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TRANSCRIPT
Dimitris Tsoukalas
Christos Tsamis (eds.)
Simulation of Semiconductor Processes
and Devices
2001
SISPAD 01
Springer-Verlag Wien GmbH
Dr. Dimitris Tsoukalas Dr. Christos Tsamis
Institute of Microelectronics "Demokritos" National Center for Scientific Research
Athens, Greece
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The use of registered names, trademarks, etc., in this publication does not imply, even in the absence of a specific statement, that such names are exempt from the relevant protective laws
and regulations and therefore free for general use. © 2001 Springer-Verlag Wien
Originally published by Springer-Verlag Wien New York in 2001 Softcover reprint of the hardcover ist edition 2001
Typesetting: Camera ready by authors Printing: Druckerei Theiss GmbH, A-9400 Wolfsberg Printed on acid-free and chlorine-free bleached paper
SPIN 10845347
With 474 Figures
ISBN978-3-7091-7278-0 ISBN 978-3-7091-6244-6 (eBook) DOI 10.1007/978-3-7091-6244-6
Editorial
This volume contains the proceedings of the International Conference on Simulation of Semiconductor Devices and Processes, SrSPAD '01, held on September 5-7, 2001, in Athens. The conference is organized annually and takes place in tum in Europe, Japan and the USA. SISPAD '99 was organized at Kyoto Research Park, Japan, and SISPAD '00 took place in Seattle, Washington, USA.
The conference provided an open forum for the presentation of the latest results and trends in process and device simulation. The trend towards shrinking device dimensions and increasing complexity in process technology demands the continuous development of advanced models describing the basic physical phenomena involved. New simulation tools are developed to complete the hierarchy in the Technology Computer-Aided Design simulation chain between microscopic and macroscopic approaches. The conference program featured 8 invited papers, 60 papers for oral presentation and 34 papers for poster presentation, selected from a total of 165 abstracts from 30 countries around the world. These papers disclose new and interesting concepts for simulating processes and devices. The proceedings were printed from the authors camera-ready manuscripts. We would like to express our sincere appreciation to the authors for their high-quality contributions, their cooperation and efforts. Also we would like to thank the members of the conference committee for reviewing the manuscripts carefully. SISPAD'02 will be held on September 4-6,2002 in Kobe, Japan. Certain to continue the tradition of being the most important conference in its tield, we once again look forward to a most successful and exciting event.
Dimitris Tsoukalas Christos Tsamis
Steering Committee
K. De Meyer IMEC Belgium J. Faricelli Compaq USA M.Law University of Florida USA P. Leon PetaLogic Corp. USA N. Nakayama STARC Japan S. Odanaka Osaka University Japan H. Ryssel FhG-IIS-B Germany D. Tsoukalas NCSR'Demokritos' Greece A. Yoshii Japan Women's University Japan
Honorary Committee
R. Dutton Stanford University USA S. Selberherr TU Vienna Austria K. Taniguchi Osaka University Japan
Technical Program Committee
Y. Awano Fujitsu Lab Japan G. Baccarani University of Bologna Italy R. Brunetti University of Modena Italy N.Cowem Philips The Netherlands M. Duane Applied Materials USA S. Dunham University of Washington USA N. Goldsman University of Maryland USA M. Hane NEC Japan H. Jaouen ST Microelectronics France M. Jaraiz University of Valla do lid Spain S. Jones Marconi Caswell Ltd UK J. B. Kuo University of Waterloo Canada P. Leon PetaLogic Corp. USA 1. Lorenz FhG-IIS-B Germany M. Miura-Mattausch Hiroshima University Japan W. Moizer Infineon Technologies Germany K. Nishi SELETE Japan P. Oldiges IBM USA M. Profirescu TU Bucharest Romania K. Rahmat IBM USA S. Selberherr TU Vienna Austria W. Shoenmaker IMEC Belgium T. Toyabe Toyo University Japan G. Wachutka TU Munich Germany
