)

1.0

2.35 2.80 3.44

Time above Liquidus (min) 0.62 1.46 1.75 1.45

Time above Liquidus (sec) 37.2 87.6 105.0 87.0 7 6 5 4 3 2 1 0

300

250

200

150

100

50

0

Time (minutes)

T e m

p e

r a t u

r e (

° C

) 217°C

Profile 1

Profile 2

Profile 3

Profile 4

Reflow Profiles

Operating Parameters (Reflow)


1 2 3 4

1206 c

hip

s

0603 c

hip

s

0402 c

hip

s

Reflow Profile

7 6 5 4 3 2 1 0

300

250

200

150

100

50

0

Time (minutes)

T e

m p

e r

a t u

r e

( °

C ) 217°C

Profile 1

Profile 2

Profile 3

Profile 4

Reflow Profiles

Operating Parameters (Reflow)


1 2 3 4

Ove

rprin

ted

So

lde

r b

all

0.5

mm

CS

P5

6

0.4

mm

TQ

FP

12

0

Reflow Profile

7 6 5 4 3 2 1 0

300

250

200

150

100

50

0

Time (minutes)

T e

m p

e r

a t u

r e

( °

C ) 217°C

Profile 1

Profile 2

Profile 3

Profile 4

Reflow Profiles

Reflow Profile


Operating Parameters (Reflow – GC10)

2 4

0201 c

hip

s

0402 c

hip

s

1206 c

hip

s

6543210

250

200

150

100

50

Time (minutes)

Te

mp

era

ture

(°C

)

217°C

Profile 1

Profile 2

Reflow Profiles


Operating Parameters (Reflow – GC10)

Reflow Profile

1 2

0.4

mm

TQ

FP

0.5

mm

CS

P56

6543210

250

200

150

100

50

Time (minutes)

Te

mp

era

ture

(°C

)

217°C

Profile 1

Profile 2

Reflow Profiles

Operating Parameters Voiding

GC 10 meets IPC7095B class 3


• Void performance assessed using 4 different reflow profiles.

• 0.5mm CSP, 120µm stencil

• With component, 0.5mm CSP, SAC305 balls

• GC 10 shows low levels of voiding over a range of profiles

• Void Percentage analysed in accordance with IPC7095B

Profile 4Profile 3Profile 2Profile 1

20

15

10

5

0

IPC

vo

idin

g %

Class 3

Class 2

Class 1

Boxplot of IPC Voiding Percentage


10

8

6

4

2

0

% V

oid

ing

Line Plot of No. of Voids

7 6 5 4 3 2 1 0

300

250

200

150

100

50

0

Time (minutes)

T e

m p

e r

a t u

r e

( °

C ) 217°C

Profile 1

Profile 2

Profile 3

Profile 4

Reflow Profiles


Operating Parameters 2nd side reflow

0.5

mm

CS

P 5

6

02

01

0402

1 2 3 4

2nd second side reflow profile

7 6 5 4 3 2 1 0

300

250

200

150

100

50

0

Time (minutes)

T e

m p

e r

a t u

r e

( °

C ) 217°C

Profile 1

Profile 2

Profile 3

Profile 4

Reflow Profiles

Operating Parameters Voiding after 2nd side reflow

GC 10 meets IPC7095B class 3


• Void performance assessed using 4 different reflow profiles.

• 0.5mm CSP, 120µm stencil

• With component, 0.5mm CSP, SAC305 balls

• GC 10 shows no deterioration in voiding with pre reflowed boards

Pre reflow

Profile

pre-reflowedNo pre-reflow

Profile 4Profile 3Profile 2Profile 1Profile 4Profile 3Profile 2Profile 1

20

15

10

5

0

Pe

rce

nta

ge

Class 3

Class 2

Class 1

Boxplot of % voidingGC 10 T3


10

8

6

4

2

0N

o.

