The E-bomb – A Weapon of Electrical Mass Destruction

By SANTOSH

INTRODUCTION

• Electromagnetic bomb is the night mare for electronic world.

• E-bomb is advanced than any other bomb which cause damage only for Electrical and Electronics equipment.

• E-bomb utilizes EMP pulse effect.• We are utterly dependent on power, when its gone

things get very bad. E-bomb make use of this dependency.

• Here we utilizing electronics to destroy electronics.

E bomb Technology Base:

• Power source – explosively pumped Flux Compression Generator (FCG)

• FCG pioneered by Los Almos Labs during the 1950s

• FCG can produce tens of Mega Joules in tens to hundreds of microseconds

• Peak current of FCG is 1000 X that of typical lightning stroke

The Physics of FCG:

• Fast explosive compresses a magnetic field• Compression transfers mechanical energy into

the magnetic field.• Peak currents of mega amperes demonstrated

in many experiments

FCG Start current is provided by an external source:

• Capacitor bank • Small FCG • MHD device

An E-Bomb:

FCG Internals:

• Armature-copper tube /fast explosive• Stator-helical heavy wire coil• Initiator-plane wave explosive lens• Jacket-prevents disintegration due magnetic

forces.

FCG Operation:

• External power source pumps FCG winding with start current

• When start current peaks, explosive lens fired to initiate explosive burn

• Explosive pressure expands armature and creates moving short

• Moving armature compreses magnetic field

High Power Microwave(HPM) sources:

Higher lethality than low frequency FCG fields,many device types:• Relativistic klystrons• Magnetrons• Slow wave device• Reflex triodes• Virtual cathode oscillator(viractor)

Viractor physics

• Relativistic electron beam punches through foil or mesh anode

• “virtual” cathode formed by space charge bubble behind anode

• Peak power of tens of GW for hundreds of nano second

• Anode typically melts in about one micro second.• Cheap and simple to manufacture• Wide band width allows chirping of oscillation

Lethality issues in E-Bomb War heads:

• Diversity of target set makes prediction of lethality difficult.

• Different implementations of like equipment have differing hardness.

• Coupling efficiency is critical to lethality.•

Coupling modes:

Front door coupling through antennas.• Destroys RF semiconductor devices in

transmission and receiver Back door coupling through power or data

cabling, telephone wiring• Destroys exposed semiconductor devices• Punches through isolation transformers.

Semiconductor vulnerability:

• Semiconductor components using CMOS,RF bipolar,RF GaAs,NMOS DRAM processes are destroyed by exposure to volts to tens of volts of electrical voltage

• High speed- high density semiconductor are highly vulnerable due small junction sizes and low breakdown voltages.

Damage mechanism:

• Low frequency pulse produced by FCG creates high voltage spikes on fixed wiring infrastructure.

• Microwave radiation from HPM devices creates high voltage standing waves on fixed wiring infrastructure.

Example scenario:

• 10 GigaWatt 5GHz HPM E-bomb initiated at several under 100m attitude.

• Footprint has diameter of 400 to 500m with field strength of kv/m.

Maximizing bomb lethality:

Lethality is maximized by maximizing the power coupled into the target set

• Maximize peak power and duration of warhead emission(large FCG or viractor)

• Maximize efficiency of internal power transfer in weapon

• Maximizing coupling efficiency into target set.

HPM E-bomb lethality:

Microwave bombs are potentially more lethal due better coupling and more focused effects

• Chirping allows weapon couple into any in band resonances

• Circular polarization of antenna allows coupling with any aperture orientation

• Reducing detonation altitude increases field strength at expense of foot print size.

Targeting E-bombs:

• Fixed installations (buildings , radar etc)-conventional methods.

• Radiating mobile or hidden target(ships)-use ESM or ELS.

• Non radiating mobile or hidden target-use un intentional emission.

Delivery of E-bombs:

• Warhead comprises priming current sources ,FCG and viractor tube.

• Missile installation supply 100% of weapon priming energy from own supply.

• Bomb installation-weapon can be precharged before release from aircraft

Delivery options:

• Dumb bombs have a CEP of 100-1000 ft (free fall delivery).

• GPS aided bombs have cep of 40ft(free fall but guided).

• Standoff missiles have a cep of40 ft(GPS inertial with propulsion).

• Cruise missiles have a cep of10-40 ft(eg : USAF AGM-86derivative)

Vulnerability reduction (Hardening):

• Convert computer room into faraday cages.• Use optical fibers for data.• Use electromagnetic”air locks”• Shielding must be comprehensive.

E-bomb effects

• An E-Bomb attack could leave the building and spare lives,but it could destroy the sizeable military.

• Low level electromagnetic pulses would temporarily jam electronic systems.

• An E-bomb could effectively neutralizes vehicle,targetting,navigating systems.

• In one sentence we can tell that an E-Bomb attack reduces military unit into guerilla type army.

Applications of E-Bomb:

• This kind 0of weapons would be especially used in an invasion of Iraq .because a pulse might effectively neutralizes underground bunkers. where most of the Iraq bunkers are hard to reach with convention bombs.

• During wars the normal atom bombs greatly disturbs the natural flora and fauna, but the usage of this bomb induces technical destruction isolating flora and fauna from destruction.

Conclusion:

• Intelligent usage of this bomb reduces the enemy potential destructing their technology and it must be noted that this e-bomb technology might become a major threat to existing electronics, if it falls in wrong hands. this again proves that electronics can also be destructive.

• Thank you