Contents
Macroscopic Quantum Carrier Transport Modeling . . .. .. . . .. . .. . . . . .. . z. Yu, R. W. Dutton, D. W. Yergeau and M G. Ancona
Atomistic Front-End Process Modelling: A Powerful Tool for Deep-Submicron Device Fabrication. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
M Jaraiz, P. Castrillo, R. Pinacho, I Martin-Bragado and J. Barbolla
Monte Carlo Impurity Diffusion Simulation Considering Charged Species . . 18 M Hane, T. Ikezawa and G. H. Gilmer
A Novel Model for Boron Diffusion in SiGe Strained Layers Based on a Kinetics Driven Ge-B Pairing Mechanism. . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
D. Villanueva, P. Moens, K. Rajendran and W. Schoenmaker
The Role ofIncomplete Interstitial-Vacancy Recombination on Silicon Amorphization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .... .. . 26
L. A. Marques, L. Pelaz, J. Hernandez and J. Barbolla
Atomistic Simulations of Extrinsic-Defects Evolution and Transient Enhanced Diffusion in Silicon. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
F. Cristiano, B. Colombeau, C. Bona/os, J. Aussoleil, G. Ben Assayag and A. Claverie
Initial Conditions for Transient Enhanced Diffusion: Beyond the Plus-Factor Approach. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
G. Hobler and V. Moroz
Local Iterative Monte Carlo Investigation of the Influence of Electron-Electron Scattering on Short Channel Si-MOSFETs . . . . . . . . . . . . . . . . . . 38
J. Jakumeit and U. Ravaioli
Simplified Inelastic Acoustic-Phonon Hole Scattering Model for Silicon. . . 42 F. M Bujler, A. Schenk and W. Fichtner
An Impact Ionization Model Including Non-Maxwellian and Non-Parabolicity Effects. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
T. Grasser, H. Kosina and S. Selberherr
Density of States and Group Velocity Calculations for Si02 . . . • • • . • . • • • • 50 E. Gnani, S. Reggiani, and M Rudan
Investigation of Spurious Velocity Overshoot Using Monte Carlo Data . . . . . 54 T. Grasser, H. Kosina and S. Selberherr
viii
Elasto-Plastic Modeling of Microelectronics Materials for Accurate Prediction of the Mechanical Stresses in Advanced Silicon Technologies . . . 58
V Senez and T. Hoffmann
A Unified Model of Dopant Diffusion in SiGe . . . . . . . . . . . . . . . . . . . . . . . . 62 A. Pakfar, A. Poncel, T. Schwarlzmann and H. Jaouen
A Simple Modeling and Simulation of Complete Suppression of Boron Out-Diffusion in Sij.xGex by Carbon Insertion. . . . . . . . . . . . . . . . . . . . . . . . . 66
K. Rajendran and W. Schoenmaker
On the Effect of Local Electronic Stopping on Ion Implantation Profiles in Non-Crystalline Targets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
A. Burenkov, Y. Mu and H. Ryssel
Dynamics ofp+ Polysilicon Gate Depletion due to the Formation of Boron Compounds in TiSiz. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
F. C. Lau and W. Moizer
Analysis of Statistical Fluctuations due to Line Edge Roughness in Sub-O.I /lm MOSFETs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. ...... .. . . 78
S. Kaya, A. R. Brown, A. Asenov, D. Magot and T. Linton
Quantum Corrections in 3-D Drift Diffusion Simulations of Decanano MOSFETs Using an Effective Potential. . . . . . . . . . . . . . . . . . . . . . . . . 82
JR. Walling, A .R. Brown, A. Asenov and D. K. Ferry
Finite Element Simulation of2D Quantum Effects in Ultra Short Channel MOSFETs with High-K Dielectric Gates. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
