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RELIABLE MINIATURIZATION TECHNOLOGIES FOR ELECTRONICS
CouvertureDos
RELIABLE MINIATURIZATION TECHNOLOGIES FOR ELECTRONICS
Our SiP solutions embeds best standard semiconductor devices and
technology in one single highly miniaturized package with almost no limit for the
merging of heterogeneous technology (Die – Package – Sensors - Passives)
and form factors.
3D PLUS SiP design capabilities include Digital, Analog, Power and RF
electronics.
Our SiP modules can be shaped with various form factors and can be delivered
with several I/OS types.
Achieving a combination that cannot be realized with monolithic System-on-
Chip (SoC) approaches, and, relying on a proven “first time right” design flow,
3D PLUS Space Qualified SiPs are used in all the Space Application fields.
SPACE PRODUCTSSYSTEM-IN-PACKAGES
RELIABLE MINIATURIZATION TECHNOLOGIES FOR ELECTRONICS
AN INNOVATIVE
COMPANY
RELIABLE MINIATURIZATION TECHNOLOGIES FOR ELECTRONICS
3D PLUS is a world leading supplier of advanced high density 3D
microelectronic products and Die and Wafer Level stacking technology meeting
the demand for high reliability, high performance and very small size of today’s
and tomorrow’s electronics. We offer standard products and custom System-in-
Package (SiP) solutions based on our Space qualified and patented technology
portfolio. The company is ISO 9001:2008 certified and its stacking technologies
are qualified by European Space Agency for Space applications.
S PAC E S Y S T E M - I N -PAC K AG E S E X P E R T I S E
F L I G H T P R O V E N P R O D U C T S
With more than 110,000 modules in orbit today and a failure-free flight heritage
of more than 17 years, 3D PLUS is the largest Space Qualified MCM
manufacturer in Europe. 3D PLUS products are used by all the major space
agencies and customers worldwide. They fly in numerous missions : Smart-1,
Solar Probe, Proba-1, Mars Express, ISS, Rosetta, MMS, Bepi-Colombo…
K E Y B E N E F I T S
HETEROGENEOUS ELECTRONICS MIXED IN ONE SINGLE PACKAGE
HIGH DENSITY
HIGH SPEED PERFORMANCE
SMALL FORM FACTOR75 % space and weight savings in the design
HIGH RELIABILITY20 years lifetime
SPACE QUALIFIED TECHNOLOGY
FLIGHT PROVEN SIP PRODUCTS
RADIATION HARDENED (TID, SEE)
LONG TERM SUPPLY GUARANTY
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www.3d-plus.com
RELIABLE MINIATURIZATION TECHNOLOGIES FOR ELECTRONICS
CouvertureDos
RELIABLE MINIATURIZATION TECHNOLOGIES FOR ELECTRONICS
INITIAL CONCEPT ANALYSIS AND
FEASIBILITY STUDY
REQUIREMENTS DETAILED ANALYSIS
PRELIMINARY DESIGN DETAILED DESIGNPROTOTYPES
MANUFACTURING
INDUSTRIALIZATION AND FLIGHT MODELS
MANUFACTURING
ONE-STOP SOURCE FORSPACE SYSTEM-IN-PACKAGES
I N I T I AL C O N C E P T AN ALY S I S AN D F E AS I B I L I T Y S T U D Y
+ Initial requirements analysis
+ Initial feasibility study and SiP technology selection
+ Manufacturing line selection
R E Q U I R E M E N T S D E TAI L E D AN ALY S I S
+ Detailed requirements specification analysis
+ Final design trade-offs & feasibility studies
+ Product Requirement Specification
D E TAI L E D D E S I G N
+ Detailed design and lay-out of the module
+ Electrical Analysis and simulation
+ Final thermal and mechanical analysis
+ Detailed design report
+ Test equipment and procedure definition
+ Product validation and qualification plan
P R O T O T Y P E S M A N U F A C T U R I N G A N D T E S T
+ Design and manufacturing of themanufacturing and test specific tools,
+ Parts and materials procurement
+ Manufacturing and test of prototypes
+ Validation and Qualification tests report
+ Final updated Product specification anddata sheet
I N D U S T R I AL I Z AT I O N AN D F L I G H T M O D E L S M AN U FAC T U R I N G
+ Procurement of the additional specificmanufacturing and test tools
+ Flight Models Manufacturing
P R E L I M I N ARY D E S I G N
+ Functional and physical partitioning analysis
+ Module physical architecture and layers’ definition
+ Preliminary mechanical outline
+ Electrical analysis (power, critical signal paths,I/Os,…)
+ Thermal and mechanical analysis
+ Environmental compatibility analysis includingspace radiations (TID,SEL,SEU)
F R O M C O N C E P T TO D E S I G N A N D M A N U FA C T U R I N GYO U R D E S I G N S TA R T S H E R E
S I P D E S I G N F L O WAN D Q U AL I T Y AS S U R AN C E
First time right design approach
As highly integrated applications require a close partnership between
the customer and the design team to get the highest benefit from the
3-D Technology, 3D PLUS SiP design flow is organized as per a
proven “first time right” design and development methodology where:
+ the SiP electrical schematics and part list are provided by the
customer,
+ the SiP detailed feasibility study and design activities are performed
by 3D PLUS with close links with the users engineers,
+ the final electrical and qualification tests are reviewed and approved
by the customer.