of

Vo

ids

No pre-reflow

pre-reflowed

Pre reflow

Line Plot of No. of voids

7 6 5 4 3 2 1 0

300

250

200

150

100

50

0

Time (minutes)

T e

m p

e r

a t u

r e

( °

C ) 217°C

Profile 1

Profile 2

Profile 3

Profile 4

Reflow Profiles

Board

Stencil 100m

Pads 500 pads per board, 2 boards tested

Probe 0.9mm 4 point plain crown light spring probe 100g spring force

Profiles 4 reflow profiles

No. of reflow 1, 2, 3 & 4 passes through oven

Atmosphere Air & 1000ppm O2

Time after reflow 1 day, 1 week


Before

Test

Operating Parameters Pin Testing

After

Test

7 6 5 4 3 2 1 0

300

250

200

150

100

50

0

Time (minutes)

T e

m p

e r

a t u

r e

( °

C )

217°C

Profile 1

Profile 2

Profile 3

Profile 4

Reflow Profiles


1 2 3 4

1 r

eflo

w

2 r

eflow

s

3 r

eflow

s

Reflow Profile (% after 1000 tests)


4 r

eflow

s

100% 100% 100% 99.5%

100%

99.9%

99.9%

100%

100%

100% 100%

100%

99.6% 99.9%

98.9%

98.5%

7 6 5 4 3 2 1 0

300

250

200

150

100

50

0

Time (minutes)

T e

m p

e r

a t u

r e

( °

C ) 217°C

Profile 1

Profile 2

Profile 3

Profile 4

Reflow Profiles



Reflow

ed in N

2

1 d

ay a

fter

reflow

1 w

eek a

fter

reflow

1 2 3 4

Reflow Profile (% after 1000 tests)

100%

99.6% 99.3% 99.8%

99.6% 99.8% 99.9%

100% 100% 100%

100%

100%

7 6 5 4 3 2 1 0

300

250

200

150

100

50

0

Time (minutes)

T e

m p

e r

a t u

r e

( °

C ) 217°C

Profile 1

Profile 2

Profile 3

Profile 4

Reflow Profiles

Operating Parameters Surface Finish


OS

P F

inis

h

Silv

er

Fin

ish

T

in F

inis

h

1 2 3 4

Reflow Profile (0.5mm CSP56)

7 6 5 4 3 2 1 0

300

250

200

150

100

50

0

Time (minutes)

T e

m p

e r

a t u

r e

( °

C ) 217°C

Profile 1

Profile 2

Profile 3

Profile 4

Reflow Profiles



OS

P F

inis

h

Silv

er

Fin

ish

T

in F

inis

h

1 2 3 4

Reflow Profile (0201)

7 6 5 4 3 2 1 0

300

250

200

150

100

50

0

Time (minutes)

T e

m p

e r

a t u

r e

( °

C ) 217°C

Profile 1

Profile 2

Profile 3

Profile 4

Reflow Profiles



OS

P F

inis

h

Silv

er

Fin

ish

T

in F

inis

h

1 2 3 4

Reflow Profile (0402)

7 6 5 4 3 2 1 0

300

250

200

150

100

50

0

Time (minutes)

T e

m p

e r

a t u

r e

( °

C ) 217°C

Profile 1

Profile 2

Profile 3

Profile 4

Reflow Profiles



OS

P F

inis

h

Silv

er

Fin

ish

T

in F

inis

h

1 2 3 4

Reflow Profile (6.5mm overprinted solder ball)

7 6 5 4 3 2 1 0

300

250

200

150

100

50

0

Time (minutes)

T e

m p

e r

a t u

r e

( °

C ) 217°C

Profile 1

Profile 2

Profile 3

Profile 4

Reflow Profiles

Reliability and Specification Testing Head in Pillow Test

Copper plate

Solder paste

Solder sphere

250+/-5˚C

Place a solder

sphere onto

printed paste


First

250+/-5˚C

….. Initial 3sec 6 sec ….. 1st sphere 2nd sphere 3rd sphere Defect

• Print solder paste on a Cu plate, 0402 pad, stencil thickness

125µm.