A. Poncet, B. Vergnet and M Mouis
Decananometer FDSOI Device Optimization Including Random Variation. . 90 D. Connelly
Fully 2D Quantum-Mechanical Simulation of Nanoscale MOSFETs . . . . . . 94 A. Pirovano, A. L. Lacaila, and A. S. Spinelli
Ab-initio Electrodynamic Modeling of On-Chip Back-End Structures. . . . . . 98 W. Schoenmaker, P. Meuris and W. Magnus
Analysis of Hot-Carrier-Induced Oxide Degradation in MOSFETs by Means of Full-Band Monte Carlo Simulation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108
Y. Kamakura, K. Deguchi, and K. Taniguchi
Acceleration of Lattice Monte Carlo Simulations and Application to Diffusion/Clustering of As at High Concentrations. . . . . . . . . . . . . . . . . . . . 116
S. T. Dunham and Z. Qin
ix
Interstitial Cluster Evolution and Transient Phenomena in Si-Crystal . . . . . . 120 A. La Magna, S. Coffa, S. Ubertino, M. Strobel and L. Colombo
Monitoring Arsenic In-Situ Doping with Advanced Models for Poly-Silicon CVD. .......... ... ... ..... . ....... .. ......................... 124
W. Pyka, C. Heitzinger, N. Tamaoki, T Takase, T Ohmine and S. Selberherr
Equipment and Process Simulation of Compound Semiconductor MOCVD in the Production Scale Multiwafer Planetary Reactor. . . . . . . . . . . . . . . . . . . 128
M. Dauelsberg, M. Deufe!, M. Reinhold, G. Strauch and T Bergunde
Numerical Simulation of Non-Equilibrium, Ultra-Rapid Heating of Si-Thin films by Nanosecond-Pulse Excimer Laser. . . . . . . . . . . . . . . . . . . . . . . . . . . 132
A. T Voutsas , H. Kisdarjono, R. Solanki and A. Kumar
20 Hierarchical Radio-Frequency Noise Modeling Based on a LangevinType Drift-Diffusion Model and Full-Band Monte-Carlo Generated Local Noise Sources. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 136
S. Decker, C. Jungemann, B. Neinhiis and B. Meinerzhagen
Variance and Covariance Estimation in Stationary Monte Carlo Device Simulation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. ........ 140
H. Kosina, M. Nedjalkov and S. Selberherr
Analysis of Gate Tunneling Current in MOS Structures using Quantum Mechanical Simulation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144
M. Ogawa and T Miyoshi
2-D Self-Consistent Solution of SchrOdinger Equation, Boltzmann Transport Equation, Poisson and Current-continuity Equation for MOSFET . . . . . . . . . 148
C. -K. Huang and N. Goldsman
Boundary Condition Models for Terminal Current Fluctuations. . . . . . . . . .. 152 M. Nedjalkov, T Grasser, H. Kosina and S. Selberherr
Electron velocity in sub-50 nm channel MOSFETs . . . . . . . . . . . . . . . . . . . . . 156 D. Antoniadis, 1. Djomehri and A. Lochtefeld
3D Statistical Simulation of Intrinsic Fluctuations in Decanano MOSFETs Introduced by Discrete Dopants, Oxide Thickness Fluctuations and LER . . . 162
A. Asenov
Modeling of Reactive Ion Etching for Si/Si02 Systems. . . . . . . . . . 170 S. Hamaguchi and H. Ohta
x
Simulation and Prediction of Aspect Ratio Dependent Phenomena during Si02 and Si Feature Etching in Fluorocarbon Plasmas. . . . . . . . . . . . . . . . . . 174
C. Kokkoris, E. Cogolides, and A. C. Boudouvis
System Level Modeling of an Electrostatic Torsional Actuator. . ... , . . . . . . 178 R. Sattler, C. Wachutka, F. Plotz and S. Hoffmann
Impact of Substrate Resistance on Drain Current Noise in MOSFETs . . . . . . 182 J -s. Coo, S. Donati, C. -H Choi, Z. Yu, T -H Lee and R. W Dutton
An Efficient Frequency-Domain Analysis Technique of MOSFET Operation 186 K-J. Lee, J Kim, H Shin, C. Lee, Y J Park and H S. Min
Modeling of Bias Dependent Fluctuations of Flicker Noise of MOSFETs . .. 190 K Sonoda, M Tanizawa, K Eikyu, K Ishikawa, T Kumamoto, H Kouno, and M Inuishi