Quality
3D PLUS SiP flows are certified by ESA and NASA for Space
applications. A Radiation Assurance Policy covers all the effects
induced on the semiconductor devices by the Space radiation
environment. 3D PLUS facilities are certified ISO 9001:2008.
A U N I Q U ET E C H N O L O G Y P O R T F O L I O
3D PLUS provides different very flexible Stack Technology Flows
qualified for Space and that can be used for the design of various
styles of SiPs:
+ Standard Packages Stack
+ Flex Process – Die Stack
+ Flex Process – SiP Stack (Heterogeneous components and mixed
technology stacks)
This technology can be used to develop Digital, Analog, Power, RF
and mixed signals electronics. The SiP modules can be shaped with
various form factors and can be delivered with several I/Os types.
Depending on the SiP performance requirements and targeted
market, the relevant stacking process will be selected within 3D PLUS
technology portfolio in order to bring the best added value and
benefits for our customer designs.
S Y S T E M - I N - PAC K AG E S ( S I P )O V E R V I E W
A System-In-Package consists of a number of dissimilar integrated
circuits enclosed in a single highly miniaturized package. The SiP
performs all or most of the functions of an electronic system, and, it
can contain several silicon components (bare die or package) and
passive components.
3D PLUS provides a one-stop source for customer’s concept analysis,
feasibility study, design, manufacturing and test of High Reliability and
High Performance SiP.
Our State-of-the Art stacking technologies for SiP allow us to bring the
best standard semiconductor devices and technologies in one single
highly miniaturized package with almost no limit for the merging of
heterogeneous technology (Die – package – Sensors - Passives).
Achieving a combination that cannot be realized with monolithic
System-on-Chip (SoC) approaches, 3D PLUS SiP stacks are more
effective and have also a lower development cost and a faster time to
market.
INDISPUTABLEBENEFITS
System In Package
Mixing of heterogeneous technologies ( bare dice -packages – sensors - passives) and form factors in one single highly miniaturized package.Enable achieving a combination that cannot be realized with other technology.
Miniaturization
Size reduction for the PWB and weight savings for theapplication.
Increased electrical performances
Interconnections are reduced and simplified.
Resistance to Harsh environments
Extended thermal cycles – High mechanical resistance -High temperature.
High Reliability
Proven technology combined with a unique design andmanufacturing know-how developed for more than 15years.
Space Qualified
Sole Space Qualified stacking technology worldwide.“Design for Space” Products definition.Space Flight heritage upward to 20 years missions in Geostationary Orbit.
Efficient Technology - Manufacturing Process
Excellent yield thanks to the test/screening of each layer before stacking.Flexibility and short development lead time.Simple and well proven technology process.Supply Chain for low volume - Space qualified applications.
Long Term Availability
Worldwide delivery guarantee.More than 10 years availability guarantee
Customer Support
Dedicated technical support team.Local sales network.
RSRKICK-OFF CDRPDR DDR
FROM YOUR NEEDS…
… TO OUR SIP MODULE