• When the solder paste starts to melt, place a solder sphere

(SAC305, 0.76mm diameter) on the printed solder paste

• Place another sphere after 3sec, 6 sec, 9sec… until the

solder sphere no-longer coalesces

• Flux activity at elevated temperatures – up to 20% longer

than industry standard – helping to reduce HiP Co

mpe

titor

G

Compe

titor F

Compe

titor

E

Compe

titor D

Compe

titor C

Compe

titor B

Compe

titor

A

GC 10

14

12

10

8

6

4

2

0

Paste

Av

era

ge

Tim

e (

s)

Head in PillowTime to first defect

Standard Test Result

ANSI/

J-STD-004B

Cu Corrosion Pass

Cu Mirror Pass

Halogen Pass (no added halogen)

Surface Insulation Resistance Pass 6.0x1011 Ohms after 7days

Electromigration Pass 5.0x1010 Ohms after 21days

GC 10 Control


GC 10 J-STD-004B classification ROL0

Reliability and Specification Testing J-STD- 004B


Reliability and Specification Testing 3rd Party Testing

• SGS report for GC 10

• Sample reflowed flux residue

• Reference EN14582/IC Analysis

• To meet halogen free requirements

• Br<900ppm, Cl <900ppm, and combined <1500ppm

• Halogen – Fluorine - ND

• Halogen – Chorine - ND

• Halogen – Bromine – ND

• Halogen – Iodine – ND

GC 10 has no detectable halogen and is designated as halogen free

Reliability and Specification Testing IPC J-STD 004B


6543210

250

200

150

100

50

Time (minutes)

Te

mp

era

ture

(°C

)

217°C

Profile 1

Profile 2

Reflow Profiles

6 5 4 3 2 1 0

250

200

150

100

50

Time (minutes)

T e m

p e r a

t u r e

( ° C

)

217°C

Profile 1

Profile 2

Reflow Profiles







• Slump Testing

• Tack-Life Force



• Voiding Data




6. Product Summary

Contents


Operating Parameters: Storage Printing After Storage 12 months 25C • Print Capabilities

• Excellent print capability

after storage for 12 months @ 25C

• No knead cycle required after 2hrs abandon down to 0.22mm round apertures

0.8mm BGA – 0.18mm round apertures, 120m stencil thickness, 60mm/s,

Fast separation, 250mm squeegee, 10kg

0.18

mm dia circ

les

0.20

mm dia circ

les

0.22

mm dia circ

les

0.25

mm dia circ

les

0.28

mm dia circ

les

0.5m

m BGA

(0.27m

m ap)

0.5m

m CSP

(0.31m

m ap)

0.5m

m µBG

A (0

.35m

m ap)

0.8m

m BGA

(0.4mm ap)

6

5

4

3

2

1

0

Cp

k1.67 ref1.33 ref

Initial

1hr

2hr

2hr + knead

Variable

Abandon time after storage 1hr, 2hr, 2hr + 1 knead

Loctite GC 10 SAC305 T3 885V 12 months 25°C


Operating Parameters: Storage Printing After Storage 12 months 25C • Print Capabilities



• Excellent print performance after 1000 cycles down to 0.22mm round apertures

0.8mm BGA – 0.18mm round apertures, 120m stencil thickness, 60mm/s,


0.18

mm dia circ

les

0.20

mm dia circ

les

0.22

mm dia circ

les

0.25

mm dia circ

les

0.28

mm dia circ

les

0.5m

m BGA

(0.27m

m ap)

0.5m

m C

SP (0

.31m

m ap)

0.5m

m µBG

A (0.35m

m ap)

0.8m

m BGA

(0.4mm ap)

6

5

4

3

2

1

0

Cp

k1.33 ref1.67 ref

Initial

1,000 cycles

Variable

Continuous Print Stability after storage 1,000 cycles

Loctite GC 10 SAC305 T3 885V 12 months 25°C


Operating Parameters: Storage Printing After Storage 12 months 25C • Transfer Efficiencies



• No knead cycle required after 2hrs abandon

• Excellent print performance after 1000 cycles

0.8mm BGA – 0.5mm BGA, 120m stencil thickness, 60mm/s,


37332925211713951

160

120

80

40

0

Print No.