Compact MOS Modeling for RF CMOS Circuit Simulation . .... .... . ... 194 A .J Scholten, R. van Langevelde, L .F. Tiemeijer, R.NJ Havens, and D. B. M Klaassen
Statistical Analysis ofVLSI Using TCAD ... , ........ , . , . . . . . . . . . . . . . 202 S. Shigyo
Numerical Modeling of Impact-Ionization Effects on Gate-Lag Phenomena in GaAs MESFETs . .. .... . . . ... ... . .. . .. .. .. .. .. ... . .. .. .. .. . .. 210
A. Wakabayashi, Y Mitani, D. Kasai and K Haria
Monte Carlo Simulation of Multi-Band Carrier Transport in Semiconductor Materials with Complex Unit Cells. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 214
H-E. Nilsson, A. Martinez, M. Hjelm, E. Bellotti and K Brennan
Modeling Semiconductor Carbon Nanotube Rectifying Heterojunctions. . . . . 218 C. Pennington and N. Coldsman
Simulation of Vertical CEO-FETs by a Coupled Solution of the Schrodinger Equation with a Hydrodynamic Transport Model. . . . . . . . . . . . . . . . . . . . . .. 222
J Hontschel, R. Stenzel, W Klix, F. Ertl, T Asperger, R. A. Deutschmann, M Bichler and C. Abstreiter
A Computational Efficient Method for HBT Intermodulation Distortions and Two-Tone Characteristics Simulation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 226
K -Y Huang, Y Li, C. P. Lee, and S. M Sze
Modeling the Impact of Body-to-Body Leakage in Partially -Depleted SOl CMOS Technology. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 230
M-K leong, R. Young, H Park, W Rausch, I. Yang, S. Fung, F. Assaderaghi and H-S. P. Wong
xi
Compact Device Model for Partially Depleted SOI-MOSFETs . . . . . . . . . . 234 Y Fujii. R. Yoshimura. T Matsuoka and K. Taniguchi
Two-Dimensional Model for the Subthreshold Slope in Deep-Submicron Fully Depleted SOl MOSFETs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 238
H. van Meer and K. De Meyer
3D Thermal Analysis for SOl and its impact on Circuit Performance. . . . . 242 R v: Joshi. S S Kang. and C T. Chuang
Modelling of High-Voltage SOI-LOMOS Transistors Including Self-Heating 246 A. C T A arts. M 1. Swanenberg and W1. Kloosterman
An Efficient Tool for Extraction of Interconnect Models in Submicron Layouts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 250
P. Majfezzoni. A. Brambilla and A. L. Lacaita
A Comparative Study of Two Numerical Techniques for Inductance Calculation in Interconnect Structures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 254
C Harlander. R. Sabelka and S Selberherr
Comparison of Finite Element Stress Simulation with X-Ray Measurement for the Aluminum Conductors with different Passivation Topography. . . . .. 258
T-K. Kim. Y-P. Kim. W-Y. Chung. Y-K. Park and 1.-T Kong
A New Compact Spice-like Model ofE2PROM Memory Cells Suitable for DC and Transient Simulations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 262
L. Larcher, P. Pavan, M Cuozzo and A. Marmiroli
Simulation of Flash Memory Programming Characteristics . . . . . . . . . . . . . . 266 K. Matsuzawa and T Ishihara
A Figure of Merit for Flash Memory Multi-Layer Tunnel Dielectrics. . . . . . 270 B. Govoreanu, P. Blomme, M Rosmeulen, 1. Van Houdt and K. De Meyer
Enhanced Diffusion of Phosphorus due to BPSG layer in SEG-MOSFETs . . 274 J Lee, W -S Cheong. J-H. Choi and J-C Om
Neutron-SER Modeling and Simulation for O.l8)lm CMOS Technology. . . . 278 C Dai. N. Hakim. S Walstra, S Hareland. 1. Maiz S Yu and S-W Lee
TCAD Driven Process Design of 0.15)lm Fully Depleted SOl Transistor for Low-Power Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 284
N. Miura, H. Hayashi, H. Komatsubara. M Mochizuki. H. Matsuhashi, Y Kajita and K. Fukuda
xii
