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  • eMMC MA110 Series

    Big Innovation Company Limited Page 1 of 36 Copyright 2017 BIG-INNO all rights reserved.

    1. Features

    MLC NAND

    General Features

    o Embedded with e-MMC Flash Controller and NAND flash

    o JEDECR eMMC 5.1 compliant

    o Field Firmware Update

    o Sleep Notification in Power Off Notification

    o Device Health Report

    o Secure Removal

    o Command Queuing

    o 1bit, 4bit, 8bit data bus widths

    Supported Speed Mode

    o SDR52MHz/DDR52MHz/HS200/HS400

    Form Factor

    o JEDECR MO-276D Embedded Flash Memory

    o BGA 153 Ball BA type (11.5 mm x 13 mm)

    Available Capacities

    o 8 GB to 32 GB

    Voltages

    o Memory Power (VCC): 3.3V

    o Interface Power (VCCQ): 1.8V

    ECC

    o Internal Error Correction

    High Performance

    o HS400 (400 MB/s bus transfer rate)

    Temperature Ranges

    o -25 C ~+85 C

    2. Ordering Information

    Part Number Capacity (GB) Dimension (mm) Form Factor

    T0008M1VDB-F6B0 8 11.5 x 13 x 1.0 BGA 153 ball

    T0016M1VDB-F6B0 16 11.5 x 13 x 1.0 BGA 153 ball

    T0032M1VDB-F6B0 32 11.5 x 13 x 1.0 BGA 153 ball

    * 1 GB=1,000,000,000 Bytes

    For latest ordering information, please consult BIG-INNOs sales.

  • eMMC MA110 Series

    Big Innovation Company Limited Page 2 of 36 Copyright 2017 BIG-INNO all rights reserved.

    3. Contents

    1. Features 1

    2. Ordering Information 1

    3. Contents 2

    4. General Description 3

    4.1 System Performance 4

    4.2 Power Consumption 4

    4.3 Recommended Operating Conditions 4

    5. Functional Block Diagram 5

    6. Physical Dimensions 6

    7. Electrical Interface 7

    8. Product Features 10

    8.1 Communication interface 10

    8.2 Bus Operating Condition 11

    9. Supported Features 12

    9.1 Bootable 12

    9.2 Partition 14

    9.3 Sleep Mode 16

    9.4 Sleep (CMD5) 16

    9.5 Enhanced Write 17

    9.6 Secure Erase 17

    9.7 Secure Trim 17

    9.8 Trim 17

    9.9 Write Protection 17

    9.10 Hardware Reset 17

    9.11 Background Operations 18

    9.12 High Priority Interrupt (HPI) 18

    9.13 HS400 18

    9.14 Discard Command 20

    9.15 Sanitize 20

    9.16 Extended partition types 20

    9.17 Context ID Management 20

    9.18 Data Tag 21

    9.19 Packed Commands 21

    9.20 Real Time Clock 21

    9.21 Dynamic Device Capacity 21

    9.22 Power Off Notification 21

    9.23 Large Sector Size 21

    9.24 Cache 22

    10. eMMC Signals Connection and Layout Guideline 23

    11. Register 25

    11.1 OCR Register 25

    11.2 CID Register 25

    11.3 CSD Register 25

    11.4 Extended CSD Register 26

    14. Contact Information 36

  • eMMC MA110 Series

    Big Innovation Company Limited Page 3 of 36 Copyright 2017 BIG-INNO all rights reserved.

    4. General Description

    BIG-INNO MA110 series is an eMMC flash memory module that integrates a slim controller and NAND

    flash into a BGA package for various consumer electronics applications such as smart phones, Tablet PC,

    GPS, etc.

    BIG-INNO MA110 series provides low power mode to greatly extend battery lifetime and to achieve high

    performance that makes it an ideal solution for multimedia handsets. MA110 integrates advanced flash

    management technology to achieve balance between cost and performance. It works at 0-200MHz

    frequency, with 1bit, 4bit and 8bit data bus width.

    BIG-INNO MA110s various advantages such as high performance, capacity and reliability make it the best

    eMMC storage solution for several consumer electronics devices such as mobile PC and personal

    handheld devices.

  • eMMC MA110 Series

    Big Innovation Company Limited Page 4 of 36 Copyright 2017 BIG-INNO all rights reserved.

    4.1 System Performance Table 1: System Performance Table

    System Performance Value Unit

    Sustained Sequential Read Rate

    8 GB

    190 MB/s

    Sustained Sequential Write Rate 35 MB/s

    4KB Random Read IOPS 8635 IOPS

    4KB Random Write IOPS 810 IOPS

    Sustained Sequential Read Rate

    16 GB

    225 MB/s

    Sustained Sequential Write Rate 120 MB/s

    4KB Random Read IOPS 8925 IOPS

    4KB Random Write IOPS 1445 IOPS

    Sustained Sequential Read Rate

    32 GB

    260 MB/s

    Sustained Sequential Write Rate 155 MB/s

    4KB Random Read IOPS 9375 IOPS

    4KB Random Write IOPS 1930 IOPS

    Note: Performance is based on 8-bit HS200 mode

    4.2 Power Consumption Table 2: Power Consumption

    VCC VCCQ

    Active 46.10mA 76.39mA

    Power saving 38.51A 116.72A

    * All value are tested under room temperature 25 @ 1.8V

    4.3 Recommended Operating Conditions Table 3: Recommended Operating Conditions

    Parameter Value

    Operating Temperature -25 to +85

    Temperature Gradient ( per hour max, non-condensing) 20 (operating)

    Temperature Gradient ( per hour max, non-condensing) 30 (non-operating)

    Power Supply Voltage (VCC) 3.3V

    Power Supply Voltage (VCCQ) 1.8V

  • eMMC MA110 Series

    Big Innovation Company Limited Page 5 of 36 Copyright 2017 BIG-INNO all rights reserved.