Tra

nsfe

r Eff

icie

ncy %

1.5 Vnom

0.5 Vnom

_X=98.9

_X=98.6

_X=97.5

_X=95.5

Initial 1 hr ab 2 hr ab 1000 prints

37332925211713951

160

120

80

40

0

Print No.

Tra

nsfe

r Eff

icie

ncy %

1.5 Vnom

0.5 Vnom

_X=90.9

_X=88.7

_X=88.3 _

X=86.0


37332925211713951

160

120

80

40

0

Print No.

Tra

nsfe

r Eff

icie

ncy %

1.5 Vnom

0.5 Vnom

_X=88.1

_X=87.3

_X=85.8

_X=84.8


37332925211713951

160

120

80

40

0

Print No.

Tra

nsfe

r Eff

icie

ncy %

1.5 Vnom

0.5 Vnom

_X=88.1

_X=85.6

_X=84.3

_X=85.7


1

0.8mm BGA (0.4mm apertures) 0.5mm BGA (0.34mm apertures)

0.5mm CSP (0.31mm apertures) 0.5mm BGA (0.27mm apertures)


Operating Parameters: Storage Printing After Storage 12 months 25C • Transfer Efficiencies



• No knead cycle required after 2hrs abandon

• Excellent print performance after 1000 cycles

0.25mm – 0.18mm round apertures, 120m stencil thickness, 60mm/s,


37332925211713951

160

120

80

40

0

Print no.

Tra

nsfe

r Eff

icie

ncy %

0.5 Vnom

1.5 Vnom

_X=96.5

_X=96.0

_X=94.5

_X=91.8


37332925211713951

160

120

80

40

0

Print No.

Tra

nsfe

r Eff

icie

ncy %

0.5 Vnom

1.5 Vnom

_X=101.8

_X=101.6

_X=100.6

_X=97.1


37332925211713951

160

120

80

40

0

Print no.

Tra

nsfe

r Eff

icie

ncy %

0.5 Vnom

1.5V nom

_X=108.4

_X=103.5

_X=101.9

_X=100.0


37332925211713951

160

120

80

40

0

Print No.

Tra

nsfe

r Eff

icie

ncy %

0.5 Vnom

1.5 Vnom

_X=102.0

_X=99.2

_X=98.5

_X=92.7


0.25mm dia round apertures 0.22mm dia round apertures

0.2mm dia round apertures 0.18mm dia round apertures

Operating Parameters: Storage Reflow After Storage to 12months 25C

6543210

300

250

200

150

100

50

0

Time (min)

Te

mp

era

ture

(°C

) 217°C

Profile 2


Initial 1m 40°C 6m 25°C

0.5

mm

CS

P

02

01

04

02

After Paste storage

12m 25°C







• Slump Testing

• Tack-Life Force



• Voiding Data




6. Product Summary

Contents


GC 10: Performance Summary

Flux

• Halogen-free flux: passes IC with pretreatment IPC-TM-650

2.3.34/EN14582

• Halogen-free flux classification: ANSI/J-STD-004 Rev. B for

a type ROL0 classification

Paste

• Suitable for printing up to 125mm/s (5”/s)

• Optimized for long hot soak reflow profiles

• Excellent coalescence in air & nitrogen atmosphere


• Excellent solderability on challenging surface finishes,

including CuNiZn

• Colourless residues for easy post-reflow inspection

• Long 12 month shelf-life when stored below 25C

Thank you!

engineering manual hf212 solder paste - farnell element14 · engineering manual ... • measured

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