A Simulation Evaluation of 100nm CMOS Device Perfonnance . . . . . . . . . . 288 S. K. Jones, D. J. Bazley, E. Augendre, G. Badenes, A. de Keersgieter and T Skotnicki
A Practical Approach to Modeling Strained Silicon NMOS Devices. . . . . .. . 292 P. Oldiges, X Wang, M-K. leong, S. Fischer and K. Rim
Accounting for Quantum Effects and Polysilicon Depletion in an Analytical Design-Oriented MOSFET Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 296
M Bucher, J.-M Sallese and C. Lallement
Investigations ofSalicided and Salicide-Blocked MOSFETs for ESD Including ESD Simulation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300
V Axelrad, Y. Huh, J. W. Chen and P. Bendix
Bipolar Transistor's Intrinsic and Extrinsic Capacitance Detennination. . . . . 304 B. Ardouin, T Zimmer, H. Mnij , P. Fouillat, D. Berger and D. Celi
Varying Characteristics of Bipolar Transistors with Emitter Contact Window Width . .. ... . ... . ... .. . ... . . .. .. .. . .. .. .. . . .. . . .. . .. . .. .. . . ... 308
J. Fu, S. Mijalkovic, W. J. Eysenga, H. W van Zeijl and W. Crans
Ensemble Monte Carlo Particle Modeling of InGaAs/lnP Un i-TravelingCarrier Photodiodes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 312
M Ryzhii and V Ryzhii
An Effective Methodology for Predicting the Distribution of MOSFET Device Characteristics Using Statistical TCAD Simulations. . . . . . . . . . . . . . 316
T Tatsumi
Quantum Mechanical Balance Equations for Modeling Transport in Closed Electric Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 320
B. Soree, W. Magnus and W. Schoenmaker
A Nonlinear Iterative Method for InAs/GaAs Semiconductor Quantum Dots Simulation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 324
Y, Li, 0. Voskoboynikov, C. P. Lee, and S. M Sze
The modeling of a SOl microelectromechanical sensor. . . . . . . . . . . . . . . . . . 328 C. Ravariu, F. Ravariu, A. Rusu, D. Dobrescu and L. Dobrescu
A Computationally Efficient Model for Three-dimensional Monte Carlo Simulation ofIon Implantation into Complex Structures. . . . . . . . . . . . . . . . 332
D. Li, G. Wang, Y. Chen, G. Shrivastav, S. Oak, A. Tasch and S. Banerjee
xiii
A Full-Wave Analysis for Multi-Level Interconnects Using FDTD-PML method . ... . .. ... ........... '" . .. . ... .. . . . ... . .. . .. .. . . . . . . . . 336
Y. Kim, S Yoon, I. Choi, SPark, 0. Kwon, and T. Won
Differences Between Quantum-Mechanical Capacitance-Voltage Simulators. 340 C A . Richter, E. M Vogel, A. M Hodge, and A. R. Hefner
Investigation of a Novel Rapid Thermal Processing Concept Using an Electro-Optically Controlled Radiation Cavity. . . . . . . . . . . . . . . . . . . .. . . . . 344
N. E. B. Cowern, F. Roozeboom and P. van der Sluis
A Shared Architecture for a Dynamic Technology Simulation Repository. . . 348 M G. Khazhinsky, A. Hoefler, M Stockinger, D. 1. Collins, /. Clejan, K. Wimmer, W. Taylor, M Foisy, 1. M Higman, L. Bomholt, C Clemencon, 0. Zuyakova and W. Fichtner
Level Set Modeling of Profile Evolution during Deposition Process. . . . . . .. 352 0. Kwon and T. Won
Parameter and Coupling Ratio Extraction for SPICE-Compatible MACRO Modeling of Source Side Injection (SSI) Flash Cell. . . . . . . . . . . . . . . .. . . . . 356
S-P. Sim, P. Guo, A. Kordesch, B. Lee, C-M Liu, K. Lee, and C Y. Yang
Theoretical Calculation of a Charged Particle Detector's Response, Fabricated by Semi Insulating (ST) GaAs . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 360
V Theonas and G. Papaioannou
Stress Modeling of Multi Level Interconnect Schemes for Future Deep Submicron Device Generations. . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . .. . . . 364
C Gonzales Montes De Oca, S Foley, A. Mathewson and 1. F. Rohan
