ESA UNCLASSIFIED - For Official Use

Enabling concepts: Packaging Technologies

Ana Collado / Liam MurphyESA / TEC-EDC

01/10/2018

ESA UNCLASSIFIED - For Official Use Ana Collado | TEC-EDC | 01/10/2018 | Slide 2

Enabling concepts: Packaging Technologies

Drivers for the future:

• Higher speed (>Gbps serial link)

• Higher integration between different active parts technologies

• Higher power dissipation

• Parts availability and market trends (e.g. Plastic parts, copper wire)

• Environmental regulation requirements (Lead free components)

ESA UNCLASSIFIED - For Official Use Ana Collado | TEC-EDC | 01/10/2018 | Slide 3

Plastic Ball Grid Array (PBGA): wire bonding on organic substrate

Flip-chip on ceramics substrate

Plastic Ball Grid Array (PBGA): Flip-chip on organic substrate

Wafer Level Packaging: Fan-in or Fan Out WLP

2D & 2.5D packaging

3D Packaging

Emerging Packaging Technologies for Space applications

ESA UNCLASSIFIED - For Official Use Ana Collado | TEC-EDC | 01/10/2018 | Slide 4

Enabling concepts: Flip chip packaging Concept description:

• Could be done onto ceramic or organic substrate (e.g.PBGA)

• Different bumping solutions (SAC alloys, Cu pillar)

Technology Benefits:

• Lower inductance than wire bonding

• Better bandwidth performance

• Lead free bumping (REACH compliant)

Technology Drawbacks: • Non-hermetic packages

• Little proven flight heritage

Space acceptability:

• Extensive reliability testing related to Lead Free bumping and plastic packaging

• Establishment of procedures and requirements for manufacturing and test

ESA UNCLASSIFIED - For Official Use Ana Collado | TEC-EDC | 01/10/2018 | Slide 5

Enabling concepts: Wafer Level Packaging

Concept description:• FI-WLP: Fan-in redistribution

• FO-WLP: Fan out redistribution with final molding

Technology Benefits:

• Suitable for new sub-micron technologies (e.g. <28nm)

• Small Form Factor / Lower cost => High Drive from Mobile and IoT markets

Technology Drawbacks:

• Dielectric strength /reliability of Redistribution Layers.

• Final encapsulation method is molded plastic (thermal management issues)

Space acceptability:• Lack of definition for testing of BEOL manufacturing

• Qualification approach similar to the silicon qualification

ESA UNCLASSIFIED - For Official Use Ana Collado | TEC-EDC | 01/10/2018 | Slide 6

Enabling concepts: 2D / 2.5D Packaging

Concept description:• 2D / 2.5D Packaging (TSV).

• Silicon interposer, with or without TSVs. Different options/configurations possible

Technology Benefits:

• Integration of different technologies (e.g. RF/ Digital)

Technology Drawbacks:

• Use of Copper pillars with tin content > 97%

• Micro-copper pillars technology still evolving

• Complex testing procedures

Space acceptability:

• High diversity of technologies and unknown reliability level (for Flight applications)

ESA UNCLASSIFIED - For Official Use Ana Collado | TEC-EDC | 01/10/2018 | Slide 7

Enabling concepts: 3D Packaging Concept description:

• Proven Tech: Stacked dies and Package-on-Package (PoP)

• Emerging Tech: 3D Wafer Stacking with TSV interconnects

Technology Benefits:

• Shorter-faster interconnections

• Solution for Memory on Logic

Technology Drawbacks:

• Thermal management issues

• Micro-copper pillar & TSV technologies

• Limited shelf life (Moisture and solderability issues)

Space acceptability:

• Complex Supply Chain. Qualification of both MEOL and BEOL processes

ESA UNCLASSIFIED - For Official Use Ana Collado | TEC-EDC | 01/10/2018 | Slide 8

Conclusions

From the packaging perspective:

- Advanced packaging is perceived as a big variety of possible options in different maturity levels.

- Requirements flow down from components performance requirements/needs

- Reduced data available on space testing performed of Advanced Packaging

- Complex supply chain adds difficulty to the qualification of the product

- Advanced Packaging suppliers mainly in Far East

- Upcoming packaging materials restrictions (RoHs, REACH)

=> Could ESA use/qualify any of these technologies in the future?

ESA UNCLASSIFIED - For Official Use Ana Collado | TEC-EDC | 01/10/2018 | Slide 9

Advanced Packaging Conference

ESA UNCLASSIFIED - For Official Use Ana Collado | TEC-EDC | 01/10/2018 | Slide 10

Back–up slides

CBGA:

ESA UNCLASSIFIED - For Official Use Ana Collado | TEC-EDC | 01/10/2018 | Slide 11

Back–up slides

Organic BGA:

ESA UNCLASSIFIED - For Official Use Ana Collado | TEC-EDC | 01/10/2018 | Slide 12

Back–up slides

TSV Formation:

ESA UNCLASSIFIED - For Official Use Ana Collado | TEC-EDC | 01/10/2018 | Slide 13

Back–up slides

Xilinx Virtex-7 2000T