    5. Functional Block Diagram

    Command, Data [7:0] Power, Ground, Clock, Reset

    e-MMC 5.1 Host

    Device

    eMMC 5.1 Interface Power On Reset, RC OSC.

    Data RAMProgram

    RAM

    Data/Address Bus

    Micro Controller DMA ECC

    Flash Control Logic

    NAND Flash

    Program

    ROM

    Figure 1: Functional Block Diagram

  • eMMC MA110 Series

    Big Innovation Company Limited Page 6 of 36 Copyright 2017 BIG-INNO all rights reserved.

    6. Physical Dimensions

    TOP BOTTOM

    Figure 2: Physical Dimensions

    Dimensions Unit

    Length 11.5 mm

    Width 13 mm

    Thickness 1.0 0.1 mm

  • eMMC MA110 Series

    Big Innovation Company Limited Page 7 of 36 Copyright 2017 BIG-INNO all rights reserved.

    7. Electrical Interface

    Top View: BA

    Figure 3: TOP View

    14 NC NC NC NC NC NC NC NC NC NC NC NC NC NC

    13 NC NC NC NC NC NC NC NC NC NC NC NC NC NC

    12 NC NC NC NC NC NC NC NC NC NC NC NC NC NC

    11 NC NC NC NC NC NC

    10 NC NC NC TX RFU NC VSS VCC NC NC NC NC

    9 NC NC NC RX VCC NC NC NC

    8 NC NC NC NC VSS NC NC NC

    7 NC NC NC VSS NC NC NC NC

    6 VSS DAT7 VCCQ VCC NC CLK NC VSS

    5 DAT2 DAT6 NC NC VCC VSS DS VSS RST_n CMD VSS VCCQ

    4 DAT1 DAT5 VSS NC VCCQ VCCQ VSS

    3 DAT0 DAT4 NC NC NC NC NC NC NC NC NC NC NC VCCQ

    2 NC DAT3 VDDi NC NC NC NC NC NC NC NC NC VSS NC

    1 NC NC NC NC NC NC NC NC NC NC NC NC NC NC

    A B C D E F G H J K L M N P

  • eMMC MA110 Series

    Big Innovation Company Limited Page 8 of 36 Copyright 2017 BIG-INNO all rights reserved.

    Table 4 153 Ball Pin and Signal Definition

    Pin Signal Type Description

    M6 CLK

    Input Clock:

    Each cycle directs a 1-bit transfer on the command and DAT lines.

    M5 CMD Input Command:

    A bidirectional channel used for device initialization and command

    transfers. Command has

    two operating modes:

    1) Open-drain for initialization.

    2) Push-pull for fast command transfer.

    A3 DAT0 I/O Data I/O0: Bidirectional channel used for data transfer.

    A4 DAT1 I/O Data I/O1: Bidirectional channel used for data transfer.

    A5 DAT2 I/O Data I/O2: Bidirectional channel used for data transfer.

    B2 DAT3 I/O Data I/O3: Bidirectional channel used for data transfer.

    B3 DAT4 I/O Data I/O4: Bidirectional channel used for data transfer.

    B4 DAT5 I/O Data I/O5: Bidirectional channel used for data transfer.

    B5 DAT6 I/O Data I/O6: Bidirectional channel used for data transfer.

    B6 DAT7 I/O Data I/O7: Bidirectional channel used for data transfer.

    K5 RST_n Input Reset signal pin

    E6, F5, J10, K9 VCC Supply VCC: Flash memory I/F and Flash memory power supply.

    C6, M4, N4, P3, P5 VCCQ Supply VCCQ: Memory controller core and MMC interface I/O power supply.

    E7, G5, H10, K8, A6,

    C4, J5, N2, N5, P4, P6

    VSS Supply VSS: Flash memory I/F and Flash memory ground connection.

    C2 VDDi VDDi: Connect 0.2F capacitor from VDDi to ground.

    E9 RX UART

    E10 TX UART

    F10 RFU Reserved for future use. Left it floating for future use.

    H5 DS Data Strobe pin

    D4 NC Index Index: Can be connected to ground or left floating.

  • eMMC MA110 Series

    Big Innovation Company Limited Page 9 of 36 Copyright 2017 BIG-INNO all rights reserved.

    Pin Signal Type Description

    A1, A2, A7, A8, A9, A10,

    A11, A12, A13, A14, B1,

    B7, B8, B9, B10, B11,

    B12, B13, B14, C1, C3,

    C5, C7, C8, C9, C10,

    C11, C12, C13, C14,

    D1, D2, D3, D4, D12,

    D13, D14, E1, E2, E3,

    E5, E8, E12, E13, E14,

    F1, F2, F3, F12, F13,

    F14, G1, G2, G3, G10,

    G12, G13, G14, H1, H2,

    H3, H12, H13, H14, J1,

    J2, J3, J12, J13, J14,

    K1, K2, K3, K6, K7,

    K10, K12, K13, K14, L1,

    L2, L3, L12, L13, L14,

    M1, M2, M3, M7, M8,

    M9, M10, M11, M12,

    M13, M14, N1, N3, N6,

    N7, N8, N9, N10, N11,

    N12, N13, N14, P1, P2,

    P7P8, P9, P10, P11,

    P12, P13, P14

    NC No connect: Can be connected to ground or left floating.

  • eMMC MA110 Series

    Big Innovation Company Limited Page 10 of 36 Copyright 2017 BIG-INNO all rights reserved.

    8. Product Features

    8.1 Communication interface

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