Download - MEMS and Microsystem Packaging
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C O N F I D E N T I A L
MEMS and Microsystem Packaging
NMI at INNOS June 2005
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C O N F I D E N T I A L[Page 1]
Introduction
Background to MEMS and Microsystem Packaging
Types of Packaging– “Zero level” packaging– Primary packaging– Secondary packaging
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C O N F I D E N T I A L[Page 2]
Silicon IC Systems
Silicon IC systems have become:– Incredibly complex– Amazingly dense
Standard packages have just about managed to keep up– From early single analogue IC– To multiple stacked digital ICs
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C O N F I D E N T I A L[Page 3]
Packaging Diversification
Standard packaging is “fraying at the edges”– System in Package– Complex chips: eg microprocessors– Power– MEMS
Package standardisation helped by:– Single input/output media – electric signals– Mature worldwide industry– High volume and demand from products such as mobile phones etc.
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C O N F I D E N T I A L[Page 4]
MEMS and Microsystems Packaging
MEMS and Microsystems packaging is at the opposite side of the spectrum!– Multiple input/output media– Immature, younger, fragmented industry– Only a few high volume products, such as inkjet, air bag sensor
Microsystems– Photonics – Sensors– Inkjet print heads– RF switches
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C O N F I D E N T I A L[Page 5]
MEMS & Microsystems Input MediaHeat Light
Gas Liquid
Motion
Image: STS
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C O N F I D E N T I A L[Page 6]
Microsystems with Inputs and Outputs in Other Medium
Micro fluidics Newer photonics are light to light
Image: Illinois University
Image: STS, MEMScap, UCLA
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C O N F I D E N T I A L[Page 7]
MEMS Interface Circuitry
MEMS devices tend to have low signal levels– Microphones– Motion sensors
Or high frequency– RF switches– Photonics
MEMS interface circuitry is often layout or package sensitive
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C O N F I D E N T I A L[Page 8]
Cost
Advanced Packaging
IC packaging 30 – 90% of item costMEMS packaging 70 – 90% of item cost
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C O N F I D E N T I A L[Page 9]
MEMSnet: Current Challenges
Most companies….. have very limited options for prototyping or manufacturing devices
MEMS packaging is more challenging than IC packaging….
Most companies find that packaging is the single most expensive and time-consuming task in their overall product development
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C O N F I D E N T I A L[Page 10]
MEMS Packaging is a Challenge!
MEMS are difficult to:– Design– Make– Find a supplier for
But, usually, packaging is the hardest task!
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C O N F I D E N T I A L[Page 11]
MEMS Die Packaging Requirements
Mechanical structures often need altered environments– RF switches, IR sensors/bolometers need high vacuum– Controlled atmosphere for capacitance sensing – accelerometers
Mechanical structures need a cavity
Access for input/output medium
Sensitive to packaging stresses
Wafers can be thicker
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C O N F I D E N T I A L[Page 12]
“Zero Level” Packaging
Additional glass or silicon wafers bonded to MEMS wafer
Composite wafer sawn into “die”
Advantages– Cheaper – bulk wafer scale process– Protects MEMS from saw slurry– Compatible with standard IC packages– Provides environmental control, cavity and protects MEMS
Glass
MEMS
Glass
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C O N F I D E N T I A L[Page 13]
Types of “Zero Level” Processes
Direct bonding– Anodic bonding of glass– Wafer-to-wafer bonding
Indirect bonding using a “glue”– Eutectic bonding – gold/silicon– Solder– Glass frit– BCB, epoxy – polymer
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C O N F I D E N T I A L[Page 14]
Direct Bonding
Anodic bonding– Glass/wafer/glass
Wafer-to-wafer bonding
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C O N F I D E N T I A L[Page 15]
Indirect Bonding
Apply “glue”– Sputter/etch eutectic– Screen print glass frit– Spin on/photo pattern BCB
Apply cap
Heat treat– Reflow/cure
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C O N F I D E N T I A L[Page 16]
Micro System Often Requires a System in a Package
Interface circuitry – Either In primary packaging– Or layout sensitive in secondary
packaging
“System in a Package” is a Zarlink speciality
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C O N F I D E N T I A L[Page 17]
Primary Packaging
Hermetic ceramic packaging instead of zero level
Zero level package thickness
Environmental access
All levels of packaging merge
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C O N F I D E N T I A L[Page 18]
Secondary Packaging
Usually a mechanical and electronic structure
Designed by the customer (or strong input )
Multidisciplinary project– Specialist engineering knowledge for application– Mechanical engineering– Package engineering
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C O N F I D E N T I A L[Page 19]
What Level of Package Integration
Package integration driven by – Cost (NRE or part cost)– Application – Electronic requirements
Levels of integration– Fully integrated MEMS + interface circuitry “System on a Chip”– MEMS + interface in Primary packaging “ System in a Package”– MEMS + interface circuitry as components on a PCB
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C O N F I D E N T I A L[Page 20]
Self-Powered Systems
Current systems– Battery: pacemaker lasts 10 years– Photo cell power: supermarket shelf RF
driven LCD price labels
Future self-powered system components– Micro fuel cells, MEMS energy
harvesters– Low-power wireless cells– E grains, intelligent dust
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C O N F I D E N T I A L[Page 21]
Design and Manufacturing Systems
Profusion of mediumNon-standard processesCustomers who know their business but not Micro systems– Bio-chips: do you understand biology, do they understand silicon ?
Multi-company and multi-disciplinary projectsShared design rules, EDA and fabs are a long way offA consultants dream!?Will we have to choose a niche, will it be difficult to swap niches?
NO WONDER MEMS PACKAGING IS NON-STANDARD!
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C O N F I D E N T I A L
SIMPLY COMMUNICATING