Robust Method for Fast and Accurate Simulation of Random Dopant Fluctuation-Induced Vth Variation in MOSFETs with Arbitrary Complex Doping Distribution. . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . .. . . . . . . . . . . .. 368
I. De, A. Shibkov and S Saxena
An Agent-Based Common Software Platform Applied to Multi-scale Device and Process simulations . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . .. . . . . . . . . . 372
S Ho, Y. Ohkura, M Ikegawa, N. Mise, 1. Prasad, Y. Kawashima, and S Kubo
Simulation of Dark Count in Geiger Mode Avalanche Photodiodes. . . . . . . . 376 1. C Jackson, B. Lane, A. Mathewson and A. P. Morrison
Device Simulation and Measurement of Hybrid SBTT. . . . . . . . . . . . . . .. . . . 380 K. Matsuzawa, K. Uchida, A. Nishiyama, T. Numala and M Noguchi
xiv
Two-Dimensional Diffusion Characterization of Boron in Silicon Using Reverse Modeling. . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . 384
E. N. Shauly, R. Ghez and fl Komem
Simulation of Advanced n-MOSFET Emphasizing Quantum Mechanical Effects on 2-D Characteristics .. . .... . . .. . . ... . ... .. .. .. . . . . . .... . , 388
f Ma, L. Chen, B. Jiang, M Zhang, L. Tian, Z. Yu, L. Liu and Z. Li
Vth Model of Pocket-Implant MOSFETs for Circuit Simulation. . . . . . . . . . 392 D. Kitamaru, H U eno, K. Morikawa, M Tanaka, M Miura-Mattausch, H J Mattausch, S. Kumashiro, T Yamaguchi, K. Yamashita and N. Nakayama
Electrothermal Device Simulation of an ESD Protection Structure Based on Bipolar DC Characteristics. . . . . . . . .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . 396
A. Icaza Deckelmann, G. Wachutka, G. Groos and W Kanert
Characterization of Low-Frequency Noise of MOSFETs Using the 2-D Device Simulator. . . . . . .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . .. . . 400
H Nah, f J Park, H-S. Min, C. Lee and H Shin
Electron Beam Lithography Simulation for Subquartermicron and HighDensity Patterns . . . . . . .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . .. . . . 404
l. Raptis and N. Glezos
Green's Function Approach for Three-Dimensional Diffusion Simulation of Industrial High-Voltage Applications . . . . . . .. . . . . . . . . . . . . . . . . . . . . . . . . 408
J. Cervenka, M Knaipp, A. Hassinger and S. Selberherr
Analysis of Ultra-short MOSFETs with High-k Gate Dielectrics. . . . . . . . . . 412 K. Dragosits, f Ponomarev, C. Dachs and S. Selberherr
TCAD Analysis of Gain Cell Retention Time for SRAM Applications. . . . . . 416 A. Gehring, C. Heitzinger, T Grasser and S. Selberherr
Optimization for TCAD Purposes Using Bernstein Polynomials. . . . . . . . . . 420 C. Heitzinger and S. Selberherr
Advanced Hybrid Cellular Based Approach for Three-Dimensional Etching and Deposition Simulation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 424
A. Hassinger, T Binder, W Pyka and S. Selberherr
A Methodology tor Deep Sub-Quartermicron CMOS Technology Characterization . .. .. .. . .. ... .... .. . . ... . .. . . . ... . .. . . .. . ... . . " 428
V Palankovski, N. Belova, T Grasser, H Puchner, S. Aronowitz and S. Selberherr
xv
A Review of Modeling Issues for RF Heterostructure Device Simulation. . . 432 R. Quay. R Schultheis, W. Kellner, V. Palankovski and S. Selberherr
Modeling and Simulation of Charge Generation Events Caused by Ion Irradiation in High-Voltage Power Devices . . . . . . . . . . . . . . . . . . . . . . . . . .. 436
W. Kaindl, G. Wachutka and G. S6lkner
Determination of the Radiation Efficiency, Contrast and Sensitivity in Electron and Ion Lithography. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 440
K . Vutova, G. Mladenov and I. Raptis
Author Index 444